JP4637647B2 - 電子部品収納用パッケージおよび電子装置 - Google Patents
電子部品収納用パッケージおよび電子装置 Download PDFInfo
- Publication number
- JP4637647B2 JP4637647B2 JP2005153592A JP2005153592A JP4637647B2 JP 4637647 B2 JP4637647 B2 JP 4637647B2 JP 2005153592 A JP2005153592 A JP 2005153592A JP 2005153592 A JP2005153592 A JP 2005153592A JP 4637647 B2 JP4637647 B2 JP 4637647B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base
- thermal conductivity
- metal layer
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
本発明の電子装置は、本発明の電子部品収納用パッケージと、基体に搭載された電子部品とを備えていることにより、電子部品に熱による特性変化を生じさせることなく封止されたものとなるので、信頼性の高い電子装置を実現することができる。
2・・・金属層
3・・・ヒータ部
4・・・蓋体
5・・・電子部品
6・・・配線導体
7・・・封止材
9・・・熱伝導率の低い部位
9a・・空隙部
Claims (5)
- 表面を有し、電子部品を搭載するための搭載部を有する基体と、
前記搭載部を取り囲むように前記基体の表面に形成され、蓋体を接合するための金属層と、
断面視して前記金属層に対向するように前記基体に設けられたヒータ部と、を備え、
前記ヒータ部から前記搭載部への伝熱経路に、前記基体の他の部位よりも熱伝導率の低い部位が形成されており、
前記熱伝導率の低い部位の幅は、前記ヒータ部の幅よりも広く、
前記熱伝導率の低い部位は、前記ヒータ部の内側端部よりも内側に延出している、電子部品収納用パッケージ。 - 前記ヒータ部と前記金属層との間には、前記基体の前記他の部位が位置している、請求項1に記載の電子部品収納用パッケージ。
- 前記熱伝導率の低い部位は、空隙部である、請求項1〜2のいずれか一項に記載の電子部品収納用パッケージ。
- 前記熱伝導率の低い部位は、前記基体の前記他の部位よりも熱伝導率の低い材料により形成されている、請求項1〜2のいずれか一項に記載の電子部品収納用パッケージ。
- 請求項1〜4のいずれか一項に記載の電子部品収納用パッケージと、
前記搭載部に搭載された電子部品と、を備える、電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005153592A JP4637647B2 (ja) | 2005-05-26 | 2005-05-26 | 電子部品収納用パッケージおよび電子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005153592A JP4637647B2 (ja) | 2005-05-26 | 2005-05-26 | 電子部品収納用パッケージおよび電子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006332316A JP2006332316A (ja) | 2006-12-07 |
JP4637647B2 true JP4637647B2 (ja) | 2011-02-23 |
Family
ID=37553695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005153592A Expired - Fee Related JP4637647B2 (ja) | 2005-05-26 | 2005-05-26 | 電子部品収納用パッケージおよび電子装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4637647B2 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5262487B2 (ja) * | 2008-09-16 | 2013-08-14 | 日産自動車株式会社 | 半導体装置の製造方法 |
JP6044227B2 (ja) * | 2012-09-26 | 2016-12-14 | 日本電気株式会社 | 気密封止パッケージおよびその製造方法 |
JP6495740B2 (ja) * | 2015-05-21 | 2019-04-03 | 京セラ株式会社 | 電子素子実装用基板および電子装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190042U (ja) * | 1984-05-25 | 1985-12-16 | 関西日本電気株式会社 | フラツトパツケ−ジ |
JPH0669364A (ja) * | 1992-08-21 | 1994-03-11 | Kyocera Corp | 半導体素子収納用パッケージ |
JPH06326216A (ja) * | 1993-05-13 | 1994-11-25 | Toshiba Corp | 電子回路用基板 |
JPH0722534A (ja) * | 1993-07-01 | 1995-01-24 | Nec Corp | 半導体装置 |
JP2007528591A (ja) * | 2003-05-22 | 2007-10-11 | リフレクティヴィティー, インク. | 微細構造および半導体デバイスのための新規なパッケージ方法 |
-
2005
- 2005-05-26 JP JP2005153592A patent/JP4637647B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60190042U (ja) * | 1984-05-25 | 1985-12-16 | 関西日本電気株式会社 | フラツトパツケ−ジ |
JPH0669364A (ja) * | 1992-08-21 | 1994-03-11 | Kyocera Corp | 半導体素子収納用パッケージ |
JPH06326216A (ja) * | 1993-05-13 | 1994-11-25 | Toshiba Corp | 電子回路用基板 |
JPH0722534A (ja) * | 1993-07-01 | 1995-01-24 | Nec Corp | 半導体装置 |
JP2007528591A (ja) * | 2003-05-22 | 2007-10-11 | リフレクティヴィティー, インク. | 微細構造および半導体デバイスのための新規なパッケージ方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006332316A (ja) | 2006-12-07 |
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