JP4633348B2 - 積層構造体の形成方法及び絶縁膜の集積方法 - Google Patents
積層構造体の形成方法及び絶縁膜の集積方法 Download PDFInfo
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- JP4633348B2 JP4633348B2 JP2003358792A JP2003358792A JP4633348B2 JP 4633348 B2 JP4633348 B2 JP 4633348B2 JP 2003358792 A JP2003358792 A JP 2003358792A JP 2003358792 A JP2003358792 A JP 2003358792A JP 4633348 B2 JP4633348 B2 JP 4633348B2
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- 238000000034 method Methods 0.000 title claims description 67
- 239000007789 gas Substances 0.000 claims description 66
- 238000005530 etching Methods 0.000 claims description 52
- 239000011261 inert gas Substances 0.000 claims description 37
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 239000000758 substrate Substances 0.000 claims description 28
- 239000012495 reaction gas Substances 0.000 claims description 24
- 229910052710 silicon Inorganic materials 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 230000010354 integration Effects 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- 230000009977 dual effect Effects 0.000 claims description 13
- 239000002994 raw material Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 9
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 238000011144 upstream manufacturing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 109
- 239000010408 film Substances 0.000 description 80
- 239000004065 semiconductor Substances 0.000 description 18
- 230000008569 process Effects 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 10
- 229910052734 helium Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000011065 in-situ storage Methods 0.000 description 3
- 238000007373 indentation Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 208000037909 invasive meningococcal disease Diseases 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- YZYDPPZYDIRSJT-UHFFFAOYSA-K boron phosphate Chemical compound [B+3].[O-]P([O-])([O-])=O YZYDPPZYDIRSJT-UHFFFAOYSA-K 0.000 description 1
- 229910000149 boron phosphate Inorganic materials 0.000 description 1
- 150000001722 carbon compounds Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229940104869 fluorosilicate Drugs 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/02107—Forming insulating materials on a substrate
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- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
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- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31633—Deposition of carbon doped silicon oxide, e.g. SiOC
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
- H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
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- Y10S438/97—Specified etch stop material
Description
27.12MHz=1400−1800W又は400kHzのRF電力の組合せ
圧力=560Pa
電極ギャップ=24mm
基板温度=370−380℃
好ましい実施例のCVD装置では、チャンバーは反応室から離れた位置に備えられ、遠隔プラズマ放電エネルギーで反応室とパイプにより連結されている。これは、図1を参照して説明される。
弾性率<11Gpa(9から11GPaの範囲を含む)
k値<2.9(2.7から2.9の範囲を含む)
低kのハード膜の一実施例は、以下の特性を有する。
弾性率>12Gpa(11から15GPaの範囲を含む)
k値<3.0(2.8から3.0の範囲を含む)
上述のように、硬度はダイヤモンド押込法により測定される。弾性率はダイヤモンド押込法により測定される。
米国特許 6350670B1,”炭素含有酸化絶縁層を有する半導体デバイスの製造方法”
米国特許 6316063B1,”炭素含有酸化絶縁層の製法”
米国特許 6348725B2,”低比誘電率膜を堆積するためのプラズマ処理”
米国特許 6440838,”積層された中間エッチング停止層を使用したデュアンダマシン構造”
米国特許 6440861,”デュアンダマシン構造の形成方法”
本発明の技術思想の範囲内で、その分野の当業者ならば多くのかつ種々の変更が可能である。それゆえ、本発明の範囲は、図示されたものに限定されないことは明らかである。
2 反応室
3 支持部
4 シャワーヘッド
5 導入ポート
6 バルブ
7 ガス排出ポート
8 高周波(RF)源
9 半導体ウェハー
10 整合回路
11 反応ガス導管
13 遠隔プラズマ放電室
14 パイプ
15 バルブ
17 パイプ
18 ゲートバルブ
19 開口
20 排出口
21 コンダクタンス制御バルブ
25 駆動機構
26 熱素子
27 接地
28a 圧力ゲージ
29 支持ピストン
Claims (14)
- 基板上にエッチングされるべき層(エッチング層)とエッチング停止層とを有する積層構造を形成する方法であって、
反応室中に、シリコンとカーボンとを含む原料ガスから成る反応ガスを原料ガス流量で導入する一方、不活性ガスを原料ガス流量の40%以上の不活性ガス流量で導入し、
加熱された基板支持部材上に取り付けられた基板の上流側であってかつ反応ガスが存在する空間に、プラズマエネルギーを印加し、
ブラズマエネルギーを使用して、反応ガスから基板上にエッチング停止層を形成し、
基板上に少なくとも一つのエッチング層を形成することにより積層構造を形成し、
前記原料ガスは、ジメチル ジメトキシ シランであり、
前記エッチング停止層形成工程及び前記エッチング層形成工程は、同じ室内で、真空状態を維持したまま連続して実施され、
前記エッチング停止層形成工程及び前記エッチング層形成工程は、同じ原料ガス及び不活性ガスを使用し、
前記エッチング停止層形成工程における不活性ガス流量は、前記エッチング層形成工程における不活性ガス流量より大きく、
前記エッチング層形成工程において、不活性ガス流量は原料ガス流量の40%以下であることを特徴とする積層構造体の形成方法。 - 前記積層構造は、デュアルダマシン構造であることを特徴とする請求項1に記載の形成方法。
- 前記エッチング停止層形成工程は、エッチング停止層の比誘電率を3.0以下に調整する条件下で実施されることを特徴とする請求項1に記載の形成方法。
- 前記プラズマエネルギーは、上部及び下部電極としてそれぞれ機能するシャワーヘッドとサセプターとの間にそれぞれ印加され、前記基板はサセプター上に実装されていることを特徴とする請求項1に記載の形成方法。
- 前記反応ガスは、反応ガスを反応室に導入する工程に先立って、遠隔プラズマ室内でプラズマエネルギーを使用して励起されることを特徴とする請求項1に記載の形成方法。
- 前記原料ガス流量は、50sccmから200sccmの範囲内にあることを特徴とする請求項1に記載の形成方法。
- 請求項1において、さらに、
ホールを形成するために、エッチング停止層以外のエッチング層をエッチングし、このホールを銅で埋めることを特徴とする形成方法。 - 絶縁膜の集積方法において、
シリコン、炭素、酸素及び水素を含む原料ガスから成る第1の反応ガスを第1の原料ガス流量で使用する一方、第1の不活性ガスを第1の不活性ガス流量で使用して、基板上に第1の絶縁層を堆積し、第1の不活性ガス流量は第1の原料ガス流量の40%以下であり、第1の反応ガスはプラズマエネルギーで励起されており、
続いて、シリコン、炭素、酸素及び水素を含む原料ガスから成る第2の反応ガスを第2の原料ガス流量で使用する一方、第2の不活性ガスを第2の不活性ガス流量で使用して、第1の絶縁層上に第2の絶縁層を堆積し、第2の不活性ガス流量は第2の原料ガス流量の40%以上であり、第2の反応ガスはプラズマエネルギーで励起され、
前記原料ガスは、ジメチル ジメトキシ シランであり、
前記第1の絶縁層形成工程及び前記第2の絶縁層形成工程は、同じチャンバー内で、真空状態を維持したまま連続して実施され、
前記第1の絶縁層形成工程及び前記第2の絶縁層形成工程は、同じ原料ガス及び不活性ガスを使用し、
前記第1の絶縁層は絶縁体であり、前記第2の絶縁層はエッチングストッパーであることを特徴とする絶縁膜の集積方法。 - 前記第1及び第2の絶縁層は、炭素含有酸化シリコンから成ることを特徴とする請求項8に記載の絶縁膜の集積方法。
- 前記第1及び第2の絶縁層は、12GPaもしくはそれ以下及び13GPaもしくはそれ以上の弾性率をそれぞれ有することを特徴とする請求項8に記載の絶縁膜の集積方法。
- 前記第1及び第2の絶縁層は、2.0GPaもしくはそれ以下及び2.0GPaもしくはそれ以上の硬度をそれぞれ有することを特徴とする請求項8に記載の絶縁膜の集積方法。
- 前記第2の絶縁層形成工程は、第2の絶縁層の比誘電率を3.0以下に調整する条件下で実施されることを特徴とする請求項8に記載の絶縁膜の集積方法。
- 前記第1及び第2の反応ガスは、基板が処理される反応室の上流側に配置された遠隔プラズマ室で、プラズマエネルギーを使用して最初に励起されることを特徴とする請求項8に記載の絶縁膜の集積方法。
- 前記第1及び第2の原料ガス流量は、それぞれ50sccmから200sccmの範囲内にあることを特徴とする請求項8に記載の絶縁膜の集積方法。
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