JP4631984B2 - 回路部材接続用接着剤、回路板、及びその製造方法 - Google Patents

回路部材接続用接着剤、回路板、及びその製造方法 Download PDF

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Publication number
JP4631984B2
JP4631984B2 JP2009158970A JP2009158970A JP4631984B2 JP 4631984 B2 JP4631984 B2 JP 4631984B2 JP 2009158970 A JP2009158970 A JP 2009158970A JP 2009158970 A JP2009158970 A JP 2009158970A JP 4631984 B2 JP4631984 B2 JP 4631984B2
Authority
JP
Japan
Prior art keywords
adhesive
circuit member
connection terminal
connection
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009158970A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010016383A (ja
JP2010016383A5 (https=
Inventor
伊津夫 渡辺
賢三 竹村
朗 永井
和博 井坂
治 渡辺
和良 小島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2009158970A priority Critical patent/JP4631984B2/ja
Publication of JP2010016383A publication Critical patent/JP2010016383A/ja
Publication of JP2010016383A5 publication Critical patent/JP2010016383A5/ja
Application granted granted Critical
Publication of JP4631984B2 publication Critical patent/JP4631984B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Liquid Crystal (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
JP2009158970A 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法 Expired - Fee Related JP4631984B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009158970A JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009158970A JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2009032626A Division JP4631979B2 (ja) 2009-02-16 2009-02-16 回路部材接続用接着剤並びに回路板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010210835A Division JP4631998B1 (ja) 2010-09-21 2010-09-21 回路部材接続用接着剤、回路板、及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010016383A JP2010016383A (ja) 2010-01-21
JP2010016383A5 JP2010016383A5 (https=) 2010-03-04
JP4631984B2 true JP4631984B2 (ja) 2011-02-16

Family

ID=41702125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009158970A Expired - Fee Related JP4631984B2 (ja) 2009-07-03 2009-07-03 回路部材接続用接着剤、回路板、及びその製造方法

Country Status (1)

Country Link
JP (1) JP4631984B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000009623A1 (fr) 1998-08-13 2000-02-24 Hitachi Chemical Company, Ltd. Adhesif pour fixer des elements de circuit, carte de circuit imprime et procede de production
JP4928378B2 (ja) * 2007-08-06 2012-05-09 日立化成工業株式会社 回路部材接続用接着剤
JP4631979B2 (ja) * 2009-02-16 2011-02-16 日立化成工業株式会社 回路部材接続用接着剤並びに回路板及びその製造方法
CN102471661B (zh) * 2010-04-09 2013-08-14 奥林巴斯医疗株式会社 内窥镜装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6015596A (en) * 1995-06-13 1997-01-09 Hitachi Chemical Company, Ltd. Semiconductor device, wiring board for mounting semiconducto r and method of production of semiconductor device
TW505686B (en) * 1996-07-15 2002-10-11 Hitachi Chemical Ltd Film-like adhesive for connecting circuit and circuit board
JP4440352B2 (ja) * 1997-02-17 2010-03-24 日立化成工業株式会社 回路部材接続用接着剤
JP2007113012A (ja) * 2006-11-13 2007-05-10 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP4928378B2 (ja) * 2007-08-06 2012-05-09 日立化成工業株式会社 回路部材接続用接着剤
JP4631979B2 (ja) * 2009-02-16 2011-02-16 日立化成工業株式会社 回路部材接続用接着剤並びに回路板及びその製造方法

Also Published As

Publication number Publication date
JP2010016383A (ja) 2010-01-21

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