JP4623987B2 - Capacitor and its mounting structure - Google Patents

Description

  The present invention relates to a capacitor and its mounting structure.

  In recent years, a structure in which internal electrodes are connected by through conductors has been proposed in a multilayer ceramic capacitor, which is a type of capacitor, in order to reduce equivalent series resistance and equivalent series inductance.

  8A and 8B are diagrams showing a conventional multilayer ceramic capacitor, where FIG. 8A is a plan view and FIG. 8B is a cross-sectional view showing a state where the multilayer ceramic capacitor is mounted on a wiring board.

The multilayer ceramic capacitor 30 shown in FIG. 8 is provided with a plurality of external terminals 37 and 38 on the lower surface of a multilayer body 31 in which a plurality of dielectric layers 32 are laminated via internal electrodes 33 and 34 therebetween. In the thickness direction of the dielectric layer 32, a plurality of through conductors 35 and 36 that connect the internal electrodes 33 and 34 are exposed on one outermost surface of the multilayer body 31, and external terminals 37 and 38, respectively. It is connected to the. Furthermore, a plurality of non-electrode forming regions 43 and 44 that are not connected to the plurality of through conductors 36 and 35 are formed in the internal electrodes 33 and 34.

  In addition, the multilayer ceramic capacitor 30 is formed by firing the unsintered laminated body 31 after removing the binder and forming the internal electrodes 33 and 34 and the through conductors 35 and 36 inside, and on the one main surface. After obtaining the multilayer body 31 with the through conductors 35 and 36 exposed, the external terminals 37 and 38 are formed on one main surface of the multilayer body 31 so as to be connected to the through conductors 35 and 36, respectively.

  Furthermore, the mounting structure of the multilayer ceramic capacitor 30 is such that the multilayer ceramic capacitor 30 is placed on the wiring substrate 11 and the external terminals 37 and 38 of the multilayer ceramic capacitor 30 are connected to the connection pads 12 of the wiring substrate 11 with a conductive adhesive. The gap formed between the multilayer ceramic capacitor 30 and the wiring board 11 is sealed with a resin material 16.

  However, according to the multilayer ceramic capacitor 30, since the connection strength by the conductive adhesive 15 is small, there is a limit in increasing the connection strength between the multilayer ceramic capacitor 30 and the wiring board 11.

  Therefore, the unevenness 31a is formed on the side surface of the multilayer ceramic capacitor 30 with a cutting tool such as a file, and a part of the resin material 16 is attached to the side surface of the multilayer ceramic capacitor 30 so that the unevenness 31a is covered. A mounting structure of the multilayer ceramic capacitor 30 is disclosed in Japanese Patent Laid-Open No. 06-268102.

According to the above publication, since the contact area between the side surface of the multilayer ceramic capacitor 30 and the resin material 16 is increased, the connection strength between the multilayer ceramic capacitor 30 and the wiring board 11 can be increased.
Japanese Patent Laid-Open No. 06-268102 (page 4, FIG. 1)

  However, according to the multilayer ceramic capacitor 30, when the multilayer ceramic capacitor 30 is downsized, it is difficult to accurately form the unevenness 31 a on the side surface.

  Further, according to the multilayer ceramic capacitor 30, since a part of the outer peripheral portion of the conductor films 33 and 34 serving as internal electrodes does not extend to the outer peripheral portion of the multilayer body 31, the binder removal is not sufficiently performed, There was a problem that structural defects such as lamination occurred. This is because the ceramic green sheet 32 serving as a dielectric layer is denser than the conductor films 33 and 34, so that the binder resin is less likely to be blown out through the ceramic green sheet 32. Further, in the case of the multilayer ceramic capacitor 30 in which the conductor films 33 and 34 are connected by the conductor portions 35 and 36 serving as through conductors, particularly when the distance between the conductor portions 35 and 36 is small, the conductor portions 35 and 36 include Since it is denser than 34, the binder removal was not sufficiently performed.

  The present invention has been devised in view of the above-mentioned problems, and its purpose is to increase the connection strength with the wiring board, to have good binder removal properties, and to prevent structural defects such as delamination and the capacitor. To provide a mounting structure.

In the capacitor of the present invention, a plurality of dielectric layers are alternately laminated with a first internal electrode or a second internal electrode interposed therebetween. A plurality of first penetrating conductors that are separated by two non-electrode forming regions and connecting the first internal electrodes, and the first internal electrodes are separated by a first non-electrode forming region; A plurality of second through conductors connecting the second internal electrodes are exposed through the plurality of dielectric layers in the thickness direction, and the first through conductor and the second through conductor are exposed. A capacitor provided with a plurality of first external terminals and second external terminals that are electrically connected to the through conductors, respectively, wherein the first internal electrode and the second internal electrode have outer peripheries. At least part of the outer periphery of the laminate. And has a extending portion extending are attached is ridge projecting outward from a side surface of the laminate to the extending portion, projecting strip is arranged in the stacking direction of the laminate A plurality are provided .

  The capacitor according to the present invention is characterized in that the protrusion is formed by plating.

Furthermore capacitor of the present invention, the laminate four sides cuboid der Rutotomoni having a on the side surface of the front Symbol laminate, one of the first internal electrode and the second internal electrode on the other hand it is characterized in that only attached to said protrusion is provided.

Internal further capacitor of the present invention is also only the protrusion which is attached to the first internal electrodes on the sides of one of the two side surfaces adjacent the stack, on the other side the second it is characterized in that only the ridges are attached to the electrodes is provided.

Furthermore capacitor of the present invention also, wherein the first attached to the inner electrodes has been the ridge and the second of said ribs that are attached to the inner electrode, its those of the edge portion is the laminate It is characterized by being arranged apart from a corner formed between two adjacent side surfaces.

Furthermore capacitor of the present invention also includes a plurality of said dielectric layer constituting said laminate along said outer periphery of the laminate in the dielectric layers adjacent in the vertical direction first internal electrode and the second nonexistent areas of internal electrodes exist, is characterized in that said dielectric layer to each other are joined directly at the region.

Furthermore, the capacitor according to the present invention includes the second internal electrode and the second internal electrode on the lower surface of a laminate in which a plurality of dielectric layers are alternately laminated with the first internal electrode or the second internal electrode interposed therebetween. Are separated by a second non-electrode forming region, and the plurality of first through conductors connecting the first inner electrodes and the first inner electrode are separated by a first non-electrode forming region. And a plurality of second through conductors connecting the second internal electrodes are exposed through in the thickness direction of the plurality of dielectric layers, and the first through conductor and the A capacitor provided with a plurality of first external terminals and second external terminals electrically connected to the second through conductor, respectively, between the dielectric layers, the first internal electrode or The second internal electrode is spaced apart While the Mie electrode is interposed, the dummy electrode has an extending portion whose end extends to the outer peripheral portion of the laminate, and the extended portion is located outward from the side surface of the laminate. A plurality of protrusions are provided side by side in the stacking direction of the laminate .

Furthermore capacitor of the present invention also provides said ridge width (w) and protruding height (h) is greater than the thickness (t) of said first internal electrode and the second internal electrode It is characterized by.

Furthermore capacitor of the present invention also, the laminate is cuboid der Rutotomoni and rounding processing radius of curvature 0.05mm~0.15mm is applied to the corner portion formed between the side surfaces adjacent the laminate It is characterized by being.

The mounting structure of the capacitor of the present invention, according to claim 1 or placing the capacitor according on the wiring board in any of claims 9 to Rutotomoni, the said capacitor first external terminal and the second external A capacitor mounting structure in which a terminal is electrically connected to a connection pad of the wiring board via a conductive adhesive, and a gap formed between the capacitor and the wiring board is sealed with a resin material. And a part of the resin material is attached to the side surface of the capacitor so as to cover the protrusions.

  According to the present invention, since the outer peripheral portion of the internal electrode or the dummy electrode extends to the outer peripheral portion of the laminated body, the binder removal property is good, and structural defects such as delamination can be prevented.

In addition, since the protrusions protruding outward from the side surface of the multilayer body are attached to the extending portion, even when the capacitor is downsized, the side surface of the multilayer body is accurately uneven. Further, by forming the protrusions by plating, in the case of electrolytic plating, the laminate is immersed in a plating solution and energized from the external terminal side. In the case of electroless plating, the laminate is formed. Is immersed in the plating solution and allowed to stand for a predetermined time, whereby the protrusions can be selectively formed on the extended material portion of the first or second internal electrode.

  Furthermore, the laminated body has a rectangular parallelepiped shape having four side surfaces, and a plurality of first internal electrodes and a plurality of internal electrodes arranged alternately in the lamination direction of the laminated body. It is composed of a second internal electrode, and each side surface of the laminate is provided with only the protrusions attached to either the first internal electrode or the second internal electrode. Even when the thickness of the dielectric layer is small, or when the width (w) and the protrusion height (h) of the protrusion are large, the protrusion is attached to the first internal electrode and the second internal electrode. It is possible to prevent the projected ridges from being connected.

  Furthermore, only the ridge attached to the first internal electrode on one side surface of the two adjacent side surfaces of the laminate is the ridge attached to the second internal electrode on the other side surface. Therefore, it is possible to more effectively prevent the protrusions attached to the first internal electrode and the protrusions attached to the second internal electrode from being connected.

  Still further, the protrusions attached to the first internal electrode and the protrusions attached to the second internal electrode have corner portions whose edge portions are formed between two adjacent side surfaces of the laminate. Since the protrusions attached to the first internal electrode and the protrusions attached to the second internal electrode can be prevented from being connected so as to cross over the corners because they are arranged more apart from each other.

  Furthermore, when the width (w) and height (h) of the protrusion are larger than the thickness (t) of the internal electrode, moisture or the like enters the internal electrode or dummy electrode from the outside. Can be effectively prevented.

  Furthermore, in the plurality of dielectric layers constituting the multilayer body, there is a region where no internal electrode exists along the outer peripheral portion of the multilayer body between the dielectric layers adjacent in the vertical direction. Since the layers are directly bonded to each other, the adhesion between the dielectric layers is greater than the adhesion strength between the dielectric layers and the internal electrodes, and effectively prevents delamination between the layers inside the laminate. Can do.

  Furthermore, while forming the said laminated body into a rectangular parallelepiped shape, the round part with a curvature radius of 0.05 mm-0.15 mm is given to the corner | angular part formed between adjacent side surfaces of a laminated body, and the said protrusion is formed. Becomes easier. That is, by performing rounding with a radius of curvature of 0.05 mm or more, it is possible to prevent the occurrence of cracks due to handling, and on the other hand, by performing rounding with a radius of curvature of 0.15 mm or less, it is possible to accurately form ridges. it can.

  When the external terminals of the capacitor are electrically connected to the connection pads of the wiring board via a conductive adhesive, the gap formed between the capacitor and the wiring board is sealed with a resin material, and the resin By attaching a part of the material to the side surface of the capacitor so that the protrusions are covered, the connection strength between the capacitor and the wiring board can be increased, and the life and deflection strength of the temperature cycle test can be improved.

  Hereinafter, a capacitor of the present invention and a mounting structure thereof will be described with reference to the accompanying drawings.

  1A and 1B are views showing a multilayer ceramic capacitor according to a first embodiment of the present invention, in which FIG. 1A is a plan view and FIG. 1B is a cross-sectional view showing a state mounted on a wiring board.

  In the figure, 10 is a multilayer ceramic capacitor, 2 is a dielectric layer, 3 and 4 are internal electrodes, 5 and 6 are through conductors (via hole conductors), and 7 and 8 are external terminals.

  A multilayer ceramic capacitor 10 shown in FIG. 1 is provided with a plurality of external terminals 7 and 8 on the lower surface of a multilayer body 1 in which a plurality of dielectric layers 2 are laminated via internal electrodes 3 and 4 therebetween. Further, in the thickness direction of these dielectric layers 2, a plurality of through conductors 5, 6 that connect the internal electrodes 3, 4 are exposed on one outermost surface of the multilayer body 1, and external terminals 7, 8, respectively. It is connected to the. Further, a plurality of non-electrode forming regions 13 and 14 that are not connected to the plurality of through conductors 6 and 5 are formed in the internal electrodes 3 and 4, respectively.

  Here, the characteristic point of the present invention is that at least a part of the outer peripheral portions of the internal electrodes 3 and 4 (the extending portions 3a and 4a extend to the outer peripheral portion of the multilayer body 1 and the extending portions 3a and 4a. The protrusions 17 and 18 projecting outward from the side surface of the laminated body 1 are attached.

  That is, since the protrusions 17 and 18 projecting outward from the side surface of the multilayer body 1 are attached to the extending portions 3a and 4a, unevenness is accurately formed on the side surface even when the multilayer ceramic capacitor 10 is downsized. Therefore, when the external terminals 7 and 8 of the multilayer ceramic capacitor 10 are electrically connected to the connection pads 12 of the wiring substrate 11 via the conductive adhesive 15, the multilayer ceramic capacitor 10 and the wiring substrate 11 can be connected to each other. The gap formed therebetween is sealed with the resin material 16, and a part of the resin material 16 is attached to the side surface of the multilayer ceramic capacitor 10 so as to cover the ridges 17 and 18. The connection strength between the ceramic capacitor 10 and the wiring substrate 11 can be increased, and the life and deflection strength of the temperature cycle test can be improved.

  The conductive adhesive 15 here includes solder and the like in addition to the conductive resin.

  Next, a method for manufacturing the multilayer ceramic capacitor 10 of the present invention will be described with reference to the drawings. In addition, about a laminated body, suppose that a code | symbol is not distinguished in all the processes.

  First, conductor films 3 and 4 serving as internal electrodes are formed on a ceramic green sheet 2 serving as a dielectric layer by printing and drying a conductive paste. At this time, the non-electrode forming regions 13 and 14 are also formed. In addition, at least a part of the outer peripheries of the conductor films 3 and 4 (portions that become the extended material portions 3a and 4a) extends so as to cross the cutting line. Note that an organic ferroelectric material may be used as the dielectric layer 2.

  Next, the required number of ceramic green sheets 2 on which the conductor films 3 and 4 are formed are alternately stacked to form a large laminate from which the laminate 1 is extracted.

  Next, through holes penetrating the conductor films 3 and 4 and the ceramic green sheet 2 are formed on the main surface of the large-sized laminate by laser irradiation or a punching method using micro drilling or punching.

  Next, by filling the through holes with a conductive paste similar to the conductive paste used for the conductor layers 3 and 4, conductor portions 5 and 6 serving as through conductors are formed.

  In addition, a through hole is made in advance in the ceramic green sheet 2 to be a dielectric layer by a punching method using a micro drill or punching, and a conductive film to be an internal electrode on the ceramic green sheet 2 by a screen printing method. At the same time as printing 3 and 4, the conductive portions 5 and 6 may be formed and then laminated by filling the through holes with a conductive paste.

  Next, the large-sized laminate is cut by a press cutting process, a dicing method, or the like to obtain the unfired laminate 1. In the unfired laminate 1, the internal electrodes 3 and 4 and the through conductors 5 and 6 are formed, the through conductors 5 and 6 are exposed on one main surface, and the outer peripheral portions of the internal electrodes 3 and 4 are exposed. Among these, at least a part (the extended material portions 3a and 4a) extends to the outer peripheral portion.

  Next, this unfired laminated body 1 is baked after the binder removal treatment, and the laminated body 1 placed inside is obtained.

  At this time, since the extended material portions 3a and 4a are extended to the outer peripheral portion of the laminated body 1, the binder removal property is good, and structural defects such as delamination can be prevented.

  Next, since the surfaces of the through conductors 5 and 6 exposed on one main surface of the multilayer body 1 and the extending portions 3a and 4a extending to the outer peripheral portion of the multilayer body 1 are oxidized, by surface polishing, Remove the oxide film.

  Subsequently, Ni plating, Sn plating, or the like is formed on the exposed portions of the through conductors 5 and 6. At this time, the protrusions 17 and 18 are formed on the extending portions 3 a and 4 a where the internal electrodes 3 and 4 extend to the outer peripheral portion of the multilayer body 1 by plating or the like. The plating may be either electroless plating or electrolytic plating. However, when electrolytic plating is used, electrification is selected from the parts 3a and 4a of the internal electrodes 3 and 4 by energizing from the side that becomes the external terminals 7 and 8. Thus, the protrusions 17 and 18 can be formed. Further, at this time, it is necessary to prevent the protrusion 17 attached to the internal electrode 3 and the protrusion 18 attached to the internal electrode 4 from being connected by controlling the immersion time in the plating solution. .

  Next, by forming a solder to be the external terminals 7 and 8 by a screen printing method of solder paste or by mounting a solder ball after applying a flux, the external terminals 7 and 8 are formed by applying a reflow process. It is formed.

  Through the above steps, the multilayer ceramic capacitor 10 as shown in FIG. 1 is manufactured.

  Next, another embodiment of the present invention will be described with reference to FIG. In addition, description is abbreviate | omitted about the component similar to the capacitor | condenser of embodiment mentioned above, and only a different point shall be demonstrated.

  2A and 2B are views showing a multilayer ceramic capacitor according to another embodiment of the present invention, wherein FIG. 2A is a plan view showing a dielectric layer on which a first internal electrode is formed, and FIG. It is a top view which shows the dielectric material layer in which the internal electrode was formed. In the figure, the laminated body 1 has a rectangular parallelepiped shape having four side surfaces, and a plurality of first internal electrodes in which the internal electrodes 3 and 4 are alternately arranged in the laminating direction of the laminated body 1. 3 and a plurality of second internal electrodes 4, and a protrusion attached to one of the first internal electrode 3 and the second internal electrode 4 on each side surface of the laminate 1. Since only the strips 17 and 18 are provided, the dielectric layer 2 is attached to the first internal electrode 3 even when the thickness of the dielectric layer 2 is small, or when the width and the projection height of the projections 17 and 18 are large. It is possible to prevent the protrusion 17 and the protrusion 18 attached to the second internal electrode 4 from being connected.

Furthermore, only the protrusion 17 attached to the first internal electrode 3 on one side surface of the two adjacent side surfaces of the laminate 1 was attached to the second internal electrode 4 on the other side surface. Since only the protrusion 18 is provided, it is possible to more effectively prevent the protrusion 17 attached to the first internal electrode 3 and the protrusion 18 attached to the second internal electrode 4 from being connected. it can.

  Further, the ridge 17 attached to the first internal electrode 3 and the ridge 18 attached to the second internal electrode 4 are formed between two adjacent side surfaces of the multilayer body 1 at the edge portion. Since the protrusions 17 attached to the first internal electrode 3 and the protrusions 18 attached to the second internal electrode 4 straddle the corners, the protrusions 17 are arranged away from the corners. Connection can be prevented.

  Next, still another embodiment of the present invention will be described with reference to FIG. In addition, description is abbreviate | omitted about the component similar to the capacitor | condenser of embodiment mentioned above, and only a different point shall be demonstrated.

  FIG. 3 is a view showing a multilayer ceramic capacitor according to still another embodiment of the present invention, and is a schematic view showing an overlapping state of first and second internal electrodes. According to the figure, the ridge 17 attached to the first internal electrode 3 is formed on two adjacent side surfaces of the multilayer body 1, and the ridge attached to the second internal electrode 4. 18 is formed on the two adjacent side surfaces of the laminate 1. Thereby, an electrical property check can be easily performed by forming the characteristic measurement terminals on the pair of opposing side surfaces of the laminate 1 in the intermediate manufacturing process (after firing).

  Next, still another embodiment of the present invention will be described with reference to FIG. In addition, description is abbreviate | omitted about the component similar to the capacitor | condenser of embodiment mentioned above, and only a different point shall be demonstrated.

  FIG. 4 is a view showing a multilayer ceramic capacitor according to still another embodiment of the present invention, and is a partially enlarged view showing an extension portion and a protrusion of an internal electrode in an outer peripheral portion of the multilayer body. According to the figure, the width (w) and the protrusion height (h) of the ridge are larger than the thickness (t) of the internal electrode, so that moisture and the like enter the internal electrodes 3 and 4 from the outside. Can be prevented.

  Further, in the above-described embodiment, the plurality of dielectric layers 2 constituting the multilayer body 1 include the internal electrodes 3, 4 along the outer peripheral portion of the multilayer body 1 between the dielectric layers 2 adjacent in the vertical direction. In this region, the dielectric layers 2 are directly bonded to each other, so that the adhesion between the dielectric layers 2 is greater than the adhesion strength between the dielectric layer 2 and the internal electrodes 3 and 4. Therefore, delamination inside the laminate 1 can be prevented. On the other hand, the internal electrodes 3, 4 (extending portions 3 a, 4 a) may extend over the entire outer peripheral portion of the multilayer body 1.

As a result, the binder removal property is further improved, the connection strength between the multilayer ceramic capacitor 10 and the wiring board 11 can be further increased, and the variation in the overlapping area of the internal electrodes 3 and 4 can be completely eliminated. .

  Moreover, it is desirable that the laminated body 1 has a rectangular parallelepiped shape, and the corners formed between adjacent side surfaces of the laminated body 1 are rounded with a curvature radius of 0.05 mm to 0.15 mm. . That is, since rounding with a curvature radius of 0.05 mm or more is performed, it is possible to prevent the occurrence of cracks due to handling. On the other hand, since the rounding process with a radius of curvature of 0.15 mm or less is performed, the ridges can be formed with high accuracy.

  Furthermore, the laminated body 1 may have a shape other than a rectangular parallelepiped shape.

  Further, the protrusions 17 and 18 may be plated other than metal. Thereby, even if the protrusion 17 attached to the first internal electrode 3 on one side is connected to the protrusion 18 attached to the second internal electrode 4 on the other side, there is no problem. .

  Next, still another embodiment of the present invention will be described with reference to FIGS. In addition, description is abbreviate | omitted about the component similar to the capacitor | condenser of embodiment mentioned above, and only a different point shall be demonstrated.

  5A and 5B are diagrams showing a capacitor according to another embodiment of the present invention, in which FIG. 5A is a schematic view showing the overlapping state of the first and second internal electrodes, and FIG. 5B is a state mounted on a wiring board. (C) is the elements on larger scale which show the extension part and protrusion of the dummy electrode in the outer peripheral part of a laminated body.

  In the capacitor of this embodiment, a dummy electrode 3b that is separated from the internal electrodes 3 and 4 is disposed between the dielectric layers 2-2, and the end of the dummy electrode 3b extends to the outer peripheral portion of the multilayer body 1. In addition, the protrusions 17 and 18 projecting outward from the side surface of the laminate 1 are attached to the extending portion.

  In the capacitor of this embodiment, in addition to the same effects as those of the above-described embodiment, the plating solution contacts the internal electrodes 3 and 4 between the dielectric layers when the protrusion is formed by plating. Since there is almost nothing, there is an advantage that it is possible to effectively prevent the occurrence of cracks due to thermal shock.

  At this time, when the thickness of the dummy electrodes 3b and 4b is t2, and the protrusion height of the protrusions 17 and 18 is h2, it is desirable that h2 / t2> 0.5. Thereby, the unevenness | corrugation of a moderate magnitude | size can be formed in the side surface of the laminated body 1, and the connection strength of the capacitor | condenser 10 and the wiring board 11 can be raised more effectively.

  In the capacitor of another embodiment shown in FIG. 6, the dummy electrodes 3b and 4b are each divided into a plurality of pieces. In this case, since the surface area per unit volume of the ridges 17 and 18 increases, the connection strength between the multilayer ceramic capacitor 10 and the wiring board 11 can be further improved. At this time, the dummy electrodes 3b and 4b are arranged so that the protrusions 17 and 18 overlap in the stacking direction as shown in (a), or the protrusions 17 and 18 are shifted in the stacking direction as shown in (b). Alternatively, the ends of the dummy electrodes 3b and 4b may be extended to the corners of the multilayer body 1, which also improves the connection strength between the multilayer ceramic capacitor 10 and the wiring board 11. Can be made.

Furthermore, in the capacitor of another embodiment shown in FIG. 7 , dummy electrodes 9 are also arranged between the dielectric layers 2 where the internal electrodes 3 and 4 do not exist. Thereby, since the uneven | corrugated formation area can be ensured widely in the side surface of the laminated body 1, the connection strength of the multilayer ceramic capacitor 10 and the wiring board 11 can further be improved. At this time, the thickness of the dummy electrode 9 may be different from the thickness of the internal electrodes 3 and 4.

  In addition, this invention is not limited to the above embodiment, A various change and improvement can be added in the range which does not deviate from the summary of this invention.

  For example, the multilayer ceramic capacitor 10 may be mounted on the wiring substrate 11 having a flat upper surface, or may be mounted on the bottom surface of a recess provided on the upper surface of the wiring substrate 11.

It is a figure which shows the capacitor | condenser which concerns on one Embodiment of this invention, (a) is schematic which shows the overlapping state of the 1st and 2nd internal electrode, (b) is sectional drawing which shows the state mounted on the wiring board. It is. It is a figure which shows the capacitor | condenser which concerns on other embodiment of this invention, (a) is a top view which shows the dielectric material layer in which the 1st internal electrode was formed, (b) was the 2nd internal electrode formed It is a top view which shows a dielectric material layer. It is a figure which shows the capacitor | condenser which concerns on other embodiment of this invention, and is the schematic which shows the overlapping state of the 1st and 2nd internal electrode. It is a figure which shows the multilayer ceramic capacitor which concerns on other embodiment of this invention, and is the elements on larger scale which show the extension part and protrusion of an internal electrode in the outer peripheral part of a laminated body. It is a figure which shows the multilayer ceramic capacitor which concerns on other embodiment of this invention, (a) is the schematic which shows the overlapping state of the 1st and 2nd internal electrode, (b) is the state mounted on the wiring board. (C) is the elements on larger scale which show the extension part and protrusion of a dummy conductor in the outer peripheral part of a laminated body. It is the schematic which shows the multilayer ceramic capacitor which concerns on other embodiment of this invention, (a) When arrange | positioning so that a protrusion may overlap in the lamination direction, (b) When arrange | positioning a protrusion shifting in the lamination direction It is. It is sectional drawing which shows the multilayer ceramic capacitor which concerns on other embodiment of this invention. It is a figure which shows the conventional multilayer ceramic capacitor, (a) is a top view, (b) is sectional drawing which shows the state mounted on the wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Multilayer ceramic capacitor 1 ... Laminate body 2 ... Dielectric layer 3, 4 ... Internal electrode 3a, 4a ... Extended material part 3b, 4b, 9 ... Dummy electrode 5, 6 ... Penetration conductors 7, 8 ... External terminals 13, 14 ... Non-electrode forming regions 17, 18 ... Projections 11 ... Wiring substrate 12 ... Connection pads 15 ... Conductive bonding Agent 16 ... resin material

Claims (10)

A second non-electrode-forming region is formed on the lower surface of the laminate in which a plurality of dielectric layers are alternately laminated with the first internal electrodes or the second internal electrodes interposed therebetween. The plurality of first through conductors that are connected to each other by the first internal electrodes and the first internal electrodes are separated by a first non-electrode forming region, and the second internal electrodes A plurality of second through conductors connected to each other penetrate through the plurality of dielectric layers in the thickness direction and are exposed to the first through conductor and the second through conductor, respectively. A capacitor provided with a plurality of first external terminals and second external terminals connected to each other,
The first internal electrode and the second internal electrode have at least a portion of the outer peripheral portion extending to the outer peripheral portion of the laminate, and the extension portion The capacitor | condenser which protrudes outward from a side surface is attached, and this protrusion is provided with two or more along with the lamination direction of the said laminated body .   The capacitor according to claim 1, wherein the protrusion is formed by plating.   The laminate has a rectangular parallelepiped shape having four side surfaces, and the protrusions attached to either the first internal electrode or the second internal electrode on the side surface of the laminate. The capacitor according to claim 2, wherein only the capacitor is provided.   Only the protrusions attached to the first internal electrode on one side surface of two adjacent side surfaces of the laminated body, and the protrusion attached to the second internal electrode on the other side surface. The capacitor according to claim 3, wherein only a strip is provided.   The protrusions attached to the first internal electrode and the protrusions attached to the second internal electrode have their edge portions formed between two adjacent side surfaces of the laminate. The capacitor according to claim 4, wherein the capacitor is arranged so as to be spaced apart from a corner portion.   The plurality of dielectric layers constituting the multilayer body are arranged between the first internal electrode and the second internal electrode along the outer periphery of the multilayer body between the dielectric layers adjacent in the vertical direction. 6. The capacitor according to claim 1, wherein a region that does not exist is present, and the dielectric layers are directly bonded to each other in the region. A second non-electrode-forming region is formed on the lower surface of the laminate in which a plurality of dielectric layers are alternately laminated with the first internal electrodes or the second internal electrodes interposed therebetween. The plurality of first through conductors that are connected to each other by the first internal electrodes are separated from the first internal electrodes by a first non-electrode forming region, and the second internal electrodes A plurality of second through conductors connected to each other are exposed through the plurality of dielectric layers in the thickness direction, and are electrically connected to the first through conductor and the second through conductor, respectively. A capacitor provided with a plurality of first external terminals and second external terminals connected to each other,
Between the dielectric layers, a dummy electrode arranged to be spaced apart from the first internal electrode or the second internal electrode is interposed, and the end of the dummy electrode extends to the outer peripheral portion of the multilayer body. And a protrusion that protrudes outward from a side surface of the laminate is attached to the extension, and the protrusion extends in the stacking direction of the laminate. A capacitor characterized in that a plurality of capacitors are provided side by side .   The width (w) and the protruding height (h) of the ridge are larger than the thickness (t) of the first internal electrode and the second internal electrode. 8. The capacitor according to any one of 7.   The laminated body has a rectangular parallelepiped shape, and a corner portion formed between adjacent side surfaces of the laminated body is rounded with a curvature radius of 0.05 mm to 0.15 mm. The capacitor according to claim 8. The capacitor according to any one of claims 1 to 9 is placed on a wiring board, and the first external terminal and the second external terminal of the capacitor are electrically connected to a connection pad of the wiring board. A capacitor mounting structure that is electrically connected via an adhesive,
A gap formed between the capacitor and the wiring board is sealed with a resin material, and a part of the resin material is attached to the side surface of the capacitor so that the protrusion is covered. Capacitor mounting structure characterized by that.

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