JP4617888B2 - 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 - Google Patents

蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Download PDF

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Publication number
JP4617888B2
JP4617888B2 JP2005007206A JP2005007206A JP4617888B2 JP 4617888 B2 JP4617888 B2 JP 4617888B2 JP 2005007206 A JP2005007206 A JP 2005007206A JP 2005007206 A JP2005007206 A JP 2005007206A JP 4617888 B2 JP4617888 B2 JP 4617888B2
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JP
Japan
Prior art keywords
light
phosphor
emitting device
group
peak
Prior art date
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Expired - Fee Related
Application number
JP2005007206A
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English (en)
Japanese (ja)
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JP2005226067A5 (enExample
JP2005226067A (ja
Inventor
孝俊 瀬戸
直人 木島
正彦 吉野
昌義 三上
統之 茂岩
宏之 伊村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP2005007206A priority Critical patent/JP4617888B2/ja
Publication of JP2005226067A publication Critical patent/JP2005226067A/ja
Publication of JP2005226067A5 publication Critical patent/JP2005226067A5/ja
Application granted granted Critical
Publication of JP4617888B2 publication Critical patent/JP4617888B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
JP2005007206A 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置 Expired - Fee Related JP4617888B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005007206A JP4617888B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004009768 2004-01-16
JP2005007206A JP4617888B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Publications (3)

Publication Number Publication Date
JP2005226067A JP2005226067A (ja) 2005-08-25
JP2005226067A5 JP2005226067A5 (enExample) 2007-06-21
JP4617888B2 true JP4617888B2 (ja) 2011-01-26

Family

ID=37879340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005007206A Expired - Fee Related JP4617888B2 (ja) 2004-01-16 2005-01-14 蛍光体、及びそれを用いた発光装置、照明装置、ならびに画像表示装置

Country Status (2)

Country Link
JP (1) JP4617888B2 (enExample)
CN (1) CN1934218A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007016229A1 (de) * 2007-04-04 2008-10-09 Litec Lll Gmbh Verfahren zur Herstellung von Leuchtstoffen basierend auf Orthosilikaten für pcLEDs
US20110278614A1 (en) * 2008-09-04 2011-11-17 Bayer Materialscience Ag Light emitting device, and method for the production thereof
CN104694118A (zh) * 2013-12-06 2015-06-10 厦门百嘉祥微晶材料科技股份有限公司 一种球形白光荧光粉及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544482A (en) * 1968-03-15 1970-12-01 Sylvania Electric Prod Europium and manganese activated alkaline earth silicate phosphors
DE10259946A1 (de) * 2002-12-20 2004-07-15 Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. Leuchtstoffe zur Konversion der ultravioletten oder blauen Emission eines lichtemittierenden Elementes in sichtbare weiße Strahlung mit sehr hoher Farbwiedergabe

Also Published As

Publication number Publication date
JP2005226067A (ja) 2005-08-25
CN1934218A (zh) 2007-03-21

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