CN1934218A - 荧光体和使用该荧光体的发光装置和照明装置以及图像显示装置 - Google Patents

荧光体和使用该荧光体的发光装置和照明装置以及图像显示装置 Download PDF

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Publication number
CN1934218A
CN1934218A CN200580008573.8A CN200580008573A CN1934218A CN 1934218 A CN1934218 A CN 1934218A CN 200580008573 A CN200580008573 A CN 200580008573A CN 1934218 A CN1934218 A CN 1934218A
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CN
China
Prior art keywords
arcsin
sin
satisfies
light
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200580008573.8A
Other languages
English (en)
Chinese (zh)
Inventor
瀬户孝俊
木岛直人
吉野正彦
三上昌义
茂岩统之
伊村宏之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Publication of CN1934218A publication Critical patent/CN1934218A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Led Devices (AREA)
CN200580008573.8A 2004-01-16 2005-01-14 荧光体和使用该荧光体的发光装置和照明装置以及图像显示装置 Pending CN1934218A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP009770/2004 2004-01-16
JP009768/2004 2004-01-16
JP2004009768 2004-01-16
JP009769/2004 2004-01-16

Publications (1)

Publication Number Publication Date
CN1934218A true CN1934218A (zh) 2007-03-21

Family

ID=37879340

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580008573.8A Pending CN1934218A (zh) 2004-01-16 2005-01-14 荧光体和使用该荧光体的发光装置和照明装置以及图像显示装置

Country Status (2)

Country Link
JP (1) JP4617888B2 (enExample)
CN (1) CN1934218A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104694118A (zh) * 2013-12-06 2015-06-10 厦门百嘉祥微晶材料科技股份有限公司 一种球形白光荧光粉及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007016229A1 (de) * 2007-04-04 2008-10-09 Litec Lll Gmbh Verfahren zur Herstellung von Leuchtstoffen basierend auf Orthosilikaten für pcLEDs
US20110278614A1 (en) * 2008-09-04 2011-11-17 Bayer Materialscience Ag Light emitting device, and method for the production thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3544482A (en) * 1968-03-15 1970-12-01 Sylvania Electric Prod Europium and manganese activated alkaline earth silicate phosphors
DE10259946A1 (de) * 2002-12-20 2004-07-15 Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. Leuchtstoffe zur Konversion der ultravioletten oder blauen Emission eines lichtemittierenden Elementes in sichtbare weiße Strahlung mit sehr hoher Farbwiedergabe

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104694118A (zh) * 2013-12-06 2015-06-10 厦门百嘉祥微晶材料科技股份有限公司 一种球形白光荧光粉及其制备方法

Also Published As

Publication number Publication date
JP4617888B2 (ja) 2011-01-26
JP2005226067A (ja) 2005-08-25

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication