JP4615411B2 - Magnetic disk substrate processing equipment - Google Patents

Magnetic disk substrate processing equipment Download PDF

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JP4615411B2
JP4615411B2 JP2005280895A JP2005280895A JP4615411B2 JP 4615411 B2 JP4615411 B2 JP 4615411B2 JP 2005280895 A JP2005280895 A JP 2005280895A JP 2005280895 A JP2005280895 A JP 2005280895A JP 4615411 B2 JP4615411 B2 JP 4615411B2
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deburring
substrate
circular substrate
circular
outer edge
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JP2007090464A (en
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英希 高橋
高志 森
泰之 大関
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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本発明は、磁気ディスク用基板の加工装置に関するものである。   The present invention relates to a magnetic disk substrate processing apparatus.

磁気ディスク用基板は、金属(アルミニウム合金)素条をダイス,パンチ及びストリッパを備えたプレス用金型によりドーナツ状に打抜き、打抜いた基板を加圧焼鈍して歪みを除いた後、サブストレート加工(内外縁部の研削、表面研削)⇒メッキ加工⇒研磨加工による仕上げ工程を経て製品とされる。(例えば後記特許文献1)。
図17で示すように、金属素条を打ち抜いた円形基板1(ブランク材)の外縁部には、
打抜き時にダイスの刃により切断された剪断面側(図の下面側)にダレ(端面ダレ)11が形成される一方、パンチの刃により破断される破断面側(図の上面側)には破断によるバリ10や微細な凹凸が形成される。前記のダレ11やバリ10は、パンチの内縁の刃とホールパンチの外縁の刃により円形基板1の内縁部にも同様に形成される。
The substrate for a magnetic disk is formed by punching a metal (aluminum alloy) strip into a donut shape with a press die equipped with a die, a punch and a stripper. Processing (grinding of inner and outer edges, surface grinding) ⇒ plating processing ⇒ Finished by finishing process. (For example, patent document 1 mentioned later).
As shown in FIG. 17, on the outer edge of the circular substrate 1 (blank material) punched out of the metal strip,
A sag (end face sag) 11 is formed on the shear surface side (lower surface side in the figure) cut by the die blade during punching, while a fracture surface side (upper surface side in the figure) broken by the punch blade is broken. As a result, burrs 10 and fine irregularities are formed. The sagging 11 and the burr 10 are similarly formed on the inner edge of the circular substrate 1 by the inner edge of the punch and the outer edge of the hole punch.

前記のバリ10は、サブストレート加工時の研磨により円形基板1から除去されるが、それよりも前の時点では、基板1が積層される過程などにおいて、その外縁部がスタッキング部(積重ね部)のガイドその他の部材に接触し、外縁部のバリ10や微細な凹凸が一部脱落して切粉(以下「バリ屑」という。)が発生する。
なお、このバリ屑は基板1の外縁部において特に多く発生するが、内縁部においても発生する。内縁部のバリ屑は、特に内縁部を利用して基板が支持される(積重ねガイドピンに基板の内縁部が接触する)スタッキング部においてより多く発生する。
The burr 10 is removed from the circular substrate 1 by polishing at the time of substrate processing. At a time earlier than that, the outer edge portion of the burr 10 is a stacking portion (stacked portion) in the process of laminating the substrate 1 or the like. The other burrs 10 and fine irregularities on the outer edge part drop off, and chips (hereinafter referred to as “burr waste”) are generated.
Note that this burr scraps are particularly generated at the outer edge portion of the substrate 1, but are also generated at the inner edge portion. More debris at the inner edge is generated more particularly in the stacking portion where the substrate is supported using the inner edge (the inner edge of the substrate contacts the stacked guide pins).

前記バリ屑の一部は、基板上(基板面)に付着したまま残り、それらのバリ屑は、基板が積層されると基板相互の間に挟み込まれた状態になり、その後の基板の加圧焼鈍時やシュリンク包装される際、あるいはシュリンク包装後の輸送中に面圧が加わることにより基板面に埋め込まれた状態になる。基板面に埋め込み状態になっているバリ屑は、その後のサブストレート加工時の表面研削により基板面から脱落するが、バリ屑の基板面への埋め込み量が基板の研削代よりも大きい場合には、表面研削後に当該埋め込み部分の凹みがビットとなり、ディスクの品質低下を招く。
特開平05−314474号
A part of the burr debris remains attached on the substrate (substrate surface), and the burr debris is sandwiched between the substrates when the substrates are stacked, and then the substrate is pressed. When annealing or shrink wrapping, or during transportation after shrink wrapping, a surface pressure is applied, resulting in a state embedded in the substrate surface. The burrs that are embedded in the substrate surface fall off from the substrate surface by surface grinding during subsequent substrate processing, but if the amount of embedded burrs on the substrate surface is greater than the grinding allowance for the substrate Then, after the surface grinding, the recessed portion of the embedded portion becomes a bit, and the quality of the disc is deteriorated.
JP 05-314474 A

本発明が解決しようとする課題は、打抜き後の過程で基板から脱落するバリ屑等の製品への影響を排除した磁気ディスク用基板の加工装置を提供することにある。   The problem to be solved by the present invention is to provide a magnetic disk substrate processing apparatus that eliminates the influence on products such as debris that falls off the substrate in the process after punching.

本発明に係る磁気ディスク用基板の加工装置は、前記課題を解決するため、第1にドーナツ状の円形基板を保持するピックアップ手段と、当該ピックアップ手段により保持された円形基板縁部が転接されるバリ取りガイド41、叉は前記ピックアップ手段により保持された円形基板縁部へ転接されるバリ取りガイド41を含むバリ取り手段とを備え、前記バリ取りガイド41は、前記円形基板1の対応縁部が案内される溝状部41aを有し、当該溝状部41aの中央を境界として分割され、軸44に回転自在に片持支持されたパーツ42,43によって構成され、少なくとも一方のパーツ42を他方のパーツ43へ押し付けるコイルばねからなる付勢部材40bを備えるとともに、前記軸44の先端に上記付勢部材40bを受け止めるフランジ状のばね受けを設けことを特徴としている。 The substrate processing device for a magnetic disk according to the present invention, in order to solve the above problems, a pickup unit 3 for holding a circular substrate 1 donut shape first, of the circular substrate 1 held by the pick-up means 3 deburring guide 41 edge is rolling bordered, or is a deburring unit 4 including the deburring guide 41 bordered rolling the inner edge of the circular substrate 1 held by the pick-up unit 3, the burr The take-up guide 41 has a groove-like portion 41a through which the corresponding edge portion of the circular substrate 1 is guided, is divided with the center of the groove-like portion 41a as a boundary, and is a part that is cantilevered and supported rotatably on a shaft 44. The biasing member 40b is formed of a coil spring configured to press at least one part 42 against the other part 43, and the biasing member 4 is provided at the tip of the shaft 44. In that a flange-like spring receiver for receiving the 0b is a feature.

第2に、前記バリ取り手段4は、前記ピックアップ手段3により保持された円形基板1の外縁部へ転接されるバリ取りガイド40をさらに含むことを特徴としている。Secondly, the deburring means 4 further includes a deburring guide 40 that is brought into rolling contact with the outer edge of the circular substrate 1 held by the pickup means 3.

第3に、前記ピックアップ手段3により保持された円形基板1へ対応するバリ取りガイド41が接触したときに、前記円形基板1を回転させることを特徴としている。Third, the circular substrate 1 is rotated when the corresponding deburring guide 41 contacts the circular substrate 1 held by the pickup means 3.

第4に、前記バリ取りガイド41を前記円形基板1の方向に押し付ける付勢部材41bを備えたことことを特徴としている。Fourthly, a biasing member 41b that presses the deburring guide 41 in the direction of the circular substrate 1 is provided.

第5に、前記バリ取りガイド41は、前記円形基板1の対応縁部が案内される溝状部41aを有することことを特徴としている。Fifthly, the deburring guide 41 has a groove-like portion 41a through which a corresponding edge portion of the circular substrate 1 is guided.

第6に、前記ピックアップ手段4は、前記円形基板1の外周へ分散するように配置された後当該円形基板1の外縁部へ押付けられるまで相互の間隔を縮小して当該円形基板の外縁をチャックする状態の三個以上の外縁チャック35により構成されていることことを特徴としている。Sixth, the pick-up means 4 is arranged so as to be dispersed on the outer periphery of the circular substrate 1 and then reduces the mutual interval until it is pressed against the outer edge of the circular substrate 1 to chuck the outer edge of the circular substrate 1 It is characterized by being constituted by three or more outer edge chucks 35 in a state of being performed.

本発明に係る磁気ディスク用基板の加工装置によれば、円形基板を保持するピックアップ手段と、当該ピックアップ手段により保持された円形基板の縁部が転接されるバリ取りガイドを含むバリ取り手段とを備えているので、縁部のバリ及び微細な凹凸等を効率的かつ短時間に除去することができる。 According to the machining apparatus of the magnetic disk substrate according to the present invention, a pickup means for holding a circular substrate, deburring means including a deburring guide the inner edge of the circular substrate held by the pick-up means is rolling bordered is provided with the bets can be removed burrs and fine irregularities or the like of the inner edge efficiently in a short time.

第1実施形態
図1は、本発明に係る第1実施形態の磁気ディスク用基板の加工装置を設置した搬送ラインの流れ図であり、打抜き後の円形基板1を搬送する例えばベルトコンベア等の搬送ライン2の途中には、搬送中の円形基板1をピックアップして保持するピックアップ部3aと、保持された状態の円形基板1の外縁部及び外縁部にバリ取り加工を施すバリ取り加工部4aとが順に設置されている。
ピックアップ部3aはピックアップ手段3を備えており、バリ取り加工部4aはバリ取り手段4を備えている。ピックアップ手段3が複数設置されている場合は、バリ取り手段4もそれに対応するように複数設置するのが好ましい。
前記バリ取り加工部4aのバリ取り手段4により外・内縁部のバリが除去された円形基板1は、ピックアップ手段3で保持された状態でスタッキング部5に供給され、順次スタッキングされるか、あるいは、一旦搬送ライン2に戻された後、そのまま又は洗浄を施されてからスタッキング部5へ搬送され順次スタッキングされる。
First Embodiment FIG. 1 is a flowchart of a conveyance line in which a magnetic disk substrate processing apparatus according to a first embodiment of the present invention is installed, and a conveyance line such as a belt conveyor that conveys a circular substrate 1 after punching. In the middle of 2, a pick-up unit 3 a that picks up and holds the circular substrate 1 being transported, and a deburring unit 4 a that deburrs the outer edge and the outer edge of the held circular substrate 1. They are installed in order.
The pickup unit 3 a includes a pickup unit 3, and the deburring unit 4 a includes a deburring unit 4. When a plurality of pickup means 3 are installed, it is preferable to install a plurality of deburring means 4 so as to correspond thereto.
The circular substrate 1 from which the burrs on the outer and inner edges have been removed by the deburring means 4 of the deburring section 4a is supplied to the stacking section 5 while being held by the pickup means 3, and sequentially stacked. Once returned to the transfer line 2, it is transferred to the stacking unit 5 as it is or after being washed and sequentially stacked.

ピックアップ手段3は、例えば図2で示すような単一の吸引パッド30又は図3,4で示すような複数の吸引パッド30から構成され、それらの吸引パッド30は吸引パイプ31を通じて図示しない真空ボックスへ接続されている。
図3及び図4で示すように、複数の吸引パッド30を有するピックアップ手段3は、各吸引パッド30がそれぞれの分岐パイプ32及び連結具33を介して一つの吸引パイプ31へ接続されている。
The pickup means 3 is composed of, for example, a single suction pad 30 as shown in FIG. 2 or a plurality of suction pads 30 as shown in FIGS. 3 and 4, and these suction pads 30 are not shown through a suction pipe 31. Connected to.
As shown in FIGS. 3 and 4, in the pickup means 3 having a plurality of suction pads 30, each suction pad 30 is connected to one suction pipe 31 via a branch pipe 32 and a connecting tool 33.

他のピックアップ手段3は、例えば図5及び図6で示すように円形基板1の内縁をチャックする複数の内縁チャック34により構成される。各内縁チャック34は、搬送中の円形基板1の内縁と干渉しない状態(接触叉は近接した状態)で当該基板1の孔内へ案内され(図5)た後、先端部の状部34aの内部が円形基板1の内縁部へ押付けられるまで相互の間隔を拡大して当該円形基板1をチャックするように構成されている。
前述のように、各内縁チャック34には、円形基板1のチャッキングを確実にするため先端部へ円形基板1の内縁が案内されるように状部34aが形成されている。
The other pickup means 3 is constituted by a plurality of inner edge chucks 34 that chuck the inner edge of the circular substrate 1 as shown in FIGS. 5 and 6, for example. Each inner edge chuck 34 is guided (FIG. 5) into the hole of the substrate 1 in a state where it does not interfere with the inner edge of the circular substrate 1 being conveyed (in a state where it is in contact with or close to the inner edge) (FIG. 5), and then the hook- shaped portion 34a at the tip portion. The circular substrate 1 is configured to chuck the circular substrate 1 by expanding the mutual distance until the inside is pressed against the inner edge of the circular substrate 1.
As described above, each inner edge chuck 34, hook-shaped portion 34a as the inner edge of the circular substrate 1 to the tip portion to ensure the chucking circular substrate 1 is guided is formed.

さらに他のピックアップ手段3は、例えば図7で示すように円形基板1の外縁をチャックする三個以上の外縁チャック35により構成される。各外縁チャック35は、内縁チャック34とほぼ同様な形状に形成されており、搬送中の円形基板1の外縁と干渉しない状態で当該基板1の外周へ分散するように配置された後、先端部の状部(符号なし)の内部が円形基板1の外縁部へ押付けられるまで相互の間隔を縮小して当該円形基板1をチャックするように構成されている。すなわち、円形基板1は各外縁チャック35により挟まれた状態でピックアップされる。
これらのピックアップ手段3は、円形基板1を保持した後図示しない駆動手段により当該円形基板1を図1のバリ取り加工部4aへ供給する。
Still another pickup means 3 is constituted by three or more outer edge chucks 35 that chuck the outer edge of the circular substrate 1 as shown in FIG. 7, for example. Each of the outer edge chucks 35 is formed in substantially the same shape as the inner edge chuck 34, and is arranged so as to be dispersed on the outer periphery of the substrate 1 without interfering with the outer edge of the circular substrate 1 being conveyed. The circular substrate 1 is configured to chuck the circular substrate 1 by reducing the mutual interval until the inside of the bowl- shaped portion (not shown) is pressed against the outer edge of the circular substrate 1. That is, the circular substrate 1 is picked up while being sandwiched between the outer edge chucks 35.
The pick-up means 3 holds the circular substrate 1 and then supplies the circular substrate 1 to the deburring unit 4a shown in FIG.

図8は、吸引パッド30により吸引保持された円形基板1の外縁部と内縁部へバリ取り加工を施している状態を示す断面図であり、図9は図8の吸引パッド30を含むピックアップ手段3を省略した概略平面図である。
図示のように、各バリ取り手段4は、吸引パッド30で吸引保持された円形基板1の外縁部が転接する(転がり接触する)複数(この実施形態では、90度間隔に四個)のバリ取りガイド40と、円形基板の内縁部が転接するバリ取りガイド41とを備えている。各バリ取りガイド40,41は固定されていてもよいが、それらが図示のようにローラ形態であ場合は、それぞれ自由に回転する(遊転する)状態に設置するのが好ましい。
各バリ取りガイド40,41の外周部には、円形基板1の外縁部と内縁部とがそれぞれ案内される溝状部40a,41aが形成されている。
各バリ取りガイド40,41は円形基板1の材質よりも硬い材質であるのが好ましく、例えば合金工具鋼(SKD)、高速工具鋼(SKH)や工具鋼(SK)が好ましく使用される。これらの各バリ取りガイド40,41には、それらの長寿命化やバリ削除の際の切れ味等の改善のため、円形基板1との接触部に窒化処理や硬質Crメッキ等を施すのが好ましい。
FIG. 8 is a cross-sectional view showing a state where deburring is performed on the outer edge and inner edge of the circular substrate 1 sucked and held by the suction pad 30, and FIG. 9 is a pickup means including the suction pad 30 of FIG. 3 is a schematic plan view in which 3 is omitted.
As shown in the figure, each deburring means 4 has a plurality of (four in this embodiment, four at 90 degree intervals) burrs that the outer edge of the circular substrate 1 sucked and held by the suction pad 30 is in rolling contact (rolling contact). A deburring guide 40 and a deburring guide 41 with which the inner edge of the circular substrate comes into rolling contact are provided. Each of the deburring guides 40 and 41 may be fixed, but when they are in the form of a roller as shown in the drawing, it is preferable that they are installed in a state of freely rotating (spinning).
Groove-shaped portions 40a and 41a for guiding the outer edge portion and the inner edge portion of the circular substrate 1 are formed on the outer peripheral portions of the deburring guides 40 and 41, respectively.
The deburring guides 40 and 41 are preferably made of a material harder than that of the circular substrate 1, and for example, alloy tool steel (SKD), high-speed tool steel (SKH), and tool steel (SK) are preferably used. Each of these deburring guides 40 and 41 is preferably subjected to nitriding treatment, hard Cr plating, or the like at the contact portion with the circular substrate 1 in order to extend the life of the deburring guides 40 or 41 and improve the sharpness when removing the deburring. .

ピックアップ手段3を構成する吸引パッド30は、円形基板1を保持した状態でバリ取り手段4へ供給すると、静止している内縁部のバリ取りガイド41へ前記円形基板1の内縁部を接触させるように作動する。この状態で、各外縁部のバリ取りガイド40が図9の二点鎖線のように退避している位置から円形基板1の方向へ前進し、当該円形基板1の外縁部へ接触する。
各外縁部のバリ取りガイド40が円形基板1の外縁部へ接触すると、吸引パッド30が当該円形基板1を図8,9の矢印のように時計方向へ例えば1回転させ、基板1の外縁部と内縁部へバリ取り加工を施す。
例えば、内縁部のバリ取りガイド41が設置されていない加工装置では、図9の状態で円形基板1を1/4回転させると、当該基板1の外縁部へバリ取り加工が施される。
前記バリ取り加工後、各外縁部のバリ取りガイド40が図9の二点鎖線で示す退避位置へ退避し、次いで吸引パッド30は、当該円形基板1を内縁部のバリ取りガイド41から離脱させて図1のスタッキング部5へ供給するか、あるいは、搬送ライン2へ戻し、図1のピックアップ部3aへ復帰する。吸引パッド30がピックアップ部3aへ復帰するとき又は復帰したとき、当該吸引パッド30を元の状態に完全に復帰するように前記回転の量と同じ量だけ逆方向に回転させるのが好ましい。
When the suction pad 30 constituting the pickup means 3 is supplied to the deburring means 4 while holding the circular substrate 1, the inner edge portion of the circular substrate 1 is brought into contact with the deburring guide 41 of the stationary inner edge portion. Operates on. In this state, the deburring guide 40 at each outer edge advances from the retracted position as indicated by a two-dot chain line in FIG. 9 toward the circular substrate 1 and contacts the outer edge of the circular substrate 1.
When the deburring guide 40 at each outer edge contacts the outer edge of the circular substrate 1, the suction pad 30 rotates the circular substrate 1 by one turn clockwise as indicated by the arrows in FIGS. And deburring the inner edge.
For example, in a processing apparatus in which the inner edge deburring guide 41 is not installed, when the circular substrate 1 is rotated by ¼ in the state shown in FIG. 9, deburring is performed on the outer edge of the substrate 1.
After the deburring process, the deburring guide 40 at each outer edge is retracted to the retracted position indicated by the two-dot chain line in FIG. 9, and then the suction pad 30 causes the circular substrate 1 to be detached from the deburring guide 41 at the inner edge. 1 is supplied to the stacking unit 5 in FIG. 1 or returned to the transport line 2 and returned to the pickup unit 3a in FIG. When the suction pad 30 returns or returns to the pickup unit 3a, it is preferable to rotate the suction pad 30 in the reverse direction by the same amount as the amount of rotation so that the suction pad 30 is completely returned to its original state.

図8の符号40b,41bは例えばコイルばねからなる付勢部材であり、付勢部材40bは外縁部のバリ取りガイド40を基板1の外縁部へ押し付け、他の付勢部材41bは内縁部のバリ取りガイド41を当該基板1の内縁部へ押し付けることにより、当該基板1の外縁部及び内縁部からのバリ取り加工を促進させる。また、円形基板1の板厚にバラツキがある場合でも、前記付勢部材40b,41bによりそのバラツキを吸収することができる。
前記実施形態の加工装置において、各外縁部のバリ取りガイド40及び内縁部のバリ取りガイド41の溝状部40a,41aは、例えば断面円弧形状でもよいが、図10で拡大して示すように断面三角形状であるのが好ましく、溝状部40a,41aと円形基板1の外・内縁部が接触する角度θは45°以上であるのが好ましい。この接触角度θが45°以上である場合、基板1の外縁部及び内縁部の破断面のバリ取りのみでなく、バリ以外の微細な凹凸も同時に除去するのに適している。
なお、図1のバリ取り加工部4aは、円形基板1から除去されたバリ屑等が搬送ライン2上に落下しないように、搬送ライン2の側方に設けるのが好ましい。
Reference numerals 40b and 41b in FIG. 8 are urging members made of, for example, coil springs. The urging member 40b presses the deburring guide 40 on the outer edge against the outer edge of the substrate 1, and the other urging members 41b are on the inner edge. By pressing the deburring guide 41 against the inner edge of the substrate 1, deburring from the outer edge and the inner edge of the substrate 1 is promoted. Even when the thickness of the circular substrate 1 varies, the biasing members 40b and 41b can absorb the variation.
In the processing apparatus of the embodiment, the groove portions 40a and 41a of the deburring guide 40 at each outer edge portion and the deburring guide 41 at the inner edge portion may have, for example, a circular arc shape in cross section, but as shown enlarged in FIG. The cross section is preferably triangular, and the angle θ at which the groove portions 40a and 41a contact the outer and inner edge portions of the circular substrate 1 is preferably 45 ° or more. When the contact angle θ is 45 ° or more, it is suitable not only for deburring the fracture surface of the outer edge and the inner edge of the substrate 1 but also for removing fine irregularities other than the burr at the same time.
1 is preferably provided on the side of the transport line 2 so that the debris removed from the circular substrate 1 does not fall on the transport line 2.

第1実施形態の加工装置によれば、円形基板1をピックアップして保持した状態でバリ取り加工が施されるので、円形基板1の外縁部と内縁部の微細な凹凸を含むバリ等が図16で示すように基板1から除去され、後の工程においてバリ屑等による基板1への悪影響を防止することができる。
また、円形基板1をピックアップして保持した状態でバリ取り加工が施されるので、外縁部のバリ取り加工のみならず内縁部のバリ取り加工を容易に施すことができる。
According to the processing apparatus of the first embodiment, since the deburring process is performed in a state where the circular substrate 1 is picked up and held, burrs including fine irregularities on the outer edge portion and the inner edge portion of the circular substrate 1 are illustrated. As shown by 16, it is removed from the substrate 1, and adverse effects on the substrate 1 due to burrs and the like can be prevented in a later process.
Further, since the deburring process is performed with the circular substrate 1 picked up and held, not only the deburring process of the outer edge part but also the deburring process of the inner edge part can be easily performed.

第2実施形態
図11は、外縁部のバリ取りガイド40と内縁部のバリ取りガイド41の配置を変えた第2実施形態の加工装置を部分的に示す概略平面図であり、ピックアップ手段の図示が省略されている。
外縁部のバリ取りガイド40は180°の間隔で配置され、内縁部のバリ取りガイド41も同様な角度間隔で配置されている。
ピックアップ手段で保持された円形基板1がバリ取り手段4の位置へ供給された初期状態では、外縁部のバリ取りガイド40,40は円形基板1の外縁部と干渉しない位置に退避しており、内縁部のバリ取りガイド41,41は互いに近接して円形基板1の内縁部と干渉しない位置に退避している。
この状態でピックアップ手段で保持された円形基板1が各バリ取りガイド40,41のレベル位置まで下降し、次いで外縁部のバリ取りガイド40,40が退避位置から前進して円形基板1の外縁部へ接触すると同時に、内縁部のバリ取りガイド41,41が互いに近接した退避位置から前進して円形基板1の内縁部へそれぞれ接触するように、各バリ取りガイド40,41を作動させる。
この状態でピックアップ手段3により円形基板1を一方向へ少なくとも180°回転させ、円形基板1の外縁部と内縁部にバリ取り加工を施す。
それ以後のピックアップ手段の作動や、その他の構成及び装置の作用,効果は、第1実施形態の加工装置とほぼ同様であるのでそれらの説明は省略する。
Second Embodiment FIG. 11 is a schematic plan view partially showing a processing apparatus according to a second embodiment in which the arrangement of the deburring guide 40 at the outer edge portion and the deburring guide 41 at the inner edge portion is changed. Is omitted.
The outer edge deburring guides 40 are arranged at intervals of 180 °, and the inner edge deburring guides 41 are also arranged at similar angular intervals.
In the initial state where the circular substrate 1 held by the pick-up means is supplied to the position of the deburring means 4, the deburring guides 40, 40 on the outer edge are retracted to a position where they do not interfere with the outer edge of the circular substrate 1, The inner edge deburring guides 41, 41 are close to each other and retracted to a position where they do not interfere with the inner edge of the circular substrate 1.
In this state, the circular substrate 1 held by the pickup means is lowered to the level position of each of the deburring guides 40 and 41, and then the deburring guides 40 and 40 at the outer edge portion are advanced from the retracted position and the outer edge portion of the circular substrate 1 is moved. The deburring guides 40 and 41 are operated so that the deburring guides 41 and 41 at the inner edge advance from the retracted positions close to each other and come into contact with the inner edge of the circular substrate 1 respectively.
In this state, the circular substrate 1 is rotated at least 180 ° in one direction by the pickup means 3 to deburr the outer edge portion and the inner edge portion of the circular substrate 1.
Subsequent operations of the pickup means and other configurations and operations and effects of the apparatus are substantially the same as those of the processing apparatus according to the first embodiment, and a description thereof will be omitted.

第3実施形態
図12は、バリ取り手段を別な形態とした第3実施形態の加工装置を部分的に示す断面図である。
バリ取り手段4は、円形基板1の外径よりも内径が必要量大きい円形リング状(又は円形トレイ状)の外縁部のバリ取りガイド40と、円形基板1の内径よりも外径が必要量小さな内縁部のバリ取りガイド41とを備えており、このバリ取りガイド41は第1実施形態の同ガイド41と同様に構成されている。
円形リング状のバリ取りガイド40は、外縁部の立壁の内側に円形基板1の外縁部が接触するように案内される溝状部40aが形成されている。
吸引パッド30で保持された状態でバリ取り手段4の上方に供給された円形基板1は、図の二点鎖線で示す位置から当該円形基板1の外縁部が外縁部のバリ取りガイド40の溝状部40aのレベルになるまで吸引パッド30により下降された後、外縁部の一部がバリ取りガイド40の溝状部40aと接触し内縁部の一部が内縁部のバリ取りガイド41の溝状部41aと接触するまで水平移動される。この状態で、吸引パッド30により円形基板1を一回転させることにより、円形基板1の外縁部と内縁部にバリ取り加工を施し、その後吸引パッド30が円形基板1を保持した状態で同図の二点鎖線の位置に復帰する。
その後の作動や他の構成及び作用,効果は第1実施形態の加工装置とほぼ同様であるのでそれらの説明は省略する。
Third Embodiment FIG. 12 is a cross-sectional view partially showing a processing apparatus according to a third embodiment in which the deburring means is different.
The deburring means 4 has a circular ring-shaped (or circular tray-shaped) outer edge deburring guide 40 whose required inner diameter is larger than the outer diameter of the circular substrate 1 and a required outer diameter than the inner diameter of the circular substrate 1. The deburring guide 41 of the small inner edge part is provided, This deburring guide 41 is comprised similarly to the same guide 41 of 1st Embodiment.
The circular ring-shaped deburring guide 40 is formed with a groove-shaped portion 40a that is guided so that the outer edge portion of the circular substrate 1 is in contact with the inner wall of the outer edge portion.
The circular substrate 1 supplied above the deburring means 4 while being held by the suction pad 30 is a groove of the deburring guide 40 in which the outer edge portion of the circular substrate 1 is the outer edge portion from the position indicated by the two-dot chain line in the figure. After being lowered by the suction pad 30 until reaching the level of the dent 40a, a part of the outer edge comes into contact with the groove 40a of the deburring guide 40 and a part of the inner edge is a groove of the deburring guide 41 of the inner edge. It moves horizontally until it comes into contact with the shaped part 41a. In this state, the circular substrate 1 is rotated once by the suction pad 30 to deburr the outer edge portion and the inner edge portion of the circular substrate 1, and then the suction pad 30 holds the circular substrate 1 as shown in FIG. Return to the position of the two-dot chain line.
Subsequent operations and other configurations, functions, and effects are substantially the same as those of the processing apparatus of the first embodiment, and thus description thereof is omitted.

第4実施形態
図13は、バリ取り手段4を他の形態とした第4実施形態の加工装置の部分拡大断面図である。
ローラ形態の外縁部のバリ取りガイド40は、溝状部40aの中心から二分割された状態のパーツ42,43とから構成され、両パーツ42,43は同じ軸44へ回転自在に取り付けられており、一方のパーツ42は他方のパーツ43へ例えばコイルばね等の付勢部材40bにより押し付けられている。したがって、両パーツ42,43は両者間の溝状部40aへ円形基板1の外縁部が案内されて接触した状態では、両パーツ42,43で形成する溝状部40aの各傾斜部によって挟み付けられる結果、バリ取りガイド40は円形基板1の外縁部へ押し付けられる状態になる。
第4実施形態の加工装置は、付勢部材40bにより押し付ける構成が簡単になり、かつバリや微細な凹凸の除去がより効率的に行われるという利点がある。
内縁部のバリ取りガイド41も外縁部のバリ取りガイド40と同じ構成にすることができる。
Fourth Embodiment FIG. 13 is a partially enlarged cross-sectional view of a processing apparatus according to a fourth embodiment in which the deburring means 4 is in another form.
The roller-shaped deburring guide 40 in the outer edge portion is composed of parts 42 and 43 that are divided into two from the center of the groove-shaped portion 40a, and both the parts 42 and 43 are rotatably attached to the same shaft 44. The one part 42 is pressed against the other part 43 by a biasing member 40b such as a coil spring. Therefore, in a state where the outer edge portion of the circular substrate 1 is guided and brought into contact with the groove-like portion 40a between them, the parts 42 and 43 are sandwiched by the inclined portions of the groove-like portion 40a formed by both the parts 42 and 43. As a result, the deburring guide 40 is pressed against the outer edge of the circular substrate 1.
The processing apparatus according to the fourth embodiment has an advantage that the configuration of pressing by the urging member 40b is simplified, and the removal of burrs and fine irregularities is more efficiently performed.
The inner edge deburring guide 41 can also have the same configuration as the outer edge deburring guide 40.

第5実施形態
図14は、バリ取り手段4をさらに他の形態とした第5実施形態の加工装置の断面図である。
外縁のバリを取るバリ取りガイド40は、外縁の内側に逆円錐面40cを有するすり鉢状ないし皿状の部材であり、その内部中央には先端部に円錐面41cを有する内縁側のバリ取りガイド41が取り付けられている。
吸引パッド30その他のピックアップ手段3に保持された円形基板1は、その破断面側(図17における上面側)の外縁部をバリ取りガイド40の逆円錐面40cへ接触させ、内縁部をバリ取りガイド41の円錐面41cへ接触させる。この状態の基板1は、ピックアップ手段3に設けられた付勢部材40bによりバリ取りガイド40,41側に押し付けられるので、基板1叉はバリ取りガイド40,41を所定角度(360°回転させる必要はない。)一方向へ回転させると、基板1の内・外縁部のバリが除去される。
この実施形態の加工装置は、バリ取りガイド40,41が一体的に構成されているので、バリ取り手段4の操作及び円形基板1の操作がより簡単であるとともに、各バリ取りガイド40,41の逆円錐面40c及び円錐面41cが溝状部40a,41aと同じ機能を発揮する。
第5実施形態の加工装置の他の作用,効果は前記各実施形態の加工装置と同様であるのでそれらの説明は省略する。
Fifth Embodiment FIG. 14 is a cross-sectional view of a processing apparatus according to a fifth embodiment in which the deburring means 4 is further different.
The deburring guide 40 for deburring the outer edge is a mortar-shaped or dish-shaped member having an inverted conical surface 40c on the inner side of the outer edge, and the deburring guide on the inner edge side having a conical surface 41c at the tip in the center. 41 is attached.
The circular substrate 1 held by the suction pad 30 and other pickup means 3 has its outer edge portion on its fracture surface side (upper surface side in FIG. 17) contacted with the inverted conical surface 40c of the deburring guide 40, and its inner edge portion is deburred. The guide 41 is brought into contact with the conical surface 41c. Since the substrate 1 in this state is pressed against the deburring guides 40 and 41 by the biasing member 40b provided in the pickup means 3, it is necessary to rotate the substrate 1 or the deburring guides 40 and 41 by a predetermined angle (360 °). No) Burr on the inner and outer edges of the substrate 1 is removed when rotated in one direction.
In the processing apparatus of this embodiment, since the deburring guides 40 and 41 are integrally formed, the operation of the deburring means 4 and the operation of the circular substrate 1 are simpler, and each of the deburring guides 40 and 41 is provided. The reverse conical surface 40c and the conical surface 41c exhibit the same function as the groove-shaped portions 40a and 41a.
Since other operations and effects of the processing apparatus of the fifth embodiment are the same as those of the processing apparatus of the above-described embodiments, description thereof will be omitted.

第6実施形態
図15は、バリ取り手段4をさらに他の形態とした第6実施形態の加工装置の断面図である。
この実施形態の装置は、図14と同じ形態の内縁側のバリ取りガイド41を外縁側のバリ取りガイド40とは別に設置したものであって、その他の構成や作用,効果は図14の装置と同様であるので説明を省略する。
なお、図14及び図15の加工装置において、バリ取りガイド40,41を付勢部材により円形基板1の外・内縁部へ押し付けるように構成することができる。
Sixth Embodiment FIG. 15 is a cross-sectional view of a processing apparatus according to a sixth embodiment in which the deburring means 4 is further different.
In the apparatus of this embodiment, the deburring guide 41 on the inner edge side having the same form as that of FIG. 14 is installed separately from the deburring guide 40 on the outer edge side. Since it is the same as that of FIG.
14 and 15, the deburring guides 40 and 41 can be configured to be pressed against the outer and inner edge portions of the circular substrate 1 by the urging member.

その他の実施形態
前記実施形態(図1)では、金属(アルミニウム合金)素条をドーナツ状に打抜いた直後の円形基板1を搬送ライン2で搬送し、当該搬送ライン2の途中にピックアップ手段3及びバリ取り加工手段4を順に設置したものである。後工程で円形基板1へのバリの影響を極力排除する意味からは、前記実施形態のように構成するのが好ましいが、打抜き後の円形基板1に加圧焼鈍を施した後、当該円形基板1を搬送ライン2へ供給し、当該搬送ライン2の途中に図1と同様にピックアップ手段3及びバリ取り加工手段4を順に設置してもそれなりの程度の効果をもって実施することができる。
Other Embodiments In the above-described embodiment (FIG. 1), the circular substrate 1 immediately after the metal (aluminum alloy) strip is punched into a donut shape is transported by the transport line 2, and the pickup means 3 is placed in the middle of the transport line 2. And deburring means 4 are sequentially installed. From the viewpoint of eliminating the influence of burrs on the circular substrate 1 as much as possible in the subsequent process, the circular substrate 1 is preferably configured as in the above embodiment, but after the circular substrate 1 after punching is subjected to pressure annealing, the circular substrate 1 Even if 1 is supplied to the transport line 2 and the pickup means 3 and the deburring means 4 are sequentially installed in the middle of the transport line 2 as in FIG.

円形基板1の外縁部にバリ取り加工を施す工程と内縁部にバリ取り加工を施す工程は、前記各実施形態のように併行して行うのが効率上好ましいが、外縁部のバリ取りと内縁部のバリ取りとのいずれかを先行しても実施することができる。ピックアップ手段3として内縁チャック34,外縁チャック35を使用し、円形基板1の内・外縁部のバリ取り加工を施す場合には、いずれかのバリ取り加工を先行させる。
前記各実施形態では、円形基板1を水平に保持してバリ取り加工を施す状態が図示されているが、バリ取り加工の際の円形基板1の保持の姿勢は水平以外の状態でも実施することができる。特にピックアップ手段3として内縁チャック34や外縁チャック35を使用する場合には、円形基板1を水平以外の姿勢で保持するのに適している。
The step of performing the deburring process on the outer edge portion of the circular substrate 1 and the step of performing the deburring process on the inner edge portion are preferably performed in parallel as in each of the above embodiments. It can be carried out even if any one of the deburring of the part is preceded. When the inner edge chuck 34 and the outer edge chuck 35 are used as the pickup means 3 and deburring processing is performed on the inner and outer edge portions of the circular substrate 1, any deburring process is preceded.
In each of the above embodiments, the state in which the circular substrate 1 is held horizontally and the deburring process is performed is illustrated. However, the posture of holding the circular substrate 1 in the deburring process may be performed in a state other than the horizontal state. Can do. In particular, when the inner edge chuck 34 or the outer edge chuck 35 is used as the pickup means 3, it is suitable for holding the circular substrate 1 in a posture other than horizontal.

第1実施形態〜第4実施形態の加工装置及び当該加工装置を使用した加工方法においては、バリ取り加工を施すとき円形基板1を固定した状態でバリ取りガイド40,41を回転させても実施することができるほか、円形基板1に付勢部材を設置し、当該円形基板1をバリ取りガイド40,41へ押し付けるように構成しても実施することができる。
また、バリ取り加工は円形基板1の外縁部と内縁部に対して施すのが好ましいが、影響が大きいのは外縁部のバリであるので外縁部のみに対してバリ取り加工を施しても十分に効果がある。さらに、バリ取り加工は小さな凹凸をも除去するためには、外縁部叉は/及び外縁部の上下(両)面側にバリ取り加工を施すのが好ましいが、バリは基板1の破断面側(図17の上面側)に形成されるので、基板1の破断面(図17の上面側)の外縁部叉は/及び内縁部についてのみバリ取り加工を施しても十分な効果を奏する。
In the processing apparatus and the processing method using the processing apparatus according to the first to fourth embodiments, the deburring guides 40 and 41 are rotated while the circular substrate 1 is fixed when the deburring process is performed. In addition, it is also possible to implement a configuration in which an urging member is installed on the circular substrate 1 and the circular substrate 1 is pressed against the deburring guides 40 and 41.
The deburring process is preferably performed on the outer edge part and the inner edge part of the circular substrate 1, but it is sufficient to perform the deburring process only on the outer edge part because the influence is largely on the outer edge burr. Is effective. Further, in order to remove even small irregularities, deburring is preferably performed on the outer edge and / or the upper and lower (both) surfaces of the outer edge, but the burr is on the fracture surface side of the substrate 1. Since it is formed (on the upper surface side in FIG. 17), a sufficient effect can be obtained even if deburring is performed only on the outer edge and / or the inner edge of the fracture surface (upper surface side in FIG. 17) of the substrate 1.

外縁部のバリ取りガイドのみ及び外・内縁部にバリ取りガイドを用いた各実施例(表1)の加工装置と比較例の加工装置を試作し、それらの加工装置で円形基板を加工したディスク(各40枚)について、当該加工後の基板のピットの有無を調べ、その結果を各バリ取りガイドの材質とともに表1に示した。   A disk in which a processing device of each example (Table 1) using only the outer edge deburring guide and a deburring guide on the outer and inner edge portions and a processing device of a comparative example were prototyped, and a circular substrate was processed by these processing devices. For each (40 sheets each), the presence or absence of pits on the processed substrate was examined, and the results are shown in Table 1 together with the material of each deburring guide.

基板
外径96.2mm、板厚1.84mmの3.5インチ用の磁気ディスク用アルミニウム合金基板(ブランク材)を使用。
実施例:
円形基板の外縁部のみ叉は外・内縁部へのバリ取りガイドの配置は第2実施形態(図11)と同様とし、バリ取りガイドの基板との接触部の溝状部は図10で示す断面三角形状のものと断面円弧形状のものとを使用し、いずれの場合も基板を180°回転させた。ピックアップ手段は図2で示した吸引パッドと図5,6で示した内縁チャックを用いた。
比較例1:
図18で示すように、回転受台7の上に打抜き後の基板1を20枚スタッキングし、外縁部へブラシ6を固定状態で押し当て、基板1を100rpmで10分間回転させた。
比較例2:
打抜き後無加工の基板
ピット不良の評価
サンプルをサブストレート加工前の工程(シュリンクパック)で調査でし、ピットがない場合を◎、ピットが有っても浅く後の工程(サブストレート加工)で除去可能なレベルである場合を○、後の工程でも除去できないレベルの深いピットがある場合を×とそれぞれ表示した。
Substrate An aluminum alloy substrate (blank material) for a 3.5 inch magnetic disk having an outer diameter of 96.2 mm and a thickness of 1.84 mm is used.
Example:
The arrangement of the deburring guide on the outer edge of the circular substrate or on the outer / inner edge is the same as in the second embodiment (FIG. 11), and the groove-shaped portion of the deburring guide in contact with the substrate is shown in FIG. A substrate having a triangular cross section and a circular arc shape were used, and in each case, the substrate was rotated 180 °. As the pickup means, the suction pad shown in FIG. 2 and the inner edge chuck shown in FIGS.
Comparative Example 1:
As shown in FIG. 18, 20 substrates 1 after punching were stacked on the rotating cradle 7, the brush 6 was pressed against the outer edge portion in a fixed state, and the substrate 1 was rotated at 100 rpm for 10 minutes.
Comparative Example 2:
Unprocessed substrate after punching Evaluation of pit defects Samples were investigated in the process before substrate processing (shrink pack), ◎ if there is no pit, shallow even if there are pits in the subsequent process (substrate processing) The case where the level is removable is indicated by ◯, and the case where there is a deep pit which cannot be removed even in a later process is indicated by ×.

表1

Figure 0004615411
Table 1
Figure 0004615411

表1で示されているように、本発明に係る実施例1〜16のサンプルはピット不良が発生せず、加圧焼鈍後に外縁部のみバリ取り加工した実施例17のサンプルではピットの発生は認められたが、サブストレート加工時に除去可能なレベルにとどまった。これに対して、ナイロンブラシを使用した装置を用いた比較例1及び打抜き後無加工の基板である比較例2は、いずれもピット不良が発生した。   As shown in Table 1, in the samples of Examples 1 to 16 according to the present invention, no pit defect occurred, and in the sample of Example 17 in which only the outer edge portion was deburred after pressure annealing, the occurrence of pits was Recognized, but remained at a level that could be removed during substrate processing. On the other hand, in Comparative Example 1 using a device using a nylon brush and Comparative Example 2 which is a non-processed substrate after punching, pit defects occurred in both cases.

前記各実施形態では、磁気ディスク用のアルミニウム合金基板を加工対象とした場合について説明したが、本発明は、基板の製品表面におけるピットの発生を防止すべきその他の円形基板であって、金属素条を打抜いた基板(ブランク材)を加工対象とする場合を含むものである。 In each of the above embodiments, the case where an aluminum alloy substrate for a magnetic disk is a processing target has been described. However, the present invention is another circular substrate that should prevent the generation of pits on the product surface of the substrate, This includes the case where a substrate (blank material) from which a strip is punched is used as a processing target.

本発明に係る第1実施形態の磁気ディスク用基板の加工装置を設置した搬送ラインの流れ図である。It is a flowchart of the conveyance line which installed the processing apparatus of the board | substrate for magnetic discs of 1st Embodiment which concerns on this invention. 図1の加工装置におけるピックアップ手段の一形態を示す斜視図である。It is a perspective view which shows one form of the pick-up means in the processing apparatus of FIG. ピックアップ手段の他の形態を例示する斜視図である。It is a perspective view which illustrates other forms of pick-up means. ピックアップ手段のさらに他の形態を例示する斜視図である。It is a perspective view which illustrates further another form of a pick-up means. ピックアップ手段のさらに他の形態を例示する部分平面図である。It is a fragmentary top view which illustrates further another form of a pickup means. 図5のピックアップ手段の断面図である。It is sectional drawing of the pick-up means of FIG. ピックアップ手段のさらに他の形態を例示する部分平面図である。It is a fragmentary top view which illustrates further another form of a pickup means. 図1の加工装置におけるバリ取り加工手段を示す断面図である。It is sectional drawing which shows the deburring process means in the processing apparatus of FIG. 図8のバリ取り手段の概略平面図である。It is a schematic plan view of the deburring means of FIG. 図8のバリ取り手段のバリ取りガイドと円形基板の外縁部との接触部の部分拡大断面図である。It is a partial expanded sectional view of the contact part of the deburring guide of the deburring means of FIG. 8, and the outer edge part of a circular board | substrate. バリ取り加工手段の他の形態を含む第2実施形態の加工装置の部分概略平面図である。It is a partial schematic plan view of the processing apparatus of 2nd Embodiment containing the other form of a deburring process means. バリ取り手段のさらに他の形態を含む第3実施形態の加工装置の部分断面図である。It is a fragmentary sectional view of the processing apparatus of 3rd Embodiment containing the further another form of a deburring means. バリ取り手段のさらに他の形態を含む第4実施形態の加工装置の部分拡大断面図である。It is a partial expanded sectional view of the processing apparatus of 4th Embodiment containing the further another form of a deburring means. バリ取り手段のさらに他の形態を含む第5実施形態の加工装置の断面図である。It is sectional drawing of the processing apparatus of 5th Embodiment containing the further another form of a deburring means. バリ取り手段のさらに他の形態を含む第6実施形態の加工装置の断面図である。It is sectional drawing of the processing apparatus of 6th Embodiment containing the further another form of a deburring means. 本発明に係る加工装置によるバリ取り加工後の円形基板の部分拡大断面図である。It is a partial expanded sectional view of the circular board | substrate after the deburring process by the processing apparatus which concerns on this invention. 未加工の円形基板の部分拡大断面図である。It is a partial expanded sectional view of an unprocessed circular substrate. 比較例の加工装置を例示した斜視図である。It is the perspective view which illustrated the processing apparatus of the comparative example.

1 円形基板
10 バリ
11 端面ダレ
2 搬送ライン
3 ピックアップ手段
3a ピックアップ部
30 吸引パッド
31 吸引パイプ
32 分岐パイプ
33 連結具
34 内縁チャック
34a 状部
35 外縁チャック
4 バリ取り手段
4a バリ取り加工部
40 バリ取りガイド(外縁側)
41 バリ取りガイド(内縁側)
40a,41a 溝状部
40b,41b 付勢部材
40c 逆円錐面
41c 円錐面
42,43 パーツ
44 軸
5 スタッキング部
6 ナイロンブラシ
7 回転受台
DESCRIPTION OF SYMBOLS 1 Circular substrate 10 Burr 11 End surface sag 2 Conveyance line 3 Pick-up means 3a Pick-up part 30 Suction pad 31 Suction pipe 32 Branch pipe 33 Connecting tool 34 Inner edge chuck 34a Hook 35 Outer chuck 4 Deburring means 4a Deburring part 40 Burr Removal guide (outer edge side)
41 Deburring guide (inner edge side)
40a, 41a Groove portions 40b, 41b Energizing member 40c Reverse conical surface 41c Conical surface 42, 43 Parts 44 Shaft 5 Stacking portion 6 Nylon brush 7 Rotating base

Claims (6)

ドーナツ状の円形基板(1)を保持するピックアップ手段(3)と、当該ピックアップ手段(3)により保持された円形基板(1)縁部が転接されるバリ取りガイド(41)、叉は前記ピックアップ手段(3)により保持された円形基板(1)縁部へ転接されるバリ取りガイド(41)を含むバリ取り手段(4)とを備え、前記バリ取りガイド(41)は、前記円形基板(1)の対応縁部が案内される溝状部(41a)を有し、当該溝状部(41a)の中央を境界として分割され、軸(44)に回転自在に片持支持されたパーツ(42),(43)によって構成され、少なくとも一方のパーツ(42)を他方のパーツ(43)へ押し付けるコイルばねからなる付勢部材(40b)を備えるとともに、前記軸(44)の先端に上記付勢部材(40b)を受け止めるフランジ状のばね受けを設けたことを特徴とする、磁気ディスク用基板の加工装置。 Pickup means for holding a donut-shaped circular board (1) (3), deburring guide the inner edge of the circular substrate (1) which is held by the pick-up means (3) is rolling bordered (41), or deburring means including deburring guide (41) which is rolling bordered to the inner edge of the circular substrate held by said pickup means (3) (1) (4) and a said deburring guide (41) Has a groove-like portion (41a) through which the corresponding edge of the circular substrate (1) is guided, is divided with the center of the groove-like portion (41a) as a boundary, and is rotatable about the shaft (44). An urging member (40b) comprising a coil spring configured to hold and support at least one part (42) against the other part (43) is provided, and includes the shaft (44). ) An apparatus for processing a magnetic disk substrate, comprising a flange-shaped spring receiver for receiving the member (40b) . 記バリ取り手段(4)は、前記ピックアップ手段(3)により保持された円形基板(1)縁部へ転接されるバリ取りガイド(40)をさらに含むことを特徴とする、請求項1に記載の磁気ディスク用基板の加工装置。 Before SL deburring means (4) is characterized in that before Symbol further comprising a deburring guide (40) which is rolling bordered to the outside edge of the pick-up means circular substrate held by (3) (1), The apparatus for processing a magnetic disk substrate according to claim 1. 前記ピックアップ手段(3)により保持された円形基板(1)へ対応するバリ取りガイド(41)が接触したときに、前記円形基板(1)を回転させることを特徴とする、請求項1叉は2に記載の磁気ディスク用基板の加工装置。 2. The rotary substrate (1) according to claim 1 , wherein when the corresponding deburring guide (41) contacts the circular substrate (1) held by the pickup means (3) , the circular substrate (1) is rotated. 3. A processing apparatus for a magnetic disk substrate according to 2. 前記バリ取りガイド(41)を前記円形基板(1)の方向に押し付ける付勢部材(41b)を備えたことを特徴とする、請求項1〜のいずれかに記載の磁気ディスク用基板の加工装置。 The magnetic disk substrate processing according to any one of claims 1 to 3 , further comprising an urging member (41b) for pressing the deburring guide (41) in the direction of the circular substrate (1). apparatus. 前記バリ取りガイド(41)は、前記円形基板(1)の対応縁部が案内される溝状部(41a)を有することを特徴とする、請求項1〜のいずれかに記載の磁気ディスク用基板の加工装置。 Said deburring guide (41), the corresponding edge of the circular substrate (1) is characterized by having a groove portion (41a) to be guided, the magnetic disk according to any one of claims 1-4 Substrate processing equipment. 前記ピックアップ手段(4)は、前記円形基板(1)の外周へ分散するように配置された後当該円形基板(1)の外縁部へ押付けられるまで相互の間隔を縮小して当該円形基板の外縁をチャックする状態の三個以上の外縁チャック(35)により構成されていることを特徴とする、請求項1に記載の磁気ディスク用基板の加工装置。 It said pickup means (4) is an outer edge of the said circular substrate by reducing the mutual spacing until pressed against the outer edge of the circular substrate (1) after being placed so as to disperse to the outer periphery of the circular substrate (1) The apparatus for processing a magnetic disk substrate according to claim 1, comprising three or more outer edge chucks (35) in a state of chucking the magnetic disk.
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