CN107743343A - A kind of circuit board processing method - Google Patents
A kind of circuit board processing method Download PDFInfo
- Publication number
- CN107743343A CN107743343A CN201711137797.XA CN201711137797A CN107743343A CN 107743343 A CN107743343 A CN 107743343A CN 201711137797 A CN201711137797 A CN 201711137797A CN 107743343 A CN107743343 A CN 107743343A
- Authority
- CN
- China
- Prior art keywords
- copper
- cutting
- cutting knife
- clad plate
- gear ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
Abstract
This patent is related to field of circuit boards, specifically disclose a kind of circuit board processing method, a kind of cutter device is employed in this method, the device can be cut to copper-clad plate, the section after cutting can also be ground simultaneously, the metal fragment or glass-fiber-fabric chip of section part adhesion can be effectively reduced, the possibility that copper-clad plate is scratched can be reduced, can sufficiently ensure the quality of final circular copper-clad plate.
Description
Technical field
The invention belongs to field of circuit boards, and in particular to a kind of circuit board processing method.
Background technology
PCB Chineses are printed circuit board, also known as printed substrate, and it is important electronic unit, are electronics member devices
The supporter of part, and the carrier of electronic component electrical connection.The process of the printed substrate of shaping is complicated, including opens
Material, drilling, heavy copper, pattern transfer, graphic plating, move back film, etching, green oil, character, plating golden finger, shaping, test and examine this eventually
13 big procedure of processings, wherein further comprises some small procedure of processings in each step, in sawing sheet step, its is specific
Processing is that copper-clad plate is carried out into cutting plate, and cutting plate step can allow the size of copper-clad plate mutually to be fitted with the size of the printed substrate after processing
Should, edging and packaging then are carried out to the copper-clad plate after cutting.
The structure of common double face copper substantially by be from top to bottom sequentially distributed first layer copper foil, adhesive sheet and second
Layer copper foil is made, and adhesive sheet is typically formed by the stacked distribution compacting of paper, glass-fiber-fabric, resin, metallic plate or multiple material.Institute
So that after copper-clad plate is cut, typically also adhesion has metal fragment or glass-fiber-fabric chip on the section of copper-clad plate, copper is covered in movement
Metal fragment or glass-fiber-fabric chip easily scratch the surface of copper-clad plate during plate.
When needing PCB being processed as circle, copper-clad plate is cut by the way of punching press more, punching press shape
Into section on have more deformation, the metal fragment that is remained on the section of copper-clad plate or glass-fiber-fabric chip can be caused more,
The risk that increase copper-clad plate is scratched；After the cutting of copper-clad plate is completed, generally require the copper-clad plate after taking out cutting and broken
Face attrition process, during copper-clad plate is shifted, the process-cycle of copper-clad plate can be increased, and then the cutting of copper-clad plate can be reduced
Edging efficiency.
The content of the invention
The invention is intended to provide a kind of circuit board processing method, to improve the cutting of circular copper-clad plate and edging efficiency.
In order to achieve the above object, base case of the invention is as follows：A kind of circuit board processing method, including following step
Suddenly：
Step 1：Prepare a kind of cutter device, including cutting bed, cutting mechanism and grinding mechanism；Cutting mechanism includes annulus
The cutting knife and support of shape, support weld on cutting tables, and cutting knife vertical sliding is rack-mount, and the lower end of cutting knife is provided with knife
Sword, one end of cutting knife blade are relative with the upper surface of cutting bed；Grinding mechanism includes two spacing rings, the first gear ring, the second tooth
Circle and some flexible voussoirs, the first gear ring coaxial welding are switched to and led to provided with two grinding grooves, grinding in the upper end of cutting knife
Groove is respectively positioned in same level；The equal coaxial welding of spacing ring is on the outer surface of cutting knife, and a spacing ring is positioned at grinding groove
Upper surface at, another spacing ring positioned at grinding groove lower surface at；Second gear ring is coaxially mounted on cutting knife, the second tooth
The inwall of circle and the outer wall of cutting knife are rotatablely connected, and the second gear ring is between two spacing rings, and the second gear ring is slided with spacing ring
Dynamic contact, the inwall of the second gear ring are provided with some flexible tooth lappings, and tooth lapping can be insinuated into grinding groove；Voussoir welds
It is connected on the inner surface of cutting knife, and voussoir is respectively positioned in same level, the plane where voussoir is less than where grinding groove
Plane, the thickness of voussoir lower end is less than the thickness of voussoir upper end, in addition to drives the power of the first gear ring and the second ring gear against rotation
Mechanism；Actuating unit includes motor, power transmission shaft, the first driving gear and the second driving gear with motor welding, electronic
Machine welds on cutting tables, and power transmission shaft is vertically-mounted on cutting tables, and the first driving gear and the second driving gear coaxially weld
It is connected in rotating shaft, the first driving gear engages with the first gear ring, and the second driving gear engages with the second gear ring；
Step 2：Copper-clad plate to be cut is placed on board, cutting knife moves up along support, cutting bed and cutting knife it
Between form gap, gap location copper-clad plate being placed between cutting bed and cutting knife；
Step 3：Start actuating unit, the first driving gear in actuating unit drives the first gear ring with 30-50r/min's
Rotational speed, the second driving gear drive the second gear ring with 10-20r/min rotational speed；First gear ring drives cutting knife covering
Rotated on plate, the cutting knife of rotation is cut to copper-clad plate；
Step 4：After the completion of circular copper-clad plate after being cut in step 3, cutting knife is moved up along support again, promoted
Copper-clad plate on cutting bed, the lower surface of cutting knife are covered by copper-clad plate again, then repeat step 3；
Step 5：In step 3 and step 4, the circular copper-clad plate after cutting can be deposited in cutting knife, the circle being squeezed
Copper-clad plate is moved to the upper end of cutter, when circular copper-clad plate is moved at grinding groove by voussoir, the second tooth in step 3
Tooth lapping on circle inwall is ground to the section of circular copper-clad plate；
Step 6：When circular copper-clad plate is moved to the upper end of cutting knife, the copper-clad plate after cutting is removed.
The principle and its advantage of base case：1st, in step 1, a kind of cutter device has been used, the device can be justified
The cutting of shape copper-clad plate, cutting knife is entered in copper-clad plate in a manner of rotating during cutting, can be to circular copper-clad plate
Section is completely cut, and the copper-clad plate after cutting is overlapped in cutting knife, and each copper-clad plate can be passed through at grinding groove successively,
Now tooth lapping is ground to the side of copper-clad plate, and copper-clad plate is ground while realizing cutting, circle is improved and covers
The cutting of copper coin and edging efficiency；2nd, in step 2, cutting knife can move up along support, be easy to copper-clad plate movement to be cut
To the cutting between cutting knife and cutting bed, being easy to cutting knife to stablize copper-clad plate, while it is easy to move copper-clad plate；3、
In step 3, actuating unit can drive the first ring gear against rotation being fixedly connected with cutting knife, be easy to implement cutting knife and copper-clad plate is turned
Dynamic cutting；Can drive the second ring gear against rotation with cutting knife rotation connection simultaneously, be easy to subsequent step to circular copper-clad plate
Section is ground；Actuating unit can drive two ring gear against rotation, moreover it is possible to ensure the stable transmission of power；4th, step 4 and step
Rapid 2 effect is identical, the continuation cutting that cutting knife can be stablized to copper-clad plate；5th, in step 5, the circular copper-clad plate of accumulation
Voussoir can be passed sequentially through to reach at grinding groove, the tooth lapping on the second gear ring inwall now rotated can be to circular copper-clad plate
Section be ground；6th, the circular copper-clad plate being deposited in cutting knife can be extruded into the upper end of cutting knife, convenient to cutting and grinding
Circular copper-clad plate after mill is collected.
In summary, a kind of cutter device is employed in this method, the device can be cut to copper-clad plate, also simultaneously
Section after cutting can be ground, the metal fragment or glass-fiber-fabric chip of section part adhesion can be effectively reduced, can be dropped
The possibility that low lying copper plate is scratched, it can sufficiently ensure the quality of final circular copper-clad plate.
Further, in the step 1, the upper surface of voussoir is provided with ball, and ball is rotatablely connected with voussoir；The top of ball
Point and the lower surface for grinding groove are in the same plane, and the thickness for grinding groove is more than the thickness of copper-clad plate.Work as copper-clad plate
When being moved on the upper surface of voussoir, the lower surface of copper-clad plate contacts with the ball point on voussoir, the grinding on the second gear ring
When tooth is ground to copper-clad plate, tooth lapping can drive the copper-clad plate fine rotation on ball, make the section after not being ground
Can be with grinding groove, being easy to comprehensively grind the section of copper-clad plate.
Further, in the step 1, some otch are provided with the blade of cutting knife, otch connects with cutting knife.Rotated in cutting knife
When, chip caused by cutting knife cutting copper-clad plate can be discharged by incision, be easy to the chip discharge after cutting, allowed cutting knife can
Stable quickly cutting, while the amount for the chip being adhered in copper-clad plate can be reduced.
Further, in the step 1, the thickness of the first driving gear is more than the thickness of the first gear ring, the second driving gear
Thickness be more than the second gear ring thickness.Because cutting knife is in cutting process, cutting knife can move up and down, when cutting knife moves up and down
When, the first driving gear still engages with the first gear ring, and the second driving gear still engages with the second gear ring, is easy in cutting knife again
Secondary when being cut to copper-clad plate, power can be transmitted quickly.
Further, in the step 3, the first driving gear drives the first gear ring with 40r/min rotating speed in actuating unit
Rotate, the second driving gear drives the second gear ring with 15r/min rotational speed.The now rotating speed of the first gear ring and the second gear ring
Rotating speed it is moderate, the cutting that cutting knife can be stablized to copper-clad plate, at the same the second gear ring can stablize to circular copper-clad plate
Section be ground.
Brief description of the drawings
Fig. 1 is the structural representation of cutter device in the present invention；
Fig. 2 is the sectional view of cutting knife.
Embodiment
Below by the further details of explanation of embodiment：
Reference in Figure of description includes：Cutting bed 10, support 20, cutting knife 30, otch 301, grinding groove
302nd, the first gear ring 401, the second gear ring 402, tooth lapping 412, voussoir 403, ball 404, spacing ring 405, motor 50, transmission
Axle 501, the first driving gear 502, the second driving gear 503.
Cutter device in embodiment is substantially as shown in Figures 1 and 2：Including cutting bed 10, cutting mechanism and grinding
Mechanism.
Cutting mechanism includes circular cutting knife 30 and support 20, and support 20 is welded on cutting bed 10, and cutting knife 30 is vertical
It is slidably mounted on support 20, the lower end of cutting knife 30 is provided with blade, one end of the blade of cutting knife 30 and the upper surface phase of cutting bed 10
It is right, some otch 301 are provided with the blade of cutting knife 30, otch 301 connects with cutting knife 30.
Grinding mechanism includes two spacing rings 405, the first gear ring 401, the second gear ring 402 and some flexible voussoirs 403,
For the coaxial welding of first gear ring 401 in the upper end of cutting knife 30, cutting knife is provided with two grinding grooves 302, and grinding groove 302 is respectively positioned on
In same level；405 equal coaxial welding of spacing ring is on the outer surface of cutting knife 30, and a spacing ring 405 is positioned at grinding groove
At 302 upper surface, another spacing ring 405 is at the lower surface of grinding groove 302；Second gear ring 402 is coaxially mounted to
On cutting knife 30, the inwall of the second gear ring 402 is rotatablely connected with the outer wall of cutting knife 30, and the second gear ring 402 is located at two spacing rings 405
Between, and the second gear ring 402 and the sliding contact of spacing ring 405, the inwall of the second gear ring 402 are provided with some flexible tooth lappings
412, tooth lapping 412 can be insinuated into grinding groove 302.
Voussoir 403 is welded on the inwall of cutting knife 30, and voussoir 403 is respectively positioned in same level, voussoir 403 it is upper
Surface is provided with ball 404, and ball 404 is rotatablely connected with voussoir 403；The summit of ball 404 and the lower surface of grinding groove 302
It is in the same plane, and the thickness for grinding groove 302 is more than the thickness of copper-clad plate；The thickness of the lower end of voussoir 403 is less than voussoir
The thickness of 403 upper ends, in addition to the actuating unit for driving the first gear ring 401 and the second gear ring 402 to rotate.
Actuating unit includes motor 50, the power transmission shaft 501 welded with motor 50, the first driving gear 502 and second
Driving gear 503, motor 50 are welded on cutting bed 10, and power transmission shaft 501 is vertically installed on cutting bed 10, the first driving tooth
On power transmission shaft 501, the first driving gear 502 is nibbled with the first gear ring 401 for wheel 502 and 503 equal coaxial welding of the second driving gear
Close, the second driving gear 503 engages with the second gear ring 402；The thickness of first driving gear 502 is more than the thickness of the first gear ring 401
Degree, the thickness of the second driving gear 503 are more than the thickness of the second gear ring 402；The right side of two spacing rings 405 is provided with vertical
Groove, the second gear ring 402 can slide up and down in groove.
When the present embodiment operates, comprise the following steps：
Step 1：Prepare the cutter device in embodiment；
Step 2：Copper-clad plate to be cut is placed on board, cutting knife 30 moves up along support 20, cutting bed 10 with
Gap is formed between cutting knife 30, copper-clad plate is placed into the gap location between cutting bed 10 and cutting knife 30；
Step 3：Start actuating unit, the first driving gear 502 in actuating unit drives the first gear ring 401 with 40r/
Min rotational speed, the second driving gear 503 drive the second gear ring 402 with 15r/min rotational speed；The band of first gear ring 401
Dynamic cutting knife 30 is rotated on cladding plate, and the cutting knife 30 of rotation is cut to copper-clad plate；
Step 4：After the completion of circular copper-clad plate after being cut in step 3, cutting knife 30 is moved up along support 20 again,
The copper-clad plate on cutting bed 10 is promoted, the lower surface of cutting knife 30 is covered by copper-clad plate again, then repeat step 3；
Step 5：In step 3 and step 4, the circular copper-clad plate after cutting can be deposited in cutting knife 30, the circle being squeezed
Shape copper-clad plate is moved to the upper end of cutter, when circular copper-clad plate is moved on ball 404 by voussoir 403, and now copper-clad plate
When at grinding groove 302, the tooth lapping 412 on the inwall of the second gear ring 402 in step 3 enters to the section of circular copper-clad plate
Row grinding；
Step 6：When circular copper-clad plate is moved to the upper end of cutting knife 30, the copper-clad plate after cutting is removed.
Above-described is only embodiments of the invention, and the general knowledge such as known concrete structure and/or characteristic is herein in scheme
Do not describe excessively.It should be pointed out that for those skilled in the art, without departing from the structure of the invention, also
Several modifications and improvements can be made, these should also be considered as protection scope of the present invention, and these are real all without the present invention is influenceed
The effect and practical applicability applied.The scope of protection required by this application should be based on the content of the claims, specification
In the record such as embodiment can be used for the content for explaining claim.
Claims (5)
- A kind of 1. circuit board processing method, it is characterised in that：Comprise the following steps：Step 1：Prepare a kind of cutter device, including cutting bed, cutting mechanism and grinding mechanism；Cutting mechanism includes circular Cutting knife and support, support weld on cutting tables, and cutting knife vertical sliding is rack-mount, and the lower end of cutting knife is provided with blade, cuts One end of knife blade is relative with the upper surface of cutting bed；If grinding mechanism include two spacing rings, the first gear ring, the second gear ring and Do flexible voussoir, the first gear ring coaxial welding is switched to provided with two grinding grooves, grinds the equal position of groove in the upper end of cutting knife In in same level；The equal coaxial welding of spacing ring is on the outer surface of cutting knife, upper table of the spacing ring positioned at grinding groove At face, another spacing ring is at the lower surface of grinding groove；Second gear ring is coaxially mounted on cutting knife, the second gear ring it is interior The outer wall of wall and cutting knife is rotatablely connected, and the second gear ring is between two spacing rings, and the second gear ring and spacing ring sliding contact, The inwall of second gear ring is provided with some flexible tooth lappings, and tooth lapping can be insinuated into grinding groove；Voussoir is welded on and cut On the inner surface of knife, and voussoir is respectively positioned in same level, and the plane where voussoir is less than the plane where grinding groove, wedge The thickness of block lower end is less than the thickness of voussoir upper end, in addition to drives the actuating unit of the first gear ring and the second ring gear against rotation；It is dynamic Force mechanisms include motor, the power transmission shaft welded with motor, the first driving gear and the second driving gear, motor and are welded on On cutting bed, power transmission shaft is vertically-mounted on cutting tables, and the first driving gear and the equal coaxial welding of the second driving gear are in rotating shaft On, the first driving gear engages with the first gear ring, and the second driving gear engages with the second gear ring；Step 2：Copper-clad plate to be cut is placed on board, cutting knife moves up along support, shape between cutting bed and cutting knife Into gap, gap location copper-clad plate being placed between cutting bed and cutting knife；Step 3：Start actuating unit, the first driving gear in actuating unit drives the first gear ring with 30-50r/min rotating speed Rotate, the second driving gear drives the second gear ring with 10-20r/min rotational speed；First gear ring drives cutting knife on cladding plate Rotate, the cutting knife of rotation is cut to copper-clad plate；Step 4：After the completion of circular copper-clad plate after being cut in step 3, cutting knife is moved up along support again, promotes cutting Copper-clad plate on platform, the lower surface of cutting knife are covered by copper-clad plate again, then repeat step 3；Step 5：In step 3 and step 4, the circular copper-clad plate after cutting can be deposited in cutting knife, and the circle being squeezed covers copper Plate moves to the upper end of cutter, when circular copper-clad plate is moved at grinding groove by voussoir, in the second gear ring in step 3 Tooth lapping on wall is ground to the section of circular copper-clad plate；Step 6：When circular copper-clad plate is moved to the upper end of cutting knife, the copper-clad plate after cutting is removed.
- A kind of 2. circuit board processing method according to claim 1, it is characterised in that：In the step 1, the upper table of voussoir Face is provided with ball, and ball is rotatablely connected with voussoir；The summit of ball and the lower surface for grinding groove are in the same plane, and The thickness for grinding groove is more than the thickness of copper-clad plate.
- A kind of 3. circuit board processing method according to claim 2, it is characterised in that：In the step 1, the blade of cutting knife Place is provided with some otch, and otch connects with cutting knife.
- A kind of 4. circuit board processing method according to claim 3, it is characterised in that：In the step 1, the first driving tooth The thickness of wheel is more than the thickness of the first gear ring, and the thickness of the second driving gear is more than the thickness of the second gear ring.
- A kind of 5. circuit board processing method according to claim 4, it is characterised in that：In the step 3, in actuating unit First driving gear drives the first gear ring, and with 40r/min rotational speed, the second driving gear drives the second gear ring with 15r/min Rotational speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711137797.XA CN107743343B (en) | 2017-11-16 | 2017-11-16 | A kind of circuit board processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711137797.XA CN107743343B (en) | 2017-11-16 | 2017-11-16 | A kind of circuit board processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107743343A true CN107743343A (en) | 2018-02-27 |
| CN107743343B CN107743343B (en) | 2019-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711137797.XA Active CN107743343B (en) | 2017-11-16 | 2017-11-16 | A kind of circuit board processing method |
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| Country | Link |
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| CN (1) | CN107743343B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108556230A (en) * | 2018-05-31 | 2018-09-21 | 重庆聚伯雅科技有限公司 | Plastic part cuts grinding apparatus |
| CN110213894A (en) * | 2019-06-05 | 2019-09-06 | 深圳大图科创技术开发有限公司 | A kind of wiring board contour machining procedure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202037628U (en) * | 2010-11-30 | 2011-11-16 | 梅州市志浩电子科技有限公司 | Printed circuit board cutting device |
| JP2014018937A (en) * | 2012-07-20 | 2014-02-03 | Atsumi Kogyo Co Ltd | Shaving device |
| CN103552121A (en) * | 2013-10-31 | 2014-02-05 | 苏州斯尔特微电子有限公司 | Device for cutting PCBs (Printed Circuit Board) |
| CN204869040U (en) * | 2015-07-08 | 2015-12-16 | 东莞万钧电子科技有限公司 | Circuit board cutting machine |
| CN204997752U (en) * | 2015-07-08 | 2016-01-27 | 东莞万钧电子科技有限公司 | Circuit board cutting device |
| CN205058144U (en) * | 2015-10-27 | 2016-03-02 | 苏州市东亿数控有限公司 | Automatic cutting device of PCB base plate |
-
2017
- 2017-11-16 CN CN201711137797.XA patent/CN107743343B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202037628U (en) * | 2010-11-30 | 2011-11-16 | 梅州市志浩电子科技有限公司 | Printed circuit board cutting device |
| JP2014018937A (en) * | 2012-07-20 | 2014-02-03 | Atsumi Kogyo Co Ltd | Shaving device |
| CN103552121A (en) * | 2013-10-31 | 2014-02-05 | 苏州斯尔特微电子有限公司 | Device for cutting PCBs (Printed Circuit Board) |
| CN204869040U (en) * | 2015-07-08 | 2015-12-16 | 东莞万钧电子科技有限公司 | Circuit board cutting machine |
| CN204997752U (en) * | 2015-07-08 | 2016-01-27 | 东莞万钧电子科技有限公司 | Circuit board cutting device |
| CN205058144U (en) * | 2015-10-27 | 2016-03-02 | 苏州市东亿数控有限公司 | Automatic cutting device of PCB base plate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108556230A (en) * | 2018-05-31 | 2018-09-21 | 重庆聚伯雅科技有限公司 | Plastic part cuts grinding apparatus |
| CN108556230B (en) * | 2018-05-31 | 2020-09-08 | 重庆工业职业技术学院 | Plastic part cutting and polishing equipment |
| CN110213894A (en) * | 2019-06-05 | 2019-09-06 | 深圳大图科创技术开发有限公司 | A kind of wiring board contour machining procedure |
| CN110213894B (en) * | 2019-06-05 | 2020-07-24 | 龙南骏亚电子科技有限公司 | Circuit board forming processing equipment |
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| Publication number | Publication date |
|---|---|
| CN107743343B (en) | 2019-10-11 |
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Effective date of registration: 20211209 Address after: 252800 No. 2, Huixin South Road, economic development zone, Gaotang County, Liaocheng City, Shandong Province (Development Zone Management Committee) Patentee after: GAOTANG Rongzhi Rongzhi Technology Service Co.,Ltd. Address before: 401555 Zhenxing Road, Taihe Town, Hechuan District, Chongqing Patentee before: CHONGQING ZHIYIXIN ELECTRONIC TECHNOLOGY Co.,Ltd. |
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