JP4593647B2 - Circular substrate processing method and processing apparatus - Google Patents

Circular substrate processing method and processing apparatus Download PDF

Info

Publication number
JP4593647B2
JP4593647B2 JP2008117923A JP2008117923A JP4593647B2 JP 4593647 B2 JP4593647 B2 JP 4593647B2 JP 2008117923 A JP2008117923 A JP 2008117923A JP 2008117923 A JP2008117923 A JP 2008117923A JP 4593647 B2 JP4593647 B2 JP 4593647B2
Authority
JP
Japan
Prior art keywords
substrate
guide member
outer edge
guide
deburring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008117923A
Other languages
Japanese (ja)
Other versions
JP2008243366A (en
Inventor
英希 高橋
高志 森
泰之 大関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THE FURUKAW ELECTRIC CO., LTD.
Original Assignee
THE FURUKAW ELECTRIC CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THE FURUKAW ELECTRIC CO., LTD. filed Critical THE FURUKAW ELECTRIC CO., LTD.
Priority to JP2008117923A priority Critical patent/JP4593647B2/en
Publication of JP2008243366A publication Critical patent/JP2008243366A/en
Application granted granted Critical
Publication of JP4593647B2 publication Critical patent/JP4593647B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

本発明は、磁気ディスク用基板その他の円形基板(この明細書では打抜き後のブランク材を言う)の加工方法及び加工装置に関するものである。   The present invention relates to a processing method and a processing apparatus for a magnetic disk substrate or other circular substrate (referred to as a blank material after punching in this specification).

例えば磁気ディスク用基板は、金属(アルミニウム合金)素条をダイス,パンチ及びストリッパを備えたプレス用金型により円形(ドーナツ状)に打抜き、打抜いた基板を加圧焼鈍により歪みを除いた後、サブストレート加工(内外縁部の研削、表面研削)⇒メッキ加工⇒研磨加工による仕上げの工程を経て製品とされる。
図8で示すように、金属素条を打抜いた円形の基板(ブランク材)1の外縁部には、打抜き時にダイスの刃により切断される剪断面側(図の下面側)にダレ(端面ダレ)11が形成される一方、パンチの刃により破断されるは破断面側(図の上面側)には破断によるバリ10や微細な凹凸が形成される。前記のダレ及びバリは、パンチの内縁の刃とホールパンチの外縁の刃により基板の内縁部にも同様に形成される。
For example, for a magnetic disk substrate, a metal (aluminum alloy) strip is punched into a circular shape (doughnut shape) by a press die equipped with a die, a punch and a stripper, and the punched substrate is subjected to pressure annealing to remove distortion. , Substrate processing (inner and outer edge grinding, surface grinding) ⇒ plating processing ⇒ finished product by polishing process.
As shown in FIG. 8, the outer edge portion of the circular substrate (blank material) 1 from which the metal strip has been punched is sag (end face) on the shear surface side (lower surface side in the figure) cut by the die blade during punching. On the other hand, burrs 10 and fine irregularities are formed on the fracture surface side (upper surface side in the figure) that is broken by the punch blade. The sagging and burrs are similarly formed on the inner edge of the substrate by the inner edge of the punch and the outer edge of the hole punch.

打抜き後の基板は、両側部に整列ガイドを有するベルトコンベア等の搬送ラインにより打抜き部からスタッキング部(積重ね部)へ搬送され、スタッキング状態で加圧焼鈍され、シュリンク包装状態で他の加工工場へ送られた後、内外縁部が研削加工される際に前記バリ10が取り除かれる。
このように、従来はサブストレート加工時の研削により基板のバリ取りが行われるが、基板が搬送ラインにより搬送される過程やスタッキングされる過程において、その外縁部は前記整列ガイドやスタッキング部のガイドその他の部材に接触し、外縁部のバリ10や微細な凹凸が一部脱落して切粉(以下「バリ屑」という。)が発生する。
なお、基板の外縁部は打抜き時にプッシュバックされるが、内縁部は打抜きっぱなしであって切り口がスケルトンと接触することがないので、バリ及び切粉の脱落は少ない。
The substrate after punching is transferred from the punching part to the stacking part (stacking part) by a transfer line such as a belt conveyor having alignment guides on both sides, pressure-annealed in the stacking state, and sent to another processing factory in the shrink packaging state. After being sent, the burr 10 is removed when the inner and outer edges are ground.
Thus, conventionally, deburring of a substrate is performed by grinding at the time of substrate processing, but in the process of transporting the substrate by the transport line or the process of stacking, the outer edge portion is the guide of the alignment guide or stacking unit. Contact with other members causes part of the burrs 10 and fine irregularities at the outer edge to fall off and generate chips (hereinafter referred to as “burr scraps”).
The outer edge portion of the substrate is pushed back at the time of punching, but the inner edge portion remains punched, and the cut edge does not come into contact with the skeleton, so that burrs and chips are less likely to fall off.

前記バリ屑の多くは基板上(基板面)に付着したまま残り、それらのバリ屑は、基板がスタッキングされると基板相互の間に挟み込まれた状態になり、その後の基板の加圧焼鈍時やシュリンク包装される際、あるいはシュリンク包装後の輸送中に面圧が加わることにより基板面に埋め込まれた状態になる。基板面に埋め込み状態になっているバリ屑は、その後サブストレート加工時の表面研削により基板面から脱落するが、バリ屑の基板面への埋め込み量が基板の研削代よりも大きい場合には、表面研削後当該埋め込み部分の凹みがピットとなり、ディスクの品質低下を招く。
特開平5−314474号公報
Most of the burrs remain attached on the substrate (substrate surface), and these burrs are sandwiched between the substrates when the substrates are stacked, and during subsequent pressure annealing of the substrate. When being subjected to shrink wrapping or during transportation after shrink wrapping, a surface pressure is applied, resulting in a state embedded in the substrate surface. The burr scrap that is embedded in the substrate surface is then removed from the substrate surface by surface grinding during substrate processing, but if the amount of burr scrap embedded in the substrate surface is larger than the grinding allowance of the substrate, After the surface grinding, the recessed portion of the embedded portion becomes a pit, which causes a deterioration in the quality of the disc.
JP-A-5-314474

本発明が解決しようとする課題は、打抜き後の過程で基板外縁部から脱落するバリ屑等の製品への影響を排除した各種円形基板及びその加工方法、並びに当該加工方法を円滑に実施することができる加工装置を提供することにある。   The problem to be solved by the present invention is to smoothly carry out various circular substrates, processing methods thereof, and the processing methods that eliminate the influence on products such as burr scraps falling off from the outer edge of the substrate in the process after punching. It is in providing the processing apparatus which can do.

本発明は前記課題を解決するため以下のように構成されている。
本発明に係る円形基板の加工方法及び装置は、第1に基板を挟んで相対する状態に設置された第1のガイド部材と第2のガイド部材とを含み、少なくとも第1のガイド部材は一方向に沿って無端的に連続駆動するガイドであり、前記第2のガイド部材は基板よりも硬い材質であるガイド部材を備えたバリ取り手段により、搬送ライン上で打抜き後の基板の外縁部にバリ取り加工を施す工程と、当該バリ取り加工により発生したバリ屑を当該基板上より除去する工程とを含み、前記基板の外縁部にバリ取り加工を施す工程では当該基板の外縁部を基板外縁部との転接部の長さが当該基板が一回以上回転するのに十分な長さを有する前記ガイド部材に転接させた状態で前記基板を一回以上回転させ、前記基板が前記ガイド部材ヘ転接しているときに当該ガイド部材を前記基板の外縁部へ所定の弾力で押し付けることにより搬送方向に搬送するとともにバリを取ることを特徴としている。
に前記バリ屑を基板上より除去する工程では吸引及び洗浄のいずれかの一方又は両方の手段によりバリ屑を除去することを特徴としている。
搬送ライン上で打抜き後の基板の外縁部転接し、基板を挟んで相対する状態に設置された第1のガイド部材と第2のガイド部材とを含み、少なくとも第1のガイド部材は一方向に沿って無端的に連続駆動するガイドであり、前記第2のガイド部材は基板よりも硬い材質であり、前記基板が前記ガイド部材ヘ転接しているときに当該ガイド部材を前記基板の外縁部へ所定の弾力で押し付けて、前記基板を一回以上回転させることにより搬送方向に回転させるとともに基板外周のバリを取るガイド部材を備えたバリ取り手段と、前記基板上に付着したバリ屑を除去するバリ屑除去手段とを設け、前記ガイド部材の基板外縁部との転接部の長さは当該基板が一回以上回転するのに十分な長さであることを特徴としている。
に前記第1のガイド部材は一対のプーリーに保持されたベルトであることを特徴としている。
に前記第1のガイド部材は駆動方向に沿って分割された状態の多数の部材からなり、各部材は、一対のプーリーに保持されたベルト又は一対の歯車に保持された無端のチェーンへ連続的に取り付けられていることを特徴としている。
に前記第1のガイド部材は一方向に回転する回転体ヘ回転方向に沿って設けられ、前記第2のガイド部材は前記第1のガイド部材の外周方向へ凹円弧状に対向配置されていることを特徴としている。
に前記第2のガイド部材又は/及び第1のガイド部材を基板の方向に付勢する付勢部材を備えたことを特徴としている。
に前記第2のガイド部材又は/及び第1のガイド部材は前記基板の外縁部が案内される溝状部を有することを特徴としている。
に少なくとも前記第2のガイド部材は、前記基板の外縁部が案内される溝状部を有するとともに、当該溝状部の底部中心に沿って分割された状態の少なくとも二つのパーツから構成され、当該第2のガイド部材を基板の方向に付勢する付勢部材は、前記パーツ相互により前記基板の外縁部を挟む方向へ付勢する付勢部材であることを特徴としている。
10に少なくとも前記溝状部内に基板外縁部が案内された状態では前記第2のガイド部材を構成する二つのパーツ間に隙間が形成され、前記第2のガイド部材の背面側には前記二つのパーツ間の隙間からバリ屑を吸引除去するバリ屑除去手段が設置されていることを特徴としている。
11に前記第1のガイド部材と第2のガイド部材は前記基板の搬送ラインの途中に設置され、前記第1のガイド部材は当該搬送ラインの搬送方向に沿ってその搬送速度と同調して駆動することを特徴としている。
The present invention is configured as follows to solve the above-described problems.
A circular substrate processing method and apparatus according to the present invention includes a first guide member and a second guide member, which are firstly disposed to face each other with a substrate interposed therebetween, and at least one first guide member is provided. The second guide member is a guide that is continuously driven along the direction, and the second guide member is formed on the outer edge portion of the substrate after punching on the transport line by a deburring means including a guide member that is harder than the substrate. A deburring process and a deburring process generated by the deburring process from the substrate. In the deburring process on the outer edge of the substrate, the outer edge of the substrate is the length of the rolling contact portion between parts is the the substrate in a state of being rolling contact with the guide member is rotated one or more times with a length sufficient to rotate said substrate at least once, the substrate is the guide When in contact with a member It is characterized in that deburring while transported in the transport direction by pressing the guide member at a predetermined elasticity to the outer edge of the substrate.
Is characterized in that the removal of burr debris by either or both of the means of any of the suction and irrigation, in the process of the burr debris second removed from the substrate.
And rolling contact an outer edge of the substrate after punching on the transport line to the third, and a first guide member and second guide members disposed at opposite state across the substrate, at least a first guide The member is a guide which is continuously driven endlessly along one direction, the second guide member is made of a material harder than the substrate, and the guide member is moved when the substrate is in rolling contact with the guide member. Deburring means provided with a guide member that is pressed against the outer edge of the substrate with a predetermined elasticity and rotated in the transport direction by rotating the substrate one or more times and deburred on the outer periphery of the substrate, and adhered to the substrate Burr debris removal means for removing burr debris is provided, and the length of the rolling contact portion of the guide member with the substrate outer edge is sufficient to allow the substrate to rotate once or more. .
Fourth , the first guide member is a belt held by a pair of pulleys.
Fifth , the first guide member is composed of a large number of members divided along the driving direction, and each member is a belt held by a pair of pulleys or an endless chain held by a pair of gears. It is characterized by being attached continuously.
The sixth first guide member provided along the rotation member f the rotational direction of rotating in one direction, the second guide member is disposed opposite to the concave arcuate outer peripheral direction of the first guide member It is characterized by having.
Seventh , a biasing member that biases the second guide member and / or the first guide member toward the substrate is provided.
The eighth second guide member and / or the first guide member is characterized by having a groove portion that the outer edge of the substrate is guided.
Ninthly , at least the second guide member has a groove-like portion that guides an outer edge portion of the substrate, and is composed of at least two parts that are divided along the center of the bottom of the groove-like portion. The urging member that urges the second guide member in the direction of the substrate is an urging member that urges the second guide member in a direction sandwiching the outer edge portion of the substrate by the parts.
Tenth , a gap is formed between two parts constituting the second guide member at least in a state where the outer edge of the substrate is guided into the groove-like portion, and the second guide member has a second gap on the back side thereof. It is characterized in that burr debris removing means for sucking and removing burr debris from a gap between two parts is installed.
11thly , the said 1st guide member and the 2nd guide member are installed in the middle of the conveyance line of the said board | substrate, and the said 1st guide member synchronizes with the conveyance speed along the conveyance direction of the said conveyance line. It is characterized by driving.

本発明によれば、外縁部のバリが当該基板上より除去されているので、その後基板の外縁部がガイドその他の部材と接触してもバリ屑は発生する余地がなく、ディスク製品にバリ屑の残留によるピット不良(ピットの発生)を生じるのを防止することができる。   According to the present invention, since the burrs at the outer edge are removed from the substrate, there is no room for burrs to be generated even if the outer edge of the substrate comes into contact with a guide or other member thereafter. It is possible to prevent the occurrence of pit defects (occurrence of pits) due to the remaining of slag.

本発明に係る円形基板の加工方法によれば、打抜き後の基板の外縁部にバリ取り加工が施され、それにより発生したバリ屑が基板上から除去されるので、その後基板の外縁部がガイドその他の部材と接触してもバリ屑は発生しない。したがって、前記本発明に係る円形基板を確実かつ円滑に加工することができる。   According to the method for processing a circular substrate according to the present invention, deburring is performed on the outer edge portion of the substrate after punching, and the generated debris is removed from the substrate. Even if it comes into contact with other members, burrs are not generated. Therefore, the circular substrate according to the present invention can be processed reliably and smoothly.

本発明に係る円形基板の加工装置によれば、打抜き後の基板の外縁部がガイド部材に転接した状態で当該基板が一回以上回転する間に外縁部のバリが取り除かれ、基板上に付着したバリ屑はバリ屑除去手段により当該基板上より除去されるので、前記の加工方法を円滑に実施することができる。   According to the circular substrate processing apparatus of the present invention, the outer edge burrs are removed while the substrate is rotated one or more times in a state where the outer edge of the substrate after punching is in contact with the guide member. Since the adhering burrs are removed from the substrate by the burrs removing means, the above processing method can be carried out smoothly.

図1〜図7を参照しながら本発明の好適な実施形態を説明する。
第1実施形態
図1は本発明に係る円形基板の加工装置の第1実施形態を示す部分平面図、図2は図1の矢印A−Aに沿う部分拡大断面図である。
A preferred embodiment of the present invention will be described with reference to FIGS.
First Embodiment FIG. 1 is a partial plan view showing a first embodiment of a circular substrate processing apparatus according to the present invention, and FIG. 2 is a partial enlarged cross-sectional view taken along arrow AA in FIG.

この実施形態の加工装置は、本発明による加工装置を磁気ディスク用アルミニウム合金基板の加工に適用した形態であり、図示しない打抜きプレス用金型の設置位置へ間欠的に移送される金属素条は、前記打抜きプレス用金型により順次ドーナツ状の基板1として打抜かれる。
打抜き後の基板1は、その外縁部が転接されるガイド部材3a,3bを備えたバリ取り手段3により外縁部のバリが取り除かれ、基板1上に付着残留したバリ屑はバリ屑除去手段4a,4により当該基板1上より除去される。
この実施形態では、ガイド部材3a,3bを備えたバリ取り手段3と、バリ屑除去手段4a,4とは打抜かれた基板1の搬送ライン2の途中に設置されており、ガイド部材3a,3bの基板外縁部との転接部の長さは当該基板1が一回以上回転するのに十分な長さである。
搬送ライン2の両側には、前記バリ取り手段3とバリ屑除去手段4の設置領域とを除く部分に図示しない整列用のガイドが設置されている。
The processing apparatus of this embodiment is a form in which the processing apparatus according to the present invention is applied to the processing of an aluminum alloy substrate for a magnetic disk, and the metal strip intermittently transferred to the installation position of a punching press mold (not shown) The doughnut-shaped substrate 1 is sequentially punched by the punching press die.
After the punching, the substrate 1 is deburred by the deburring means 3 provided with guide members 3a and 3b whose outer edge portions are brought into rolling contact, and the debris remaining on the substrate 1 is removed by the deburring means. It is removed from the substrate 1 by 4a and 4.
In this embodiment, the deburring means 3 provided with the guide members 3a and 3b and the deburring dust removing means 4a and 4 are installed in the middle of the transport line 2 of the punched substrate 1, and the guide members 3a and 3b. The length of the rolling contact portion with the outer edge portion of the substrate is sufficient for the substrate 1 to rotate once or more.
On both sides of the transport line 2, alignment guides (not shown) are installed in portions other than the installation area of the deburring means 3 and the debris removal means 4.

この実施形態では、3aは第1のガイド部材,3bは第2のガイド部材であり、第1のガイド部材3aは搬送ライン2の搬送方向に沿って無端的に連続駆動するガイドである。
搬送ライン2は途中に平面視においてUターン状を呈する円弧状曲がり部20を有しており、前記バリ取り手段3は当該円弧状曲がり部20に設置されている。
すなわち、円弧状曲がり部20にはその中心部を回転軸心として搬送方向へ回転する回転体30が設置され、第1のガイド部材3aは当該回転体30に対して回転方向に沿って(同心状に)取り付けられている。
前記第1のガイド部材3aの外周方向には、搬送される基板1を挟んで第1のガイド部材3aと相対するように円弧状の第2のガイド部材3bが設置されている。この第2のガイド部材3bの内周長は基板1の周長以上であるので、基板1は円弧状曲がり部20を通過する際外縁部がガイド部材3a,3bへ転接した状態で一回以上回転する。
In this embodiment, 3a is a first guide member, 3b is a second guide member, and the first guide member 3a is a guide that is continuously driven endlessly along the transport direction of the transport line 2.
The conveyance line 2 has an arcuate bent portion 20 having a U-turn shape in plan view in the middle, and the deburring means 3 is installed on the arcuate bent portion 20.
That is, the arcuate bent portion 20 is provided with a rotating body 30 that rotates in the transport direction with the central portion serving as a rotation axis, and the first guide member 3a is arranged along the rotating direction (concentric with respect to the rotating body 30). Attached).
In the outer peripheral direction of the first guide member 3a, an arc-shaped second guide member 3b is installed so as to face the first guide member 3a with the substrate 1 to be conveyed interposed therebetween. Since the inner peripheral length of the second guide member 3b is equal to or greater than the peripheral length of the substrate 1, the substrate 1 is once in a state where the outer edge portion is in rolling contact with the guide members 3a and 3b when passing through the arc-shaped bent portion 20. It rotates above.

図2で示すように、各ガイド部材3a,3bは搬送ラインの搬送方向に沿って断面がほぼV字状の溝状部32を有しており、各基板1の外縁部は各ガイド部材3a,3bの溝状部32へ案内された状態で転接するように構成されている。
第2のガイド部材3bは溝状部32の底部中心に沿って分割された状態の上下の二つのパーツ31,31から構成されている。これらの各パーツ31,31は、溝状部32へ基板1の外縁部が案内されたとき適当な隙間を介して重なる状態に配置され、溝状部32の傾斜面で基板1の外縁部を挟む方向へばね等の複数の付勢部33により付勢されている。33aは図示しないフレーム等に固定されている受け具(ばね受け)、33bは対応するパーツ31へ鉛直に取り付けられたガイドピンであり、ガイドピン33bはコイルばねからなる付勢部材33を保持し、かつ受け具33aに対して可動に貫通されている。
各パーツ31,31が前記のように付勢されていることにより、基板1は、その外縁部の角が各パーツ31,31間の溝状部32の各斜面により圧迫され、同時に第1のガイド部材3aの方向へ押し付けられるため、バリ取り処理が促進されるほか、基板1の板厚や径のバラツキが大きい場合でもそのバラツキを吸収することができる。
As shown in FIG. 2, each guide member 3a, 3b has a groove portion 32 having a substantially V-shaped cross section along the transport direction of the transport line, and the outer edge portion of each substrate 1 is each guide member 3a. , 3b so as to be in rolling contact with the groove-shaped portion 32.
The second guide member 3 b is composed of two upper and lower parts 31, 31 that are divided along the center of the bottom of the groove 32. These parts 31 and 31 are arranged so as to overlap with each other through an appropriate gap when the outer edge portion of the substrate 1 is guided to the groove portion 32, and the outer edge portion of the substrate 1 is arranged on the inclined surface of the groove portion 32. It is biased by a plurality of biasing portions 33 such as springs in the sandwiching direction. Reference numeral 33a denotes a holder (spring receiver) fixed to a frame (not shown), 33b denotes a guide pin vertically attached to the corresponding part 31, and the guide pin 33b holds a biasing member 33 made of a coil spring. And it penetrates movably with respect to the receiving tool 33a.
Since the parts 31 and 31 are biased as described above, the corners of the outer edge of the substrate 1 are pressed by the slopes of the groove-shaped part 32 between the parts 31 and 31, and the first Since it is pressed in the direction of the guide member 3a, the deburring process is promoted, and even when the board 1 has a large thickness or diameter variation, the variation can be absorbed.

ガイド部材3a,3bは基板1の材質よりも硬い材質であって、合金工具鋼(SKD)、高速工具鋼(SKH)及び工具鋼(SK)等が使用されている。ガイド部材3a,3bには、それらの長寿命化や切れ味等の改善のため、基板1の外縁部との接触面に窒化処理又は硬質Crメッキ等を施すのが好ましい。   The guide members 3a and 3b are made of a material harder than the material of the substrate 1, and alloy tool steel (SKD), high speed tool steel (SKH), tool steel (SK) and the like are used. The guide members 3a and 3b are preferably subjected to nitriding treatment or hard Cr plating on the contact surface with the outer edge portion of the substrate 1 in order to extend their life and sharpness.

バリ屑除去手段4,4aの中の一方4aは、第2のガイド部材3bの背面側に設置された吸引形態の手段である。すなわち、第2のガイド部材3bを構成する上下のパーツ31,31相互間の隙間に背面から臨むように開口された吸引ボックス40が設置され、当該吸引ボックス40には図示しない吸引パイプが連通していて、運転中は基板1から脱落したバリ屑が吸引ボックス40内に吸引されるようになっている。
他方のバリ屑除去手段4は、バリ取り手段3よりも搬送ラインの後方に設置された洗浄形態の手段である。このバリ屑除去手段4は、搬送中の基板1を上下から挟んで搬送方向へ回転する複数の対のローラ(図示せず)と、ローラ相互間において搬送ライン2の上下から洗浄水(湯)を噴射する複数の噴射ノズル(図示せず)とを備えており、これらの各ローラ及び噴射ノズルは搬送ライン2の一部とともに洗浄ボックス41によりカバーされている。
前記噴射ノズルから噴射される洗浄水には、基板1の品質に悪影響を及ぼさない洗浄剤を添加することができる。
One 4a of the debris removal means 4 and 4a is a suction-type means installed on the back side of the second guide member 3b. That is, a suction box 40 opened so as to face the back surface is provided in a gap between the upper and lower parts 31 and 31 constituting the second guide member 3b, and a suction pipe (not shown) communicates with the suction box 40. During operation, the burrs that fall off the substrate 1 are sucked into the suction box 40.
The other deburring removal means 4 is a cleaning type means installed behind the deburring means 3 in the transport line. The debris removal means 4 includes a plurality of pairs of rollers (not shown) that rotate in the transport direction with the substrate 1 being transported from above and below, and cleaning water (hot water) from above and below the transport line 2 between the rollers. A plurality of spray nozzles (not shown) are sprayed, and each of these rollers and spray nozzles is covered by a cleaning box 41 together with a part of the transport line 2.
A cleaning agent that does not adversely affect the quality of the substrate 1 can be added to the cleaning water sprayed from the spray nozzle.

第1実施形態の加工装置において、第2のガイド部材3bは前述のように分割された状態の各パーツ31,31でなく、第1のガイド部材3aと同じ断面形状の部材を使用することができる。
その場合には、当該ガイド部材を搬送方向に沿って複数(例えば三つ)に分割した状態の部材を、所定の間隙を介して平面視円弧状となるように設置し、それらの各部材を基板1の方向に(円弧状曲がり部20の中心方向に)付勢する付勢部材を設けるのが望ましい。その理由は、基板1の外縁部のバリ取りを効率的に行うことができるからであり、また、基板1の板厚や径のバラツキを吸収できることによる。
In the processing apparatus according to the first embodiment, the second guide member 3b may be a member having the same cross-sectional shape as the first guide member 3a, instead of the parts 31 and 31 that are divided as described above. it can.
In that case, the members in a state in which the guide member is divided into a plurality (for example, three) along the conveyance direction are installed so as to form an arc shape in plan view through a predetermined gap, and the respective members are It is desirable to provide a biasing member that biases in the direction of the substrate 1 (in the central direction of the arc-shaped bent portion 20). The reason is that deburring of the outer edge portion of the substrate 1 can be performed efficiently, and that variations in the thickness and diameter of the substrate 1 can be absorbed.

第1実施形態の加工装置の作用を、円形基板の加工方法の実施形態とともに説明する。
搬送ライン2により所定の間隔で搬送される基板1は、順次バリ取り手段3に到達し、それらの外縁部が第1のガイド部材3aの外周部と第2のガイド部材3bの内周部の各溝状部32へ案内された状態で転接する。そして、第1のガイド部材3aが搬送方向に沿ってそのライン速度と同調して回転することにより、基板1は搬送方向に沿って回転しながら各ガイド部材3a,3bヘ径方向に挟まれて順次搬送され、この間に基板1の外縁部にバリ取り加工が施される。
The operation of the processing apparatus of the first embodiment will be described together with an embodiment of a circular substrate processing method.
The substrates 1 transported at a predetermined interval by the transport line 2 sequentially reach the deburring means 3, and their outer edge portions are the outer peripheral portion of the first guide member 3a and the inner peripheral portion of the second guide member 3b. Rolling contact is made while being guided to each groove-like portion 32. The first guide member 3a rotates in synchronization with the line speed along the conveyance direction, so that the substrate 1 is sandwiched between the guide members 3a and 3b in the radial direction while rotating along the conveyance direction. Deburring processing is performed on the outer edge of the substrate 1 during this time.

前記バリ取り加工と併行して、基板外縁部から脱落したバリ屑の一部は、第2のガイド部材3bの背面に設置された吸引形態のバリ屑除去手段4aによって吸引除去された後、基板1は順次他のバリ屑除去手段4を通過する。
この洗浄形態のバリ屑除去手段4を通過する際、洗浄により基板1上に残ったバリ屑は除去され、同時に打抜き時に使用された油分も基板1上から洗い流される。
Along with the deburring process, a part of the burr debris dropped from the outer edge of the substrate is removed by suction by the deburring debris removing means 4a in the suction form installed on the back surface of the second guide member 3b. 1 sequentially passes through the other debris removal means 4.
When passing through the debris removal means 4 in this cleaning form, the debris remaining on the substrate 1 is removed by the cleaning, and at the same time, the oil used at the time of punching is also washed away from the substrate 1.

バリ取り手段3及びバリ屑除去手段4a,4を通過した基板1は、図7で示すようにその外縁部のバリ10(図8)が削除されているとともに、削除後に基板1上へ付着残留していたバリ屑も除去される。したがって、後の工程で基板1の外縁部にガイドその他の部材が接触してもバリ屑が生ずるおそれはなく、仕上げ加工後製品にピットが形成される(以下「ピット不良」という。)のを防止することができる。   As shown in FIG. 7, the burrs 10 (FIG. 8) at the outer edge of the substrate 1 that has passed through the deburring means 3 and the deburring removal means 4a and 4 are removed, and the adhesion remains on the substrate 1 after the removal. The debris that had been removed is also removed. Therefore, even if a guide or other member comes into contact with the outer edge of the substrate 1 in a later process, there is no possibility that burrs will be generated, and pits are formed in the finished product (hereinafter referred to as “pit defects”). Can be prevented.

第2実施形態
図3は円形基板の加工装置の第2実施形態を示す部分平面図であり、バリ取り手段3は搬送ラインの直線搬送部に設置されている。
バリ取り手段3は、搬送ライン2の一方の側部へ搬送方向に沿って設置された第1のガイド部材3aと、搬送ライン2の他方の側部に沿って設置された第2のガイド部材3bとから構成されている。
Second Embodiment FIG. 3 is a partial plan view showing a second embodiment of the processing apparatus for a circular substrate, and the deburring means 3 is installed in a linear conveyance section of the conveyance line.
The deburring means 3 includes a first guide member 3a installed along the conveyance direction on one side of the conveyance line 2, and a second guide member installed along the other side of the conveyance line 2. 3b.

第1のガイド部材3aは図2(第1実施形態)の第1のガイド部材3aと同様な断面形状を有していて、搬送方向に沿って一定の長さで分割された状態で搬送方向に沿って無端状に連続駆動する多数の部材34から構成されている。
各部材34は、水平な一対の歯車30a,30aに保持された無端のチェーン30bへ連続的に取り付けられており、チェーン30bは搬送ライン2の搬送方向に沿って当該ラインの速度と同調して連続駆動するように制御されている。
The first guide member 3a has a cross-sectional shape similar to that of the first guide member 3a of FIG. 2 (first embodiment), and is divided in a certain length along the conveyance direction. It is comprised from many members 34 which are continuously driven endlessly along.
Each member 34 is continuously attached to an endless chain 30b held by a pair of horizontal gears 30a, 30a. The chain 30b is synchronized with the speed of the line along the conveying direction of the conveying line 2. It is controlled to drive continuously.

各部材34は、搬送ライン2ヘ面して駆動する部分では背面側に設置されたコイルばねからなる付勢部材35により、当該各部材34の溝状部に外縁部が案内された状態の基板1ヘ押し付けられるように付勢されている。この実施形態では、搬送ライン2の方向へ所定の範囲で進退するように図示しない支持部材へ保持部材35cを設置し、この保持部材35cへその前を走行する各部材34に転接する状態に少なくとも一対のローラ35d,35dを保持させ、付勢部材35は前記保持部材35cに保持された各ローラ35dを介して各部材34を前記のように付勢している。
なお、35aは図示しないフレーム等に固定された受け具であり、35bは受け具35aを軸方向へ可動に貫通しているガイドピンであって、ガイドピン35bは保持部材35cの背面側へ鉛直に取り付けられており、コイルばねからなる付勢部材35を保持している。また、付勢部材35を含む保持部材35cは、チェーン30bが水平方向へ弛まないように支持するガイドレールを兼ねており、チェーン30bは全体が垂直方向に弛まないように図示しないガイドレールにより支持されている。
Each member 34 is a substrate in which the outer edge portion is guided to the groove-like portion of each member 34 by a biasing member 35 made of a coil spring installed on the back side in a portion that faces the conveyance line 2 and is driven. It is energized so that it can be pressed to 1 part. In this embodiment, a holding member 35c is installed on a support member (not shown) so as to advance and retreat within a predetermined range in the direction of the conveyance line 2, and at least in a state of rolling contact with each member 34 traveling in front of the holding member 35c. A pair of rollers 35d and 35d are held, and the biasing member 35 biases each member 34 as described above via each roller 35d held by the holding member 35c.
35a is a holder fixed to a frame or the like (not shown), 35b is a guide pin that movably penetrates the holder 35a in the axial direction, and the guide pin 35b is perpendicular to the back side of the holding member 35c. The urging member 35 made of a coil spring is held. The holding member 35c including the urging member 35 also serves as a guide rail that supports the chain 30b so as not to loosen in the horizontal direction, and the chain 30b is supported by a guide rail (not shown) so as not to loosen in the vertical direction. Has been.

第2のガイド部材3bは、第1のガイド部材3aを構成する各部材34と同様な断面形状を有し、搬送ライン2に向かって所定の範囲で進退するように図示しない支持部材に取り付けられており、コイルばねからなる付勢部材33により、当該第2のガイド部材3bの溝状部へ外縁部が案内された状態の基板1の方向へ付勢されている。
33aは図示しないフレームへ取り付けられた受け具、33bはコイルばねからなる付勢部材33を保持したガイドピンであり、ガイドピン33bはガイド部材3bの背面側へ鉛直に取り付けられていて、受け具33aを可動に貫通している。
各ガイド部材3a(部材34),3bの材質は第1実施形態のガイド部材3a,3bと同じである。
The second guide member 3b has the same cross-sectional shape as each member 34 constituting the first guide member 3a, and is attached to a support member (not shown) so as to advance and retreat in a predetermined range toward the transport line 2. The biasing member 33 made of a coil spring is biased toward the substrate 1 in a state where the outer edge portion is guided to the groove-shaped portion of the second guide member 3b.
33a is a holder attached to a frame (not shown), 33b is a guide pin holding a biasing member 33 made of a coil spring, and the guide pin 33b is vertically attached to the back side of the guide member 3b. 33a is movably penetrated.
The material of each guide member 3a (member 34), 3b is the same as that of the guide members 3a, 3b of the first embodiment.

第2実施形態の円形基板の加工装置によれば、各基板1は、搬送ライン2のライン速度と同調して連続駆動する第1のガイド部材3aの各部材34により、第1及び第2のガイド部材3a,3bの溝状部へ外縁部が転接した状態で図3の時計方向へ回転しつつ搬送される。
各基板1は前記のように回転しつつ搬送される間に、外縁部がガイド部材3a,3bの溝状部内へ転接した状態で一回以上回転するので、その外縁部のバリが脱落し(外縁部にバリ取り加工が施され)、脱落して基板1へ付着したバリ屑は、搬送ライン2の下流位置に設置された図示しない洗浄形態のバリ屑除去手段により基板1上より除去される。
また、第1のガイド部材3a及び第2のガイド部材3bは、両者により各基板1を挟む方向へ付勢されているので、各基板1の板厚や径のバラツキを吸収することができる。
この実施形態の他の作用や効果は、第1実施形態の装置と同様であるのでそれらの説明は省略する。
According to the circular substrate processing apparatus of the second embodiment, each substrate 1 is driven by the first and second members 34 of the first guide member 3a that is continuously driven in synchronization with the line speed of the transport line 2. It is conveyed while rotating in the clockwise direction of FIG. 3 in a state where the outer edge portion is in rolling contact with the groove-like portions of the guide members 3a and 3b.
While each substrate 1 is transported while rotating as described above, the outer edge portion rotates in the grooved portions of the guide members 3a and 3b and rotates one or more times, so that the burr at the outer edge portion drops off. (Burr removal processing is performed on the outer edge portion), and the debris that has fallen off and adheres to the substrate 1 is removed from the substrate 1 by a debris removal means (not shown) in a cleaning form installed at a downstream position of the transfer line 2. The
Further, since the first guide member 3a and the second guide member 3b are biased in a direction in which each substrate 1 is sandwiched between them, variations in the thickness and diameter of each substrate 1 can be absorbed.
Since other operations and effects of this embodiment are the same as those of the apparatus of the first embodiment, description thereof will be omitted.

第2実施形態においては、第1のガイド部材3a側の各歯車30aとチェーン30bを、それぞれプーリーとベルトに代えることができるほか、第2のガイド部材3bを第1実施形態の装置の第2のガイド部材3bと同様な断面形状で直線状の上下のパーツで構成し、それらを基板1の外縁部が挟まれる方向へ付勢するとともに、当該第2のガイド部材の背面側へ図2と同様な吸引形態のバリ屑除去手段を設けることができる。
付勢部材33,35のいずれかの一方は省略しても実施することができる。
また、第2のガイド部材3bは第1のガイド部材3aと同様に駆動可能な形態に構成することができる。この場合には、第2のガイド部材3bを搬送ライン2の搬送方向の逆方向へ連続駆動させるか、あるいは第1のガイド部材3aよりも遅い速度で搬送ライン2の搬送方向に沿って連続駆動させるが、いずれの場合も基板1が回転しながら搬送ライン2の搬送速度と同調して搬送されるように両ガイド部材3a,3bの駆動速度を制御する。
In the second embodiment, the gears 30a and the chain 30b on the first guide member 3a side can be replaced with pulleys and belts, respectively, and the second guide member 3b can be replaced with the second of the apparatus of the first embodiment. The guide member 3b is composed of linear upper and lower parts having the same cross-sectional shape, and urges them in the direction in which the outer edge portion of the substrate 1 is sandwiched, and toward the back side of the second guide member as shown in FIG. A debris removing means having a similar suction form can be provided.
Even if one of the urging members 33 and 35 is omitted, it can be implemented.
Moreover, the 2nd guide member 3b can be comprised in the form which can be driven similarly to the 1st guide member 3a. In this case, the second guide member 3b is continuously driven in the direction opposite to the transport direction of the transport line 2, or continuously driven along the transport direction of the transport line 2 at a slower speed than the first guide member 3a. In either case, however, the drive speeds of the guide members 3a and 3b are controlled so that the substrate 1 is transported in synchronization with the transport speed of the transport line 2 while rotating.

第3実施形態
図4は円形基板の加工装置の第3実施形態を示す部分平面図であり、バリ取り手段3は、搬送ライン2の直線搬送部の一方の側部へ搬送方向に沿って設置された第1のガイド部材3aと、他方の側部に沿って設置された第2のガイド部材3bとから構成されている。前記第1のガイド部材3aは、運転中搬送ライン2の搬送速度と同調して搬送方向へ無端状に連続駆動する。
第2のガイド部材3bは、第2実施形態の装置における第2のガイド部材3bとほぼ同様に構成されている。
Third Embodiment FIG. 4 is a partial plan view showing a third embodiment of a processing apparatus for a circular substrate, and the deburring means 3 is installed on one side of the linear conveyance section of the conveyance line 2 along the conveyance direction. The first guide member 3a and the second guide member 3b installed along the other side portion. The first guide member 3a is continuously driven endlessly in the transport direction in synchronization with the transport speed of the transport line 2 during operation.
The second guide member 3b is configured in substantially the same manner as the second guide member 3b in the apparatus of the second embodiment.

第1のガイド部材3aは、水平な一対のプーリー30c,30cに保持されたベルト(Vベルト)3dにより構成されている。
第1のガイド部材3aの搬送ライン2ヘ面して駆動する部分は、付勢部材35により第2実施形態の加工装置におけると同様な状態で基板1の方向へ付勢されている。保持部材35cには、第1のガイド部材3aを構成するベルト30dに転接する少なくとも一対のローラ(図示せず)が保持されている。
The first guide member 3a is constituted by a belt (V belt) 3d held by a pair of horizontal pulleys 30c, 30c.
The portion of the first guide member 3a that drives to face the conveyance line 2 is urged toward the substrate 1 by the urging member 35 in the same state as in the processing apparatus of the second embodiment. The holding member 35c holds at least a pair of rollers (not shown) that are in rolling contact with the belt 30d constituting the first guide member 3a.

第3実施形態の加工装置によれば、各基板1は、搬送ライン2の搬送速度と同調して連続駆動する第1のガイド部材3aにより、第1及び第2のガイド部材3a,3bの溝状部へ外縁部が転接した状態で図4の時計方向へ回転しつつ搬送される。
各基板1は前記のように回転しつつ搬送される間に、外縁部が第2のガイド部材3bの溝状部内へ転接した状態で一回以上回転するので、その外縁部にバリ取り加工が施され、脱落して基板1へ付着したバリ屑は、搬送ライン2の下流位置に設置された図示しない洗浄形態のバリ屑除去手段により基板1上より除去される。
また、第1のガイド部材3a及び第2のガイド部材3bは、両者により各基板1を挟む方向へ付勢されているので、各基板1の板厚や径のバラツキを吸収することができる。
この実施形態の他の作用や効果は、第1実施形態の装置と同様であるのでそれらの説明は省略する。
According to the processing apparatus of the third embodiment, each substrate 1 is grooved in the first and second guide members 3a and 3b by the first guide member 3a that is continuously driven in synchronization with the transport speed of the transport line 2. In the state where the outer edge portion is in rolling contact with the shape portion, the sheet is conveyed while rotating clockwise in FIG.
While each substrate 1 is conveyed while rotating as described above, the outer edge rotates one or more times in a state of rolling contact with the grooved portion of the second guide member 3b, so that the outer edge is deburred. The debris that has fallen off and adheres to the substrate 1 is removed from the substrate 1 by a debris removing means (not shown) in a cleaning form installed at a downstream position of the transfer line 2.
Further, since the first guide member 3a and the second guide member 3b are biased in a direction in which each substrate 1 is sandwiched between them, variations in the thickness and diameter of each substrate 1 can be absorbed.
Since other operations and effects of this embodiment are the same as those of the apparatus of the first embodiment, description thereof will be omitted.

第3実施形態においては、第2のガイド部材3bを第1実施形態の装置の第2のガイド部材3bと同様な上下のパーツで構成し、それらを同様に付勢するとともに、当該第2のガイド部材の背面側へ図2と同様な吸引形態のバリ屑除去手段を設けることができる。
付勢部材33,35のいずれかの一方は省略しても実施することができる。
また、第2のガイド部材3bは第2実施形態における第1のガイド部材3aと同様に構成することができる。この場合には、第2のガイド部材3bを搬送ライン2の搬送方向の逆方向へ連続駆動させるか、あるいは第1のガイド部材3aよりも遅い速度で搬送ライン2の搬送方向に沿って連続駆動させるが、いずれの場合も基板1が回転しながら搬送ライン2の搬送速度と同調して搬送されるように両ガイド部材3a,3bの駆動速度を制御する。
In the third embodiment, the second guide member 3b is composed of upper and lower parts similar to those of the second guide member 3b of the apparatus of the first embodiment, urges them in the same manner, and the second guide member 3b The debris removal means of the suction | inhalation form similar to FIG. 2 can be provided in the back side of a guide member.
Even if one of the urging members 33 and 35 is omitted, it can be implemented.
Moreover, the 2nd guide member 3b can be comprised similarly to the 1st guide member 3a in 2nd Embodiment. In this case, the second guide member 3b is continuously driven in the direction opposite to the transport direction of the transport line 2, or continuously driven along the transport direction of the transport line 2 at a slower speed than the first guide member 3a. In either case, however, the drive speeds of the guide members 3a and 3b are controlled so that the substrate 1 is transported in synchronization with the transport speed of the transport line 2 while rotating.

第4実施形態
図5は円形基板の加工装置の第4実施形態を示す部分正面図であり、バリ取り手段3は、溝状の傾斜ガイドからなる搬送ライン2の傾斜搬送部の上部へ搬送方向に沿って設置された第1のガイド部材3aと、搬送ライン2の下部に沿って設置された第2のガイド部材3bとから構成されている。前記第1のガイド部材3aは、運転中搬送ライン2の搬送速度と同調して搬送方向へ無端状に連続駆動する。
第1のガイド部材3aは、垂直な一対のプーリー30c,30cに保持されたベルト(Vベルト)により構成されている。
第2のガイド部材3bは、第1実施形態の装置の第1のガイド部材3aと同様な断面形状を有し、第1実施形態のガイド部材3aと同様に基板1よりも硬い材料により構成されている。
Fourth Embodiment FIG. 5 is a partial front view showing a fourth embodiment of a processing apparatus for a circular substrate. And a second guide member 3b installed along the lower part of the transport line 2. The first guide member 3a is continuously driven endlessly in the transport direction in synchronization with the transport speed of the transport line 2 during operation.
The first guide member 3a is constituted by a belt (V-belt) held by a pair of vertical pulleys 30c, 30c.
The second guide member 3b has a cross-sectional shape similar to that of the first guide member 3a of the apparatus of the first embodiment, and is made of a material harder than the substrate 1 like the guide member 3a of the first embodiment. ing.

第4実施形態の加工装置によれば、各基板1は、搬送ライン2のライン速度と同調して連続駆動する第1のガイド部材3aにより、第1及び第2のガイド部材3a,3bの溝状部へ外縁部が転接した状態で図の時計方向へ回転しつつ搬送される。
各基板1は前記のように回転しつつ搬送される間に、外縁部が第2のガイド部材3bの溝状部内へ転接した状態で搬送方向に沿って複数回回転するので、その外縁部にバリ取り加工が施され、脱落して基板1へ付着したバリ屑は、搬送ライン2の下流位置に設置された図示しない洗浄形態のバリ屑除去手段により基板1上より除去される。
また、基板1は重力によりその外縁部が固定側の第2のガイド部材3bの溝状部へ常時接触するので、その板厚のバラツキを吸収することができる。
この実施形態の他の作用や効果は、第1実施形態の装置と同様であるのでそれらの説明は省略する。
According to the processing apparatus of the fourth embodiment, each substrate 1 is grooved in the first and second guide members 3a and 3b by the first guide member 3a that is continuously driven in synchronization with the line speed of the transport line 2. In the state where the outer edge portion is in rolling contact with the shape portion, it is conveyed while rotating clockwise in the figure.
While each substrate 1 is conveyed while rotating as described above, the outer edge portion rotates a plurality of times along the conveying direction with the outer edge portion rolling into the groove-like portion of the second guide member 3b. The deburring process that has been removed and adhered to the substrate 1 is removed from the substrate 1 by a deburring removal means (not shown) installed at a downstream position of the transfer line 2.
Further, since the outer edge portion of the substrate 1 is always in contact with the groove-like portion of the second guide member 3b on the fixed side due to gravity, it is possible to absorb variations in the plate thickness.
Since other operations and effects of this embodiment are the same as those of the apparatus of the first embodiment, description thereof will be omitted.

第4実施形態においては、下部に設置された第2のガイド部材3bの溝状部が深く、かつ断面V字状又は凹円弧状の内底部の両側に低摩擦性シートが定着された垂直壁を有している場合には、第1のガイド部材3aを省略し、基板1が自重により第2のガイド部材3bに沿って搬送方向へ転がるように構成することができる。   In the fourth embodiment, a vertical wall in which the groove portion of the second guide member 3b installed in the lower portion is deep and low friction sheets are fixed on both sides of the inner bottom portion having a V-shaped or concave arc shape in cross section. The first guide member 3a can be omitted, and the substrate 1 can be configured to roll in the transport direction along the second guide member 3b by its own weight.

その他の実施形態
図6の(a)図〜(f)図は、本発明に係る加工装置におけるそれぞれ別のガイド部材の変形形態を示す断面図である。
(a)図は、駆動側の第1のガイド部材3a及び固定側の第2のガイド部材3bともに基板1の外縁部が転接する面が垂直な粗面で形成されている形態である。第1のガイド部材3aの他の構成やそれらの設置状態、及び第2のガイド部材3bの設置状態は、図3で示した第2実施形態と同様であるので、同一の符号を付してそれらの説明は省略する。
なお、符号36はローラ35dの保持部材35cを搬送ライン2に向かって所定の範囲で進退するように支持する支持部材、37は無端のチェーン30bの弛みを防止するガイドレール、38は第2のガイド部材3bを搬送ライン2に向かって所定の範囲で進退するように支持する支持部材である。
Other Embodiments FIG. 6A to FIG. 6F are cross-sectional views showing modifications of different guide members in the processing apparatus according to the present invention.
(A) The figure is a form in which the surface on which the outer edge portion of the substrate 1 rolls is formed by a vertical rough surface in both the first guide member 3a on the driving side and the second guide member 3b on the fixed side. The other configurations of the first guide member 3a, the installation state thereof, and the installation state of the second guide member 3b are the same as those in the second embodiment shown in FIG. Those explanations are omitted.
Reference numeral 36 denotes a support member that supports the holding member 35c of the roller 35d so as to advance and retreat within a predetermined range toward the conveyance line 2, 37 denotes a guide rail that prevents the endless chain 30b from loosening, and 38 denotes a second member. It is a support member that supports the guide member 3b so as to advance and retreat within a predetermined range toward the transport line 2.

(b)図は、第2のガイド部材3bの溝状部32が断面凹円弧状に形成されている形態であり、第2のガイド部材3bは図3の実施形態と同様な構成により付勢部材33により基板1の方向へ付勢される。第1のガイド部材も同様な形状に形成することができる。
(c)図は、第1のガイド部材3aを構成する各部材34が溝状部32の中央から長さ方向に沿って分割された状態に形成されている形態であり、上下の各部材34はそれぞれ別の対の歯車(図示せず)に保持された無端のチェーン30b,30bヘ連続的に取り付けられている。また、各部材34,34は基板1の外縁部を上下方向から挟む方向へコイルばねからなる各付勢部材35によりそれぞれ付勢されている。付勢部材35により各部材34を付勢するための設置状態は、(a)図の場合とほぼ同様である。
(B) The figure is a form in which the groove-like portion 32 of the second guide member 3b is formed in a concave arc shape in section, and the second guide member 3b is urged by the same configuration as the embodiment of FIG. The member 33 is biased toward the substrate 1. The first guide member can also be formed in a similar shape.
(C) The figure shows a form in which each member 34 constituting the first guide member 3a is formed in a state of being divided along the length direction from the center of the groove-like portion 32. Are continuously attached to endless chains 30b, 30b, which are held in separate pairs of gears (not shown). Each member 34, 34 is urged by each urging member 35 comprising a coil spring in a direction sandwiching the outer edge portion of the substrate 1 from the vertical direction. The installation state for urging each member 34 by the urging member 35 is substantially the same as in the case of FIG.

(d)図は、第2のガイド部材3bが断面円弧状の溝状部32の中央から長さ方向に沿って分割された状態のパーツ31,31から構成されている形態であり、各パーツ31,31は、図2の実施形態と同様に各付勢部材33,33により基板1の外縁部を挟む方向へ付勢される。
第1のガイド部材の各部材(図3の部材34と同様な部材)も同様な断面形状に形成することができる。この場合の各部材の設置状態は、(c)図とほぼ同様になる。
(D) The figure shows a form in which the second guide member 3b is composed of parts 31, 31 in a state where the second guide member 3b is divided along the length direction from the center of the groove-shaped portion 32 having an arcuate cross section. Similarly to the embodiment of FIG. 2, 31 and 31 are urged by the urging members 33 and 33 in the direction of sandwiching the outer edge portion of the substrate 1.
Each member of the first guide member (a member similar to the member 34 in FIG. 3) can also be formed in a similar cross-sectional shape. The installation state of each member in this case is substantially the same as in FIG.

(e)図は、第2のガイド部材3bを、それぞれ集合される先端部が断面三角形の三つのパーツ31,31及び31aにより構成したもので、各パーツ31,31,31aはそれぞれ付勢部材33により基板1の方向へ付勢される。
第1のガイド部材を構成する各部材(図3の部材34と同様な部材)も同様な断面形状に形成することができ、この場合には、各上下の各部材及び側部の部材はそれぞれ別の無端のチェーンに取り付けられ、それらの設置状態は、側部の部材については(a)図と同様になり、上下の部材については(c)図と同様になる。
(E) In the figure, the second guide member 3b is constituted by three parts 31, 31, and 31a each having a triangular cross-section at the front end portion to be assembled. Each part 31, 31, 31a is an urging member. 33 is urged in the direction of the substrate 1.
Each member constituting the first guide member (a member similar to the member 34 in FIG. 3) can also be formed in the same cross-sectional shape. In this case, each of the upper and lower members and the side members are respectively It is attached to another endless chain, and the installation state thereof is the same as that of FIG. (A) for the side members and the same as that of FIG.

(f)図は、第2のガイド部材3bを構成する二つのパーツ31の一方を断面ほぼ三角形に形成する一方、他方のパーツ31を先端部に断面三角形の部分を有する形状に形成し、一方のパーツ31の斜面に他方のパーツ31の一方の斜面を相対させて両パーツ31,31を上下に組み合わせたもので、他方のパーツ31のみを基板1の外縁部の方向へ付勢している。下部のパーツ31と上部のパーツ31とは、逆に配置しても同じである。
第1のガイド部材を構成する各部材(図3の各部材34と同様な部材)も同様な断面形状に形成することができ、この場合には上下の各部材はそれぞれ別の無端のチェーンへ取り付ける。
(F) In the figure, one of the two parts 31 constituting the second guide member 3b is formed in a substantially triangular cross section, while the other part 31 is formed in a shape having a triangular section at the tip. The parts 31 and 31 are vertically combined with the slope of the other part 31 opposite to the slope of the other part 31, and only the other part 31 is biased toward the outer edge of the substrate 1. . The lower part 31 and the upper part 31 are the same even if they are arranged in reverse.
The members constituting the first guide member (members similar to the members 34 in FIG. 3) can also be formed in the same cross-sectional shape. In this case, the upper and lower members are respectively connected to different endless chains. Install.

前記各実施形態においては、第1のガイド部材3a又は/及び第2のガイド部材3bを付勢部材35,33によって基板1の外縁部の方向へ付勢しているが、打抜かれた基板1の板厚や径のバラツキが小さければガイド部材を付勢する必要はない。
特に図4のように、駆動側である第1のガイド部材にベルトを使用する場合には、ベルトが基板1の板厚や径のバラツキを吸収するのでガイド部材を付勢しなくても前記の効果を奏する。
In each of the above embodiments, the first guide member 3a and / or the second guide member 3b is urged toward the outer edge portion of the substrate 1 by the urging members 35 and 33. If the variation in the plate thickness and diameter is small, it is not necessary to bias the guide member.
In particular, as shown in FIG. 4, when a belt is used for the first guide member on the driving side, the belt absorbs variations in the plate thickness and diameter of the substrate 1, so that the guide member is not energized. The effect of.

以下の構成の各実施例の加工装置と比較例の加工装置を試作し、当該加工装置で基板を加工したディスクについて、当該加工後の基板のピットの有無を調べ、その結果をガイド部材の材質とともに表1に示した。   Prototypes of the processing apparatus of each example of the following configuration and the processing apparatus of the comparative example, for the disk processed the substrate by the processing apparatus, the presence or absence of pits of the substrate after the processing is examined, the result is the material of the guide member The results are shown in Table 1.

基板
外径96.0mm、板厚1.84mmの3.5インチ用の磁気ディスク用アルミニウム合金基板(ブランク材)を使用。
第1のガイド部材
搬送ラインの直線部分に設置した各加工装置では、基板外縁部が転接する部分が弛まないようにガイドされたベルト(Vベルト)を用いるとともに当該ベルトは基板の方向に付勢しなかった。その長さは、外縁部が転接する基板が一回以上回転するのに十分なものとした。駆動速度(円弧状曲がり部に設置した実施例13以下は回転数で示した。)はそれぞれ表1に示した。
バリ取り手段を搬送ラインの円弧状曲がり部に設置した各加工装置では、断面V字状の溝状部を有するもの(図2)であって、第2のガイド部材と同じ材質のものを使用した。
第2のガイド部材
いずれも駆動させず、表1で示すようにそれぞれ断面V字状の溝状部を有して異なる形態、材質のもの使用するとともに、上下二つのパーツで構成した場合についてはそれぞれ基板外縁部を挟む方向へ付勢した。溝状部の内角は50°に設計し、各傾斜面の基板面に対する角度は25°とした。その長さは、外縁部が転接する基板が一回以上回転するのに十分なものとした。
比較例1
図9で示すような回転受け台5の上に打抜き後の基板1を20枚スタッキングし、外縁部へブラシ6を固定状態で接触させ、基板1を100rpmで回転させた。
比較例2
打抜き後無加工の基板
バリ屑除去手段
実施例,比較例のいずれも洗浄形態の手段を使用した。
ピット不良
加工したサンプルをサブストレート加工前の工程(シュリンクパック)で調査し、ピットなしの場合を◎、ピットが有っても浅くサブストレート加工時に除去可能なレベルの場合を△、ピットが有りサブストレート加工時に除去できないレベルの場合を×とそれぞれ表示した。
Substrate An aluminum alloy substrate (blank material) for a 3.5 inch magnetic disk having an outer diameter of 96.0 mm and a plate thickness of 1.84 mm is used.
1st guide member In each processing apparatus installed in the linear part of a conveyance line, while using the belt (V belt) guided so that the part which a board | substrate outer edge part roll-contacts may not loosen, the said belt is urged | biased in the direction of a board | substrate. I did not. The length was sufficient for the substrate with which the outer edge portion was rolled to rotate one or more times. The driving speeds (Examples 13 and below installed at the arcuate bends are indicated by the number of revolutions) are shown in Table 1, respectively.
In each processing apparatus in which the deburring means is installed in the arc-shaped bent portion of the transfer line, it has a groove-shaped portion having a V-shaped cross section (FIG. 2) and is made of the same material as the second guide member. did.
When neither of the second guide members are driven and each has a groove-shaped portion with a V-shaped cross section as shown in Table 1 and is used in different forms and materials, and is configured with two upper and lower parts. Each was biased in a direction to sandwich the outer edge of the substrate. The interior angle of the groove-shaped part was designed to be 50 °, and the angle of each inclined surface with respect to the substrate surface was 25 °. The length was sufficient for the substrate with which the outer edge portion was rolled to rotate one or more times.
Comparative Example 1
Twenty substrates 1 after punching were stacked on a rotating cradle 5 as shown in FIG. 9, the brush 6 was brought into contact with the outer edge portion in a fixed state, and the substrate 1 was rotated at 100 rpm.
Comparative Example 2
Substrate without blanking after punching Deburring means Means for cleaning were used in both the examples and comparative examples.
Pit failure Processed sample is investigated in the process before substrate processing (shrink pack), ◎ when there is no pit, △ when there is a pit, but a level that can be removed when processing the substrate is shallow, pit is present The case where the level could not be removed during substrate processing was indicated as x.

Figure 0004593647
Figure 0004593647

表1の結果によれば、本発明に係る実施例のサンプルではいずれも外縁部のバリが基板上より除去され、ピット不良は認められなかったのに対し、比較例1,2ではピット不良が認められた。また、第2のガイド部材を上下二つのパーツで構成し、各パーツに対し基板外縁部を挟む方向へ付勢した実施例5〜12,実施例17〜24のケースでは、第2のガイド部材を一体型として付勢しなかった実施例1〜4,実施例13〜16のケースと比べ、一層効果的にバリ取り加工を施すことができた。   According to the results of Table 1, in the samples of the examples according to the present invention, burrs at the outer edge were removed from the substrate, and no pit defects were observed, whereas in Comparative Examples 1 and 2, there were pit defects. Admitted. In the cases of Examples 5 to 12 and Examples 17 to 24, in which the second guide member is composed of two upper and lower parts, and the parts are biased in the direction of sandwiching the outer edge of the substrate, the second guide member is used. As compared with the cases of Examples 1 to 4 and Examples 13 to 16 which were not energized as an integrated type, the deburring process could be performed more effectively.

前記各実施形態では、磁気ディスク用のアルミニウム合金基板を加工対象とした場合について説明したが、本発明は、基板の製品表面におけるピットの発生を防止すべきその他の円形基板であって、金属素条を打抜いた基板(ブランク材)を加工対象とする場合を含むものである。   In each of the above embodiments, the case where an aluminum alloy substrate for a magnetic disk is a processing target has been described. However, the present invention is another circular substrate that should prevent the generation of pits on the product surface of the substrate, This includes the case where a substrate (blank material) from which a strip is punched is used as a processing target.

本発明に係る円形基板の加工装置の第1実施形態を示す部分平面図である。It is a fragmentary top view which shows 1st Embodiment of the processing apparatus of the circular substrate which concerns on this invention. 図1の矢印A−Aに沿う部分拡大断面図である。It is a partial expanded sectional view which follows the arrow AA of FIG. 円形基板の加工装置の第2実施形態を示す部分平面図である。It is a fragmentary top view which shows 2nd Embodiment of the processing apparatus of a circular substrate. 円形基板の加工装置の第3実施形態を示す部分平面図である。It is a fragmentary top view which shows 3rd Embodiment of the processing apparatus of a circular substrate. 円形基板の加工装置の第4実施形態を示す部分正面図である。It is a partial front view which shows 4th Embodiment of the processing apparatus of a circular substrate. 本発明に係る円形基板の加工装置におけるガイド部材の変形形態を示す図で、(a)図〜(f)図はそれぞれ別のガイド部材の変形形態を示す断面図である。It is a figure which shows the deformation | transformation form of the guide member in the processing apparatus of the circular board | substrate which concerns on this invention, (a) Figures-(f) is sectional drawing which shows the deformation | transformation form of another guide member. 本発明に係る円形基板の部分拡大断面図である。It is a partial expanded sectional view of the circular substrate concerning the present invention. 打抜かれた円形基板(ブランク材)の部分拡大断面図である。It is a partial expanded sectional view of the punched circular substrate (blank material). 比較例の円形基板の加工装置を示す概略斜視図である。It is a schematic perspective view which shows the processing apparatus of the circular substrate of a comparative example.

符号の説明Explanation of symbols

1 基板
10 バリ
10a 残留凸部
11 ダレ
12 面押し部
2 搬送ライン
20 円弧状曲がり部
3 バリ取り手段
3a 第1のガイド部材
3b 第2のガイド部材
30 回転体
30a 歯車(プーリー)
30b チェーン(ベルト)
30c プーリー
30d ベルト
31,31a パーツ
32 溝状部
33,35 付勢部材
33a,35a 受け具
33b,35b ガイドピン
35c 保持部材
35d ローラ
36,38 支持部材
37 ガイドレール
4,4a バリ屑除去手段
40 吸引ボックス
41 洗浄ボックス
DESCRIPTION OF SYMBOLS 1 Substrate 10 Burr 10a Residual convex part 11 Sag 12 Face pressing part 2 Conveying line 20 Arc-shaped bent part 3 Deburring means 3a 1st guide member 3b 2nd guide member 30 Rotating body 30a Gear (pulley)
30b Chain (belt)
30c Pulley 30d Belt 31, 31a Parts 32 Groove portion 33, 35 Biasing member 33a, 35a Receiving member 33b, 35b Guide pin 35c Holding member 35d Roller 36, 38 Support member 37 Guide rail 4, 4a Debris removal means 40 Suction Box 41 Washing box

Claims (11)

基板を挟んで相対する状態に設置された第1のガイド部材と第2のガイド部材とを含み、少なくとも第1のガイド部材は一方向に沿って無端的に連続駆動するガイドであり、前記第2のガイド部材は基板よりも硬い材質であるガイド部材を備えたバリ取り手段により、搬送ライン上で打抜き後の基板の外縁部にバリ取り加工を施す工程と、当該バリ取り加工により発生したバリ屑を当該基板上より除去する工程とを含み、前記基板の外縁部にバリ取り加工を施す工程では当該基板の外縁部を基板外縁部との転接部の長さが当該基板が一回以上回転するのに十分な長さを有する前記ガイド部材に転接させた状態で前記基板を一回以上回転させ、前記基板が前記ガイド部材ヘ転接しているときに当該ガイド部材を前記基板の外縁部へ所定の弾力で押し付けることにより搬送方向に搬送するとともにバリを取ることを特徴とする、円形基板の加工方法。 A first guide member and a second guide member installed in a state of being opposed to each other with the substrate interposed therebetween, wherein at least the first guide member is a guide that is continuously driven endlessly along one direction; The deburring means having the guide member 2 made of a material harder than the substrate is used to deburr the outer edge of the substrate after punching on the transfer line, and the deburring generated by the deburring process is performed. A step of removing debris from the substrate, and in the step of deburring the outer edge portion of the substrate, the length of the rolling contact portion between the outer edge portion of the substrate and the outer edge portion of the substrate is one or more times. The substrate is rotated one or more times in a state of rolling contact with the guide member having a sufficient length to rotate, and the guide member is moved to the outer edge of the substrate when the substrate is in rolling contact with the guide member. With predetermined elasticity Characterized that, the processing method of a circular substrate that deburring while transported in the transport direction by and attached. 前記バリ屑を基板上より除去する工程では吸引及び洗浄のいずれかの一方又は両方の手段によりバリ屑を除去する、請求項1に記載の円形基板の加工方法。 The circular substrate processing method according to claim 1, wherein in the step of removing the debris from the substrate, the debris is removed by one or both of suction and cleaning. 搬送ライン上で打抜き後の基板の外縁部転接し、基板を挟んで相対する状態に設置された第1のガイド部材と第2のガイド部材とを含み、少なくとも第1のガイド部材は一方向に沿って無端的に連続駆動するガイドであり、前記第2のガイド部材は基板よりも硬い材質であり、前記基板が前記ガイド部材ヘ転接しているときに当該ガイド部材を前記基板の外縁部へ所定の弾力で押し付けて、前記基板を一回以上回転させることにより搬送方向に回転させるとともに基板外周のバリを取るガイド部材を備えたバリ取り手段と、前記基板上に付着したバリ屑を除去するバリ屑除去手段とを設け、前記ガイド部材の基板外縁部との転接部の長さは当該基板が一回以上回転するのに十分な長さであることを特徴とする、円形基板の加工装置。 And rolling contact an outer edge of the substrate after punching on the transport line, and a first guide member and second guide members disposed at opposite state across the substrate, at least a first guide member one A guide that is continuously driven endlessly in a direction, and the second guide member is made of a material harder than the substrate, and the guide member is moved to the outer edge of the substrate when the substrate is in rolling contact with the guide member. Deburring means provided with a guide member that is pressed against a portion with a predetermined elasticity and rotated in the transport direction by rotating the substrate one or more times and deburring the outer periphery of the substrate, and debris adhering to the substrate A circular substrate characterized in that a burr debris removing means for removing is provided, and the length of the rolling contact portion with the substrate outer edge portion of the guide member is sufficient for the substrate to rotate one or more times. Processing equipment. 前記第1のガイド部材は一対のプーリーに保持されたベルトである、請求項に記載の円形基板の加工装置。 The circular substrate processing apparatus according to claim 3 , wherein the first guide member is a belt held by a pair of pulleys. 前記第1のガイド部材は駆動方向に沿って分割された状態の多数の部材からなり、各部材は、一対のプーリーに保持されたベルト又は一対の歯車に保持された無端のチェーンへ連続的に取り付けられている、請求項に記載の円形基板の加工装置。 The first guide member is composed of a number of members divided along the driving direction, and each member is continuously connected to a belt held by a pair of pulleys or an endless chain held by a pair of gears. It is attached, the processing apparatus of a circular substrate according to claim 3. 前記第1のガイド部材は一方向に回転する回転体ヘ回転方向に沿って設けられ、前記第2のガイド部材は前記第1のガイド部材の外周方向へ凹円弧状に対向配置されている、請求項に記載の円形基板の加工装置。 The first guide member is provided along a rotational direction of a rotating body that rotates in one direction, and the second guide member is disposed to face the outer circumferential direction of the first guide member in a concave arc shape. The circular substrate processing apparatus according to claim 3 . 前記第2のガイド部材又は/及び第1のガイド部材を基板の方向に付勢する付勢部材を備えた、請求項3〜6のいずれかに記載の円形基板の加工装置。 The circular substrate processing apparatus according to claim 3 , further comprising a biasing member that biases the second guide member or / and the first guide member toward the substrate. 前記第2のガイド部材又は/及び第1のガイド部材は前記基板の外縁部が案内される溝状部を有する、請求項3〜6のいずれかに記載の円形基板の加工装置。 The circular substrate processing apparatus according to claim 3 , wherein the second guide member and / or the first guide member has a groove-like portion in which an outer edge portion of the substrate is guided. 少なくとも前記第2のガイド部材は、前記基板の外縁部が案内される溝状部を有するとともに、当該溝状部の底部中心に沿って分割された状態の少なくとも二つのパーツから構成され、当該第2のガイド部材を基板の方向に付勢する付勢部材は、前記パーツ相互により前記基板の外縁部を挟む方向へ付勢する付勢部材である、請求項に記載の円形基板の加工装置。 At least the second guide member has a groove-like portion that guides an outer edge portion of the substrate, and includes at least two parts that are divided along the center of the bottom of the groove-like portion. The circular substrate processing apparatus according to claim 7 , wherein the urging member that urges the two guide members in the direction of the substrate is a urging member that urges the parts in a direction in which an outer edge portion of the substrate is sandwiched between the parts. . 少なくとも前記溝状部内に基板外縁部が案内された状態では前記第2のガイド部材を構成する二つのパーツ間に隙間が形成され、前記第2のガイド部材の背面側には前記二つのパーツ間の隙間からバリ屑を吸引除去するバリ屑除去手段が設置されている、請求項に記載の円形基板の加工装置。 At least in the state where the outer edge of the substrate is guided in the groove-like portion, a gap is formed between the two parts constituting the second guide member, and between the two parts on the back side of the second guide member The apparatus for processing a circular substrate according to claim 9 , wherein burr debris removing means for removing burr debris from the gap is provided. 前記第1のガイド部材と第2のガイド部材は前記基板の搬送ラインの途中に設置され、前記第1のガイド部材は当該搬送ラインの搬送方向に沿ってその搬送速度と同調して駆動する、請求項3〜10のいずれかに記載の円形基板の加工装置。 The first guide member and the second guide member are installed in the middle of the transport line of the substrate, and the first guide member is driven in synchronization with the transport speed along the transport direction of the transport line. The circular substrate processing apparatus according to claim 3 .
JP2008117923A 2008-04-28 2008-04-28 Circular substrate processing method and processing apparatus Active JP4593647B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008117923A JP4593647B2 (en) 2008-04-28 2008-04-28 Circular substrate processing method and processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008117923A JP4593647B2 (en) 2008-04-28 2008-04-28 Circular substrate processing method and processing apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004346662A Division JP2006155788A (en) 2004-11-30 2004-11-30 Circular substrate and processing method and device for circular substrate

Publications (2)

Publication Number Publication Date
JP2008243366A JP2008243366A (en) 2008-10-09
JP4593647B2 true JP4593647B2 (en) 2010-12-08

Family

ID=39914487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008117923A Active JP4593647B2 (en) 2008-04-28 2008-04-28 Circular substrate processing method and processing apparatus

Country Status (1)

Country Link
JP (1) JP4593647B2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53104564A (en) * 1977-02-25 1978-09-11 Mitsui Mining & Smelting Co Rolling device
JPS63311625A (en) * 1987-06-12 1988-12-20 Tokin Corp Floppy disk finishing device
JPH0638008U (en) * 1992-10-20 1994-05-20 富士写真フイルム株式会社 Finishing device for flexible magnetic recording media
JPH08118218A (en) * 1994-10-21 1996-05-14 Murata Mfg Co Ltd Polishing device for article to be processed

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53104564A (en) * 1977-02-25 1978-09-11 Mitsui Mining & Smelting Co Rolling device
JPS63311625A (en) * 1987-06-12 1988-12-20 Tokin Corp Floppy disk finishing device
JPH0638008U (en) * 1992-10-20 1994-05-20 富士写真フイルム株式会社 Finishing device for flexible magnetic recording media
JPH08118218A (en) * 1994-10-21 1996-05-14 Murata Mfg Co Ltd Polishing device for article to be processed

Also Published As

Publication number Publication date
JP2008243366A (en) 2008-10-09

Similar Documents

Publication Publication Date Title
JP3100240B2 (en) Disk type rotary cutter
CN111230639A (en) Burr-free steel plate cutting process and equipment
EP2918558B1 (en) Initial crack formation method
CN113305445B (en) Laser processing device
CN106985031A (en) Cold-rolled strip surface spikes removal mechanism
CN113458899A (en) A deckle edge clearing device for soft magnet production
EP0018925A1 (en) Apparatus for breaking moving glass sheets
JP4593647B2 (en) Circular substrate processing method and processing apparatus
JP2006155788A (en) Circular substrate and processing method and device for circular substrate
JP4615411B2 (en) Magnetic disk substrate processing equipment
CN113305446B (en) Laser processing apparatus
KR100737410B1 (en) Chip removel apparatus of surface for strip transfer roll
CN213164733U (en) Steel pipe rust cleaning paint spraying apparatus
JP5064755B2 (en) Circular substrate, circular substrate processing method and processing apparatus
JP3061133B1 (en) Food cutting equipment
CN207480328U (en) A kind of dual rotary deburring equipment
CN105965608A (en) Band sawing machine
JP2007098551A (en) Knife receptacle roll, sheet cutting device, and slitter scorer
JPH0947949A (en) Machining burr grinding device
JP2011067919A (en) Deburring device
TW200403119A (en) Method and system for machining rolled strip to remove surface defects
WO2021137823A1 (en) Sliding gear unit for deburring machine
JP2001191206A (en) Surface defect removing method for steel plate
JP2006021312A (en) Thin band-shaped material slit-machining method and device
CN115608811A (en) Automatic material loading and rolling machine

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090210

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20090213

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090319

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100427

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100628

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100817

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100915

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130924

Year of fee payment: 3

R151 Written notification of patent or utility model registration

Ref document number: 4593647

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130924

Year of fee payment: 3

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350