JP4603461B2 - 光学系及びレーザ照射装置 - Google Patents
光学系及びレーザ照射装置 Download PDFInfo
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- JP4603461B2 JP4603461B2 JP2005306197A JP2005306197A JP4603461B2 JP 4603461 B2 JP4603461 B2 JP 4603461B2 JP 2005306197 A JP2005306197 A JP 2005306197A JP 2005306197 A JP2005306197 A JP 2005306197A JP 4603461 B2 JP4603461 B2 JP 4603461B2
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- 230000003287 optical effect Effects 0.000 title claims description 87
- 239000000758 substrate Substances 0.000 claims description 131
- 238000006243 chemical reaction Methods 0.000 claims description 31
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000010410 layer Substances 0.000 description 91
- 239000010408 film Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 16
- 239000011229 interlayer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 241001270131 Agaricus moelleri Species 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/465—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using masks, e.g. light-switching masks
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/023—Catoptric systems, e.g. image erecting and reversing system for extending or folding an optical path, e.g. delay lines
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Description
100 ステージ
150 基板載置部ガイドバー(チャックガイドバー)
200 基板載置部(チャック)
300 光学系
301 レーザ光源
310 イメージ変換手段
320 マスク
320a 光透過パターン
340 イメージ方向調節手段
350 投影レンズ
400 光学系ガイドバー
L レーザビーム
L_i,L_m,L_dm1,L_dm2,L_p1,L_p2 ビームイメージ
341,342,343,344,355 反射鏡
S 基板
500 アクセプタ基板
501 基板
520 半導体層
525 ゲート絶縁膜
530 ゲート電極
535 第1層間絶縁膜
541 ドレイン電極
543 ソース電極
T 薄膜トランジスタ
550 第2層間絶縁膜
555 画素電極
560 画素定義膜
560a 開口部
600 ドナー基板
601 ベース基板
602 光熱変換層
77 転写層
P_e パターン
C_e セルの外郭線
P1,P2 転写層パターン
Claims (16)
- レーザビームを発生させるレーザ光源と;
前記レーザビームにより被処理物に形成されるイメージの方向が第1の方向となるようにレーザビームの方向を調節して出力する第1調節モード,及び前記被処理物に形成されるイメージの方向が第2の方向となるようにレーザビームの方向を調節して出力する第2調節モードを含むイメージ方向調節手段と;
を含み,
前記イメージ方向調節手段は,当該イメージ方向調節手段内に前記第1調節モードで作動するときに前記レーザビームが通過する第1ビーム経路と,前記第2調節モードで作動するときに前記レーザビームが通過する第2ビーム経路とが設けられることを特徴とする光学系。 - 前記第1の方向はX軸方向であり,前記第2の方向は前記第1の方向に対して直角をなすY軸方向であることを特徴とする請求項1に記載の光学系。
- 前記第1ビーム経路及び前記第2ビーム経路は,それぞれ複数の反射鏡から構成されることを特徴とする請求項1に記載の光学系。
- 前記レーザ光源と前記イメージ方向調節手段との間に位置し,前記レーザ光源から発生したレーザビームのイメージをライン状に変換させるイメージ変換手段をさらに含むことを特徴とする請求項1に記載の光学系。
- 前記イメージ変換手段はホモジナイザーであることを特徴とする請求項4に記載の光学系。
- 前記イメージ変換手段と前記イメージ方向調節手段との間に位置し,光透過パターンまたは光反射パターンを含むマスクをさらに含むことを特徴とする請求項4に記載の光学系。
- レーザビームを発生させるレーザ光源,前記レーザビームにより被処理物に形成されるイメージの方向を調節するイメージ方向調節手段,及び投影レンズを含む光学系と;
前記光学系から照射されるレーザビームを受像可能な位置に配置され,前記被処理物としての基板が載置される基板載置部と;
を含み,
前記イメージ方向調節手段は,
前記被処理物に形成されるイメージの方向が第1の方向となるようにレーザビームの方向を調節して出力する第1調節モード,及び前記被処理物に形成されるイメージの方向が第2の方向となるようにレーザビームの方向を調節して出力する第2調節モードを含み,
前記イメージ方向調節手段は,当該イメージ方向調節手段内に前記第1調節モードで作動するときに前記レーザビームが通過する第1ビーム経路と,前記第2調節モードで作動するときに前記レーザビームが通過する第2ビーム経路とが設けられることを特徴とするレーザ照射装置。 - 前記レーザ光源と前記イメージ方向調節手段との間に位置し,前記レーザ光源から発生したレーザビームのイメージをライン状に変換させるイメージ変換手段をさらに含むことを特徴とする請求項7に記載のレーザ照射装置。
- 前記イメージ変換手段はホモジナイザーであることを特徴とする請求項8に記載のレーザ照射装置。
- 前記第1の方向はX軸方向であり,前記第2の方向は前記第1の方向に対して直角をなすY軸方向であることを特徴とする請求項7に記載のレーザ照射装置。
- 前記第1ビーム経路及び前記第2ビーム経路は,それぞれ複数の反射鏡から構成されることを特徴とする請求項7に記載のレーザ照射装置。
- 前記イメージ変換手段と前記イメージ方向調節手段との間に位置し,光透過パターンまたは光反射パターンを含むマスクをさらに含むことを特徴とする請求項8に記載のレーザ照射装置。
- 前記投影レンズは,前記レーザ光源と前記イメージ方向調節手段との間に位置することを特徴とする請求項7に記載のレーザ照射装置。
- 前記投影レンズは,前記イメージ方向調節手段を通過した前記レーザビームを前記基板上に投影することを特徴とする請求項7に記載のレーザ照射装置。
- 前記基板載置部は前記基板が載置される面に沿った一方向に移動可能であり,前記光学系は前記基板が載置される面に平行で前記一方向と直角をなす方向に移動可能であることを特徴とする請求項7に記載のレーザ照射装置。
- 前記基板は,アクセプタ基板と,前記アクセプタ基板上に位置するドナー基板とを含むことを特徴とする請求項7に記載のレーザ照射装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020040085972A KR100570979B1 (ko) | 2004-10-26 | 2004-10-26 | 이미지 방향 조절기를 구비한 광학계 및 상기 광학계를구비한 레이저 조사장치 |
Publications (2)
Publication Number | Publication Date |
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JP2006128105A JP2006128105A (ja) | 2006-05-18 |
JP4603461B2 true JP4603461B2 (ja) | 2010-12-22 |
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JP2005306197A Active JP4603461B2 (ja) | 2004-10-26 | 2005-10-20 | 光学系及びレーザ照射装置 |
Country Status (3)
Country | Link |
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US (1) | US7545403B2 (ja) |
JP (1) | JP4603461B2 (ja) |
KR (1) | KR100570979B1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100600881B1 (ko) * | 2004-10-20 | 2006-07-18 | 삼성에스디아이 주식회사 | 레이저 열전사 장치, 라미네이터 및 상기 장치를 사용하는레이저 열전사 방법 |
US10095016B2 (en) | 2011-01-04 | 2018-10-09 | Nlight, Inc. | High power laser system |
US9409255B1 (en) | 2011-01-04 | 2016-08-09 | Nlight, Inc. | High power laser imaging systems |
US9429742B1 (en) | 2011-01-04 | 2016-08-30 | Nlight, Inc. | High power laser imaging systems |
KR101813548B1 (ko) * | 2011-06-30 | 2018-01-02 | 삼성디스플레이 주식회사 | 레이저 열전사 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
JP2013020768A (ja) * | 2011-07-08 | 2013-01-31 | Ulvac Japan Ltd | レーザ転写装置 |
JP2013020767A (ja) * | 2011-07-08 | 2013-01-31 | Ulvac Japan Ltd | 有機発光デバイスの製造装置及びその製造方法 |
US9720244B1 (en) * | 2011-09-30 | 2017-08-01 | Nlight, Inc. | Intensity distribution management system and method in pixel imaging |
EP2705812A1 (de) * | 2012-09-05 | 2014-03-12 | Universität zu Lübeck | Vorrichtung zum Laserschneiden innerhalb transparenter Materialien |
US9310248B2 (en) | 2013-03-14 | 2016-04-12 | Nlight, Inc. | Active monitoring of multi-laser systems |
WO2014157658A1 (ja) * | 2013-03-29 | 2014-10-02 | 大日本印刷株式会社 | 素子製造方法および素子製造装置 |
KR20140133741A (ko) * | 2013-05-10 | 2014-11-20 | 삼성디스플레이 주식회사 | 레이저 열전사용 마스크 및 이를 포함하는 레이저 조사 장치 |
KR102099722B1 (ko) | 2014-02-05 | 2020-05-18 | 엔라이트 인크. | 단일-이미터 라인 빔 시스템 |
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JP2003243168A (ja) * | 2002-01-23 | 2003-08-29 | Eastman Kodak Co | 有機層の付着方法及び有機層を付着するためのレーザープリンタ |
US20040004749A1 (en) * | 2002-07-08 | 2004-01-08 | Orcutt John W. | Torsionally hinged devices with support anchors |
JP2004006876A (ja) * | 2003-05-19 | 2004-01-08 | Nec Corp | 半導体薄膜形成装置 |
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JP2001105164A (ja) * | 1999-10-07 | 2001-04-17 | Sumitomo Heavy Ind Ltd | レーザ穴あけ加工方法及び加工装置 |
US6458504B2 (en) * | 2000-04-28 | 2002-10-01 | Fuji Photo Film Co., Ltd. | Method for forming an image |
DE10122484A1 (de) * | 2001-05-09 | 2002-11-28 | Heidelberger Druckmasch Ag | Verfahren und Vorrichtung zur Belichtung von Druckformen |
US6577429B1 (en) * | 2002-01-15 | 2003-06-10 | Eastman Kodak Company | Laser projection display system |
DE10307309B4 (de) * | 2003-02-20 | 2007-06-14 | Hitachi Via Mechanics, Ltd., Ebina | Vorrichtung und Verfahren zur Bearbeitung von elektrischen Schaltungssubstraten mittels Laser |
US7148957B2 (en) * | 2004-06-09 | 2006-12-12 | 3M Innovative Properties Company, | Imaging system for thermal transfer |
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2004
- 2004-10-26 KR KR1020040085972A patent/KR100570979B1/ko active IP Right Grant
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2005
- 2005-10-18 US US11/251,851 patent/US7545403B2/en active Active
- 2005-10-20 JP JP2005306197A patent/JP4603461B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003243168A (ja) * | 2002-01-23 | 2003-08-29 | Eastman Kodak Co | 有機層の付着方法及び有機層を付着するためのレーザープリンタ |
US20040004749A1 (en) * | 2002-07-08 | 2004-01-08 | Orcutt John W. | Torsionally hinged devices with support anchors |
JP2004006876A (ja) * | 2003-05-19 | 2004-01-08 | Nec Corp | 半導体薄膜形成装置 |
Also Published As
Publication number | Publication date |
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US20060087550A1 (en) | 2006-04-27 |
US7545403B2 (en) | 2009-06-09 |
KR100570979B1 (ko) | 2006-04-13 |
JP2006128105A (ja) | 2006-05-18 |
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