JP4603461B2 - Optical system and laser irradiation apparatus - Google Patents

Description

  The present invention relates to an optical system and a laser irradiation apparatus, and more particularly to an optical system and a laser irradiation apparatus that are characterized by a portion that adjusts the direction of an image formed by a laser beam.

  Since the flat panel display device has characteristics such as light weight and thin shape, it has recently emerged as a display device that replaces a cathode-ray tube display (CRT). Typical examples of such a flat panel display device include a liquid crystal display (LCD) and an organic light emitting display (OLED). Among these, the organic light emitting display device has the advantages that the luminance characteristic and the viewing angle characteristic are superior to those of the liquid crystal display device and does not require a backlight, so that it can be realized to be ultra-thin.

  Such a flat panel display can realize full color including red, green and blue pixels. For example, in the case of a liquid crystal display device, full color can be realized by forming red, green and blue color filters. For example, in the case of an organic light emitting display device, a full color can be realized by forming red, green, and blue light emitting layers.

  Here, in the case of the organic electroluminescence display device, a laser thermal transfer method can be used in forming the red, green and blue light emitting layers. The laser thermal transfer method has an advantage that the light emitting layer can be finely patterned as compared with a vapor deposition method using a shadow mask. In addition, there is an advantage that the process is a dry process as compared with an ink-jet printing method.

  According to such a laser thermal transfer method, a light emitting layer patterned into an organic electroluminescence display element is obtained by transferring the transfer layer of a donor film including a base film, a photothermal conversion layer, and a transfer layer onto an acceptor substrate. Can be formed (for example, see Patent Documents 1, 2, or 3). Specifically, the donor film is disposed on the base film so that the transfer layer of the donor film faces the acceptor substrate, and a laser beam is irradiated from the base film side of the donor film, The transfer layer can be transferred onto an acceptor substrate to form a light emitting layer pattern. At this time, the light emitting layer pattern may have a stripe shape. Such a stripe-shaped light emitting layer pattern can be formed on the base film by scanning a laser beam in the longitudinal direction of the light emitting layer pattern.

  In the laser thermal transfer method, it is common to use a laser thermal transfer apparatus including a substrate mounting portion for mounting a substrate and an optical system for outputting a laser beam to the substrate on the substrate mounting portion. It is. At this time, the laser beam irradiated onto the substrate has an image fixed on the X axis or the Y axis by the laser irradiation apparatus. Here, the image means a region where the beam is actually irradiated when the surface of the workpiece is irradiated with the laser beam. That is, the laser beam can be scanned in one direction to form a fixed image with respect to an axis perpendicular to the one direction. Therefore, the longitudinal direction of the light emitting layer pattern formed on the substrate is determined by the direction in which the laser beam forms an image (scanning direction).

US Pat. No. 5,998,085 US Pat. No. 6,214,520 US Pat. No. 6,114,088

  On the other hand, depending on the organic light emitting display device, there are cases where the longitudinal direction of the light emitting layer pattern must be formed in the X axis direction and in the Y axis direction. In such a case, there is a problem in that the light emitting layer pattern must be formed using a different laser irradiation apparatus according to the longitudinal direction of the light emitting layer pattern.

  Accordingly, the present invention has been made in view of such problems, and an object of the present invention is to provide an image formed by an outgoing beam by a relatively simple method without replacing or changing parts (equipment). It is an object of the present invention to provide an optical system that can be adjusted so as to change its direction. Another object of the present invention is to provide a laser irradiation apparatus capable of forming transfer layer patterns arranged in different directions by a relatively simple method without replacing or changing parts with a single apparatus. There is.

  In order to solve the above-described problem, according to an aspect of the present invention, a laser source that generates a laser beam; and a direction of an image formed on the object to be processed by the laser beam is a first direction. A first adjustment mode in which the direction of the laser beam is adjusted so as to be output, and a first adjustment mode in which the direction of the laser beam is adjusted so that the direction of the image formed on the workpiece is the second direction. An optical system comprising: an image direction modulator including two adjustment modes; and an optical system.

  According to such an optical system of the present invention, the image direction adjusting means that can be adjusted so that the image formed on the object to be processed by the laser beam is formed in the first direction or the second direction is provided. Thus, an image can be formed in the first direction or the second direction without changing or replacing the optical system or components included in the optical system. That is, the optical system can form images in different directions with one optical system. Here, “image” means a region where a laser beam is actually irradiated when the surface of the workpiece is irradiated with the laser beam.

  At this time, if the first direction is the X-axis direction and the second direction is the Y-axis direction perpendicular to the first direction, the optical system can move in that direction. Any of the images that are 90 ° different from each other can be selectively formed.

The image direction adjusting means passes through a first beam path through which the laser beam passes when operating in the first adjusting mode, and the laser beam passes when operating in the second adjusting mode. It is configured to include a second beam path for Ru. At this time, each of the first beam path and the second beam path may be composed of a plurality of reflecting mirrors.

  The optical system may further include an image conversion unit that is located between the laser light source and the image direction adjusting unit and converts an image of a laser beam generated from the laser light source into a line shape. At this time, the image conversion means may be a homogenizer.

  The optical system may further include a mask positioned between the image conversion unit and the image direction adjustment unit and including a light transmission pattern or a light reflection pattern.

  In order to solve the above problems, according to another aspect of the present invention, a laser source that generates a laser beam, and an image direction adjustment that adjusts the direction of an image formed on the object to be processed by the laser beam. An optical system including an image direction modulator and a projection lens; and a substrate as the object to be processed, disposed at a position capable of receiving a laser beam emitted from the optical system. And a substrate mounting portion (chuck) on which is mounted.

  According to the laser irradiation apparatus according to the present invention as described above, by including the image direction adjusting means capable of adjusting the direction of the image formed on the object to be processed by the laser beam, the substrate mounting portion, the optical system, and the laser The direction of the image formed on the substrate placed on the substrate placing portion can be changed without changing or replacing the irradiation device or their components. That is, the laser irradiation device can form images in different directions on a substrate placed on the substrate placement portion with one device. Here, “image” means a region where a laser beam is actually irradiated when the surface of the workpiece is irradiated with the laser beam.

At this time, the image direction adjusting means adjusts and outputs the direction of the laser beam so that the direction of the image formed on the object to be processed is the first direction, and the object to be processed. direction of the image to be formed on the Ru is configured to include a second adjustment mode to output to adjust the direction of the laser beam such that the second direction. Accordingly, an image can be formed in the first direction or the second direction on the substrate placed on the substrate placement unit.

  At this time, if the first direction is the X-axis direction and the second direction is the Y-axis direction perpendicular to the first direction, the laser irradiation apparatus Any of images whose directions are 90 ° different from each other can be selectively formed on the substrate placed on the substrate placement portion. Here, for example, if the above laser irradiation device is used to form the pattern of the organic light emitting layer of the organic light emitting display device, the same laser irradiation device is used to form patterns whose directions differ from each other by 90 °. be able to.

  The laser irradiation apparatus may further include an image conversion unit that is located between the laser light source and the image direction adjusting unit and converts an image of a laser beam generated from the laser light source into a line shape. At this time, the image conversion means may be a homogenizer.

  The laser irradiation apparatus may further include a mask positioned between the image conversion unit and the image direction adjustment unit and including a light transmission pattern or a light reflection pattern.

The image direction adjusting means passes through a first beam path through which the laser beam passes when operating in the first adjusting mode, and the laser beam passes when operating in the second adjusting mode. It is configured to include a second beam path for Ru. At this time, each of the first beam path and the second beam path may be composed of a plurality of reflecting mirrors.

  The optical system may further include a mask positioned between the image conversion unit and the image direction adjustment unit and including a light transmission pattern or a light reflection pattern.

  The projection lens may be disposed so as to be positioned between the laser light source and the image direction adjusting means. At this time, the projection lens can project the laser beam that has passed through the image direction adjusting means onto the substrate.

  The substrate mounting portion is movable in one direction along the surface on which the substrate is mounted, and the optical system is parallel to the surface on which the substrate is mounted and is perpendicular to the one direction. It may be configured to be movable. Thus, by repeating the step of moving the substrate platform in one direction and the step of moving the optical system in a direction perpendicular to the one direction, the substrate placed on the substrate platform is moved. A pattern can be formed over the entire surface.

  At this time, if the substrate includes an acceptor substrate and a donor substrate positioned on the acceptor substrate, the substrate is irradiated with a laser beam emitted from the laser light source, for example, the donor substrate. A pattern can be formed on the substrate by a laser thermal transfer method in which a transfer layer of the substrate is transferred to the acceptor substrate.

  According to the present invention, the substrate mounting portion is provided with the image direction adjusting means that can be adjusted so that the image formed on the object to be processed by the laser beam is formed in the first direction or the second direction. It is possible to provide an optical system and a laser irradiation apparatus that can form an image in the first direction or the second direction without changing or replacing the optical system, the laser irradiation apparatus, or their components. At this time, if the first direction is the X-axis direction and the second direction is the Y-axis direction perpendicular to the first direction, one device can be obtained by using the optical system and the laser irradiation apparatus. With this, images in different directions can be formed. Furthermore, the optical system or the laser irradiation device is used to form the organic light emitting layer pattern of the organic light emitting display device, and the transfer layer of the donor film is transferred to the acceptor substrate by the laser beam to form the organic light emitting layer pattern. can do.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the present specification and drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and redundant description is omitted.

  In this specification and drawings, when a layer is described as being “on” another layer or substrate, it is formed directly on the other layer or substrate, or a third layer is interposed therebetween. You can also. Further, in this specification, “image” means a region where a laser beam is actually irradiated when the surface of the workpiece is irradiated with the laser beam.

  First, a schematic configuration of a laser irradiation apparatus according to an embodiment of the present invention will be described. FIG. 1 is a perspective view schematically showing a configuration of a laser irradiation apparatus according to the present embodiment. As shown in FIG. 1, the laser irradiation apparatus LA includes a stage 100. A substrate platform (chuck) 200 on which the substrate is placed is positioned on the stage 100. The stage 100 also has a substrate placement section guide bar (chuck guide bar: chuck) that guides the substrate placement section 200 so as to reciprocate along one direction of the surface of the stage 100 (X-axis direction in FIG. 1). guide bar) 150.

  The optical system 300 is located above the substrate platform 200. The optical system 300 is attached to the optical system guide bar 400. The optical system 300 can move along the optical system guide bar 400 in a direction (Y-axis direction) perpendicular to the direction in which the substrate platform 200 moves.

  Next, the optical system 300 included in the laser irradiation apparatus LA according to the embodiment of the present invention will be described. 2 and 4 are diagrams schematically showing an embodiment of the configuration of the optical system of FIG.

  As shown in FIGS. 2 and 4, the optical system 300 includes a laser light source 301, an image conversion unit 310, a mask 320, an image direction adjustment unit 340, and a projection lens 350. It is comprised including.

  The laser light source 301 is a device that generates a laser beam. The laser beam L generated by the laser light source 301 can be emitted toward the image conversion means 310.

  The image conversion means 310 is a device that can deform an image of a beam generated from the laser light source 301 into a line shape. The beam that has passed through the image conversion means 310 has a line-shaped image L_i. The longitudinal direction of the line-shaped image L_i can be the X-axis direction. The line shape can include not only a strict line shape but also a square shape having a relatively large aspect ratio.

  In addition, the image conversion means 310 can be a homogenizer. The homogenizer can not only deform the image of the beam into a line, but also can transform a beam having a Gaussian profile generated from a laser light source into a homogenized flat-top profile. The beam having the line-shaped image L_i that has passed through the image conversion unit 310 can be irradiated toward the mask 320.

  The mask 320 may include at least one light transmission pattern or at least one light reflection pattern. 2 and 4 show only the light transmission pattern 320a as an example, the mask 320 is not limited to such a pattern. The beam that has passed through the mask 320 may have an image L_m patterned by the pattern of the mask 320. The patterned image L_m may include a plurality of sub patterns L_ms.

  The light transmission patterns 320a are arranged in the region of the beam line-shaped image L_i, but are preferably arranged in a line in the longitudinal direction (X-axis direction) of the image L_i. By arranging the light transmission pattern 320a in this way, it is possible to generate a plurality of subpatterns L_ms arranged in the X-axis direction. As a result, in the subsequent beam scanning process, a plurality of patterns can be simultaneously formed by a single scanning operation.

  On the other hand, the beam scanning direction can be constrained to a direction (Y-axis direction) perpendicular to the longitudinal direction (X-axis direction) of the patterned image L_m. That is, the organic light emitting layer of the organic light emitting display device is striped, for example, by the image L_m including a plurality of subpatterns L_ms arranged in a line in the longitudinal direction (X-axis direction) of the line image L_i as described above. In the case of patterning, a stripe-shaped organic light emitting layer pattern can be formed by scanning the laser beam L in a direction (Y-axis direction) perpendicular to the longitudinal direction of the image L_i. Therefore, the scanning direction of the optical system 300 having the image conversion means 310 for linearly converting the laser beam L in the X-axis direction as described above must be the Y-axis direction. In the formed stripe pattern, the Y-axis direction is the longitudinal direction as shown in FIG. As described above, there is a restriction that the scanning direction of the optical system 300 is determined by the linear conversion direction of the image conversion unit 310. Due to such a restriction, the direction of the stripe pattern formed on the substrate S is also conventionally changed. It was determined by the direction of linear transformation of the means 310. However, in the embodiment of the present invention, such restrictions on the beam scanning direction and the restrictions on the direction of the light emitting layer pattern formed on the object to be processed are overcome by providing an image direction adjusting means 340 described later. Can do.

  A beam having a patterned image L_m is incident on the image direction adjusting unit 340 to adjust the image direction. At this time, the beam having the patterned image L_m may be incident on the image direction adjusting unit 340 through the reflecting mirror 330.

  The image direction adjusting unit 340 includes a first adjustment mode for adjusting the image direction of the beam to be the first direction and a second adjustment mode for adjusting the image direction of the beam to be the second direction. Can do. At this time, the first direction can be the X-axis direction, and the second direction can be the Y-axis direction. That is, when the first direction is the X-axis direction, the second direction can be a direction perpendicular to the first direction on the same plane as the first direction.

  A projection lens 350 receives a beam emitted from the image direction adjusting unit 340, passes through the projection lens 350, exits the optical system 300, and is irradiated onto the substrate S. At this time, the projection lens 350 does not affect the direction of the image formed by the beam.

  In the optical system 300 as described above, FIG. 2 shows a case where the image direction adjusting means 340 operates in the first adjustment mode, and FIG. 4 shows a case where the image direction adjusting means 340 operates in the second adjustment mode. .

  As shown in FIG. 2, when the image direction adjusting unit 340 operates in the first adjustment mode, the longitudinal direction of the image L_dm1 of the beam that has passed through the image direction adjusting unit 340 is adjusted in the X-axis direction. Specifically, the direction of the image L_dm1 of the beam that has passed through the image direction adjusting unit 340 is the same as the direction of the image L_m that has been patterned through the mask 320. The direction of the image L_P1 of the beam irradiated onto the substrate S is the same as the direction of the image L_m patterned through the mask 320. As a result, a pattern P1 having the same direction as the image L_m patterned through the mask 320 is formed on the substrate S.

  On the other hand, as shown in FIG. 4, when the image direction adjusting unit 340 operates in the second adjustment mode, the longitudinal direction of the image L_dm2 of the beam that has passed through the image direction adjusting unit 340 is adjusted in the Y-axis direction. Specifically, the direction of the image L_dm2 of the beam that has passed through the image direction adjusting unit 340 is perpendicular to the direction of the image L_m that has been patterned through the mask 320. The direction of the image L_P2 of the beam irradiated onto the substrate S is perpendicular to the direction of the image L_m patterned through the mask 320. As a result, a pattern P2 having a direction perpendicular to the image L_m patterned through the mask 320 is formed on the substrate S.

  Here, changing the image direction adjusting means 340 from the first adjustment mode to the second adjustment mode can be performed by moving the image direction adjusting means 340 by a predetermined distance in the Y-axis direction, as will be described later. .

  As described above, the optical system 300 according to the embodiment of the present invention is provided with the image direction adjusting means 340 that can adjust the image directions of the incident beams in different directions. The image direction of the outgoing beam can be changed in a simple manner without making a major change.

  Next, details of the image direction adjusting means 340 will be described. 3 and 5 are diagrams schematically showing a configuration of the image direction adjusting means 340 according to the embodiment of the present invention. FIG. 3 shows a case where the image direction adjusting means operates in the first adjustment mode, and FIG. 5 shows a case where the image direction adjusting means operates in the second adjustment mode.

  As shown in FIGS. 3 and 5, the image direction adjusting unit 340 may include first to fifth reflecting mirrors 341, 342, 343, 344 and 345. The first to third reflecting mirrors 341, 342, and 343 are located in one layer, and the fourth and fifth reflecting mirrors 344 and 345 are located in another layer separated from the one layer by a predetermined distance. Here, the 'layer' refers to the traveling direction of the image L_m patterned through the mask 320 (FIGS. 2 and 4) or the traveling direction of the beam emitted from the image direction adjusting means 340 (FIGS. 2 and 4). The layer may be based on the same axial direction as in FIG. For example, in FIGS. 2 and 4, the Z-axis coordinates of the centers of the first to third reflecting mirrors 341, 342, and 343 can be the same. Further, the Z-axis coordinates of the centers of the fourth and fifth reflecting mirrors 344 and 345 may be the same. At this time, the first reflecting mirror 341 and the fourth reflecting mirror 344 of the image direction adjusting means 340 are located on the same Z axis. Further, the interval between the first reflecting mirror 341 and the second reflecting mirror 342 is separated from each other on the Y axis. The interval between the fifth reflecting mirror 345 and the third reflecting mirror 343 is separated from each other on the Y axis. Is the same. Here, the distance between the reflecting mirror and the reflecting mirror is a distance measured with reference to the center point of each reflecting mirror.

  The first to fifth reflecting mirrors 341, 342, 343, 344, and 345 include a beam incident on the reflecting surface and a reflecting surface in each reflecting mirror in order to shorten the path of the beam passing through the image direction adjusting means 340. It is preferable that the angle formed by the beam reflected from the beam is arranged at a right angle. Accordingly, each reflecting mirror can be arranged so as to be in contact with the opposite corner of one virtual regular hexahedron. Specifically, the reflecting surface of the first reflecting mirror 341 satisfies the plane equation x + z = c, the second reflecting mirror 342 satisfies the plane equation x + y = c, and the reflecting surface of the third reflecting mirror 343 satisfies the plane equation y + z = c. The reflecting surface of the fourth reflecting mirror 344 satisfies the plane equation y + z = c, and the reflecting surface of the fifth reflecting mirror 345 can satisfy the plane equation y + z = c.

  The case where the image direction adjusting means 340 operates in the first adjustment mode will be described below with reference to FIG.

  The beam having the image L_m patterned through the mask 320 (FIG. 2) travels in the X-axis direction through the reflecting mirror 330 and is incident on the image direction adjusting unit 340. At this time, the beam patterned through the mask 320 (FIG. 2) is a linear image L_m in which the X-axis direction is the longitudinal direction. The beam reflected by the reflecting mirror 330 is preferably reflected by the reflecting mirror 330 so as to have a linear image L_m1 in which the Y-axis direction is the longitudinal direction.

  The beam incident on the image direction adjusting unit 340 is reflected by the first reflecting mirror 341, so that the beam traveling direction is changed to the -Z direction so as to have an image L_m2 inclined by -45 ° with respect to the Y axis. Become. Next, the beam L_m2 reflected by the first reflecting mirror 341 is incident on the fourth reflecting mirror 344 and then reflected by the fourth reflecting mirror 344, the beam traveling direction is changed to the −Y direction, and the X-axis direction is changed. Has a linear image L_m3 in the longitudinal direction. Then, the beam reflected by the fourth reflecting mirror 344 enters the fifth reflecting mirror 345, is reflected by the fifth reflecting mirror 345, and changes the beam traveling direction to the −Z direction, thereby adjusting the image direction. The light is emitted from the means 340. The beam emitted from the image direction adjusting means 340 has a linear image L_m4 in which the X-axis direction is the longitudinal direction.

  As a result, the direction of the patterned image L_m of the beam that has passed through the mask 320 (FIG. 2) and the direction of the image L_m4 of the beam emitted from the image direction adjusting unit 340 can be the same.

  The case where the image direction adjusting means 340 operates in the second adjustment mode will be described below with reference to FIG.

  The beam having the image L_m patterned through the mask 320 (FIG. 2) travels in the X-axis direction through the reflecting mirror 330 and is incident on the image direction adjusting unit 340. At this time, the beam patterned through the mask 320 (FIG. 2) is a linear image L_m in which the X-axis direction is the longitudinal direction. The beam reflected by the reflecting mirror 330 is preferably reflected by the reflecting mirror 330 so as to have a linear image L_m1 in which the Y-axis direction is the longitudinal direction.

  Here, in order to operate the image direction adjusting unit 340 as the second adjustment mode, the adjustment mode is changed from the first adjustment mode to the second adjustment mode by moving the image direction adjustment unit 340 by a predetermined distance in the Y-axis direction. Can be changed. At this time, the distance by which the image direction adjusting means 340 is moved may be the same as the distance in which the first reflecting mirror 341 and the second reflecting mirror 342 are separated from each other on the Y axis.

  Therefore, the beam incident on the image direction adjusting unit 340 can be incident on the second reflecting mirror 342. The beam incident on the second reflecting mirror 342 is reflected by the second reflecting mirror 342, has a linear image L_m5 in which the beam traveling direction is changed to the -Y direction and the Z-axis direction is the longitudinal direction. Next, the beam L_m5 reflected by the second reflecting mirror 342 enters the third reflecting mirror 343. The beam L_m5 incident on the third reflecting mirror 343 is reflected by the third reflecting mirror 343 and is emitted from the image direction adjusting means 340 by changing the beam traveling direction to the −Z direction. The beam emitted from the image direction adjusting unit 340 has a linear image L_m6 whose longitudinal direction is the Y-axis direction.

  As a result, the direction of the patterned image L_m of the beam that has passed through the mask 320 (FIG. 2) and the direction of the image L_m6 of the beam emitted from the image direction adjusting unit 340 can be perpendicular to each other.

  As described above, the first adjustment mode of the image direction adjusting unit 340 may be implemented by the first beam path formed by the first reflecting mirror 341, the fourth reflecting mirror 344, and the fifth reflecting mirror 345. . Meanwhile, the second adjustment mode may be implemented by a second beam path formed by the second reflecting mirror 342 and the third reflecting mirror 343. Here, the means for adjusting the image direction of the incident beam in different directions is limited to the first beam path and the second beam path according to the first adjustment mode and the second adjustment mode of the image direction adjustment means 340 described above. However, the present invention can be embodied in other forms. In addition, the first beam path and the second beam path may be implemented by other means that are not reflecting mirrors.

  As described above, in the optical system 300 according to the embodiment of the present invention, the image direction adjusting means 340 is set to the Y direction by the distance that the first reflecting mirror 341 and the second reflecting mirror 342 are separated from each other on the Y axis. By moving in the axial direction, it can operate as a second adjustment mode. Therefore, it is not necessary to change the position of the beam incident on the image direction adjusting means 340 in order to operate as the second adjustment mode. Further, the distance that the fifth reflecting mirror 345 and the third reflecting mirror 343 are separated from each other on the Y axis is the distance that the first reflecting mirror 341 and the second reflecting mirror 342 are separated from each other on the Y axis. Since they are the same, the center position of the beam emitted from the image direction adjusting means 340 can be the same in the first adjustment mode and the second adjustment mode. That is, by moving only the image direction adjusting unit 340 by a predetermined distance while fixing other devices and parts other than the image direction adjusting unit 340, the image direction adjusting unit 340 is moved in the first adjustment mode or the second adjustment mode. It can be operated as either of the adjustment modes. Therefore, there is an advantage that the image direction of the outgoing beam can be changed by a simple method without exchanging the optical system or making a large change.

  Next, a modified example of the optical system according to the embodiment of the present invention will be described. FIG. 6 is a diagram schematically showing a modification of the configuration of the optical system included in the laser irradiation apparatus LA shown in FIG. As shown in FIG. 6, in the optical system according to the modification of the embodiment of the present invention, the projection lens 350 is located between the mask 320 and the image direction adjusting means 340. More specifically, the projection lens 350 is located between the mask 320 and the reflecting mirror 330. The configuration of the optical system according to the modification of the embodiment of the present invention is the same as that of the optical system shown in FIG. 2 except for the arrangement position of the projection lens 350.

  Next, a method for manufacturing an organic light emitting display device using a laser irradiation apparatus including an optical system according to an embodiment of the present invention will be described. 7a to 7c and FIGS. 8a to 8c are perspective views illustrating a method of manufacturing an organic light emitting display device using a laser irradiation apparatus including the optical system described above.

  First, referring to FIGS. 7a to 7c, when the optical system according to the embodiment of the present invention operates in the first adjustment mode, that is, the image direction adjusting means provided in the optical system operates in the first adjustment mode. The case where it does is demonstrated.

  First, as shown in FIG. 7a, the substrate S is mounted on the substrate mounting portion 200 of the laser irradiation apparatus LA described with reference to FIG. The substrate S can include an acceptor substrate 500 and a donor substrate 600 laminated on the acceptor substrate 500.

  Here, the donor substrate 600 includes a base substrate 601 (FIG. 9), a photothermal conversion layer 602 (FIG. 9) located on the base substrate 601, and a transfer layer 77 (FIG. 9) located on the photothermal conversion layer 602. be able to. The acceptor substrate 500 may be an organic light emitting display device substrate on which at least a pixel electrode 555 (FIG. 9) is formed. The transfer layer 77 (FIG. 9) of the donor substrate 600 is laminated on the acceptor substrate 500 so as to face the pixel electrode 555 (FIG. 9) of the acceptor substrate 500.

  7A to 7C, the outline C_e of the plurality of cells of the organic light emitting display device on the substrate S and the pattern P_e to be patterned on the acceptor substrate 500 are shown. The longitudinal direction of the pattern P_e to be patterned on the acceptor substrate 500 is the Y-axis direction, that is, the width direction of the substrate S. Here, the outline C_e and the pattern P_e are not actually located on the substrate S, but are shown for convenience of explanation.

  Next, a beam is irradiated from the optical system 300. The optical system 300 is the same as that shown in FIG. That is, the image direction adjusting means 340 (FIG. 2) of the optical system 300 operates in the first adjustment mode. Therefore, the optical system 300 emits a beam having an image whose longitudinal direction is the X-axis direction. The beam emitted from the optical system 300 forms a transfer layer pattern P1 (77a in FIG. 9) on the acceptor substrate S. Specifically, the beam emitted from the optical system 300 is absorbed by the photothermal conversion layer 602 (FIG. 9) of the donor film 600, and the photothermal conversion layer 602 (FIG. 9) that has absorbed the beam generates heat. The transfer layer adjacent to the photothermal conversion layer 602 (FIG. 9) is transferred onto the acceptor substrate 500 by the heat generated in the photothermal conversion layer 602 (FIG. 9), and the transfer layer pattern P1 (FIG. 9) is transferred. 77a) is formed.

  Next, the optical system 300 moves along the optical system guide bar 400 in the −Y direction at a predetermined speed. The beam emitted from the optical system 300 is scanned in the Y-axis direction on the substrate S. As a result, as shown in FIG. 7b, a set of transfer layer patterns is formed on the substrate S by the beam scanning on the substrate S in the Y-axis direction.

  Next, the substrate platform 200 moves one step in the −X direction along the substrate platform guide bar 150. Thereafter, the beam is scanned on the substrate S by the method as described above to complete a set of transfer layer patterns.

  In this way, as shown in FIG. 7 c, a plurality of sets of transfer layer patterns can be formed on the acceptor substrate 500 by repeatedly performing the beam scan and the step movement of the substrate platform 200.

  Next, referring to FIGS. 8a to 8c, when the optical system according to the embodiment of the present invention operates in the second adjustment mode, that is, the image direction adjusting means provided in the optical system is in the second adjustment mode. The case where it operates will be described.

  First, as shown in FIG. 8 a, the substrate S is mounted on the substrate platform 200. Here, the longitudinal direction of the pattern P_e to be patterned on the acceptor substrate 500 of the substrate S is the X-axis direction, that is, the longitudinal direction of the substrate S.

  Next, a beam is irradiated from the optical system 300. The optical system 300 is the same as that shown in FIG. That is, the image direction adjusting means 340 (FIG. 4) of the optical system 300 operates in the second adjustment mode. Therefore, the optical system 300 emits a beam having an image whose longitudinal direction is the Y-axis direction. The beam emitted from the optical system 300 forms a transfer layer pattern P2 on the acceptor substrate S.

  Next, the substrate platform 200 moves along the substrate platform guide bar 150 at a predetermined speed in the −X direction. The beam emitted from the optical system 300 is scanned on the substrate S in the X-axis direction. As a result, as shown in FIG. 8b, a set of transfer layer patterns is formed on the substrate S by the beam scanning on the substrate S in the X-axis direction.

  Next, the optical system 300 moves one step in the −Y direction along the optical system guide bar 400. Thereafter, the beam is scanned on the substrate S by the method as described above to complete a set of transfer layer patterns.

  In this manner, as shown in FIG. 8c, a plurality of sets of transfer layer patterns can be formed on the acceptor substrate 500 by repeatedly performing the beam scan and the step movement of the optical system 300.

  Next, a detailed configuration of the organic electroluminescence display device will be described. FIG. 9 is a cross-sectional view of the organic light emitting display device taken along the section line II ′ of FIG. 7c or 8c.

  As shown in FIG. 9, the semiconductor layer 520 is located on the substrate 501 including the red region R, the green region G, and the blue region B. The semiconductor layer 520 can be an amorphous silicon film or polycrystalline silicon obtained by crystallizing an amorphous silicon film. A gate insulating film 525 is located over the semiconductor layer 520. A gate electrode 530 that overlaps with the semiconductor layer 520 is located over the gate insulating film 525. A first interlayer insulating film 535 is disposed on the gate electrode 530 to cover the semiconductor layer 520 and the gate electrode 530. On the first interlayer insulating film 535, a drain electrode 541 and a source electrode 543 that are connected to both ends of the semiconductor layer 520 through the first interlayer insulating film 535 and the gate insulating film 525 are positioned. The semiconductor layer 520, the gate electrode 530, the drain electrode 541, and the source electrode 543 constitute a thin film transistor T. A second interlayer insulating film 550 that covers the drain electrode 541 and the source electrode 543 is located on the drain electrode 541 and the source electrode 543. The second interlayer insulating film 550 may include a passivation film for protecting the thin film transistor T and / or a planarization film for relaxing a step due to the thin film transistor. A pixel electrode 555 passing through the second interlayer insulating film 550 and connected to the drain electrode 541 is located on the second interlayer insulating film 550. The pixel electrode 555 may be, for example, an ITO (Indium Tin Oxide) film or an IZO (Indium Zinc Oxide) film. A pixel defining layer 560 having an opening 560a exposing a part of the pixel electrode may be disposed on the pixel electrode 555.

  On the other hand, the donor substrate 600 includes a base substrate 601, a photothermal conversion layer 602 and a transfer layer 77 that are sequentially stacked on the base substrate 601. The transfer layer 77 can be an electroluminescent organic film. The transfer layer 77 is at least one selected from the group consisting of a hole injecting organic film, a hole transporting organic film, a hole suppressing organic film, an electron transporting organic film, and an electron injecting organic film. A membrane can further be included.

  Then, a part of the transfer layer 77 of the donor substrate 600 is transferred onto the pixel electrode 555 of the acceptor substrate 500 to form a transfer layer pattern 77a. The transfer layer pattern 77a can be an organic light emitting layer. The transfer layer pattern 77a may further include at least one layer selected from the group consisting of a hole injection layer, a hole transport layer, a hole suppression layer, an electron transport layer, and an electron injection layer. The optical system and the laser irradiation apparatus of the present invention can be used for patterning the organic light emitting layer, hole injection layer, hole transport layer, hole suppression layer, electron transport layer, electron injection layer, etc. of the organic light emitting display device. For example, it can be applied to patterning of all parts such as wiring.

  As mentioned above, although preferred embodiment of this invention was described referring an accompanying drawing, it cannot be overemphasized that this invention is not limited to the example which concerns. It will be apparent to those skilled in the art that various changes and modifications can be made within the scope of the claims, and these are naturally within the technical scope of the present invention. Understood.

  The present invention can be applied to an optical system and a laser irradiation apparatus. In particular, a pattern can be formed on an acceptor substrate by a laser thermal transfer method in which a transfer layer of a donor film is transferred onto the acceptor substrate by irradiating a laser. The present invention can be applied to an optical system and a laser irradiation apparatus that can be used.

It is a perspective view which shows roughly the structure of the laser irradiation apparatus concerning embodiment of this invention. FIG. 2 is a diagram schematically illustrating a configuration of an optical system included in FIG. 1, and illustrates a case where an image direction adjusting unit operates in a first adjustment mode. It is a figure which shows schematically the case where the image direction adjustment means of the optical system concerning embodiment of this invention operate | moves in a 1st adjustment mode. FIG. 2 is a diagram schematically illustrating a configuration of an optical system included in FIG. 1, and illustrates a case where an image direction adjusting unit operates in a second adjustment mode. It is a figure which shows roughly the case where the image direction adjustment means of the optical system concerning embodiment of this invention operate | moves in a 2nd adjustment mode. It is a figure which shows schematically other embodiment of a structure of the optical system contained in FIG. 1 illustrates a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an embodiment of the present invention in a first adjustment mode, and a substrate on a substrate mounting portion of the laser irradiation apparatus; It is a perspective view which shows the state in which was mounted. 1 illustrates a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an embodiment of the present invention in a first adjustment mode, and a method of manufacturing an organic light emitting display by using a beam scanned in the Y-axis direction of a substrate; It is a perspective view which shows the state where one set of transfer layers was completed on the board | substrate. 1 shows a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an embodiment of the present invention in a first adjustment mode, and scanning a beam and moving a substrate mounting unit stepwise. 5 is a perspective view showing a state in which all of the transfer layer pattern is formed on the acceptor substrate by repeating the above. 1 illustrates a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an embodiment of the present invention in a second adjustment mode, and a substrate on a substrate mounting portion of the laser irradiation apparatus; It is a perspective view which shows the state in which was mounted. 1 illustrates a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an exemplary embodiment of the present invention in a second adjustment mode, and includes a beam scanned in a Y-axis direction of a substrate. It is a perspective view which shows the state where one set of transfer layers was completed on the board | substrate. 1 shows a method of manufacturing an organic light emitting display by operating an image direction adjusting unit of a laser irradiation apparatus according to an embodiment of the present invention in a second adjustment mode, and scanning a beam and moving a substrate mounting unit stepwise. 5 is a perspective view showing a state in which all of the transfer layer pattern is formed on the acceptor substrate by repeating the above. 9 is a cross-sectional view illustrating an organic light emitting display device taken along a cutting line II ′ of FIG. 7c or FIG. 8c.

Explanation of symbols

LA laser irradiation device 100 Stage 150 Substrate placement section guide bar (chuck guide bar)
200 Substrate rest (chuck)
DESCRIPTION OF SYMBOLS 300 Optical system 301 Laser light source 310 Image conversion means 320 Mask 320a Light transmission pattern 340 Image direction adjustment means 350 Projection lens 400 Optical system guide bar L Laser beam L_i, L_m, L_dm1, L_dm2, L_p1, L_p2 Beam image 341, 342, 343 , 344, 355 Reflector S substrate 500 acceptor substrate 501 substrate 520 semiconductor layer 525 gate insulating film 530 gate electrode 535 first interlayer insulating film 541 drain electrode 543 source electrode T thin film transistor 550 second interlayer insulating film 555 pixel electrode 560 pixel definition film 560a Opening 600 Donor substrate 601 Base substrate 602 Photothermal conversion layer 77 Transfer layer P_e pattern C_e Cell outline P1, P2 Transfer layer pattern

Claims (16)

A laser light source for generating a laser beam;
A first adjustment mode in which the direction of the laser beam is adjusted so that the direction of the image formed on the object to be processed by the laser beam is the first direction; and the direction of the image formed on the object to be processed Image direction adjusting means including a second adjustment mode for adjusting and outputting the direction of the laser beam so that is in the second direction;
Only including,
The image direction adjusting means includes a first beam path through which the laser beam passes when operating in the first adjusting mode, and the laser beam when operating in the second adjusting mode. And a second beam path passing therethrough .   2. The optical system according to claim 1, wherein the first direction is an X-axis direction, and the second direction is a Y-axis direction perpendicular to the first direction. The optical system according to claim 1 , wherein each of the first beam path and the second beam path includes a plurality of reflecting mirrors.   The optical system according to claim 1, further comprising an image conversion unit that is positioned between the laser light source and the image direction adjusting unit and converts an image of a laser beam generated from the laser light source into a line shape. system. The optical system according to claim 4 , wherein the image conversion means is a homogenizer. The optical system according to claim 4 , further comprising a mask positioned between the image conversion unit and the image direction adjustment unit and including a light transmission pattern or a light reflection pattern. An optical system including a laser light source for generating a laser beam, image direction adjusting means for adjusting the direction of an image formed on the object to be processed by the laser beam, and a projection lens;
A substrate mounting portion disposed at a position capable of receiving a laser beam emitted from the optical system and on which a substrate as the object to be processed is mounted;
Only including,
The image direction adjusting means includes:
A first adjustment mode in which the direction of the laser beam is adjusted and outputted so that the direction of the image formed on the object to be processed is the first direction, and the direction of the image formed on the object to be processed is the second. A second adjustment mode for adjusting and outputting the direction of the laser beam so as to be
The image direction adjusting means includes a first beam path through which the laser beam passes when operating in the first adjusting mode, and the laser beam when operating in the second adjusting mode. And a second beam path passing therethrough . 8. The laser according to claim 7 , further comprising an image converting unit positioned between the laser light source and the image direction adjusting unit and converting an image of a laser beam generated from the laser light source into a line shape. Irradiation device. 9. The laser irradiation apparatus according to claim 8 , wherein the image conversion means is a homogenizer. The laser irradiation apparatus according to claim 7 , wherein the first direction is an X-axis direction, and the second direction is a Y-axis direction perpendicular to the first direction. The laser irradiation apparatus according to claim 7 , wherein each of the first beam path and the second beam path includes a plurality of reflecting mirrors. 9. The laser irradiation apparatus according to claim 8 , further comprising a mask positioned between the image conversion unit and the image direction adjustment unit and including a light transmission pattern or a light reflection pattern. The laser irradiation apparatus according to claim 7 , wherein the projection lens is positioned between the laser light source and the image direction adjusting unit. The laser irradiation apparatus according to claim 7 , wherein the projection lens projects the laser beam that has passed through the image direction adjusting unit onto the substrate. The substrate mounting portion is movable in one direction along a surface on which the substrate is placed, and the optical system is moved in a direction parallel to the surface on which the substrate is placed and perpendicular to the one direction. The laser irradiation apparatus according to claim 7 , which is possible. The laser irradiation apparatus according to claim 7 , wherein the substrate includes an acceptor substrate and a donor substrate positioned on the acceptor substrate.

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