JP4601201B2 - Frame holding device and wire bonding method and device - Google Patents

Frame holding device and wire bonding method and device Download PDF

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JP4601201B2
JP4601201B2 JP2001128300A JP2001128300A JP4601201B2 JP 4601201 B2 JP4601201 B2 JP 4601201B2 JP 2001128300 A JP2001128300 A JP 2001128300A JP 2001128300 A JP2001128300 A JP 2001128300A JP 4601201 B2 JP4601201 B2 JP 4601201B2
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frame
pellet mounting
row
pressing
window
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JP2002324818A (en
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昭夫 小河
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Shibaura Mechatronics Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は半導体装置を製造するためのフレーム押さえ装置並びにワイヤボンディング方法及び装置に関する。
【０００２】
【従来の技術】
従来、半導体装置を製造するためのワイヤボンディング装置では、ボンディング時におけるリードフレーム等のフレーム部材のペレット搭載部（アイランド及びリード）の反り等の変形を矯正し、ボンディング精度の向上等を図るため、ボンディング作業位置に位置付けられたフレーム部材を支持ブロックに対し押さえ付けるフレーム押さえ部材を用いている。このとき、フレーム押さえ部材は、フレーム部材のペレット搭載部の被押さえ部に弾性を有して当接する押さえ部を備えるものとすることができる。
【０００３】
【発明が解決しようとする課題】
しかしながら、ペレット搭載部の列を多数設けた高密度フレーム部材に対し、その列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部の被押さえ部を同時に押さえ付ける多数の押さえ部をフレーム押さえ部材に設けようとすると、各押さえ部の寸法（弾性変形する腕の長さ等）を大きくとれず、各押さえ部は所望の弾性を確保できない。
【０００４】
本発明の課題は、高密度フレーム部材の互いに近接するペレット搭載部の被押さえ部を確実に押さえ付けることにある。
【０００５】
【課題を解決するための手段】
請求項１の発明は、ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、フレーム押さえ部材がフレーム部材のペレット搭載部に対応して該ペレット搭載部を囲むように設けられた１つの窓部と、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部の一部ずつを順に窓部で囲んで押さえ付ける作業を繰り返すようにしたものである。
【０００６】
請求項２の発明は、ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、フレーム押さえ部材がフレーム部材の複数の各列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設けられ、隣接する各列のそれぞれに対応するもの同士でそれらの列に沿う方向にずれて配置された複数の窓部と、窓部内に向かって突出し、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、隣接する各列のそれぞれに対応するペレット搭載部同士でそれらの列に沿う方向にずれて位置するペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すようにしたものである。
【０００７】
請求項３の発明は、請求項２の発明において更に、前記支持ブロックが、窓部に対応する位置にペレット搭載部を支持する支持凸部を有するようにしたものである。
【０００８】
請求項４の発明は、ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、フレーム押さえ部材がフレーム部材の少なくとも一の列を隔てた複数の各列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設けられた複数の窓部と、窓部内に向かって突出し、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、少なくとも一の列を隔てた各列毎のペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すようにしたものである。
【０００９】
請求項５の発明は、請求項４の発明において更に、前記フレーム押さえ部材とフレーム部材とを、少なくともペレット搭載部の列に直交する方向に相対移動させる移動装置を有するようにしたものである。
【００１３】
【作用】
請求項１の発明によれば下記(a)の作用がある。
(a)フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部の一部ずつを順に窓部で囲んで押さえ付ける作業を繰り返すものとなり、窓部に囲まれたペレット搭載部の被押さえ部を押さえ付ける押さえ部をフレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部に対して１対１で設ける必要がなくなる。このため、各押さえ部の寸法を大きくとることができ、各押さえ部にペレット搭載部の被押さえ部に対する所望の弾性を確保できるから、高密度フレーム部材の互いに近接するペレット搭載部の被押さえ部を確実に押さえ付けることができる。
【００１４】
請求項２の発明によれば下記(b)の作用がある。
(b)フレーム押さえ部材を構成するに際し、フレーム押さえ部材の窓部を、フレーム部材の列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設け、隣接する列に対応するもの同士を列に沿う方向にずらして配置した。そして、フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、隣接する各列のそれぞれに対応するペレット搭載部同士でそれらの列に沿う方向にずれて位置するペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すものにした。従って、窓部に囲まれたペレット搭載部の被押さえ部を押さえ付ける押さえ部をフレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部に対して１対１で設ける必要がなくなる。このため、各押さえ部の寸法を大きくとることができ、各押さえ部にペレット搭載部の被押さえ部に対する所望の弾性を確保できるから、高密度フレーム部材の互いに近接するペレット搭載部の被押さえ部を確実に押さえ付けることができる。
【００１５】
請求項３の発明によれば下記(c)の作用がある。
(c)支持ブロックが、窓部に対応する位置にペレット搭載部を支持する支持凸部を有するものとしたから、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部に対応する多数の支持凸部を設ける必要がなくなり、フレーム部材を支持する支持ブロックの支持面の加工が容易になる。
【００１６】
請求項４の発明によれば下記(d)の作用がある。
(d)フレーム押さえ部材を構成するに際し、フレーム押さえ部材の窓部を、フレーム部材の少なくとも一の列を隔てた列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設けた。そして、フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、少なくとも一の列を隔てた各列毎のペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すものにした。従って、窓部に囲まれたペレット搭載部の被押さえ部を押さえ付ける押さえ部をフレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部に対して１対１で設ける必要がなくなる。このため、各押さえ部の寸法を大きくとることができ、各押さえ部にペレット搭載部の被押さえ部に対する所望の弾性を確保できるから、高密度フレーム部材の互いに近接するペレット搭載部の被押さえ部を確実に押さえ付けることができる。
【００１７】
請求項５の発明によれば下記(e)の作用がある。
(e)移動装置により、上述(d)のフレーム押さえ部材とフレーム部材とを相対移動させることができる。
【００２０】
【発明の実施の形態】
図１は第１実施形態のワイヤボンディング装置とフレーム押さえ装置を示す模式図、図２はフレーム押さえ装置を示す平面図、図３は図２におけるフレーム押さえ部材を示す平面図、図４は図１における支持ブロックを示す模式図、図５は第２実施形態のフレーム押さえ装置を示す平面図、図６は図５におけるフレーム押さえ部材を示す平面図、図７は第２実施形態で用いられる図４に相当する支持ブロックを示す模式図、図８は第３実施形態のフレーム押さえ装置を示す平面図、図９は第４実施形態のフレーム押さえ装置を示す平面図、図１０は従来例の支持ブロックを示す模式図である。
【００２１】
（第１実施形態）（図１〜図４）
ワイヤボンディング装置１０は、図１に示す如く、フレーム部材１のペレット搭載部１Ａ（アイランド）に搭載された半導体ペレット２の電極上のボンディング点と、フレーム部材１のリード１Ｂ上のボンディング点とを、ワイヤにより電気的に接続するものである。
【００２２】
ワイヤボンディング装置１０は、不図示のフレーム送り装置を用いてフレーム部材１を搬送案内する一対のガイドレール１１を有し、このガイドレール１１の側方に、ガイドレール１１によるフレーム部材１の送り方向及びこれに直交する方向に移動自在なＸＹテーブル１２が配置され、このＸＹテーブル１２にボンディングヘッド１３が搭載されている。
【００２３】
ボンディングヘッド１３は、そのヘッドフレーム１３Ａに、ワイヤを挿通するキャピラリ１４を先端部に装着したボンディングアーム１５と、トーチ電極（不図示）とを支持して構成される。このボンディングアーム１５は、ボンディングアーム揺動モータ１５Ａにより上下方向に揺動させられる。また、トーチ電極は、放電時に不図示のトーチ駆動装置により、その先端部がキャピラリ１４の直下に位置させられる。また、一対のガイドレール１１の間には、キャピラリ１４の直下のボンディング作業位置にヒータブロックを構成する支持ブロック１７が設置される。
【００２４】
ボンディングヘッド１３のヘッドフレーム１３Ａにはカメラ２０が固定支持される。カメラ２０は、キャピラリ１４の上方に配置され、フレーム部材１上の半導体ペレット２を撮像し、それらの電極の位置検出（必要によりフレーム部材１のリードの位置も検出）に用いられる。カメラ２０で撮像された画像は画像処理装置２１へ出力される。
【００２５】
画像処理装置２１は、カメラ２０の取り込んだ画像の画像処理を行なう。そして、この処理画像は、制御装置２３の記憶部に記憶される。制御装置２３は、記憶部に記憶させたカメラ２０の検出画像情報データと予め記憶部に設定してある基準画像データに基づき、公知のパターンマッチング手法等にて半導体ペレット２の位置ずれを検出（必要によりフレーム部材１のリードの位置ずれも検出）する。
【００２６】
制御装置２３は、ボンディング作動時に、ＸＹテーブル１２のＸテーブル駆動モータ１２Ａ、Ｙテーブル駆動モータ１２Ｂ、ボンディングアーム１５の揺動モータ１５Ａ及び画像処理装置２１を制御する。即ち、制御装置２３は、ＸＹテーブル１２を制御してカメラ２０を移動させ、また、画像処理装置２１を制御し、半導体ペレット２の位置ずれを検出し（必要によりフレーム部材１のリードの位置ずれも検出）、更に、ＸＹテーブル１２及びボンディングアーム１５を制御し、キャピラリ１４により、フレーム部材１と半導体ペレット２のボンディング点、即ちフレーム部材１のリードと半導体ペレット２の電極とをワイヤボンディングする。
【００２７】
しかるに、ワイヤボンディング装置１０は、ボンディング作業位置に位置付けられた、全２列のペレット搭載部１Ａを備えたフレーム部材１を支持ブロック１７に対して押さえ付けるフレーム押さえ部材３１を有するフレーム押さえ装置３０を備える。フレーム押さえ装置３０は、昇降装置３２によりフレーム押さえ部材３１を昇降し、フレーム押さえ部材３１をフレーム部材１の上方に離隔する待機位置と、フレーム部材１を支持ブロック１７に対して押し付ける押圧位置とに切換え設定される。
【００２８】
フレーム押さえ部材３１は、図１〜図３に示す如く、フレーム部材１の列毎（この列はフレーム部材１の送り方向に沿う列、全２列）のペレット搭載部１Ａに対応して該ペレット搭載部１Ａを囲むように設けられ、隣接する列に対応するもの同士で列に沿う方向にずれて配置された２つの窓部３１Ａ、３１Ｂを有する。フレーム押さえ部材３１がフレーム部材１を押さえ付けた状態で、各窓部３１Ａ、３１Ｂはそれぞれ４個のペレット搭載部１Ａを囲む。また、フレーム押さえ部材３１は、窓部３１Ａ（３１Ｂ）内に向かって突出し、窓部３１Ａ（３１Ｂ）に囲まれた各ペレット搭載部１Ａの被押さえ部に弾性を有して当接する片持ち腕状の押さえ部３３（ペレット搭載部１Ａに対する押さえ部３３Ａとリード１Ｂに対する押さえ部３３Ｂ）を有する。そして、フレーム押さえ装置３０は、フレーム押さえ部材３１とフレーム部材１との該フレーム部材１の前記列に沿う方向の相対移動（支持ブロック１７のフレーム支持面に沿う方向）により、フレーム部材１のペレット搭載部１Ａの全てが窓部３１Ａ、３１Ｂに対応して該窓部３１Ａ、３１Ｂに囲まれるように窓部３１Ａ、３１Ｂを配置した。フレーム押さえ部材３１とフレーム部材１の相対移動は、フレーム部材１をフレーム送り装置により移動して行なう。但し、フレーム押さえ部材３１を移動装置により移動しても良い。
【００２９】
このとき、本実施形態のフレーム部材１は、ペレット搭載部１Ａとリード１Ｂを図４（Ｂ）に示す如くに凸状にしており、支持ブロック１７は、フレーム押さえ部材３１の窓部３１Ａ、３１Ｂに対応する位置に、ペレット搭載部１Ａ、リード１Ｂを支持する支持凸部１７Ａを有する（図４）。フレーム部材１の２例（各列８個）のペレット搭載部１Ａ、リード１Ｂに対し、従来の支持ブロック１７であれば図１０（Ａ）に示す如くの16個の支持凸部１７Ａを設ける必要があったのに対し、本実施形態の支持ブロック１７では図４（Ａ）に示す如くの8個の支持凸部１７Ａで足りる。
【００３０】
従って、フレーム押さえ装置３０を用いたワイヤボンディング装置１０のワイヤボンディング方法は以下の如くなされる。
【００３１】
(1)フレーム送り装置により、フレーム部材１を支持ブロック１７に対して位置合わせする。
【００３２】
(2)上述(1)のフレーム部材１の各列のペレット搭載部１Ａをフレーム押さえ部材３１の窓部３１Ａ、３１Ｂに対応させて位置付け、昇降装置３２により押下される押さえ部３３によってフレーム部材１を支持ブロック１７に対して押さえ付ける。
【００３３】
(3)ボンディングヘッド１３により、フレーム押さえ部材３１の窓部３１Ａ、３１Ｂを介して、ペレット搭載部１Ａの半導体ペレット２に対するワイヤボンディングを行なう。尚、ワイヤボンディングは、ボンディングヘッド１３を搭載するＸＹテーブル１２を移動させることで、今回窓部３１Ａ、３１Ｂに対応して位置付けられた全ての半導体ペレット２に対して行なわれる。
【００３４】
(4)上述(3)のワイヤボンディング工程の後、フレーム押さえ部材３１を上昇させ、そしてフレーム送り装置により、フレーム部材１の各列に沿う他のペレット搭載部１Ａをフレーム押さえ部材３１の窓部３１Ａ、３１Ｂに位置付け、昇降装置３２により押下される押さえ部３３によってフレーム部材１を支持ブロック１７に対して再び押さえ付け、ボンディングツール１３により新たなペレット搭載部１Ａの半導体ペレット２に対するワイヤボンディングを行なう。
【００３５】
本実施形態によれば、以下の作用がある。
▲１▼フレーム押さえ部材３１を構成するに際し、フレーム押さえ部材３１の窓部３１Ａ、３１Ｂを、フレーム部材１の列毎のペレット搭載部１Ａに対応して該ペレット搭載部１Ａを囲むように設け、隣接する列に対応するもの同士を列に沿う方向にずらして配置した。そして、フレーム押さえ部材３１とフレーム部材１との相対移動により、フレーム部材１のペレット搭載部１Ａの全てが、フレーム押さえ部材３１の窓部３１Ａ、３１Ｂに対応して該窓部３１Ａ、３１Ｂに囲まれるように窓部３１Ａ、３１Ｂを配置した。従って、フレーム押さえ部材３１は、フレーム部材１の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部１Ａのうち、隣接する列に対応するペレット搭載部１Ａ同士で列に沿う方向にずれて位置するペレット搭載部１Ａの組を順に窓部３１Ａ、３１Ｂで囲んで押さえ付ける作業を繰り返すものとなり、窓部３１Ａ、３１Ｂに囲まれたペレット搭載部１Ａの被押さえ部を押さえ付ける押さえ部３３をフレーム部材１の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部１Ａに対して１対１で設ける必要がなくなる。このため、各押さえ部３３の寸法を大きくとることができ、各押さえ部３３にペレット搭載部１Ａの被押さえ部に対する所望の弾性を確保できるから、高密度フレーム部材１の互いに近接するペレット搭載部１Ａの被押さえ部を確実に押さえ付けることができる。
【００３６】
▲２▼支持ブロック１７が、窓部３１Ａ、３１Ｂに対応する位置にペレット搭載部１Ａを支持する支持凸部を有するものとしたから、フレーム部材１の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部１Ａに対応する多数の支持凸部１７Ａを設ける必要がなくなり、フレーム部材１を支持する支持ブロックの支持面の加工が容易になる。
【００３７】
▲３▼高密度フレーム部材１のペレット搭載部１Ａの反り等の変形を矯正して確実に支持ブロック１７に押さえ付けることができ、ボンディング精度を向上できる。
【００３８】
（第２実施形態）（図５〜図７）
第２実施形態のフレーム押さえ装置４０が第１実施形態のフレーム押さえ装置３０と異なる点は、フレーム押さえ部材４１が図５、図６に示す如く、全４列の列毎のペレット搭載部１Ａに対応する４つの窓部４１Ａ〜４１Ｄを有し、フレーム押さえ部材４１の押さえ部４２（ペレット搭載部１Ａに対する押さえ部４２Ａ、リード１Ｂに対する押さえ部４２Ｂ）がフレーム部材１を押さえ付けた状態で、各窓部４１Ａ〜４１Ｄがそれぞれ２個のペレット搭載部１Ａを囲むように構成したことにある。
【００３９】
また、フレーム押さえ装置４０を用いたワイヤボンディング装置１０でも、支持ブロック１７が、フレーム押さえ部材４１の窓部４１Ａ〜４１Ｄに対応する位置に、ペレット搭載部１Ａ、リード１Ｂを支持する支持凸部１７Ａを有する（図７）。フレーム部材１の4列（各列8個）のペレット搭載部１Ａ、リード１Ｂに対し、従来の支持ブロック１７では図１０（Ｂ）に示す如くの32個の支持凸部１７Ａを設ける必要があったのに対し、本実施形態の支持ブロック１７では図７（Ａ）に示す如くの8個の支持凸部１７Ａで足りる。
【００４０】
（第３実施形態）（図８）
第３実施形態のフレーム押さえ装置５０が第１実施形態のフレーム押さえ装置３０と異なる点は、図８に示す如く、フレーム部材１の送り方向に直交する方向に沿う方向に列を定め、フレーム押さえ部材５１がフレーム部材１の少なくとも一の列（本実施形態では2列）を隔てた列毎（全3列）のペレット搭載部１Ａに対応して該ペレット搭載部１Ａを囲むように設けられた3つの窓部５１Ａ〜５１Ｃと、窓部５１Ａ〜５１Ｃ内に向かって突出し、窓部５１Ａ〜５１Ｃに囲まれたペレット搭載部１Ａの被押さえ部に弾性を有して当接する片持ち腕状の押さえ部５２（ペレット搭載部１Ａに対する押さえ部５２Ａ、リード１Ｂに対する押さえ部５２Ｂ）を有する。そして、フレーム押さえ装置５０は、フレーム押さえ部材５１をペレット搭載部１Ａの列に直交する方向に移動させることができる移動装置を有し、この移動装置と、フレーム送り装置によるフレーム押さえ部材５１とフレーム部材１の相対移動により、フレーム部材１のペレット搭載部１Ａの全てが窓部５１Ａ〜５１Ｃに対応して窓部５１Ａ〜５１Ｃに囲まれるように窓部５１Ａ〜５１Ｃを配置した。
【００４１】
従って、ペレット押さえ装置５０を用いたワイヤボンディング装置１０のワイヤボンディング方法は以下の如くなされる。
【００４２】
(1)フレーム送り装置により、フレーム部材１を支持ブロック１７に対して位置合わせする。
【００４３】
(2)フレーム押さえ部材５１の窓部５１Ａ〜５１Ｃをフレーム部材１の各列のペレット搭載部１Ａに対応する位置に位置付け、押さえ部５２にてフレーム部材１を支持ブロック１７に対して押さえ付ける。
【００４４】
(3)フレーム押さえ部材５１の窓部５１Ａ〜５１Ｃを介して、ボンディングツール１３により、ペレット搭載部１Ａに搭載された半導体ペレット２に対してワイヤボンディングを行なう。
【００４５】
(4)上述(3)のワイヤボンディング工程ののち、フレーム押さえ部材５１を上昇させ、移動装置を用いて、フレーム押さえ部材５１の窓部５１Ａ〜５１Ｃをフレーム部材１の各列に相隣る他の列のペレット搭載部１Ａに対応する位置に位置付け、押さえ部５２にてフレーム部材１を支持ブロック１７に対して再び押さえ付け、ボンディングツール１３により新たなペレット搭載部１Ａの半導体ペレット２に対するボンディングを行なう。
【００４６】
ここで、図８において、窓部５１Ａおよび窓部５１Ｂ、窓部５１Ｂおよび窓部５１Ｃは、それぞれ２列のペレット搭載部１Ａを隔てて配置されているので、上述(4)の工程を２回行なう毎に、フレーム押さえ部材１５を上述(4)の工程による送りとは反対方向にペレット搭載部１Ａの２列分移動させて元の位置に位置付けるとともに、フレーム送り装置によりフレーム部材１をペレット搭載部１Ａの９列分送るものとする。
【００４７】
本実施形態によれば、以下の作用がある。
▲１▼フレーム押さえ部材５１を構成するに際し、フレーム押さえ部材５１の窓部５１Ａ〜５１Ｃを、フレーム部材１の少なくとも一の列を隔てた列毎のペレット搭載部１Ａに対応して該ペレット搭載部１Ａを囲むように設けた。そして、フレーム押さえ部材５１とフレーム部材１との相対移動により、フレーム部材１のペレット搭載部１Ａの全てが、フレーム押さえ部材５１の窓部５１Ａ〜５１Ｃに対応して該窓部５１Ａ〜５１Ｃに囲まれるように窓部５１Ａ〜５１Ｃを配置した。従って、フレーム押さえ部材５１は、フレーム部材１の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部１Ａのうち、少なくとも一の列を隔てた列毎のペレット搭載部１Ａの組を順に窓部５１Ａ〜５１Ｃで囲んで押さえ付ける作業を繰り返すものとなり、窓部５１Ａ〜５１Ｃに囲まれたペレット搭載部１Ａの被押さえ部を押さえ付ける押さえ部５２をフレーム部材１の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部１Ａに対して１対１で設ける必要がなくなる。このため、各押さえ部５２の寸法を大きくとることができ、各押さえ部５２にペレット搭載部１Ａの被押さえ部に対する所望の弾性を確保できるから、高密度フレーム部材１の互いに近接するペレット搭載部１Ａの被押さえ部を確実に押さえ付けることができる。
【００４８】
▲２▼移動装置により、上述▲１▼のフレーム押さえ部材５１とフレーム部材１とを相対移動させることができる。
【００４９】
▲３▼高密度フレーム部材１のペレット搭載部１Ａの反り等の変形を矯正して確実に支持ブロックに押さえ付けることができ、ボンディング精度を向上できる。
【００５０】
（第４実施形態）（図９）
第４実施形態のフレーム押さえ装置６０が第１実施形態のフレーム押さえ装置３０と異なる点は、図９に示す如く、フレーム部材１の送り方向に直交する方向に沿う方向に列を定め、フレーム押さえ部材６１がフレーム部材１の唯一の列の唯一のペレット搭載部１Ａに対応して該ペレット搭載部１Ａを囲むように設けられた１つの窓部６１Ａと、窓部６１Ａ内に向かって突出し、窓部６１Ａに囲まれたペレット搭載部１Ａの被押さえ部に弾性を有して当接する片持ち腕状の押さえ部６２（ペレット搭載部１Ａに対する押さえ部６２Ａ、リード１Ｂに対する押さえ部６２Ｂ）を有する。そして、フレーム押さえ装置６０は、フレーム押さえ部材６１をペレット搭載部１Ａの列に沿う方向に移動させる移動装置を有し、この移動装置とフレーム送り装置によるフレーム押さえ部材６１とフレーム部材１の相対移動により、フレーム部材１のペレット搭載部１Ａの全てが窓部６１Ａに対応して窓部６１Ａに囲まれるように窓部６１Ａを配置した。
【００５１】
従って、フレーム押さえ装置６０を用いたワイヤボンディング装置１０のワイヤボンディング方法は以下の如くなされる。
【００５２】
(1)フレーム送り装置により、フレーム部材１を支持ブロック１７に対して位置合わせする。
【００５３】
(2)フレーム押さえ部材６１の窓部６１Ａをフレーム部材１の一の列の一のペレット搭載部１Ａに対応する位置に位置付け、押さえ部６２にてフレーム部材１を支持ブロック１７に対して押さえ付ける。
【００５４】
(3)フレーム押さえ部材６１の窓部６１Ａを介して、ボンディングツール１３により、ペレット搭載部１Ａに搭載された半導体ペレット２に対してワイヤボンディングを行なう。
【００５５】
(4)上述(3)のワイヤボンディング工程ののち、フレーム押さえ部材６１を上昇させ、移動装置を用いて、フレーム押さえ部材６１の窓部６１Ａを同じ列の隣接するペレット搭載部１Ａに対応する位置に位置付け、押さえ部６２にてフレーム部材１を支持ブロック１７に対して押さえ付け、ボンディングツール１３により新たなペレット搭載部１Ａの半導体ペレット２に対するボンディングを行なう。
【００５６】
そして、一の列のペレット搭載部１Ａ全てについてのボンディングが完了したら、フレーム送り装置にてフレーム部材１をペレット搭載部１Ａの一列分送り、隣接する列の一のペレット搭載部１Ａと窓部６１Ａとを対応させる。以下上述と同様の手順によりペレット搭載部１Ａの半導体ペレット２に対するボンディングを行なう。
【００５７】
本実施形態によれば、以下の作用がある。
▲１▼フレーム部材１の一の列の一のペレット搭載部１Ａに対応する窓部６１Ａを有するフレーム押さえ部材６１を移動装置により移動させ、フレーム部材１のペレット搭載部１Ａを支持ブロック１７に押さえ付けることができる。
【００５８】
▲２▼高密度フレーム部材１のペレット搭載部１Ａの反り等の変形を矯正して確実に支持ブロックに押さえ付けることができ、ボンディング精度を向上できる。
【００５９】
以上、本発明の実施の形態を図面により詳述したが、本発明の具体的な構成はこの実施の形態に限られるものではなく、本発明の要旨を逸脱しない範囲の設計の変更等があっても本発明に含まれる。
【００６０】
【発明の効果】
以上のように本発明によれば、高密度フレーム部材の互いに近接するペレット搭載部の被押さえ部を確実に押さえ付けることができる。
【図面の簡単な説明】
【図１】 図１は第１実施形態のワイヤボンディング装置とフレーム押さえ装置を示す模式図である。
【図２】 図２はフレーム押さえ装置を示す平面図である。
【図３】 図３は図２におけるフレーム押さえ部材を示す平面図である。
【図４】 図４は図１における支持ブロックを示す模式図である。
【図５】 図５は第２実施形態のフレーム押さえ装置を示す平面図である。
【図６】 図６は図５におけるフレーム押さえ部材を示す平面図である。
【図７】 図７は第２実施形態に用いられる図４に相当する支持ブロックを示す模式図である。
【図８】 図８は第３実施形態のフレーム押さえ装置を示す平面図である。
【図９】 図９は第４実施形態のフレーム押さえ装置を示す平面図である。
【図１０】 図１０は従来例の支持ブロックを示す模式図である。
【符号の説明】
１ フレーム部材
１Ａ ペレット搭載部
１０ ワイヤボンディング装置
１３ ボンディングヘッド
１７ 支持ブロック
１７Ａ 支持凸部
３０、４０、５０、６０ フレーム押さえ装置
３１、４１、５１、６１ フレーム押さえ部材
３１Ａ、３１Ｂ、４１Ａ〜４１Ｄ、５１Ａ〜５１Ｃ、６１Ａ 窓部
３３、４２、５２、６２ 押さえ部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a frame pressing device and a wire bonding method and apparatus for manufacturing a semiconductor device.
[0002]
[Prior art]
Conventionally, in a wire bonding apparatus for manufacturing a semiconductor device, in order to correct deformation such as warpage of a pellet mounting portion (island and lead) of a frame member such as a lead frame at the time of bonding and improve bonding accuracy, A frame pressing member that presses the frame member positioned at the bonding work position against the support block is used. At this time, the frame pressing member may include a pressing portion that elastically contacts the pressed portion of the pellet mounting portion of the frame member.
[0003]
[Problems to be solved by the invention]
However, for a high-density frame member provided with a number of rows of pellet mounting portions, a number of pressers that simultaneously press down the pressed portions of all pellet mounting portions that are close in both the direction along the row and the direction perpendicular to the rows. If the portion is provided on the frame pressing member, the size of each pressing portion (such as the length of the elastically deforming arm) cannot be increased, and each pressing portion cannot secure the desired elasticity.
[0004]
The subject of this invention is pressing down the to-be-pressed part of the pellet mounting part which a high-density frame member adjoins mutually reliably.
[0005]
[Means for Solving the Problems]
  The invention according to claim 1 is a frame pressing member having a support block for supporting a frame member provided with a plurality of rows of pellet mounting portions, and a frame pressing member for pressing the frame member against the support block. Is provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion of the frame memberOneHaving a window part and a pressing part that elastically contacts the pressed part of the pellet mounting part surrounded by the window part,The frame holding memberBy relative movement of the frame pressing member and the frame member,Repeated the work of enclosing and pressing a part of all the pellet mounting parts that are close to each other in both the direction along the row of the frame members and the direction perpendicular to the row.Is.
[0006]
  According to a second aspect of the present invention, there is provided a frame pressing member including a support block that supports a frame member provided with a plurality of rows of pellet mounting portions, and a frame pressing member that presses the frame member against the support block. Of the frame memberMultiple eachIt is provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion for each row, and is adjacent.Each in each columnBetween those that correspond toThemArranged in the direction along the linepluralA window part and a pressing part that protrudes into the window part and elastically contacts the pressed part of the pellet mounting part surrounded by the window part;The frame holding memberBy relative movement of the frame pressing member and the frame member,Of all the pellet mounting parts that are close in both the direction along the row of the frame member and the direction orthogonal to the row, the pellet mounting parts corresponding to each of the adjacent rows are shifted in the direction along those rows. Repeat the work of enclosing and pressing the set of pellet mounting parts to be surrounded by each window part in order.It is a thing.
[0007]
According to a third aspect of the present invention, in the second aspect of the present invention, the support block further includes a support convex portion that supports the pellet mounting portion at a position corresponding to the window portion.
[0008]
  According to a fourth aspect of the present invention, there is provided a frame pressing member comprising: a support block that supports a frame member provided with a plurality of rows of pellet mounting portions; and a frame pressing member that presses the frame member against the support block. Separated at least one row of frame membersMultiple eachCorresponding to the pellet mounting part for each row, provided to surround the pellet mounting partpluralA window part and a pressing part that protrudes into the window part and elastically contacts the pressed part of the pellet mounting part surrounded by the window part;The frame holding memberBy relative movement of the frame pressing member and the frame member,Of all the pellet mounting parts that are close in both the direction along the row of the frame member and the direction orthogonal to the row, a set of pellet mounting parts for each row that is separated by at least one row is sequentially surrounded by each window portion. Repeat the pressing processIt is a thing.
[0009]
According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the frame pressing member and the frame member further include a moving device that relatively moves the frame pressing member and the frame member at least in a direction orthogonal to the row of the pellet mounting portions.
[0013]
[Action]
  According to the invention of claim 1,(a)There is an effect of.
  (a)Frame holding memberIs, Relative movement of frame holding member and frame memberBy the frame memberThe part of all the pellet mounting parts that are close in both the direction along the line and the direction perpendicular to the line are sequentially surrounded and pressed by the window part in order, and the pellet mounting part surrounded by the window part is repeated. There is no need to provide a pressing portion for pressing the pressed portion in a one-to-one manner with respect to all the pellet mounting portions that are close in both the direction along the row of the frame members and the direction orthogonal to the row. For this reason, since the dimension of each holding | maintenance part can be taken large and the desired elasticity with respect to the to-be-pressed part of a pellet mounting part can be ensured in each holding | suppressing part, the to-be-pressed part of the pellet mounting part of the high-density frame member which adjoins mutually Can be pressed down securely.
[0014]
  According to the invention of claim 2,(b)There is an effect of.
  (b)When configuring the frame pressing member, the window portion of the frame pressing member is provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion for each column of the frame member, and those corresponding to adjacent columns are arranged in rows. It was shifted in the direction along. AndThe frame holding memberRelative movement of frame holding member and frame memberBy the frame memberAdjacent among all the pellet mounting parts that are close in both the direction along the row and the direction perpendicular to the rowEach in each columnBetween the pellet mounting parts corresponding toThemIn order the set of pellet mounting parts that are displaced in the direction along the roweachRepeating the work of enclosing and pressing in the windowI made it. ThereforeThe pressing portion for pressing the pressed portion of the pellet mounting portion surrounded by the window portion is one-to-one with respect to all the pellet mounting portions that are close in both the direction along the row of the frame members and the direction orthogonal to the row. There is no need to provide it. For this reason, since the dimension of each holding | maintenance part can be taken large and the desired elasticity with respect to the to-be-pressed part of a pellet mounting part can be ensured in each holding | suppressing part, the to-be-pressed part of the pellet mounting part of the high-density frame member which adjoins mutually Can be pressed down securely.
[0015]
  According to the invention of claim 3,(c)There is an effect of.
  (c)Since the support block has a support convex portion that supports the pellet mounting portion at a position corresponding to the window portion, all the pellet mounting portions that are close to each other in both the direction along the row of the frame members and the direction orthogonal to the row. It is no longer necessary to provide a large number of support projections corresponding to the above, and the processing of the support surface of the support block that supports the frame member becomes easy.
[0016]
  According to the invention of claim 4,(d)There is an effect of.
  (d)In configuring the frame pressing member, the window portion of the frame pressing member was provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion for each row separating at least one row of the frame member. AndThe frame holding memberRelative movement of frame holding member and frame memberBy the frame memberAt least one row is separated from all the pellet mounting portions adjacent in both the direction along the row and the direction perpendicular to the row.eachThe group of pellet mounting parts for each roweachRepeating the work of enclosing and pressing in the windowI made it. ThereforeThe pressing portion for pressing the pressed portion of the pellet mounting portion surrounded by the window portion is one-to-one with respect to all the pellet mounting portions that are close in both the direction along the row of the frame members and the direction orthogonal to the row. There is no need to provide it. For this reason, since the dimension of each holding | maintenance part can be taken large and the desired elasticity with respect to the to-be-pressed part of a pellet mounting part can be ensured in each holding | suppressing part, the to-be-pressed part of the pellet mounting part of the high-density frame member which adjoins mutually Can be pressed down securely.
[0017]
  According to the invention of claim 5,(e)There is an effect of.
  (e)Depending on the mobile device(d)The frame pressing member and the frame member can be moved relative to each other.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
  FIG. 1 shows the first embodiment.WireFIG. 2 is a plan view showing the frame pressing device, FIG. 3 is a plan view showing the frame pressing member in FIG. 2, and FIG. 4 is a schematic diagram showing the support block in FIG. 5 is a plan view showing the frame pressing device of the second embodiment, FIG. 6 is a plan view showing the frame pressing member in FIG. 5, and FIG. 7 is a schematic diagram showing a support block corresponding to FIG. 4 used in the second embodiment. FIG. 8 is a plan view showing the frame pressing device of the third embodiment, FIG. 9 is a plan view showing the frame pressing device of the fourth embodiment, and FIG. 10 is a schematic diagram showing a conventional support block.
[0021]
First Embodiment (FIGS. 1 to 4)
As shown in FIG. 1, the wire bonding apparatus 10 determines bonding points on the electrodes of the semiconductor pellet 2 mounted on the pellet mounting portion 1A (island) of the frame member 1 and bonding points on the leads 1B of the frame member 1. The wire is electrically connected by a wire.
[0022]
The wire bonding apparatus 10 has a pair of guide rails 11 that convey and guide the frame member 1 using a frame feeding device (not shown), and the direction in which the frame member 1 is fed by the guide rails 11 beside the guide rails 11. An XY table 12 that is movable in a direction orthogonal to the XY table 12 is disposed, and a bonding head 13 is mounted on the XY table 12.
[0023]
The bonding head 13 is configured such that a head arm 13A supports a bonding arm 15 having a capillary 14 through which a wire is inserted and a torch electrode (not shown) mounted on the tip. The bonding arm 15 is swung in the vertical direction by a bonding arm rocking motor 15A. Further, the tip of the torch electrode is positioned immediately below the capillary 14 by a torch drive device (not shown) during discharge. A support block 17 constituting a heater block is installed between the pair of guide rails 11 at a bonding work position immediately below the capillary 14.
[0024]
A camera 20 is fixedly supported on the head frame 13A of the bonding head 13. The camera 20 is disposed above the capillary 14, images the semiconductor pellet 2 on the frame member 1, and is used for detecting the positions of these electrodes (and detecting the positions of the leads of the frame member 1 as necessary). An image captured by the camera 20 is output to the image processing device 21.
[0025]
The image processing device 21 performs image processing on an image captured by the camera 20. The processed image is stored in the storage unit of the control device 23. The control device 23 detects the displacement of the semiconductor pellet 2 by a known pattern matching method or the like based on the detected image information data of the camera 20 stored in the storage unit and the reference image data set in the storage unit in advance ( If necessary, the positional deviation of the lead of the frame member 1 is also detected).
[0026]
The control device 23 controls the X table drive motor 12A, the Y table drive motor 12B of the XY table 12, the swing motor 15A of the bonding arm 15 and the image processing device 21 during the bonding operation. That is, the control device 23 controls the XY table 12 to move the camera 20 and also controls the image processing device 21 to detect the displacement of the semiconductor pellet 2 (if necessary, the displacement of the lead of the frame member 1). Further, the XY table 12 and the bonding arm 15 are controlled, and the bonding point of the frame member 1 and the semiconductor pellet 2, that is, the lead of the frame member 1 and the electrode of the semiconductor pellet 2 are wire-bonded by the capillary 14.
[0027]
However, the wire bonding apparatus 10 includes a frame pressing device 30 having a frame pressing member 31 that presses the frame member 1 provided with the pellet mounting portions 1A in all two rows positioned at the bonding work position against the support block 17. Prepare. The frame pressing device 30 moves the frame pressing member 31 up and down by the lifting device 32 to a standby position for separating the frame pressing member 31 above the frame member 1 and a pressing position for pressing the frame member 1 against the support block 17. Switching is set.
[0028]
As shown in FIGS. 1 to 3, the frame pressing member 31 corresponds to the pellet mounting portion 1A for each row of the frame members 1 (this row is a row along the feeding direction of the frame member 1 and all two rows). The two window portions 31A and 31B are provided so as to surround the mounting portion 1A and are arranged so as to correspond to adjacent rows and are shifted in the direction along the row. In a state where the frame pressing member 31 presses the frame member 1, each of the window portions 31A and 31B surrounds four pellet mounting portions 1A. The frame pressing member 31 protrudes into the window portion 31A (31B) and has a cantilever arm that elastically contacts the pressed portion of each pellet mounting portion 1A surrounded by the window portion 31A (31B). Shaped pressing part 33 (pressing part 33A for pellet mounting part 1A and pressing part 33B for lead 1B). The frame pressing device 30 then moves the pellets of the frame member 1 by relative movement of the frame pressing member 31 and the frame member 1 in the direction along the row of the frame members 1 (direction along the frame support surface of the support block 17). The window portions 31A and 31B are arranged so that all the mounting portions 1A are surrounded by the window portions 31A and 31B corresponding to the window portions 31A and 31B. The relative movement between the frame pressing member 31 and the frame member 1 is performed by moving the frame member 1 with a frame feeding device. However, the frame pressing member 31 may be moved by a moving device.
[0029]
At this time, the frame member 1 of the present embodiment has the pellet mounting portion 1A and the lead 1B projecting as shown in FIG. 4B, and the support block 17 has the window portions 31A and 31B of the frame pressing member 31. Is provided with a supporting convex portion 17A for supporting the pellet mounting portion 1A and the lead 1B (FIG. 4). In the case of the conventional support block 17 for the pellet mounting portion 1A and the lead 1B of the two examples (eight in each row) of the frame member 1, it is necessary to provide 16 support convex portions 17A as shown in FIG. On the other hand, in the support block 17 of the present embodiment, eight support convex portions 17A as shown in FIG.
[0030]
Therefore, the wire bonding method of the wire bonding apparatus 10 using the frame pressing device 30 is performed as follows.
[0031]
(1) The frame member 1 is aligned with the support block 17 by the frame feeding device.
[0032]
(2) The pellet mounting portions 1A of each row of the frame member 1 of (1) described above are positioned corresponding to the window portions 31A and 31B of the frame pressing member 31, and the frame member 1 is pressed by the pressing portion 33 pressed by the lifting device 32. Is pressed against the support block 17.
[0033]
  (3) Bondinghead13, wire bonding is performed on the semiconductor pellet 2 of the pellet mounting portion 1 </ b> A through the window portions 31 </ b> A and 31 </ b> B of the frame pressing member 31. The wire bonding is performed on all the semiconductor pellets 2 positioned corresponding to the current window portions 31A and 31B by moving the XY table 12 on which the bonding head 13 is mounted.
[0034]
(4) After the wire bonding step (3) described above, the frame pressing member 31 is raised, and another pellet mounting portion 1A along each row of the frame member 1 is moved to the window portion of the frame pressing member 31 by the frame feeding device. The frame member 1 is pressed against the support block 17 again by the pressing portion 33 which is positioned at 31A and 31B and pressed down by the lifting device 32, and the bonding tool 13 performs wire bonding to the semiconductor pellet 2 of the new pellet mounting portion 1A. .
[0035]
According to this embodiment, there are the following operations.
(1) When the frame pressing member 31 is configured, the window portions 31A and 31B of the frame pressing member 31 are provided so as to surround the pellet mounting portion 1A corresponding to the pellet mounting portion 1A for each row of the frame member 1, Those corresponding to adjacent columns were shifted in the direction along the columns. Then, due to the relative movement of the frame pressing member 31 and the frame member 1, all of the pellet mounting portions 1A of the frame member 1 are surrounded by the window portions 31A and 31B corresponding to the window portions 31A and 31B of the frame pressing member 31. The window portions 31A and 31B are arranged as shown. Accordingly, the frame pressing member 31 is arranged in a row between the pellet mounting portions 1A corresponding to the adjacent rows among all the pellet mounting portions 1A adjacent in both the direction along the row of the frame members 1 and the direction orthogonal to the row. The operation is to repeat the work of sequentially enclosing and pressing the set of pellet mounting portions 1A that are shifted in the direction along the window portions 31A and 31B, and pressing the pressed portion of the pellet mounting portion 1A surrounded by the window portions 31A and 31B. It is not necessary to provide the pressing portions 33 to be attached in a one-to-one manner with respect to all the pellet mounting portions 1A that are close in both the direction along the row of the frame members 1 and the direction orthogonal to the row. For this reason, since the dimension of each holding | suppressing part 33 can be taken large and the desired elasticity with respect to the to-be-pressed part of the pellet mounting part 1A can be ensured in each holding | suppressing part 33, the pellet mounting part of the high-density frame member 1 which adjoins mutually. The pressed portion of 1A can be reliably pressed down.
[0036]
(2) Since the support block 17 has support convex portions that support the pellet mounting portion 1A at positions corresponding to the window portions 31A and 31B, the direction along the row of the frame members 1 and the direction perpendicular to the row It is not necessary to provide a large number of support convex portions 17A corresponding to all the pellet mounting portions 1A that are close to each other, and the processing of the support surface of the support block that supports the frame member 1 becomes easy.
[0037]
(3) Deformation such as warping of the pellet mounting portion 1A of the high-density frame member 1 can be corrected and reliably pressed against the support block 17, and bonding accuracy can be improved.
[0038]
Second Embodiment (FIGS. 5 to 7)
The frame pressing device 40 of the second embodiment is different from the frame pressing device 30 of the first embodiment in that the frame pressing member 41 is provided in the pellet mounting portion 1A for every four rows as shown in FIGS. In the state which has four corresponding window parts 41A-41D, and the pressing part 42 (pressing part 42A with respect to the pellet mounting part 1A, pressing part 42B with respect to the lead 1B) of the frame pressing member 41 pressed the frame member 1, There exists in having comprised so that the window parts 41A-41D may each surround the two pellet mounting parts 1A.
[0039]
Further, also in the wire bonding apparatus 10 using the frame pressing device 40, the support block 17 supports the pellet mounting portion 1A and the lead 1B at positions corresponding to the windows 41A to 41D of the frame pressing member 41. (FIG. 7). The conventional support block 17 needs to provide 32 support projections 17A as shown in FIG. 10 (B) for the pellet mounting portions 1A and leads 1B of the four rows (8 in each row) of the frame member 1. On the other hand, in the support block 17 of this embodiment, eight support convex parts 17A as shown in FIG.
[0040]
(Third Embodiment) (FIG. 8)
The difference between the frame pressing device 50 of the third embodiment and the frame pressing device 30 of the first embodiment is that, as shown in FIG. 8, a row is defined in a direction along the direction orthogonal to the feed direction of the frame member 1 to The member 51 is provided so as to surround the pellet mounting portion 1A corresponding to the pellet mounting portion 1A for each row (all three rows) separating at least one row (two rows in this embodiment) of the frame member 1. Three window portions 51A to 51C and a cantilever arm shape that protrudes into the window portions 51A to 51C and elastically contacts the pressed portion of the pellet mounting portion 1A surrounded by the window portions 51A to 51C. It has a holding part 52 (a holding part 52A for the pellet mounting part 1A and a holding part 52B for the lead 1B). The frame pressing device 50 includes a moving device that can move the frame pressing member 51 in a direction perpendicular to the row of the pellet mounting portions 1A. The moving device, the frame pressing member 51 by the frame feeding device, and the frame By relative movement of the member 1, the window portions 51A to 51C are arranged so that all the pellet mounting portions 1A of the frame member 1 are surrounded by the window portions 51A to 51C corresponding to the window portions 51A to 51C.
[0041]
Therefore, the wire bonding method of the wire bonding apparatus 10 using the pellet pressing apparatus 50 is performed as follows.
[0042]
(1) The frame member 1 is aligned with the support block 17 by the frame feeding device.
[0043]
(2) The window portions 51 </ b> A to 51 </ b> C of the frame pressing member 51 are positioned at positions corresponding to the pellet mounting portions 1 </ b> A in each row of the frame member 1, and the frame member 1 is pressed against the support block 17 by the pressing portion 52.
[0044]
(3) Wire bonding is performed on the semiconductor pellet 2 mounted on the pellet mounting portion 1A by the bonding tool 13 through the window portions 51A to 51C of the frame pressing member 51.
[0045]
(4) After the wire bonding step (3) described above, the frame pressing member 51 is lifted, and the windows 51A to 51C of the frame pressing member 51 are adjacent to each row of the frame member 1 by using the moving device. The frame member 1 is positioned again at the position corresponding to the pellet mounting portion 1A in the row, the pressing member 52 presses the frame member 1 against the support block 17 again, and the bonding tool 13 bonds the new pellet mounting portion 1A to the semiconductor pellet 2. Do.
[0046]
Here, in FIG. 8, since the window 51A and the window 51B, and the window 51B and the window 51C are arranged with two rows of pellet mounting parts 1A, respectively, the step (4) described above is performed twice. Each time the frame holding member 15 is moved, the frame holding member 15 is moved to the original position by moving the two rows of the pellet mounting portion 1A in the opposite direction to the feeding in the step (4), and the frame member 1 is loaded with the pellet by the frame feeding device. Assume that 9 columns of part 1A are sent.
[0047]
According to this embodiment, there are the following operations.
(1) When configuring the frame pressing member 51, the window portions 51A to 51C of the frame pressing member 51 correspond to the pellet mounting portions 1A for each row separating at least one row of the frame member 1. It was provided so as to surround 1A. Then, due to the relative movement of the frame pressing member 51 and the frame member 1, all of the pellet mounting portions 1A of the frame member 1 are surrounded by the window portions 51A to 51C corresponding to the window portions 51A to 51C of the frame pressing member 51. As shown in FIG. Accordingly, the frame pressing member 51 includes the pellet mounting portions 1A for each row separated by at least one row among all the pellet mounting portions 1A that are close in both the direction along the row of the frame members 1 and the direction orthogonal to the row. This is a process of repeatedly enclosing and pressing the set with the window portions 51 </ b> A to 51 </ b> C in order, and holding the pressing portions 52 for pressing the pressed portions of the pellet mounting portion 1 </ b> A surrounded by the window portions 51 </ b> A to 51 </ b> C in the row of the frame members 1. It is not necessary to provide one-to-one with respect to all the pellet mounting portions 1A that are close to each other in both the direction along the line and the direction orthogonal to the row. For this reason, since the dimension of each holding | suppressing part 52 can be taken large and the desired elasticity with respect to the to-be-pressed part of 1 A of pellet mounting parts can be ensured in each holding | suppressing part 52, the pellet mounting part of the high-density frame member 1 which adjoins mutually. The pressed portion of 1A can be reliably pressed down.
[0048]
(2) The frame pressing member 51 and the frame member 1 of (1) can be relatively moved by the moving device.
[0049]
(3) Deformation such as warping of the pellet mounting portion 1A of the high-density frame member 1 can be corrected and reliably pressed against the support block, and bonding accuracy can be improved.
[0050]
(Fourth Embodiment) (FIG. 9)
The difference between the frame pressing device 60 of the fourth embodiment and the frame pressing device 30 of the first embodiment is that, as shown in FIG. 9, a row is defined in a direction along the direction perpendicular to the feeding direction of the frame member 1. A member 61 is provided so as to surround the pellet mounting portion 1A corresponding to the only pellet mounting portion 1A in the only row of the frame member 1, and protrudes into the window portion 61A. The holding portion of the pellet mounting portion 1A surrounded by the portion 61A has a cantilevered holding portion 62 (a pressing portion 62A for the pellet mounting portion 1A and a pressing portion 62B for the lead 1B) that elastically contacts the pressed portion. The frame pressing device 60 has a moving device that moves the frame pressing member 61 in a direction along the row of the pellet mounting portions 1A. The relative movement of the frame pressing member 61 and the frame member 1 by the moving device and the frame feeding device. Thus, the window portion 61A is arranged so that the whole pellet mounting portion 1A of the frame member 1 is surrounded by the window portion 61A corresponding to the window portion 61A.
[0051]
Therefore, the wire bonding method of the wire bonding apparatus 10 using the frame pressing device 60 is performed as follows.
[0052]
(1) The frame member 1 is aligned with the support block 17 by the frame feeding device.
[0053]
(2) The window portion 61A of the frame pressing member 61 is positioned at a position corresponding to one pellet mounting portion 1A in one row of the frame member 1, and the frame member 1 is pressed against the support block 17 by the pressing portion 62. .
[0054]
(3) Wire bonding is performed on the semiconductor pellet 2 mounted on the pellet mounting portion 1A by the bonding tool 13 through the window portion 61A of the frame pressing member 61.
[0055]
(4) After the wire bonding step (3) described above, the frame pressing member 61 is raised, and the position of the window 61A of the frame pressing member 61 corresponding to the adjacent pellet mounting portion 1A in the same row using the moving device. The frame member 1 is pressed against the support block 17 by the pressing portion 62, and bonding to the semiconductor pellet 2 of the new pellet mounting portion 1 </ b> A is performed by the bonding tool 13.
[0056]
When the bonding for all the pellet mounting portions 1A in one row is completed, the frame member 1 is fed by one row of the pellet mounting portion 1A by the frame feeding device, and the pellet mounting portion 1A and the window portion 61A in one adjacent row are sent. And correspond. Thereafter, bonding to the semiconductor pellet 2 of the pellet mounting portion 1A is performed by the same procedure as described above.
[0057]
According to this embodiment, there are the following operations.
(1) The frame pressing member 61 having the window portion 61A corresponding to one pellet mounting portion 1A in one row of the frame member 1 is moved by the moving device, and the pellet mounting portion 1A of the frame member 1 is pressed against the support block 17. Can be attached.
[0058]
(2) Deformation such as warping of the pellet mounting portion 1A of the high-density frame member 1 can be corrected and reliably pressed against the support block, and the bonding accuracy can be improved.
[0059]
The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. Is included in the present invention.
[0060]
【The invention's effect】
As described above, according to the present invention, the pressed portions of the pellet mounting portions of the high-density frame member that are close to each other can be reliably pressed.
[Brief description of the drawings]
FIG. 1 shows the first embodiment.WireIt is a schematic diagram which shows a bonding apparatus and a frame pressing apparatus.
FIG. 2 is a plan view showing a frame pressing device.
FIG. 3 is a plan view showing a frame pressing member in FIG. 2;
4 is a schematic diagram showing a support block in FIG. 1. FIG.
FIG. 5 is a plan view showing a frame pressing device according to a second embodiment.
6 is a plan view showing a frame pressing member in FIG. 5. FIG.
FIG. 7 is a schematic diagram showing a support block corresponding to FIG. 4 used in the second embodiment.
FIG. 8 is a plan view showing a frame pressing device according to a third embodiment.
FIG. 9 is a plan view showing a frame pressing device according to a fourth embodiment.
FIG. 10 is a schematic view showing a conventional support block.
[Explanation of symbols]
  1 Frame member
  1A Pellet mounting part
  10 Wire bonding equipment
  13 Bondinghead
  17 Support block
  17A Supporting convex part
  30, 40, 50, 60 Frame presser
  31, 41, 51, 61 Frame pressing member
  31A, 31B, 41A-41D, 51A-51C, 61A Window
  33, 42, 52, 62 Holding part

Claims (5)

ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、
フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、
フレーム押さえ部材がフレーム部材のペレット搭載部に対応して該ペレット搭載部を囲むように設けられた１つの窓部と、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、
フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部の一部ずつを順に窓部で囲んで押さえ付ける作業を繰り返すことを特徴とするフレーム押さえ装置。A support block for supporting a frame member provided with a plurality of rows of pellet mounting portions;
In the frame pressing device having a frame pressing member that presses the frame member against the support block,
The frame pressing member has elasticity in one window portion provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion of the frame member, and the pressed portion of the pellet mounting portion surrounded by the window portion. A holding part that contacts,
The frame pressing member sequentially surrounds a part of all the pellet mounting portions adjacent in both the direction along the row of the frame member and the direction orthogonal to the row by the relative movement between the frame pressing member and the frame member. A frame pressing device characterized by repeating the pressing operation. ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、
フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、
フレーム押さえ部材がフレーム部材の複数の各列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設けられ、隣接する各列のそれぞれに対応するもの同士でそれらの列に沿う方向にずれて配置された複数の窓部と、
窓部内に向かって突出し、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、
フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、隣接する各列のそれぞれに対応するペレット搭載部同士でそれらの列に沿う方向にずれて位置するペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すことを特徴とするフレーム押さえ装置。A support block for supporting a frame member provided with a plurality of rows of pellet mounting portions;
In the frame pressing device having a frame pressing member that presses the frame member against the support block,
A frame pressing member is provided so as to surround the pellet mounting portion corresponding to the pellet mounting portion for each of a plurality of rows of the frame member, and in the direction along those rows between those corresponding to each of the adjacent rows. A plurality of windows arranged offset from each other ;
A pressing part protruding toward the inside of the window part and elastically contacting the pressed part of the pellet mounting part surrounded by the window part;
The frame pressing member is attached to each adjacent row among all the pellet mounting portions that are close to each other in both the direction along the row of the frame member and the direction perpendicular to the row by relative movement of the frame pressing member and the frame member. A frame pressing device that repeats an operation of sequentially enclosing and pressing a set of pellet mounting portions positioned in the direction along their rows between corresponding pellet mounting portions with each window portion . 前記支持ブロックが、窓部に対応する位置にペレット搭載部を支持する支持凸部を有する請求項２に記載のフレーム押さえ装置。  The frame pressing device according to claim 2, wherein the support block has a support convex portion that supports the pellet mounting portion at a position corresponding to the window portion. ペレット搭載部の列が複数設けられているフレーム部材を支持する支持ブロックと、
フレーム部材を支持ブロックに対して押さえ付けるフレーム押さえ部材を有するフレーム押さえ装置において、
フレーム押さえ部材がフレーム部材の少なくとも一の列を隔てた複数の各列毎のペレット搭載部に対応して該ペレット搭載部を囲むように設けられた複数の窓部と、窓部内に向かって突出し、窓部に囲まれたペレット搭載部の被押さえ部に弾性を有して当接する押さえ部とを有し、
フレーム押さえ部材は、フレーム押さえ部材とフレーム部材との相対移動により、フレーム部材の列に沿う方向と列に直交する方向の両方で近接する全てのペレット搭載部のうち、少なくとも一の列を隔てた各列毎のペレット搭載部の組を順に各窓部で囲んで押さえ付ける作業を繰り返すことを特徴とするフレーム押さえ装置。A support block for supporting a frame member provided with a plurality of rows of pellet mounting portions;
In the frame pressing device having a frame pressing member that presses the frame member against the support block,
A plurality of window portions provided so as to surround the pellet mounting portions corresponding to the pellet mounting portions for each of a plurality of rows , wherein the frame pressing member separates at least one row of the frame members, and projecting into the window portions , Having a pressing part that elastically contacts the pressed part of the pellet mounting part surrounded by the window part,
The frame pressing member has separated at least one row among all the pellet mounting portions adjacent in both the direction along the row of the frame member and the direction orthogonal to the row by relative movement of the frame pressing member and the frame member . A frame pressing device that repeats an operation of sequentially enclosing and pressing a set of pellet mounting portions for each row by each window portion . 前記フレーム押さえ部材とフレーム部材とを、少なくともペレット搭載部の列に直交する方向に相対移動させる移動装置を有する請求項４に記載のフレーム押さえ装置。  The frame pressing device according to claim 4, further comprising a moving device that relatively moves the frame pressing member and the frame member in a direction orthogonal to at least a row of pellet mounting portions.
JP2001128300A 2001-04-25 2001-04-25 Frame holding device and wire bonding method and device Expired - Fee Related JP4601201B2 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831861A (en) * 1994-07-20 1996-02-02 Sony Corp Wire bonder
JP2000195894A (en) * 1998-12-24 2000-07-14 Sanyo Electric Co Ltd Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831861A (en) * 1994-07-20 1996-02-02 Sony Corp Wire bonder
JP2000195894A (en) * 1998-12-24 2000-07-14 Sanyo Electric Co Ltd Manufacture of semiconductor device

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