JP2008251587A - Part-mounting device and part-mounting method - Google Patents

Part-mounting device and part-mounting method Download PDF

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JP2008251587A
JP2008251587A JP2007087418A JP2007087418A JP2008251587A JP 2008251587 A JP2008251587 A JP 2008251587A JP 2007087418 A JP2007087418 A JP 2007087418A JP 2007087418 A JP2007087418 A JP 2007087418A JP 2008251587 A JP2008251587 A JP 2008251587A
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mounting
stage
component
head
standby
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JP4780017B2 (en
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Tomoaki Nakanishi
智昭 中西
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a part-mounting device and a part-mounting method by which tact time can be shortened to a large extent in comparison with conventional devices. <P>SOLUTION: The parts are mounted by repeating the steps of a first step of picking up a lower part P1, moving it to a standby stage 49, picking up an upper part P2 and turn it upside down; a second step of picking up a lower part P1 on a standby stage 49 and transferring it to a mounting stage 48; and a third step of picking up the inverted upper part P2 and mounting it on the lower part P1 on the mounting stage 48. When the lower part P1 on the standby stage 49 is picked up and transferred to the mounting stage 48 in the second stage, a completed part P3, manufactured in the previous mounting step, is picked up and transferred to the standby stage 48 from the mounting stage 48; and, while the third step is being executed, the completed part P3 on the standby stage 49 is collected and the first step is executed. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、下側部品に上側部品を実装する部品実装装置及び部品実装方法に関するものである。   The present invention relates to a component mounting apparatus and a component mounting method for mounting an upper component on a lower component.

或る部品(下側部品)の上に他の部品(上側部品)を重ねて実装する実装形態はチップオンチップ(Chip−on−Chip:CoC)実装として知られている。このCoC実装では三次元的にIC部品が積み上げられることから、小型で高集積度のパッケージを実現することができる。   A mounting form in which another component (upper component) is mounted on a certain component (lower component) is known as chip-on-chip (CoC) mounting. In this CoC mounting, IC components are stacked three-dimensionally, so that a small and highly integrated package can be realized.

従来のチップオンチップ型の電子部品を製造する部品実装装置では、下側部品と上側部品が供給される部品供給部、部品供給部から下側部品が移送される実装ステージ、部品供給部及び実装ステージに対して相対移動自在に設けられた移送ヘッド及び実装ヘッドを備えている。そして、図5の作業工程の流れ図に示すように、下側部品が移送ヘッドによりピックアップされて実装ステージに移送された後(ステップST1)、上側部品が移送ヘッドによりピックアップされて上下反転され(ステップST2)、その上下反転された上側部品が実装ヘッドに受け渡されて(ステップST3)、実装ステージ上の下側部品に実装されるようになっている(ステップST4)。このような部品実装装置では、上記下側部品の実装ステージへの移送及び上側部品の上下反転に加えて実装ステージからの完成部品の回収(ステップST5)を全て1つのヘッド(移送ヘッド)で行うことにより、簡易な構成で生産効率の向上を図ることができるようになっている。
特開2006−93321号公報
In a conventional component mounting apparatus for manufacturing a chip-on-chip type electronic component, a component supply unit to which a lower component and an upper component are supplied, a mounting stage to which the lower component is transferred from the component supply unit, a component supply unit, and a mounting A transfer head and a mounting head are provided so as to be movable relative to the stage. 5, after the lower part is picked up by the transfer head and transferred to the mounting stage (step ST1), the upper part is picked up by the transfer head and turned upside down (step ST1). ST2) The upper part that is turned upside down is transferred to the mounting head (step ST3) and mounted on the lower part on the mounting stage (step ST4). In such a component mounting apparatus, in addition to the transfer of the lower component to the mounting stage and the upside down of the upper component, the collection of the completed component from the mounting stage (step ST5) is all performed with one head (transfer head). Thus, the production efficiency can be improved with a simple configuration.
JP 2006-93321 A

しかしながら、上記従来の部品実装装置では、実装ヘッドによる実装工程の終了後、完成部品が実装ステージから回収され(ステップST5)、次の実装工程において使用される下側部品が実装ステージに移送されてくるまでの間(ステップST1)は実装工程(ステップST4)に入ることができず、待ち時間が生じてその分タクトタイムの短縮が妨げられるという問題点があった。   However, in the conventional component mounting apparatus, after the mounting process by the mounting head is completed, the completed component is recovered from the mounting stage (step ST5), and the lower component used in the next mounting process is transferred to the mounting stage. Until it comes (step ST1), the mounting process (step ST4) cannot be entered, and there is a problem that waiting time occurs and shortening of the tact time is prevented accordingly.

そこで本発明は、従来に比べてタクトタイムを大きく短縮させることができる部品実装装置及び部品実装方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method capable of greatly reducing the tact time as compared with the prior art.

請求項1に記載の部品実装装置は、下側部品に上側部品を実装する部品実装装置であって、下側部品及び上側部品が供給される部品供給部と、前記部品供給部から下側部品が移送される待機ステージと、前記待機ステージから下側部品が移送される実装ステージと、前記部品供給部、前記待機ステージ及び前記実装ステージに対して相対移動自在に設けられた移送ヘッド、移載ヘッド及び実装ヘッドと、前記移送ヘッド、前記移載ヘッド及び前記実装ヘッドの作動制御を行うヘッド作動制御手段とを備え、前記ヘッド作動制御手段は、前記部品供給部の下側部品を前記移送ヘッドにピックアップさせて前記待機ステージに移送し、前記部品供給部の上側部品を前記移送ヘッドにピックアップさせて上下反転させ、前記移載ヘッドに前記待機ステージ上の下側部品をピックアップさせて前記実装ステージに移載し、前記移送ヘッドにより上下反転された上側部品を前記実装ヘッドにピックアップさせてその上側部品を前記実装ステージ上の下側部品に実装させる実装工程を繰り返し行い、前記移載ヘッドにより下側部品を前記実装ステージに移載させる際に、前の実装
工程において前記実装ステージ上で製造された完成部品を前記移載ヘッドにピックアップさせて前記待機ステージに移載し、前記実装ヘッドが上側部品を下側部品に実装している間に、前記移送ヘッドに前記待機ステージ上の完成部品の回収、下側部品の前記部品供給部から前記待機ステージへの移送、上側部品の前記部品供給部からのピックアップ及び上下反転を行わせる。
The component mounting apparatus according to claim 1 is a component mounting apparatus that mounts an upper component on a lower component, a component supply unit to which the lower component and the upper component are supplied, and a lower component from the component supply unit. A standby stage to which a lower part is transferred, a mounting stage to which a lower part is transferred from the standby stage, a transfer head provided to be movable relative to the component supply unit, the standby stage, and the mounting stage, transfer A head and a mounting head; and a head operation control unit that controls the operation of the transfer head, the transfer head, and the mounting head. The head operation control unit transfers a lower part of the component supply unit to the transfer head. Picked up and transferred to the standby stage, the upper part of the parts supply unit was picked up by the transfer head and turned upside down, and the transfer head was moved to the standby stage. The lower part on the stage is picked up and transferred to the mounting stage, the upper part turned upside down by the transfer head is picked up by the mounting head, and the upper part is used as the lower part on the mounting stage. When the mounting process for mounting is repeated and the lower part is transferred to the mounting stage by the transfer head, the transfer head picks up the completed part manufactured on the mounting stage in the previous mounting process. While the mounting head is mounting the upper part on the lower part, the transfer head collects the completed part on the standby stage from the component supply unit of the lower part. Transfer to the standby stage, pickup of the upper part from the part supply unit, and upside down are performed.

請求項2に記載の部品実装装置は、下側部品に上側部品を実装する部品実装装置であって、下側部品及び上側部品が供給される部品供給部と、前記部品供給部から下側部品が移送される待機ステージと、前記待機ステージから下側部品が移送される実装ステージと、上側部品をピックアップして前記実装ステージ上の下側部品に実装する実装ヘッドと、2つのピックアップ部を有し、前記実装ステージ上で製造された完成部品と前記待機ステージ上の下側部品をそれぞれピックアップして完成部品と下側部品の位置を入れ替える移載ヘッドと、前記部品供給部の下側部品をピックアップして前記待機ステージに移送し、前記部品供給部の上側部品をピックアップして上下反転させて前記実装ヘッドに受け渡し、前記待機ステージ上の完成部品を回収する移送ヘッドとを備えた。   The component mounting apparatus according to claim 2 is a component mounting apparatus for mounting an upper component on a lower component, a component supply unit to which the lower component and the upper component are supplied, and a lower component from the component supply unit. Has a pickup stage, a mounting stage to which the lower part is transferred from the standby stage, a mounting head for picking up the upper part and mounting it on the lower part on the mounting stage, and two pickup parts. A transfer head for picking up the completed part manufactured on the mounting stage and the lower part on the standby stage and switching the positions of the completed part and the lower part, and the lower part of the part supply unit. Picked up and transferred to the standby stage, picked up the upper part of the part supply unit, turned upside down and delivered to the mounting head, and finished parts on the standby stage And a transfer head recovering.

請求項3に記載の部品実装方法は、下側部品に上側部品を実装する部品実装方法であって、部品供給部の下側部品をピックアップして待機ステージに移送し、前記部品供給部の上側部品をピックアップして上下反転させる第1工程と、前記待機ステージ上の下側部品をピックアップして実装ステージに移載する第2工程と、第1工程において上下反転された上側部品をピックアップしてその上側部品を前記実装ステージ上の下側部品に実装する第3工程とを含む実装工程を繰り返し、第2工程では下側部品を前記実装ステージに移載する際に、前の実装工程において前記実装ステージ上で製造された完成部品をピックアップして前記待機ステージに移載し、第3工程を実行している間に前記待機ステージ上の完成部品の回収及び第1工程を実行する。   The component mounting method according to claim 3 is a component mounting method of mounting an upper component on a lower component, picking up the lower component of the component supply unit and transferring it to a standby stage, A first step of picking up the components and turning them upside down; a second step of picking up the lower components on the standby stage and transferring them to the mounting stage; and picking up the upper components turned upside down in the first step A mounting step including a third step of mounting the upper part on the lower part on the mounting stage, and when transferring the lower part to the mounting stage in the second step, in the previous mounting step The completed part manufactured on the mounting stage is picked up and transferred to the standby stage, and the collection of the completed part on the standby stage and the first process are performed while the third process is executed. To.

本発明では、実装工程の終了後、実装ステージ上の完成部品は一旦待機ステージに移載されて次の実装工程が実行されている間に回収されるようになっており、次の実装工程において使用される下側部品は現在の実装工程中に待機ステージに移送されて待機し、実装工程が終了した後、実装ステージに移載される。一方、上側部品も実装工程中に上下反転されて待機しているので、実装工程が終了するとただちに上側部品をピックアップして次の実装工程に入ることができる。このため従来のように実装工程の終了後、完成部品が回収され、次の実装工程において使用される下側部品が実装ステージに移送されてくるのを待つことがなく、従来に比べてタクトタイムを大きく短縮させることができる。   In the present invention, after the mounting process is completed, the completed parts on the mounting stage are once transferred to the standby stage and collected while the next mounting process is being executed. The lower part to be used is transferred to the standby stage during the current mounting process and waits. After the mounting process is completed, the lower part is transferred to the mounting stage. On the other hand, since the upper part is also turned upside down during the mounting process and is on standby, immediately after the mounting process is completed, the upper part can be picked up and the next mounting process can be started. Therefore, after completion of the mounting process as in the prior art, the completed part is collected, and the tact time is reduced as compared with the conventional one without waiting for the lower part used in the next mounting process to be transferred to the mounting stage. Can be greatly shortened.

以下、図面を参照して本発明の実施の形態について説明する。図1は本発明の一実施の形態における部品実装装置の斜視図、図2は本発明の一実施の形態における部品実装装置の制御系統図、図3は本発明の一実施の形態における部品実装装置の作業工程説明図、図4は本発明の一実施の形態における部品実装装置の作業工程の流れ図である。   Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of a component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a control system diagram of the component mounting apparatus according to one embodiment of the present invention, and FIG. 3 is a component mounting according to one embodiment of the present invention. FIG. 4 is a flowchart of the work process of the component mounting apparatus according to the embodiment of the present invention.

図1において、部品実装装置1は水平な上面を有する基台2を備え、基台2の上方には水平面内の一の方向(Y軸方向とする)に延びた実装ヘッド移動ガイド3及び移送ヘッド移動ガイド4がY軸方向に並んで設けられている。基台2の実装ヘッド移動ガイド3の前方領域には実装待機テーブル5が設けられており、基台2の移送ヘッド移動ガイド4の前方領域には部品供給回収テーブル6が設けられている。また、基台2の実装待機テーブル5の前方領域には移載ヘッド支持柱7が立設されている。   In FIG. 1, a component mounting apparatus 1 includes a base 2 having a horizontal upper surface, and a mounting head moving guide 3 extending in one direction in the horizontal plane (referred to as the Y-axis direction) and transfer above the base 2 Head movement guides 4 are provided side by side in the Y-axis direction. A mounting standby table 5 is provided in the front area of the mounting head moving guide 3 of the base 2, and a component supply / recovery table 6 is provided in the front area of the transfer head moving guide 4 of the base 2. Further, a transfer head support column 7 is erected in the front area of the mounting standby table 5 of the base 2.

実装ヘッド移動ガイド3には実装ヘッド支持部8が設けられており、実装ヘッド支持部
8は実装ヘッド移動ガイド3に沿ってY軸方向に移動自在となっている。実装ヘッド支持部8の下部には実装ヘッド9が実装ヘッド支持部8に対して昇降自在に設けられており、実装ヘッド9の下部には実装用ノズル10が下方に延びて設けられている。
The mounting head movement guide 3 is provided with a mounting head support portion 8, and the mounting head support portion 8 is movable in the Y-axis direction along the mounting head movement guide 3. A mounting head 9 is provided below the mounting head support 8 so as to be movable up and down relative to the mounting head support 8. A mounting nozzle 10 is provided below the mounting head 9 so as to extend downward.

移送ヘッド移動ガイド4には移送ヘッド移動ガイド4と直交する水平面内の方向(X軸方向とする)に延びた移送ヘッド支持部11の一端部が支持されており、移送ヘッド支持部11は移送ヘッド移動ガイド4に沿ってY軸方向に移動自在となっている。移送ヘッド支持部11の他端部には移送ヘッド12が内蔵されており、移送ヘッド12の下部には移送用ノズル13が下方に延びて設けられている。移送ヘッド支持部11は移送ヘッド移動ガイド4に支持された部分を支点にしてX軸回りに回転自在であり、移送ヘッド12の向き(移送用ノズル13の向き)を上下に切り換えることができるようになっている。   The transfer head moving guide 4 supports one end of a transfer head support portion 11 extending in a direction (X-axis direction) in a horizontal plane orthogonal to the transfer head moving guide 4. It is movable along the head movement guide 4 in the Y-axis direction. A transfer head 12 is built in the other end of the transfer head support 11, and a transfer nozzle 13 is provided below the transfer head 12 so as to extend downward. The transfer head support portion 11 is rotatable about the X axis with a portion supported by the transfer head moving guide 4 as a fulcrum, so that the direction of the transfer head 12 (the direction of the transfer nozzle 13) can be switched up and down. It has become.

実装待機テーブル5は基台2上に設けられた実装待機テーブル移動機構14によって水平面内を移動自在になっている。実装待機テーブル移動機構14は、基台2に対して固定された実装待機Y軸テーブル14a、実装待機Y軸テーブル14a上に設けられた実装待機X軸テーブル14b、実装待機Y軸テーブル14a上で実装待機X軸テーブル14bをY軸方向に移動させる実装待機Y駆動機構41、実装待機X軸テーブル14b上で実装待機テーブル5をX軸方向に移動させる実装待機X駆動機構42から成る。   The mounting standby table 5 is movable in a horizontal plane by a mounting standby table moving mechanism 14 provided on the base 2. The mounting standby table moving mechanism 14 is mounted on the mounting standby Y-axis table 14a fixed to the base 2, the mounting standby X-axis table 14b provided on the mounting standby Y-axis table 14a, and the mounting standby Y-axis table 14a. The mounting standby X drive mechanism 41 moves the mounting standby X-axis table 14b in the Y-axis direction, and the mounting standby X drive mechanism 42 moves the mounting standby table 5 in the X-axis direction on the mounting standby X-axis table 14b.

部品供給回収テーブル6は基台2上に設けられた部品供給回収テーブル移動機構15によって水平面内を移動自在になっている。部品供給回収テーブル移動機構15は、基台2に対して固定された供給回収Y軸テーブル15a、供給回収Y軸テーブル15a上に設けられた供給回収X軸テーブル15b、供給回収Y軸テーブル15a上で供給回収X軸テーブル15bをY軸方向に移動させる供給回収Y駆動機構43、供給回収X軸テーブル15b上で部品供給回収テーブル6をX軸方向に移動させる供給回収X駆動機構44から成る。   The component supply / recovery table 6 is movable in a horizontal plane by a component supply / recovery table moving mechanism 15 provided on the base 2. The parts supply / recovery table moving mechanism 15 includes a supply / recovery Y-axis table 15a fixed to the base 2, a supply / recovery X-axis table 15b provided on the supply / recovery Y-axis table 15a, and a supply / recovery Y-axis table 15a. The supply / recovery Y drive mechanism 43 moves the supply / recovery X-axis table 15b in the Y-axis direction, and the supply / recovery X-drive mechanism 44 moves the component supply / recovery table 6 in the X-axis direction on the supply / recovery X-axis table 15b.

移載ヘッド支持柱7の上端部には移載ヘッド支持部材16が移載ヘッド支持柱7に対して昇降自在に設けられており、移載ヘッド支持部材16の下端部には移載ヘッド17が設けられている。移載ヘッド17の下部には下方に延びたアーム旋回軸18が設けられており、アーム旋回軸18の下端には水平に延びた旋回アーム19の中央部が固定されている。旋回アーム19の両端部それぞれには移載用ノズル20が下方に延びて設けられている。   A transfer head support member 16 is provided at the upper end of the transfer head support column 7 so as to be movable up and down with respect to the transfer head support column 7. A transfer head 17 is provided at the lower end of the transfer head support member 16. Is provided. An arm turning shaft 18 extending downward is provided at the lower portion of the transfer head 17, and a central portion of a turning arm 19 extending horizontally is fixed to the lower end of the arm turning shaft 18. A transfer nozzle 20 is provided at each end of the swivel arm 19 so as to extend downward.

図2において、部品実装装置1が備える制御装置30は、実装ヘッド支持部8を実装ヘッド移動ガイド3に沿って移動させる実装ヘッド移動機構31、実装ヘッド9を実装ヘッド支持部8に対して昇降させる実装ヘッド昇降機構32、実装用ノズル10に吸着動作を行わせる実装ヘッド吸着機構33、移送ヘッド支持部11を移送ヘッド移動ガイド4に沿って移動させる移送ヘッド移動機構34、移送ヘッド12を移送ヘッド支持部11に対して昇降させる移送ヘッド昇降機構35、移送ヘッド支持部11をX軸まわりに回転(移送ヘッド12の向きを上下反転)させる移送ヘッド反転機構36、移送用ノズル13に吸着動作を行わせる移送ヘッド吸着機構37、移載ヘッド支持部材16を移載ヘッド支持柱7に対して昇降させる移載ヘッド昇降機構38、アーム旋回軸18を上下軸まわりに旋回させるアーム旋回機構39、移載用ノズル20に吸着動作を行わせる移載ヘッド吸着機構40、前述の実装待機Y駆動機構41、実装待機X駆動機構42、供給回収Y駆動機構43及び供給回収X駆動機構44の作動制御を行う。   In FIG. 2, the control device 30 included in the component mounting apparatus 1 moves the mounting head support unit 8 along the mounting head moving guide 3 and moves the mounting head 9 up and down with respect to the mounting head support unit 8. Mounting head lifting mechanism 32 to be mounted, mounting head suction mechanism 33 to cause the mounting nozzle 10 to perform a suction operation, transfer head moving mechanism 34 to move the transfer head support portion 11 along the transfer head moving guide 4, and transfer head 12 to be transferred Adsorption operation to the transfer head raising / lowering mechanism 35 that moves up and down relative to the head support 11, the transfer head reversing mechanism 36 that rotates the transfer head support 11 around the X axis (the direction of the transfer head 12 is turned upside down), and the transfer nozzle 13. A transfer head suction mechanism 37 for moving the transfer head and a transfer head for moving the transfer head support member 16 up and down relative to the transfer head support column 7 The lowering mechanism 38, the arm turning mechanism 39 for turning the arm turning shaft 18 about the vertical axis, the transfer head suction mechanism 40 for causing the transfer nozzle 20 to perform the suction operation, the mounting standby Y drive mechanism 41, and the mounting standby X described above. Operation control of the drive mechanism 42, the supply / recovery Y drive mechanism 43, and the supply / recovery X drive mechanism 44 is performed.

また、制御装置30には、実装ヘッド9、移送ヘッド12、移載ヘッド17の各ノズル部(実装用ノズル10、移送用ノズル13、両移載用ノズル20)の位置及び実装待機テーブル5と部品供給回収テーブル6それぞれの位置を検出するための複数のセンサ類(こ
れらをまとめてセンサ類45と称する)からの検出信号が入力される。制御装置30は、このセンサ類45からの検出信号に基づいて上記機構類31〜44の作動制御を行う。
Further, the control device 30 includes the positions of the nozzle portions (mounting nozzle 10, transfer nozzle 13, both transfer nozzles 20) of the mounting head 9, the transfer head 12, and the transfer head 17 and the mounting standby table 5. Detection signals from a plurality of sensors (collectively referred to as sensors 45) for detecting the positions of the component supply / recovery tables 6 are input. The control device 30 controls the operation of the mechanisms 31 to 44 based on the detection signals from the sensors 45.

図1において、実装待機テーブル5上には実装ステージ48と待機ステージ49が設けられており、部品供給回収テーブル6上にはパレット状の下側部品供給部50、上側部品供給部51及び完成部品回収部52が設けられている。下側部品供給部50には図示しない下側部品供給手段によって下側部品P1が供給され、上側部品供給部51には図示しない上側部品供給手段によって上側部品P2が供給される。また、完成部品回収部52には下側部品P1に上側部品P2が実装されて製造された完成部品P3が移送回収される。なお、下側部品P1は上側部品P2との接合面を上に向けた状態で下側部品供給部50に供給され、上側部品P2は下側部品P1との接合面を上に向けた状態で上側部品供給部51に供給されるようになっている。   In FIG. 1, a mounting stage 48 and a standby stage 49 are provided on the mounting standby table 5, and a pallet-shaped lower component supply unit 50, an upper component supply unit 51, and a finished component are provided on the component supply / recovery table 6. A collection unit 52 is provided. The lower part supply unit 50 is supplied with a lower part P1 by a lower part supply unit (not shown), and the upper part supply unit 51 is supplied with an upper part P2 by an upper part supply unit (not shown). Further, the completed part collection unit 52 transports and collects a completed part P3 manufactured by mounting the upper part P2 on the lower part P1. The lower part P1 is supplied to the lower part supply unit 50 with the joint surface with the upper part P2 facing upward, and the upper part P2 has the joint surface with the lower part P1 facing upward. It is supplied to the upper part supply unit 51.

次に、図3及び図4を参照して部品実装装置1が下側部品P1の上に上側部品P2を実装する部品実装工程について説明する。制御装置30とデータのやり取りが可能なメモリ部46(図2)には部品実装プログラム47が記憶されており、制御装置30はこの部品実装プログラム47に従って上記機構類31〜44を駆動し、部品実装工程を実行する。   Next, a component mounting process in which the component mounting apparatus 1 mounts the upper component P2 on the lower component P1 will be described with reference to FIGS. A component mounting program 47 is stored in the memory unit 46 (FIG. 2) capable of exchanging data with the control device 30, and the control device 30 drives the mechanisms 31 to 44 according to the component mounting program 47 to Execute the mounting process.

制御装置30は、下側部品供給部50の下側部品P1を移送ヘッド12にピックアップ(吸着)させて待機ステージ49に移送した後(図3(a)、図4のステップS1)、上側部品供給部51の上側部品P2を移送ヘッド12にピックアップさせ、その上側部品P2を上下反転させる(図3(b)、図4のステップS2)。そして、実装待機テーブル5を移載ヘッド17に近づける方向に移動させ、上側部品P2の下側部品P1への実装が終了した実装ヘッド9を移送ヘッド12によって上下反転された上側部品P2の上方へ移動させる(図3(c))。   The control device 30 picks up (sucks) the lower part P1 of the lower part supply unit 50 to the transfer head 12 and transfers it to the standby stage 49 (FIG. 3A, step S1 in FIG. 4), and then the upper part. The upper part P2 of the supply unit 51 is picked up by the transfer head 12, and the upper part P2 is turned upside down (FIG. 3B, step S2 in FIG. 4). Then, the mounting standby table 5 is moved in a direction to approach the transfer head 17, and the mounting head 9 that has been mounted on the lower part P 1 of the upper part P 2 is moved above the upper part P 2 that is turned upside down by the transfer head 12. It is moved (FIG. 3 (c)).

実装ヘッド9を上側部品P2の上方へ移動させたら、移載ヘッド17により実装待機テーブル5上での下側部品P1と完成部品P3の位置(載置場所)を入れ替える(図4のステップS3)。そして、これとほぼ同時に、実装ヘッド9により移送ヘッド12によって上下反転された上側部品P2をピックアップ(吸着)させ、上側部品P2を移送ヘッド12から実装ヘッド9に受け渡す(図3(d)、図4のステップS4)。ここで、移載ヘッド17による実装待機テーブル5上での下側部品P1と完成部品P3の入れ替えは、移載ヘッド17が備える2つのピックアップ部、すなわち2つの移載用ノズル20に、待機ステージ49上の下側部品P1と実装ステージ48上の完成部品P3(この完成部品P3は前回の実装工程において製造されたものである)をピックアップ(吸着)させた後、旋回アーム19を180度水平旋回させて、待機ステージ49上の下側部品P1を実装ステージ48に移載するとともに、実装ステージ48上の完成部品P3を待機ステージ49に移載して行う。   When the mounting head 9 is moved above the upper part P2, the position (placement place) of the lower part P1 and the completed part P3 on the mounting standby table 5 is switched by the transfer head 17 (step S3 in FIG. 4). . At substantially the same time, the upper part P2 turned upside down by the transfer head 12 is picked up (sucked) by the mounting head 9, and the upper part P2 is transferred from the transfer head 12 to the mounting head 9 (FIG. 3 (d), Step S4 in FIG. Here, the lower part P1 and the completed part P3 on the mounting standby table 5 by the transfer head 17 are replaced with two pickup units provided in the transfer head 17, that is, two transfer nozzles 20 with a standby stage. After picking up (sucking) the lower part P1 on 49 and the completed part P3 on the mounting stage 48 (this completed part P3 was manufactured in the previous mounting process), the swivel arm 19 is horizontally moved 180 degrees. The lower part P1 on the standby stage 49 is transferred to the mounting stage 48, and the completed part P3 on the mounting stage 48 is transferred to the standby stage 49.

移載ヘッド17による実装待機テーブル5上の下側部品P1と実装ステージ48上の完成部品P3の位置の入れ替えと、実装ヘッド9による上側部品P2のピックアップが終了したら、制御装置30は移送ヘッド12を上下反転させて移送用ノズル13を下方に向けるとともに(図4のステップS5)、実装待機テーブル5を移載ヘッド17から遠ざかる方向に移動させて、実装ヘッド9を実装ステージ48の上方に移動させる(図3(e))。そして、実装ヘッド9を下降させて、実装ヘッド9がピックアップしている上側部品P2を実装ステージ48上の下側部品P1に実装させる(図4のステップS6)。制御装置30は実装ヘッド9に上側部品P2の下側部品P1への実装を行わせている間に、待機ステージ49上の完成部品P3を移送ヘッド12にピックアップさせて完成部品回収部52に移送して回収した後(図3(f)、図4のステップS7)、下側部品供給部50の下側部品P1を移送ヘッド12にピックアップさせて待機ステージ49に移送し(図3(a)
、図4のステップS1)、次いで上側部品供給部51の上側部品P2を移送ヘッド12にピックアップさせて上下反転させる(図3(b)、図4のステップS2)。
When the position of the lower part P1 on the mounting standby table 5 and the completed part P3 on the mounting stage 48 by the transfer head 17 and the pick-up of the upper part P2 by the mounting head 9 are finished, the control device 30 moves the transfer head 12. Is turned upside down and the transfer nozzle 13 is directed downward (step S5 in FIG. 4), the mounting standby table 5 is moved away from the transfer head 17, and the mounting head 9 is moved above the mounting stage 48. (FIG. 3E). Then, the mounting head 9 is lowered, and the upper part P2 picked up by the mounting head 9 is mounted on the lower part P1 on the mounting stage 48 (step S6 in FIG. 4). The control device 30 causes the transfer head 12 to pick up the completed component P3 on the standby stage 49 and transfer it to the completed component collection unit 52 while the mounting head 9 is mounting the lower component P1 on the upper component P2. Then, the lower part P1 of the lower part supply unit 50 is picked up by the transfer head 12 and transferred to the standby stage 49 (FIG. 3A).
4, and then the upper part P2 of the upper part supply unit 51 is picked up by the transfer head 12 and turned upside down (FIG. 3B, step S2 of FIG. 4).

このように、本実施の形態における部品実装装置1では、部品供給部(下側部品供給部50及び上側部品供給部51)と、待機ステージ49と、実装ステージ48と、部品供給部、待機ステージ49及び実装ステージ48に対して相対移動自在に設けられた移送ヘッド12、移載ヘッド17及び実装ヘッド9と、移送ヘッド12、移載ヘッド17及び実装ヘッド9の作動制御を行うヘッド作動制御手段60(制御装置30及び制御装置30によって作動制御がなされる前述の機構類31〜44等から成る)とを有しており、このヘッド作動制御手段60が、部品供給部の下側部品P1を移送ヘッド12にピックアップさせて待機ステージ49に移送し、部品供給部の上側部品P2を移送ヘッド12にピックアップさせて上下反転させる第1工程(図4のステップS1,S2)、移載ヘッド17に待機ステージ49上の下側部品P1をピックアップさせて実装ステージ48に移載する第2工程(図4のステップS3)、及び移送ヘッド12により上下反転された上側部品P2を実装ヘッド9にピックアップさせて上側部品P2を実装ステージ48上の下側部品P1に実装させる第3工程(図4のステップS4,S6)を含む実装工程を繰り返し行うので、下側部品P1に上側部品P2が実装されて成る完成部品(チップオンチップ型の電子部品)P3が次々と製造される。   Thus, in the component mounting apparatus 1 according to the present embodiment, the component supply unit (the lower component supply unit 50 and the upper component supply unit 51), the standby stage 49, the mounting stage 48, the component supply unit, and the standby stage. 49, the transfer head 12, the transfer head 17, and the mounting head 9 provided so as to be relatively movable with respect to the mounting stage 48, and a head operation control means for controlling the operation of the transfer head 12, the transfer head 17, and the mounting head 9. 60 (consisting of the control device 30 and the above-described mechanisms 31 to 44 whose operation is controlled by the control device 30). The head operation control means 60 has the lower component P1 of the component supply section. The first work is picked up by the transfer head 12 and transferred to the standby stage 49, and the upper part P2 of the component supply unit is picked up by the transfer head 12 and turned upside down. (Steps S1 and S2 in FIG. 4), a second step (Step S3 in FIG. 4) in which the transfer head 17 picks up the lower part P1 on the standby stage 49 and transfers it to the mounting stage 48, and the transfer head 12 The mounting process including the third process (steps S4 and S6 in FIG. 4) in which the upper part P2 turned upside down by the mounting head 9 is picked up by the mounting head 9 and the upper part P2 is mounted on the lower part P1 on the mounting stage 48 is repeated. As a result, a finished part (chip-on-chip type electronic part) P3 in which the upper part P2 is mounted on the lower part P1 is manufactured one after another.

そして、上記第2工程では移載ヘッド17により下側部品P1を実装ステージ48に移載させる際に、前の実装工程において実装ステージ48上で製造された完成部品P3を移載ヘッド17にピックアップさせて待機ステージ49に移載するようになっており(図4のステップS3)、また上記第3工程を実行している間(実装ヘッド9が上側部品P2を下側部品P1に実装している間)に移送ヘッド12に待機ステージ49上の完成部品P3の回収(図4のステップS7)、下側部品P1の部品供給部から待機ステージ49への移送(図4のステップS1)、上側部品P2の部品供給部からのピックアップ及び上下反転(図4のステップS2)を行わせるようになっている。   In the second process, when the lower part P1 is transferred to the mounting stage 48 by the transfer head 17, the completed part P3 manufactured on the mounting stage 48 in the previous mounting process is picked up by the transfer head 17. (Step S3 in FIG. 4) and while the third step is being executed (the mounting head 9 mounts the upper part P2 on the lower part P1). 4), the transfer head 12 collects the completed part P3 on the standby stage 49 (step S7 in FIG. 4), transfers the lower part P1 from the component supply unit to the standby stage 49 (step S1 in FIG. 4), and the upper side. The pickup of the component P2 from the component supply unit and the upside down (step S2 in FIG. 4) are performed.

すなわち、本実施の形態における部品実装装置1では、実装工程の終了後、実装ステージ48上の完成部品P3は一旦待機ステージ49に移載されて次の実装工程が実行されている間に回収されるようになっており、次の実装工程において使用される下側部品P1は現在の実装工程中に待機ステージ49に移送されて待機し、実装工程が終了した後、実装ステージ48に移載される。一方、上側部品P2も実装工程中に上下反転されて待機しているので、実装工程が終了するとただちに上側部品をピックアップして次の実装工程に入ることができる。このため従来のように実装工程の終了後、完成部品P3が回収され、次の実装工程において使用される下側部品P1が実装ステージ48に移送されてくるのを待つことがなく、従来に比べてタクトタイムを大きく短縮させることができる。   That is, in the component mounting apparatus 1 according to the present embodiment, after the mounting process is completed, the completed component P3 on the mounting stage 48 is once transferred to the standby stage 49 and collected while the next mounting process is being performed. The lower part P1 used in the next mounting process is transferred to the standby stage 49 during the current mounting process and waits. After the mounting process is completed, the lower part P1 is transferred to the mounting stage 48. The On the other hand, since the upper part P2 is also turned upside down during the mounting process and is on standby, immediately after the mounting process is completed, the upper part can be picked up and the next mounting process can be started. Therefore, after completion of the mounting process as in the prior art, the completed part P3 is recovered, and there is no need to wait for the lower part P1 used in the next mounting process to be transferred to the mounting stage 48. The tact time can be greatly reduced.

これまで本発明の実施の形態について説明してきたが、本発明は上述の実施の形態に示したものに限定されない。例えば、移載ヘッド17は、待機ステージ49上の下側部品P1を実装ステージ48に移載するとともに、この移載の際に、前の実装工程において製造された実装ステージ48上の完成部品P3を待機ステージ49に移載する機能を備えていればよく、その構成は必ずしも限定されないが、上述の実施の形態に示したように移載ヘッド17が2つのピックアップ部(移載用ノズル20)を有しており、実装ステージ48上の完成部品P3と待機ステージ49上の下側部品P1をそれぞれピックアップしてこれらの部品P1,P3の位置をほぼ同時に入れ替える構成となっているのであれば、簡単な構成でありながら部品P1,P3の移載を短時間に行うことができるという利点がある。   Although the embodiments of the present invention have been described so far, the present invention is not limited to those shown in the above-described embodiments. For example, the transfer head 17 transfers the lower part P1 on the standby stage 49 to the mounting stage 48, and at the time of this transfer, the completed part P3 on the mounting stage 48 manufactured in the previous mounting process. However, the configuration is not necessarily limited, but the transfer head 17 has two pickup units (transfer nozzles 20) as shown in the above-described embodiment. If the configuration is such that the completed part P3 on the mounting stage 48 and the lower part P1 on the standby stage 49 are respectively picked up and the positions of these parts P1 and P3 are replaced almost simultaneously, There is an advantage that the parts P1 and P3 can be transferred in a short time with a simple configuration.

従来に比べてタクトタイムを大きく短縮させることができる。   The tact time can be greatly shortened compared to the conventional case.

本発明の一実施の形態における部品実装装置の斜視図The perspective view of the component mounting apparatus in one embodiment of this invention 本発明の一実施の形態における部品実装装置の制御系統図Control system diagram of component mounting apparatus according to one embodiment of the present invention 本発明の一実施の形態における部品実装装置の作業工程説明図Work process explanatory drawing of the component mounting apparatus in one embodiment of this invention 本発明の一実施の形態における部品実装装置の作業工程の流れ図The flowchart of the work process of the component mounting apparatus in one embodiment of this invention 従来の部品実装装置の作業工程の流れ図Flow chart of work process of conventional component mounting equipment

符号の説明Explanation of symbols

1 部品実装装置
9 実装ヘッド
12 移送ヘッド
17 移載ヘッド
30 制御装置
48 実装ステージ
49 待機ステージ
50 下側部品供給部(部品供給部)
51 上側部品供給部(部品供給部)
60 ヘッド作動制御手段
P1 下側部品
P2 上側部品
P3 完成部品
DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 9 Mounting head 12 Transfer head 17 Transfer head 30 Control apparatus 48 Mounting stage 49 Standby stage 50 Lower part supply part (component supply part)
51 Upper part supply part (part supply part)
60 Head operation control means P1 Lower part P2 Upper part P3 Completed part

Claims (3)

下側部品に上側部品を実装する部品実装装置であって、下側部品及び上側部品が供給される部品供給部と、前記部品供給部から下側部品が移送される待機ステージと、前記待機ステージから下側部品が移送される実装ステージと、前記部品供給部、前記待機ステージ及び前記実装ステージに対して相対移動自在に設けられた移送ヘッド、移載ヘッド及び実装ヘッドと、前記移送ヘッド、前記移載ヘッド及び前記実装ヘッドの作動制御を行うヘッド作動制御手段とを備え、
前記ヘッド作動制御手段は、前記部品供給部の下側部品を前記移送ヘッドにピックアップさせて前記待機ステージに移送し、前記部品供給部の上側部品を前記移送ヘッドにピックアップさせて上下反転させ、前記移載ヘッドに前記待機ステージ上の下側部品をピックアップさせて前記実装ステージに移載し、前記移送ヘッドにより上下反転された上側部品を前記実装ヘッドにピックアップさせてその上側部品を前記実装ステージ上の下側部品に実装させる実装工程を繰り返し行い、前記移載ヘッドにより下側部品を前記実装ステージに移載させる際に、前の実装工程において前記実装ステージ上で製造された完成部品を前記移載ヘッドにピックアップさせて前記待機ステージに移載し、前記実装ヘッドが上側部品を下側部品に実装している間に、前記移送ヘッドに前記待機ステージ上の完成部品の回収、下側部品の前記部品供給部から前記待機ステージへの移送、上側部品の前記部品供給部からのピックアップ及び上下反転を行わせることを特徴とする部品実装装置。
A component mounting apparatus for mounting an upper component on a lower component, a component supply unit to which the lower component and the upper component are supplied, a standby stage to which the lower component is transferred from the component supply unit, and the standby stage A mounting stage to which a lower part is transferred from, a transfer head provided so as to be relatively movable with respect to the component supply unit, the standby stage and the mounting stage, a transfer head and a mounting head, the transfer head, A transfer head and head operation control means for controlling the operation of the mounting head,
The head operation control means causes the lower part of the part supply unit to be picked up by the transfer head and transferred to the standby stage, causes the upper part of the part supply part to be picked up by the transfer head and inverted upside down, The transfer head picks up the lower part on the standby stage and transfers it to the mounting stage. The upper part turned upside down by the transfer head is picked up by the mounting head, and the upper part is picked up on the mounting stage. When the mounting process for mounting on the lower part is repeatedly performed and the lower part is transferred to the mounting stage by the transfer head, the completed part manufactured on the mounting stage in the previous mounting process is transferred to the mounting stage. While the mounting head picks up the mounting head and transfers it to the standby stage, the mounting head mounts the upper part on the lower part. , Causing the transfer head to collect a completed part on the standby stage, transfer a lower part from the component supply unit to the standby stage, pick up an upper part from the component supply unit, and perform upside down. A component mounting device.
下側部品に上側部品を実装する部品実装装置であって、下側部品及び上側部品が供給される部品供給部と、前記部品供給部から下側部品が移送される待機ステージと、前記待機ステージから下側部品が移送される実装ステージと、上側部品をピックアップして前記実装ステージ上の下側部品に実装する実装ヘッドと、2つのピックアップ部を有し、前記実装ステージ上で製造された完成部品と前記待機ステージ上の下側部品をそれぞれピックアップして完成部品と下側部品の位置を入れ替える移載ヘッドと、前記部品供給部の下側部品をピックアップして前記待機ステージに移送し、前記部品供給部の上側部品をピックアップして上下反転させて前記実装ヘッドに受け渡し、前記待機ステージ上の完成部品を回収する移送ヘッドとを備えたことを特徴とする部品実装装置。   A component mounting apparatus for mounting an upper component on a lower component, a component supply unit to which the lower component and the upper component are supplied, a standby stage to which the lower component is transferred from the component supply unit, and the standby stage A mounting stage on which the lower part is transferred, a mounting head that picks up the upper part and mounts it on the lower part on the mounting stage, and two pickup parts, and is completed on the mounting stage A transfer head for picking up a part and a lower part on the standby stage, respectively, and replacing the position of the completed part and the lower part; picking up a lower part of the part supply unit and transferring it to the standby stage; A transfer head for picking up the upper part of the part supply unit, turning it upside down, delivering it to the mounting head, and collecting the finished part on the standby stage; Component mounting apparatus according to claim. 下側部品に上側部品を実装する部品実装方法であって、部品供給部の下側部品をピックアップして待機ステージに移送し、前記部品供給部の上側部品をピックアップして上下反転させる第1工程と、前記待機ステージ上の下側部品をピックアップして実装ステージに移載する第2工程と、第1工程において上下反転された上側部品をピックアップしてその上側部品を前記実装ステージ上の下側部品に実装する第3工程とを含む実装工程を繰り返し、第2工程では下側部品を前記実装ステージに移載する際に、前の実装工程において前記実装ステージ上で製造された完成部品をピックアップして前記待機ステージに移載し、第3工程を実行している間に前記待機ステージ上の完成部品の回収及び第1工程を実行することを特徴とする部品実装方法。   A component mounting method for mounting an upper part on a lower part, wherein the lower part is picked up and transferred to a standby stage, and the upper part of the part supply part is picked up and turned upside down. A second step of picking up the lower part on the standby stage and transferring it to the mounting stage; and picking up the upper part that has been turned upside down in the first step and placing the upper part on the lower side of the mounting stage A mounting process including a third process for mounting on a component is repeated, and when the lower part is transferred to the mounting stage in the second process, the completed part manufactured on the mounting stage in the previous mounting process is picked up. The component mounting method is characterized in that the transfer of the completed parts on the standby stage and the first step are performed while the third step is being carried out and transferred to the standby stage. .
JP2007087418A 2007-03-29 2007-03-29 Component mounting apparatus and component mounting method Expired - Fee Related JP4780017B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102059421B1 (en) 2016-01-06 2019-12-26 야마하 모터 로보틱스 홀딩스 가부시키가이샤 Electronic component mounting unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102059421B1 (en) 2016-01-06 2019-12-26 야마하 모터 로보틱스 홀딩스 가부시키가이샤 Electronic component mounting unit

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