JPH05267384A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To provide bonding technique capable of effectively performing bonding using various lead frames in which tab locations are scattered. CONSTITUTION:A heat block 3 supports a position of a tab 1a of a lead frame 1A from the back side and heats up. A heat column block 6 for moving vertically the heat block 3 is mounted on a XY table 7, for example even when the position of the tab 1a is biased from a central axis of the lead frame 1A, it operates without exchanging components or the like so that a position of the heat block 3 can accurately follow a position directly under the tab 1a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding technique, and more particularly to a technique effectively applied to pellet bonding and wire bonding processes in assembling a semiconductor device.

[0002]

2. Description of the Related Art For example, Industrial Research Council, Showa 5
As described in documents such as "Electronic Materials", November 1982, reprint, November 1982, P158 to P162, etc., in the process of assembling a semiconductor device, a semiconductor circuit having a desired function is manufactured. Electrical connection between the pellet and the lead as an external connection terminal, sealing, etc. by using a lead frame consisting of a tab for mounting the pellet and a plurality of leads arranged so as to surround the tab. It is known to carry out the assembly work of.

By the way, in the lead frame, usually, the tabs on which the pellets are mounted are often arranged at a predetermined pitch on the central axis in the longitudinal direction. Lead frames having a structure in which tabs are arranged at positions eccentric from the central axis are also being used.

When pellets are bonded to the tabs of the lead frame and wire bonding between the pellets mounted on the tabs and the leads is performed, on the side of the pellet bonding device or the wire bonding device, the tabs or leads are bonded at the time of bonding. It is necessary to accurately move the support structure such as a heat block that performs the heating and supporting operation by following the eccentric tab position.

[0005]

However, in the conventional bonding apparatus, the movable amount of the heat block in the width direction of the lead frame is at most an adjustment allowance at the time of maintenance, and the lead with a large eccentric amount of the tab position is used. When bonding the frame, it is necessary to carry out setup work such as newly manufacturing and exchanging a support structure such as a dedicated heat block, which causes a decrease in productivity due to an increase in man-hours for maintenance management and equipment downtime. was there.

Further, in the wire bonding apparatus, in order to stabilize the bonding operation, the lead group surrounding the tab is collectively fixed by a frame-shaped clamp having a size corresponding to the type of the lead frame. Each time the type of lead frame is changed and the size of the bonding area in the lead is changed, the clamp must be replaced, which also complicates the setup work. This clamping problem occurs regardless of whether or not the tab position is eccentric.

An object of the present invention is to provide a bonding technique capable of efficiently performing bonding using various lead frames having various tab positions.

Another object of the present invention is to provide a bonding technique capable of efficiently performing wire bonding using lead frames of various sizes.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

Among the inventions disclosed in the present application, a typical one will be briefly described as follows.
It is as follows.

That is, the bonding apparatus of the present invention according to claim 1 is a lead frame having a plurality of tabs for mounting pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs. Frame transfer mechanism for carrying and positioning operation of the lead frame, a heat block for supporting the tab position of the lead frame from the rear side and heating to a desired temperature, a pellet bonding operation for the tab, or a pellet mounted on the tab. In a bonding apparatus provided with a bonding tool that individually lays a bonding wire between a lead and a lead, the heat block includes a first moving mechanism that controls displacement of the heat block in a thickness direction of a lead frame. , In the width direction and the longitudinal direction of the lead frame of the heat block. A second moving mechanism for controlling displacement on one side, and at least following the eccentric amount of the tab position in the width direction of the lead frame from the center of the lead frame, place the heat block directly below the mounting position of the tab. It is designed to be positioned.

The bonding apparatus of the present invention according to claim 2 is the bonding apparatus according to claim 1,
On the top surface of the heat block in contact with the lead frame, multiple types of heat stages corresponding to the shapes of multiple types of tabs are arranged in the longitudinal direction of the lead frame, and the heat block is arranged according to the type of incoming lead frame. By displacing in the longitudinal direction, the corresponding heat stage is positioned at the bonding position in the feed direction.

According to a third aspect of the bonding apparatus of the present invention, a lead frame having a plurality of tabs for mounting pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs. Frame transfer mechanism for carrying and positioning operation of the lead frame, a heat block for supporting the tab position of the lead frame from the rear side and heating to a desired temperature, a pellet bonding operation for the tab, or a pellet mounted on the tab. In a bonding apparatus provided with a bonding tool for individually laying a bonding wire between a lead and a frame, a frame transfer mechanism moves centered in the width direction of the lead frame and supports both ends of the lead frame. A pair of chutes and the lead frame that supports the pair of chutes as a whole. And a frame positioning control mechanism for moving the tab position in the width direction of the lead frame, at least following the eccentric amount of the tab position in the width direction of the lead frame from the center of the lead frame to position the tab position directly above the heat block. It's something that you do.

According to a fourth aspect of the bonding apparatus of the present invention, a lead frame having tabs for mounting a plurality of pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs. Frame transport mechanism that carries and positions the lead frame, a heat block that supports the tab position of the lead frame from the rear side and heats it to a desired temperature, and a clamp that clamps and fixes the lead frame lead between the heat block. In a bonding apparatus provided with a mechanism and a bonding tool for bonding a pellet to a tab or an operation of individually laying a bonding wire between a pellet mounted on the tab and a lead, the clamp mechanism has a diameter of A rectangular shape that is much larger than the bonding area in the leads that surround the tab. The window-shaped clamp is provided with a diagonal movement of the window-shaped clamp so that the lead-groups facing the two opposite sides of the tab are alternately pinched and fixed by using the two opposite sides of the window-shaped clamp. The wire bonding operation is performed.

[0015]

According to the bonding apparatus of the present invention as set forth in claim 1, even if the position of the tab is eccentric with respect to the central axis in the longitudinal direction of the lead frame, the heat block is moved by the second moving mechanism. It can be positioned right under the eccentric tab to support it accurately, and every time the tab position changes, bonding work can be performed without the need for complicated work such as heat block replacement. However, it is possible to efficiently perform bonding using various lead frames.

Further, according to the bonding apparatus of the present invention as set forth in claim 2, the heat block is attached to the lead frame not only in the arrangement position of the tab in the lead frame but also in various lead frames having different shapes of the tab itself. Since it is possible to move the heat stage to the bonding position by moving it appropriately in the feeding direction, it is possible to perform the bonding work without the need for complicated work such as heat block replacement every time the tab shape changes. Bonding using various lead frames with various tab positions can be efficiently performed.

Further, according to the bonding apparatus of the present invention as defined in claim 3, even when the position of the tab is eccentric with respect to the central axis in the longitudinal direction of the lead frame, the eccentric direction and the amount of eccentricity of the tab position are determined. Then, by moving the lead frame in the width direction by the frame positioning control mechanism, the tab position can be accurately positioned right above the heat block to perform bonding work, and various lead frames with various tab positions are provided. It is possible to efficiently carry out bonding using.

Further, according to the bonding apparatus of the present invention as set forth in claim 4, during wire bonding of a lead frame in which the tabs and the leads surrounding the tabs are arranged in various positions, a lead group facing two opposite sides of the tabs. For each time, the window clamp itself is exchanged every time the lead frame type is switched by alternately pinching and fixing on the heat block using two opposite sides of the window clamp and performing the wire bonding operation. Such complicated work is unnecessary, and wire bonding using lead frames of various sizes can be efficiently performed.

[0019]

First Embodiment A bonding apparatus, which is an embodiment of the present invention, will be described in detail below with reference to the drawings.

FIG. 1 is a schematic sectional view showing an example of the structure of the bonding apparatus of this embodiment, and FIG. 2 is a side view thereof. 5 and 6 are plan views showing an example of a lead frame bonded by the bonding apparatus of this embodiment.

A lead frame 1A is supported at its both ends by a pair of chutes 4 and 5 having a substantially L-shaped cross section, and is guided movably in the longitudinal direction (direction perpendicular to the plane of FIG. 1).

A heat block 3 is arranged below the chute 4 and the chute 5 which support the lead frame 1A. The heat block 3 has a heating element 3a therein, and can heat the heat stage 2 facing the lead frame 1A to a desired temperature.

Further, the heat block 3 is supported by the heat column block 6 via the rod 6c, and the cam 6a provided inside the heat column block 6 and the cam follower locked to the lower end of the rod 6c. Positioning control is performed at a desired position in the vertical direction by 6b.

In this case, the entire heat column block 6 that supports the heat block 3 is placed on the XY table 7, and the operation of the X-direction drive motor 7a is performed as shown in FIG.
Drive motor 7b in the X and Y directions perpendicular to the plane of FIG.
1 has a structure in which positioning control is independently performed at desired positions in the left and right Y directions in FIG.

That is, in the case of the present embodiment, the heat column block 6 controls the vertical movement of the heat block 3 in the thickness direction of the lead frame 1A, and the XY table 7 is used in the width direction of the lead frame 1A. It can be positioned at a desired position in the Y direction, and further in the X direction, which is the feed direction of the lead frame 1A.

In the case of this embodiment, the heat block 3
Is extended in the longitudinal direction of the lead frame 1A,
The heat stage 2 located above the heat block 3
Is, for example, the remaining heat stage 2a, the flat stage 2b, the DIP in order from the arrival direction of the lead frame 1A.
(Dual In line Package) stage 2c, QFP (Qu
The structure includes a stage 2d for ad flat package). Then, the heat block 3 is appropriately moved in the longitudinal direction according to the planar shape of the tab 1a in the incoming lead frame 1A or the like and the uneven shape in the thickness direction, and the suitable heat stage 2 is selectively positioned at the bonding position. Perform an action that causes

Although not shown in particular, a bonding tool is arranged at a position facing the heat block 3 via the lead frame 1A. For example, pellet bonding to the lead frame 1A or bonding to the lead frame has been completed. A bonding operation is performed such that a bonding wire is installed between the pellet and the lead.

The lead frame 1A which is the target of the bonding apparatus of this embodiment has, for example, the shape illustrated in FIGS.

That is, the lead frame 1A shown in FIG.
Plural rectangular tabs 1a on which pellets 60 are individually mounted
The center position 1p of the lead frame 1A is arranged at a position uniformly deviated from the central axis 1x in the longitudinal direction of the lead frame 1A by the distance Sy in the width direction (Y direction), and the arrangement pitch in the longitudinal direction is constant. .. In addition, at a position surrounding each of the eccentric tabs 1a, a plurality of leads 1b are arranged corresponding to each side in a posture in which a tip end portion faces the tab 1a, and a base end portion thereof is a lead frame 1A. Are integrally supported by. The individual tabs 1a are supported by the lead frame 1A via the tab suspension leads 1c.

Further, the lead frame 1B illustrated in FIG.
Is the center position 1 of the plurality of tabs 1a arranged in the longitudinal direction.
p are alternately distributed and arranged at positions deviated by a distance Sy from the central axis 1x in the longitudinal direction of the lead frame 1B in the width direction (Y direction).

An example of the operation of the bonding apparatus of this embodiment will be described below.

First, the lead frame 1A illustrated in FIG.
When the center position 1p of the tab 1a is uniformly deviated from the center axis direction to one side as shown in FIG.
Operate the table 7 and set the center of the heat block 3 to Y
The tab 1a is moved in the direction by a deviation distance Sy of the center position 1p. Further, according to the shape of the tab 1a of the incoming lead frame 1A, etc., the heat block 3 is appropriately moved by Sx in the feed direction, and the flat stage 2b, the DIP stage 2c, and the QFP of the heat block 2 are moved.
One of the compatible stages 2d is positioned at a predetermined bonding position.

After that, by feeding the space between the chute 4 and the chute 5 in the longitudinal direction by a feeding mechanism (not shown) or the like, the feeding operation is performed so that the target tab 1a is stopped at a position just above the heat stage 2 of the heat block 3. Control.

Thereafter, the cam 6a in the heat column block 6 is operated to raise the heat block 3,
The heat stage 2 at the top supports the target tab 1a and the lead 1b around the target tab 1 so as to press the tab 1a from the back side and slightly lift it, and heats it to a predetermined temperature.

In this state, for example, in the case of pellet bonding, the pellet 6 is conveyed and pressed by a bonding tool (not shown).
A well-known pellet bonding operation of thermocompressing 0 to a predetermined position of the target tab 1a is performed.

In the case of wire bonding, a bonding wire is provided between each of the external connection electrodes (not shown) of the pellet 60 already mounted on the tab 1a and each of the leads 1b surrounding the pellet 60. Well-known wire bonding for erection is performed.

On the other hand, as in the lead frame 1A illustrated in FIG. 6, when the center position 1p of the tab 1a is alternately distributed to the deviated positions on both sides of the central axis 1x in the longitudinal direction. , Each time when the individual tab 1a arrives, X is detected based on the type information of the lead frame 1A which is input to the bonding apparatus in advance, or the detection position information of the tab 1a by an image recognition device (not shown) or the like.
By appropriately controlling the movement operation of the Y table 7, the heat stage 2 suitable for the heat block 3 is positioned directly below the target tab 1a which is eccentric in the width direction, and then the above-described pellet bonding or wire bonding is performed. Run.

As described above, in the bonding apparatus of this embodiment, the center position 1p of the tab 1a of the lead frame 1A is arranged at a position eccentric from the axial direction of the lead frame 1A, or the shape of the tab 1a is changed. Even in various cases, the movement of the heat block 3 in the width direction and the longitudinal direction by the XY table 7 can accurately position the heat stage 2 that is directly below the target tab 1a, so that the tab 1a can be predetermined. In addition to being able to uniformly heat to the above temperature, for example, a complicated setup work such as replacement of the heat block 3 each time is performed every time when the product type of the lead frame 1A in which the tabs 1a are arranged is different. It is completely useless to do. Therefore, the number of man-hours required for the worker to replace the heat block 3 and adjust the position is significantly reduced, and the down time of the apparatus is also significantly reduced. As a result, the productivity in the bonding process such as pellet bonding and wire bonding is surely improved.

[0039]

[Embodiment 2] FIG. 3 is a schematic sectional view showing an example of the structure of a bonding apparatus according to another embodiment of the present invention.

At positions facing each other across the heat block 3 supported by the heat column block 6 so as to be vertically movable,
A pair of shoots 4 and 5 for guiding the lead frame 1A are provided, and the pair of shoots 4 and 5 are provided in the shoot block 13.
It has a structure in which both ends are screwed into a chute opening / closing screw 9 in which a right screw and a left screw are respectively engraved. And
By rotating the chute opening / closing screw 9 by the chute opening / closing motor 8, the lead blocks 1A are centrally distributed around the heat block 3 and are moved toward or away from each other in the width direction of the lead frame 1A. Compatible with lead frame 1A.

The entire chute block 13 that supports the chute 4 and the chute 5 is mounted on a guide block 12 that linearly slidably guides the chute block 13 in the width direction of the lead frame 1A. There is. A part of the chute block 13 is supported on the guide block 12 side, and the chute block drive motor 1
A feed screw 11 driven to rotate by 0 penetrates in the width direction and is screwed.

Then, the pair of chutes 4 and 5 mounted on the chute block 13 as a whole in the desired direction in the desired direction is rotated in the desired direction by the rotation operation of the feed screw 11 in the desired direction. A positioning operation of moving a distance is performed.

That is, in the case of the second embodiment, even when the tab 1a is arranged at a position eccentric from the central axis of the lead frame 1A in the longitudinal direction, the lead frame 1
By moving the chute block 13 supporting the entire pair of chute 4 and chute 5 guiding A in the width direction of the lead frame 1A, the tab 1a is accurately positioned directly above the heat block 3. be able to.

This makes it possible to obtain the same effects as in the case of the first embodiment.

[0045]

[Third Embodiment] FIG. 4 is a schematic plan view of a main portion of an example of a bonding apparatus according to still another embodiment of the present invention.

The bonding apparatus according to the third embodiment has a pellet 60 mounted on the tab 1a of the lead frame 1A.
And a plurality of leads 1b of the lead frame 1A, the wire bonding apparatus performs the operation of laying the bonding wire 80.

A window clamp 70 is arranged on the lead frame 1A positioned on the heat block 3 as exemplified in the first and second embodiments. This window clamp 70 includes a clamp drive arm 71.
Supported on both sides by the lead frame 1A
Of the lead frame 1A in the thickness direction (direction perpendicular to the paper surface of FIG. 4), the width direction of the lead frame 1A (vertical direction in FIG. 4), and the longitudinal direction of the lead frame 1A (horizontal direction in FIG. 4). It has a possible structure. The window-shaped clamp 70 is provided with a rectangular opening 70a. Further, in a region along the opening 70a, the frame-shaped pressing protrusion 70 is provided on the side facing the lead frame 1A.
b is formed to project.

In this case, the dimensions Lx and Ly of the rectangular opening 70a of the window clamp 70 are determined by wire bonding of the leads 1b arranged around each side of the tab 1a in various lead frames 1A to be bonded. It is set to be sufficiently larger than the dimension lx and the dimension ly of the region where the positions are connected.

In the wire bonding apparatus of the present embodiment, when wire bonding the pellet 60 mounted on the tab 1a and the plurality of leads 1b, first, as shown in FIG.
As illustrated in (a) of FIG. 3, the pellet 6 is formed by the pressing protrusions 70b located on two adjacent sides of the opening 70a.
The outer periphery of the bonding portion of the lead 1b positioned corresponding to the two adjacent sides of 0 is clamped and fixed between the lead 1b and the heat block 3, and the part of the lead 1 thus fixed is fixed.
The operation of installing the bonding wire 80 between b and the pellet 60 is performed.

Thereafter, the bonding operation is temporarily stopped, the window-shaped clamp 70 is moved, and as shown in FIG. 7B, bonding is performed on the two rows of leads 1b facing the two opposite sides of the pellet 60. The vicinity of the outside of the portion is pressed and fixed, and wire bonding is performed on the fixed lead 1b.

The lead 1b of such a window clamp 70
By the fixing operation described above, various lead frames 1A having various sizes of the arrangement region (bonding region) of the leads 1b around the tab 1a (pellet 60) and the center position of the tab 1a can be obtained without replacing the window clamp 70. Wire bonding can be performed, and productivity in the wire bonding process is improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

[0053]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, according to the bonding apparatus of the present invention, it is possible to efficiently perform bonding using various lead frames having various tab positions.

Further, according to the bonding apparatus of the present invention, the effect that the wire bonding using the lead frames of various sizes can be efficiently performed can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an example of the configuration of a bonding apparatus that is an embodiment of the present invention.

FIG. 2 is a schematic side view showing an example of the configuration of a bonding apparatus that is an embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing an example of the configuration of a bonding apparatus that is an embodiment of the present invention.

4 (a) and 4 (b) are schematic plan views showing, in the order of operation, essential parts of an example of a bonding apparatus that is still another embodiment of the present invention.

FIG. 5 is a plan view showing an example of a lead frame bonded by a bonding apparatus according to an embodiment of the present invention.

FIG. 6 is a plan view showing an example of a lead frame bonded by a bonding apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 1A lead frame 1B lead frame 1a tab 1b lead 1c tab suspension lead 1p center position 1x center axis 2 heat stage 2a residual heat stage 2b flat stage 2c DIP stage 2d QFP stage 3 heat block 3a heating element 4 chute 5 chute 6 heat column Block 6a Cam 6b Cam follower 6c Rod 7 XY table 7a X direction driving motor 7b Y direction driving motor 8 Chute opening / closing motor 9 Chute opening / closing screw 10 Chute block driving motor 11 Feed screw 12 Guide block 13 Chute block 60 Pellet 70 Window clamp 70a Opening Part 70b Pressing protrusion 71 Clamp drive arm 80 Bonding wire

Claims (4)

[Claims] 1. A frame carrying mechanism for carrying and positioning a lead frame having a plurality of tabs for mounting pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs, A heat block that supports the tab position of the lead frame from the back side and heats it to a desired temperature, and a bonding operation of a pellet to the tab, or between the pellet mounted on the tab and the lead. A bonding apparatus comprising: a bonding tool for performing an operation of laying a bonding wire on the heat block, wherein the heat block includes a first moving mechanism that controls displacement of the heat block in a thickness direction of the lead frame; At least one of the width direction and the longitudinal direction of the lead frame of the heat block A second movement mechanism for controlling the displacement of the heat block, and at least following the eccentric amount of the tab position in the width direction of the lead frame from the center of the lead frame, directly below the mounting position of the tab. A bonding device characterized by being positioned at. 2. A plurality of types of heat stages corresponding to the shapes of the plurality of types of tabs are arranged in the longitudinal direction of the lead frame on the top surface of the heat block in contact with the lead frame, and the incoming lead frame of the lead frame is provided. The bonding apparatus according to claim 1, wherein the corresponding heat stage is positioned at a bonding position in the feed direction by displacing the heat block in the longitudinal direction of the lead frame according to the type. 3. A frame carrying mechanism for carrying and positioning a lead frame having a plurality of tabs for mounting pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs, A heat block that supports the tab position of the lead frame from the back side and heats it to a desired temperature, and a bonding operation of a pellet to the tab, or between the pellet mounted on the tab and the lead. And a bonding tool for performing an operation of laying a bonding wire on the frame, wherein the frame transport mechanism is movable in a center distribution in the width direction of the lead frame and supports a pair of side ends of the lead frame. Support the chute and the entire pair of chutes, and move it in the width direction of the lead frame. An operation of positioning the tab position directly above the heat block, following at least the eccentric amount of the tab position in the width direction of the lead frame from the center of the lead frame. A wire bonding apparatus for performing the following. 4. A frame carrying mechanism for carrying and positioning a lead frame having a plurality of tabs for mounting pellets at desired intervals in the longitudinal direction and a plurality of leads arranged so as to surround the tabs, A heat block that supports the tab position of the lead frame from the back side and heats it to a desired temperature, a clamp mechanism that clamps and fixes the lead of the lead frame between the heat block, and a pellet for the tab. Or a bonding tool for performing an operation of individually bonding wires between the pellet mounted on the tab and the lead, wherein the clamp mechanism has a diameter of A rectangular shape that is sufficiently larger than the bonding area in the lead group surrounding the tab. A window-type clamp is provided, and the window-type clamp is alternately moved in a diagonal direction to alternately clamp and fix each lead group facing two opposite sides of the tab to perform a wire bonding operation. Characteristic bonding equipment.