JP4589163B2 - 画像処理装置、基板配線露光システム及び基板配線形成システム - Google Patents

画像処理装置、基板配線露光システム及び基板配線形成システム Download PDF

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Publication number
JP4589163B2
JP4589163B2 JP2005104388A JP2005104388A JP4589163B2 JP 4589163 B2 JP4589163 B2 JP 4589163B2 JP 2005104388 A JP2005104388 A JP 2005104388A JP 2005104388 A JP2005104388 A JP 2005104388A JP 4589163 B2 JP4589163 B2 JP 4589163B2
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Prior art keywords
wiring
substrate
thickness
image processing
exposure
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JP2005104388A
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Japanese (ja)
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JP2006284894A5 (enExample
JP2006284894A (ja
Inventor
孝 岡安
貞夫 関口
建二 高橋
敦 菅沼
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Fujifilm Corp
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Fujifilm Corp
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2005104388A 2005-03-31 2005-03-31 画像処理装置、基板配線露光システム及び基板配線形成システム Expired - Fee Related JP4589163B2 (ja)

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JP2005104388A JP4589163B2 (ja) 2005-03-31 2005-03-31 画像処理装置、基板配線露光システム及び基板配線形成システム

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JP2005104388A JP4589163B2 (ja) 2005-03-31 2005-03-31 画像処理装置、基板配線露光システム及び基板配線形成システム

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JP2006284894A JP2006284894A (ja) 2006-10-19
JP2006284894A5 JP2006284894A5 (enExample) 2010-09-09
JP4589163B2 true JP4589163B2 (ja) 2010-12-01

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JP2005104388A Expired - Fee Related JP4589163B2 (ja) 2005-03-31 2005-03-31 画像処理装置、基板配線露光システム及び基板配線形成システム

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6139197B2 (ja) * 2013-03-18 2017-05-31 株式会社Ｓｃｒｅｅｎホールディングス Ｒｉｐ装置、画像記録装置、ｒｉｐ方法およびプログラム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10221851A (ja) * 1997-02-10 1998-08-21 Fujitsu Ltd パターン形成方法
JPH11112142A (ja) * 1997-10-01 1999-04-23 Kyocera Corp 多層配線基板
JP4274784B2 (ja) * 2002-05-28 2009-06-10 新光電気工業株式会社 配線形成システムおよびその方法
JP2004228228A (ja) * 2003-01-21 2004-08-12 Toshiba Corp 形状シミュレーション方法、形状シミュレーションプログラム及びマスクパターン作成方法
JP2004319899A (ja) * 2003-04-18 2004-11-11 Nikon Corp 露光装置及び露光方法

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JP2006284894A (ja) 2006-10-19

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