JP4566283B2 - Manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a multilayer wiring structure formed by using a so-called damascene method and a technique effective when applied to a semiconductor device having such a multilayer wiring structure.

  Along with the high performance and miniaturization of semiconductor devices, multilayer wiring technology has become a necessary technology in semiconductor device manufacturing. As a method for forming a wiring layer in a semiconductor integrated circuit, a refractory metal thin film such as an aluminum (Al) alloy or tungsten (W) is formed on an insulating film, and then the same as the wiring pattern on the wiring thin film by a photolithography process. A method is known in which a resist pattern having a shape is formed and a wiring pattern is formed by a dry etching process using the resist pattern as a mask. However, in the method using Al alloy or the like, there is a problem that the wiring resistance increases remarkably with the miniaturization of the wiring, the wiring delay increases accordingly, and the performance of the semiconductor device decreases. In particular, in a high-performance logic LSI, a big problem has arisen as a performance impediment factor.

  For this reason, after embedding a wiring metal having copper (Cu) as a main conductor layer in the groove formed in the insulating film, excess metal outside the groove is removed by using a CMP method (chemical mechanical polishing method). A method of forming a wiring pattern in the groove (so-called damascene method) has been studied.

  However, the multi-layer wiring by the damascene method, particularly the dual damascene method (the damascene method in which the wiring groove for forming the wiring and the connection hole for forming the interlayer connection wiring are formed and then the wiring and the interlayer connection wiring are simultaneously formed). When the present inventors examined the formation process, the following problems were recognized. The following problems have been independently studied by the present inventors and have not been publicly known.

  That is, according to the study by the present inventors, there are roughly two methods for forming a groove (wiring groove) and a hole (connection hole) by the dual damascene method. There are a hole tip method and a self-alignment method.

  In the hole tip method, a deep hole reaching the lower layer wiring is first formed in an interlayer insulating film (including an inter-line insulating film that is an insulating film for wiring formation) formed on the lower layer wiring. This hole is formed by forming a photoresist film patterned into a hole pattern on the interlayer insulating film, and using this as a mask, the interlayer insulating film is etched by, for example, dry etching. Next, the hole is filled with an antireflection material, a resist or the like, and then a wiring groove is formed in the interlayer insulating film. In the formation of the wiring groove, a photoresist film patterned into a groove pattern is formed on the interlayer insulating film, and the interlayer insulating film is etched using this photoresist film as a mask, as in the formation of the hole. The reason why the hole is filled with an antireflection material or the like before the formation of the wiring groove is to accurately expose the photoresist film for forming the wiring groove and improve the processing accuracy. That is, if the hole is not buried, the surface of the photoresist film at that portion does not become flat reflecting the hole shape. If exposure is performed in the presence of such irregularities, exposure light scatters at the irregularity existing portions (holes), and the groove pattern is not accurately formed. In particular, since a wiring groove is formed in a hole portion (connection hole) in which a connection wiring for connecting the upper and lower wiring layers is formed, such a problem of a decrease in processing accuracy occurs in many portions.

  If the hole is filled with an antireflection material or the like as described above, the problem in exposing the wiring groove pattern is almost solved. However, it is necessary to remove the filling material (antireflection material or the like) remaining in the hole after forming the wiring groove. However, it is difficult to remove such a filling material, and there is a problem of poor connection between the upper and lower wiring layers or an increase in connection resistance due to the filling material remaining at the bottom of the connection hole. In particular, in the recent miniaturized semiconductor devices, the connection hole diameter is reduced and the aspect ratio is also increased, so that the difficulty is further increased.

  On the other hand, in the self-alignment method, the wiring groove and the connection hole can be formed as follows. That is, an interlayer insulating film (in this case, the interlayer insulating film does not include an inter-line insulating film for wiring formation) is formed on the lower wiring, and a silicon nitride film is further formed. The silicon nitride film is subjected to a hole pattern process, and a line insulating film (for example, a silicon oxide film) is formed. That is, an intermediate layer (silicon nitride film layer) processed into a hole pattern is formed between the interlayer insulating film and the inter-line insulating film. Then, a groove pattern is formed in the inter-line insulating film, and after the groove pattern processing, hole processing is performed using the intermediate layer (silicon nitride film on which the groove pattern is formed) as a mask. In such a self-alignment method, it is possible to avoid the remaining of the embedded material in the hole (connection hole) as described above, or the deterioration of the processing accuracy when performing the groove processing.

  However, the intermediate layer functions as an etching stopper at the time of groove processing (at the time of etching), and also functions as an etching mask for hole processing. For this reason, the film thickness of the intermediate layer needs to be considerably thick, and according to the study by the present inventors, a film thickness of at least about 100 nm is necessary. The silicon nitride film is known as a high dielectric material, and becomes a major negative factor for lowering the dielectric constant of the interlayer insulating film and the inter-line insulating film. If the dielectric constant between wirings or between wiring layers increases, the capacitance between wirings increases, which is an impediment to increasing the speed and performance of semiconductor devices. In addition, since the hole is defined by a region where both the wiring and the hole are dry-etched, there may occur a situation in which the finished hole diameter becomes small due to misalignment between the mask for hole formation and the mask for groove formation. The reduction in the hole diameter hinders securing of a resistance value necessary for the line-to-line connection wiring, and becomes an obstacle to increasing the speed and performance of the semiconductor device.

  Further, if the groove pattern is enlarged to avoid mask misalignment, miniaturization of the wiring width and pitch is hindered, and high integration is hindered.

  An object of the present invention is to prevent the foreign matter from remaining in the connection hole even when a fine dual damascene groove is formed, and to improve the reliability of wiring connection and the performance of the semiconductor device.

  Another object of the present invention is to provide a technology capable of reducing the connection resistance between the wiring layers by securing the processing area of the connection hole, and to improve the performance of the semiconductor device.

  Still another object of the present invention is to provide a technique capable of reducing the capacitance between wirings and improving the performance of a semiconductor device.

  Still another object of the present invention is to provide a technique capable of improving the integration degree of a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, according to the method for manufacturing a semiconductor device of the present invention, a wiring groove pattern layer serving as an etching mask for forming a wiring groove is formed on an insulating layer (interlayer insulating film and inter-line insulating film) formed on a substrate. Next, a hole pattern layer serving as an etching mask when forming the interlayer connection hole is formed on the wiring groove pattern layer. Then, dry etching is performed from above the hole pattern layer, the hole pattern is transferred to the insulating layer to a predetermined depth, only the hole pattern layer is removed, and the hole pattern and wiring groove pattern layer transferred to the insulating layer are masked. Insulating layer is processed.

  The semiconductor device or the manufacturing method of the present invention is premised on a wiring structure having no region in which the wiring width is partially expanded in order to absorb misalignment of the interlayer connection holes. For this reason, the space between wirings can be reduced to the minimum dimension of photolithography, and it is possible to cope with fine wiring processing. However, there is a problem of misalignment between the wiring groove pattern layer and the hole pattern formed thereon. As a countermeasure against this misalignment, first, a method of adding a dry etching process step of the wiring groove pattern layer through the hole pattern layer before transferring the hole pattern to a predetermined depth in the insulating layer, 2. The hole pattern diameter perpendicular to the longitudinal direction of the wiring groove pattern is made larger than the wiring groove width, and dry etching is performed on the hole pattern layer so that the wiring groove pattern layer is not etched. Two methods of transferring the hole pattern are provided.

  In the method for manufacturing a semiconductor device of the present invention, a thin silicon nitride film having a thickness of about 50 nm is used for the wiring groove pattern layer on the insulating film. Since the wiring groove pattern layer is sufficiently thin, the hole pattern layer formed thereon can be processed with sufficiently high accuracy. That is, in the method of the present invention, since the resist pattern (pattern layer for forming the hole pattern layer) is formed on a small step of about 50 nm, simple measures such as application of an antireflection film formed under the resist are provided. Can easily relieve the step. Therefore, a flattening process (embedding of connection holes with an antireflection material or the like) as in the above-described hole tip method is unnecessary. Further, with respect to the misalignment between the wiring groove pattern and the hole pattern, when transferring the hole pattern having a predetermined depth to the insulating layer, the hole pattern can be formed through the wiring groove pattern layer at the initial stage of etching. . This can be carried out without any particular difficulty in the etching process since the wiring groove pattern layer is made of a thin silicon nitride film. Thus, by performing the hole processing first, it is possible to secure the hole diameter and compensate for the disadvantages of the self-alignment method. In this case, the bottom of the hole formed in the insulating layer may be slightly under-etched in the misalignment region, but an etching stopper layer is provided below the insulating layer, and it is acceptable even if the hole etching becomes over-etched. This can be dealt with. On the other hand, when the hole pattern diameter perpendicular to the longitudinal direction of the wiring groove pattern is made larger than the wiring groove width and the hole pattern is transferred by dry etching under the condition that the wiring groove pattern layer is not etched, the wiring groove pattern and the wiring groove The hole pattern is etched and transferred in the overlapping region with the hole pattern wider than the width. Since the hole pattern layer is formed to have a large hole diameter in anticipation of mask displacement in advance, the same opening diameter as the pattern width of the wiring groove pattern can be secured.

  In this way, it is possible to avoid the disadvantage of the tip-hole method, that is, to avoid the remaining of the filler in the connection hole, and to easily secure the connection hole diameter, which is the advantage of the tip-hole method. That is, in the manufacturing method of the present invention, since the hole pattern is dry-etched first and then the groove pattern is dry-etched, the shape of the hole pattern is determined first, and the hole diameter becomes smaller due to misalignment. There is nothing.

  Focusing on the silicon nitride film as the stopper layer, the self-aligned method is an etching stopper for the groove pattern, and at the same time functions as a dry etching mask for the hole pattern. In the semiconductor device of the present invention, only the function of the etching stopper for the groove pattern is required. Therefore, the intermediate stopper layer can be made thinner than in the self-alignment method. Moreover, if the depth of the hole pattern is controlled by etching with time management, it is not necessary to use an intermediate stopper layer, and processing can be realized without it. As a result, the inter-wiring capacitance of the semiconductor device can be reduced and the performance of the semiconductor device can be improved.

  The features of the present invention are listed as follows.

  1. A method for manufacturing a semiconductor device, comprising: (a) a step of forming a first insulating layer on a substrate; and (b) a wiring groove pattern layer serving as an etching mask when forming a wiring groove on the first insulating layer. (C) a step of forming a hole pattern layer serving as an etching mask when forming a connection hole on the wiring groove pattern layer; and (d) a step of forming the wiring groove pattern layer and the second wiring layer in the presence of the hole pattern layer. Etching the first insulating layer and transferring a hole pattern of a predetermined depth to the first insulating layer; (e) removing the hole pattern layer; and (f) existence of the wiring groove pattern layer and hole pattern. An etching process is performed below, and a wiring groove pattern is transferred to the first insulating layer.

  2. A method for manufacturing a semiconductor device, comprising: a wiring groove formed with a constant width; a wiring formed in the wiring groove; and an interlayer connection member for connecting the wiring and its lower layer wiring. A step of forming a first insulating layer; (b) a step of forming a wiring groove pattern layer serving as an etching mask when forming a wiring groove on the first insulating layer; and (c) an interlayer on the wiring groove pattern layer. A step of forming a hole pattern layer serving as an etching mask when forming a connection hole in which the connection member is formed; (d) performing an etching process in the presence of the hole pattern layer to form a first insulating layer having a predetermined depth; A step of transferring the hole pattern, (e) a step of removing the hole pattern layer, and (f) a step of performing an etching process in the presence of the wiring groove pattern layer and the hole pattern.

  3. A method for manufacturing a semiconductor device, comprising: a wiring groove formed with a constant width; a wiring formed in the wiring groove; and an interlayer connection member for connecting the wiring and its lower layer wiring. A step of forming a first insulating layer; (b) a step of forming a wiring groove pattern layer serving as an etching mask when forming a wiring groove on the first insulating layer; and (c) an interlayer on the wiring groove pattern layer. Forming a hole pattern layer serving as an etching mask when forming a connection hole in which the connection member is formed, with a pattern diameter substantially the same as the pattern width of the wiring groove pattern layer; Etching in the presence, transferring a hole pattern of a predetermined depth to the first insulating layer, (e) removing the hole pattern layer, (f) in the presence of the wiring groove pattern layer and the hole pattern Etching process, Including.

  4). 4. The method of manufacturing a semiconductor device according to item 2 or 3, wherein a part of the wiring groove pattern layer is etched together with the first insulating layer by the etching process in the step (d).

  5. 5. The method of manufacturing a semiconductor device according to any one of Items 1 to 4, wherein a hole pattern is formed up to a lower portion of the first insulating layer in the step (d), and a wiring groove is formed in the step (f). The

  6). 5. The method of manufacturing a semiconductor device according to any one of Items 1 to 4, wherein the hole pattern is etched partway through the first insulating layer in the step (d), and the wiring groove and the connection hole are formed in the step (f). And are formed.

  7). 7. The method of manufacturing a semiconductor device according to any one of Items 1 to 6, wherein a step of forming a second insulating layer having an etching selectivity with respect to the first insulating layer before the step (a). And the dry etching process in the step (f) is performed under the condition that the etching rate of the second insulating layer is lower than the etching rate of the first insulating layer and the second insulating layer is etched. This is performed by two-stage etching with the second etching performed.

  8). A method of manufacturing a semiconductor device, comprising: (a) a step of sequentially forming a first stopper insulating layer, a first insulating layer and a stopper layer; (b) a step of transferring a wiring groove pattern to the stopper layer; (c) (b ) After the step, a step of forming a hole pattern layer of the connection hole, (d) In the presence of the hole pattern layer, an etching process is performed under conditions for removing the stopper layer and the first insulating layer, and the middle of the first insulating layer (E) a step of removing the hole pattern layer, (f) an etching process in the presence of a stopper layer on which the hole pattern and the wiring groove pattern are formed, and connecting holes and wirings. Forming a groove.

  9. It is a manufacturing method of the semiconductor device as described in any one of said 1-8, Comprising: A hole pattern layer is comprised by the shape which opens a stacked via part at a (c) process, A hole pattern is at a (d) process. It is formed to the lower part of the first insulating layer.

  10. 10. The method for manufacturing a semiconductor device according to any one of Items 1 to 9, further comprising a step of forming a planarizing film between the step (b) and the step (c).

  11. 11. The method for manufacturing a semiconductor device according to Item 10, wherein the planarizing film is an antireflection film.

  12 12. The method of manufacturing a semiconductor device according to any one of Items 1 to 11, wherein a wiring groove and a connection hole are formed in the step (f), and then a conductive film is embedded in the wiring groove and the connection hole. An interlayer connection member is formed.

  13. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, comprising: (a) a first stopper insulating layer, an interlayer insulating layer, and a second stopper A step of sequentially forming an insulating layer, a line insulating layer, and a stopper layer; (b) a step of transferring a wiring groove pattern to the stopper layer; and (c) a hole of a connection hole in which an interlayer connection member is formed after (b). A step of forming a pattern mask; (d) a step of etching the inter-line insulating layer and the second stopper insulating layer in the presence of the hole pattern mask to transfer the hole pattern; and (e) removing the hole pattern mask. And (f) performing an etching process in the presence of the stopper layer in which the hole pattern and the wiring groove pattern are formed.

  14 14. The method of manufacturing a semiconductor device according to 13, wherein the resist layer used for forming the wiring groove pattern is removed after transferring the wiring groove pattern in the step (b), and the hole pattern mask is directly formed on the stopper layer. Is formed.

  15. 15. The method of manufacturing a semiconductor device according to item 13 or 14, wherein the etching process in the step (f) is performed with a first stopper insulating layer in the hole pattern region and with a second stopper insulating layer in the wiring groove pattern region. Machining ends or stops.

  16. 16. The method for manufacturing a semiconductor device according to 13, 13, or 15, wherein the first and second stopper insulating layers and the stopper layer are made of a silicon nitride film.

  17. 17. The method for manufacturing a semiconductor device according to Item 16, wherein the stopper layer has a thickness greater than that of the first and second stopper insulating layers.

  18. 18. The method for manufacturing a semiconductor device according to any one of Items 13 to 17, wherein the hole pattern mask is a resist mask.

  19. 19. The method for manufacturing a semiconductor device according to any one of Items 13 to 18, further comprising a step of removing the stopper layer after the step (f).

  20. 16. The method for manufacturing a semiconductor device according to the item 15, wherein the method includes a step of removing the stopper layer, the first stopper layer, and the second stopper layer after the step (f), and thereafter forming the wiring groove and the connection hole. A conductive film is embedded to form a wiring and an interlayer connection member.

  21. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, comprising: (a) a first stopper insulating layer, a first insulating layer, and a stopper layer (B) a step of transferring the wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of the connection hole in which the interlayer connection member is formed, and (d) in the presence of the hole pattern mask. The step of etching the stopper layer and the first insulating layer, etching to the middle of the first insulating layer to transfer the hole pattern, (e) the step of removing the hole pattern mask, (f) the hole pattern and the wiring A step of performing an etching process in the presence of the stopper layer on which the groove pattern is formed to form a connection hole and a wiring groove.

  22. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, comprising: (a) a first stopper insulating layer, a first interlayer insulating layer, a marker A step of sequentially forming an insulating layer, a second interlayer insulating layer, and a stopper layer; (b) a step of transferring a wiring groove pattern to the stopper layer; and (c) forming a hole pattern mask of a connection hole in which an interlayer connection member is formed. (D) a step of transferring the hole pattern by etching the second interlayer insulating layer and the marker insulating layer in the presence of the hole pattern mask; (e) a step of removing the hole pattern mask; Etching process is performed in the presence of the stopper layer on which the pattern and the wiring groove pattern are formed to form a connection hole and a wiring groove. Detected by plasma emission elements included in the layer are determined in terms of reaching the end point of the etching process of the hole pattern in the step (f) with the first stopper insulating layer.

  23. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein: (a) a first interlayer insulating layer, a marker insulating layer, a second interlayer A step of sequentially forming an insulating layer and a stopper layer; (b) a step of transferring a wiring groove pattern to the stopper layer; (c) a step of forming a hole pattern mask of a connection hole in which an interlayer connection member is formed; and (d) a hole. Etching the second interlayer insulating layer and the marker insulating layer in the presence of the pattern mask to transfer the hole pattern; (e) removing the hole pattern mask; and (f) the hole pattern and the wiring groove pattern. Etching step in the presence of the formed stopper layer to form connection holes and wiring grooves, and (f) including the end point of the etching process of the groove pattern in step (f) in the marker insulating layer. Detected by elements of the plasma luminescence.

  24. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein: (a) a first stopper insulating layer, a first interlayer insulating layer, a first (2) Step of sequentially forming the stopper insulation, the second interlayer insulation layer, the marker insulation layer, the third interlayer insulation layer and the stopper layer, (b) the step of transferring the wiring groove pattern to the stopper layer, (c) the formation of the interlayer connection member Forming a hole pattern mask for the connection hole, and (d) etching the third interlayer insulating layer, the marker insulating layer, the second interlayer insulating layer, and the second stopper insulating layer in the presence of the hole pattern mask. , A step of transferring the hole pattern, (e) a step of removing the hole pattern mask, (f) etching treatment in the presence of the stopper layer on which the hole pattern and the wiring groove pattern are formed, and the connection hole and the wiring groove Includes the step of forming simultaneously, detected by plasma emission element contained the end point of the etching process of the groove pattern the marker insulating layer in step (f).

  25. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, comprising: (a) a first interlayer insulating layer, a second interlayer insulating layer, and a stopper A step of sequentially forming layers, (b) a step of transferring a wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of a connection hole in which an interlayer connection member is formed, and (d) the presence of the hole pattern mask. The step of etching the stopper layer and the second interlayer insulating layer to transfer the hole pattern, (e) the step of removing the hole pattern mask, (f) the stopper layer on which the hole pattern and the wiring groove pattern are formed The first interlayer insulating layer and the second interlayer insulating layer are made of materials having different etching rates from each other. ) To determine the end point of the etching process of the groove pattern at the point reaching the second interlayer insulating layer in the process.

  26. A method for manufacturing a semiconductor device, comprising: a wiring groove formed with a constant width; a wiring formed in the wiring groove; and an interlayer connection member for connecting the wiring and its lower layer wiring. A step of forming a first insulating layer; (b) a step of forming a wiring groove pattern layer serving as an etching mask when forming a wiring groove on the first insulating layer; and (c) an interlayer on the wiring groove pattern layer. A step of forming a hole pattern layer serving as an etching mask when forming a connection hole in which a connection member is formed; (d) in the presence of the hole pattern layer, the etching rate of the wiring groove pattern layer is the etching of the first insulating layer; Etching process under conditions slower than the speed, transferring a hole pattern having a predetermined depth to the first insulating layer, (e) removing the hole pattern layer, (f) wiring groove pattern layer and hole pattern Etching in the presence Step of performing management including,.

  27. 27. The method of manufacturing a semiconductor device according to Item 26, wherein the diameter dimension of the hole pattern in the width direction of the wiring groove pattern layer is larger than the width dimension of the groove pattern layer.

  28. 28. The method of manufacturing a semiconductor device according to any one of Items 1 to 27, further comprising: (g) a step of forming a barrier metal layer and a copper layer on the entire surface of the substrate; and (h) an etching in the step (f). A step of removing the barrier metal layer and the copper layer in regions other than the inside of the wiring groove and the connection hole formed by the treatment by a chemical mechanical polishing method.

  29. 29. The manufacturing method of a semiconductor device according to item 28, wherein the wiring groove pattern layer or the stopper layer is removed in the step (h).

  30. 30. The method for manufacturing a semiconductor device according to 29, wherein the wiring groove pattern layer or the stopper layer or the mask layer for patterning the wiring groove pattern layer or the stopper layer is made of a conductive material.

  31. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein (a) a step of sequentially forming a first insulating layer and a stopper layer; (B) a step of transferring the wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of the connection hole in which the interlayer connection member is formed, and (d) the stopper layer and the first layer in the presence of the hole pattern mask. A step of performing a first etching process on a portion of one insulating layer to transfer a hole pattern; (e) a step of removing a hole pattern mask; and (f) presence of a stopper layer on which the hole pattern and the wiring groove pattern are formed. And a step of forming a connection hole and a wiring groove, and the ridges of the stopper layer and the first insulating layer are etched by either or both of the first and second etching processes. It is.

  32. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein (a) a step of sequentially forming a first insulating layer and a stopper layer; (B) a step of transferring the wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of the connection hole in which the interlayer connection member is formed, and (d) a first insulating layer in the presence of the hole pattern mask. A step of performing a first etching process on a part of the substrate and transferring the hole pattern; (e) a step of removing the hole pattern mask; and (f) a second layer in the presence of a stopper layer in which the hole pattern and the wiring groove pattern are formed. Including at least one of the first and second etching processes, the end of the stopper layer is etched, including a step of forming a connection hole and a wiring groove by performing an etching process.

  33. 33. The method of manufacturing a semiconductor device according to 31 or 32, further comprising: (g) a step of forming a barrier metal layer and a copper layer on the entire surface of the substrate; A step of removing the metal layer and the copper layer by a chemical mechanical polishing method, and in step (h), a part of the copper layer and the barrier metal layer located above the wiring groove, the stopper layer, and the surface of the first insulating layer Part is removed.

  34. 34. The method of manufacturing a semiconductor device according to Item 33, wherein the copper layer includes a first copper layer functioning as a seed layer and a second copper layer formed by a plating method.

  35. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein (a) a first insulating layer and a stopper layer are provided on the lower layer wiring A step of sequentially forming, (b) a step of transferring the wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of the connection hole in which the interlayer connection member is formed, and (d) in the presence of the hole pattern mask. Etching the first insulating layer to transfer the hole pattern; (e) removing the hole pattern mask; and (f) second in the presence of a stopper layer on which the hole pattern and the wiring groove pattern are formed. An etching process is performed to form a connection hole and a wiring groove, and the hole pattern mask in the step (c) is formed in accordance with the lower layer wiring.

  36. A method of manufacturing a semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein (a) a first insulating layer and a stopper layer are provided on the lower layer wiring A step of sequentially forming, (b) a step of transferring the wiring groove pattern to the stopper layer, (c) a step of forming a hole pattern mask of the connection hole in which the interlayer connection member is formed, and (d) in the presence of the hole pattern mask. Etching the first insulating layer to transfer the hole pattern; (e) removing the hole pattern mask; and (f) second in the presence of a stopper layer on which the hole pattern and the wiring groove pattern are formed. An etching process is performed to form a connection hole and a wiring groove, and the hole pattern mask in the step (c) is formed in accordance with the center of the lower layer wiring and the wiring groove pattern.

  37. 37. The method of manufacturing a semiconductor device according to any one of Items 1 to 36, wherein the planar shape of the hole pattern in the step (c) is transferred to configure the planar shape of the connection hole, and (b) and (C) The sum of the pattern plane shape of the process is transferred to form the plane shape of the wiring.

  38. 38. The method of manufacturing a semiconductor device according to any one of Items 1 to 37, wherein the mask of (b) is configured by a resist or a hard mask.

  39. 39. The method of manufacturing a semiconductor device according to any one of Items 1 to 38, wherein a diameter of the connection hole and a wiring width of the wiring are substantially equal.

  40. A semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein a marker insulating layer is provided in the interlayer insulating layer separating the lower layer wiring and the wiring in the wiring groove. The marker insulating layer is included between the bottom surface of the wiring groove and the lower layer wiring.

  41. A semiconductor device having a wiring formed in a wiring groove and an interlayer connection member for connecting the wiring and its lower layer wiring, wherein the cross-sectional shape of the wiring increases its width with a greater inclination toward the surface. Shape.

  42. A method for manufacturing a semiconductor device, comprising: forming an antireflection film on an insulating film having a wiring underneath and having a planarized surface; and applying and forming a resist film on the antireflection film; Irradiating patterned exposure light on the film.

  43. 43. The method of manufacturing a semiconductor device according to the item 42, wherein the wiring is filled with a conductor in a wiring groove formed in a lower insulating film of the insulating film, and the conductor in a region other than the wiring groove is removed by a CMP method. The insulating film formed by this and having a flattened surface is formed on the lower layer wiring and the wiring by a deposition method.

  44. 43. The method of manufacturing a semiconductor device according to Item 42, wherein the wiring is formed by depositing a conductive film and patterning by a photolithography method, and the insulating film having a planarized surface is formed by depositing an insulating film covering the wiring; The surface of the deposited insulating film is formed by performing a CMP method.

  45. A method of manufacturing a semiconductor device, comprising: depositing a second insulating film having an etching selectivity with respect to the first insulating film on the first insulating film; and patterning a wiring groove pattern on the second insulating film Forming a first resist film, etching the second insulating film in the presence of the first resist film, transferring the wiring groove pattern to the second insulating film, and preventing reflection on the second insulating film A step of forming a film, a step of applying and forming a second resist film on the antireflection film, and a step of irradiating the second resist film with exposure light shaped into a connection hole pattern.

  46. 46. The method for manufacturing a semiconductor device according to the item 45, wherein the film thickness of the second insulating film is so thin that the surface after forming the antireflection film can be regarded as flat.

  47. 47. The method for manufacturing a semiconductor device according to Item 45 or 46, wherein the second insulating film is thinner than the first insulating film and the second resist film.

  48. A method for manufacturing a semiconductor device, comprising: forming a wiring groove mask and then forming an antireflection film; forming a connection hole mask on the antireflection film; and wiring groove mask and connection hole And transferring the wiring grooves and connection holes to the insulating film using a mask.

  49. 49. A manufacturing method of a semiconductor device as set forth in 48 above, wherein the antireflection film functions as a planarizing film.

  50. A method of manufacturing a semiconductor device comprising: a step of forming a planarizing film after forming a wiring groove mask; a step of forming a connection hole mask on the planarizing film; and a wiring groove mask and a connection hole And transferring the wiring grooves and connection holes to the insulating film using a mask.

  51. 50. The method of manufacturing a semiconductor device according to 50, wherein the planarizing film and the wiring groove mask are removed in a self-aligning manner with respect to the connection hole mask.

  52. A semiconductor device comprising: a wiring groove formed in an interlayer insulating film; a wiring formed in the wiring groove; a connection hole formed in the interlayer insulating film; and a connection member formed in the connection hole. The diameter is substantially equal to the wiring width of the wiring groove, and the wiring and the connection member are formed integrally.

  53. 53. The semiconductor device according to Item 52, wherein the planar shape of the wiring is the sum of the planar shape of the connection hole and the wiring width portion of the diameter of the connection hole.

  54. 53. The semiconductor device according to Item 52, wherein the wiring groove and the connection hole overlap with each other in a planar shape area of the connection hole.

  55. 55. The semiconductor device according to Item 52, 53, or 54, further including a first wiring having a constant wiring width larger than a diameter of the connection hole, wherein the first wiring and the connection hole Overlapping with planar area.

  56. A method of manufacturing a semiconductor device, comprising: forming a first mask film on a pattern film; then forming an antireflection film; forming a second mask film on the antireflection film; And a step of transferring the pattern to the film to be patterned using the second mask film.

  57. A method of manufacturing a semiconductor device, comprising: forming a planarizing film after forming a first mask film on a patterned film; forming a second mask film on the planarizing film; And a step of transferring the pattern to the film to be patterned using the second mask film.

  58. 58. The method for manufacturing a semiconductor device according to 56 or 57, wherein the antireflection film or the planarizing film and the first mask film are removed in a self-aligning manner with respect to the second mask film.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, even when the fine dual damascene groove is formed, it is possible to avoid the foreign matter from remaining in the connection hole and improve the reliability of wiring connection and the performance of the semiconductor device.

It is sectional drawing which showed an example of the manufacturing method of the semiconductor device which is one embodiment (Embodiment 1) of this invention in process order. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 13A is a plan view showing the overlap between the wiring pattern and the hole pattern of the first embodiment, and FIG. 13B is a plan view in the case of having the dog bone shown for comparison. It is. FIG. 13C is a plan view showing another example of the wiring pattern and hole pattern of the first embodiment. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 23A is a plan view showing a wiring pattern of the semiconductor device of the first embodiment, and FIGS. 23B and 23C are cross-sectional views of FIG. It is the top view and sectional view which showed the wiring pattern of the semiconductor device shown for the comparison. FIG. 10 is a cross-sectional view showing another example of the method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 10 is a cross-sectional view showing another example of the method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 11 is a cross-sectional view showing still another example of the method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 11 is a cross-sectional view showing still another example of the method for manufacturing the semiconductor device of the first embodiment in the order of steps. FIG. 11 is a cross-sectional view showing still another example of the method for manufacturing the semiconductor device of the first embodiment in the order of steps. (A)-(c) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is other embodiment (Embodiment 2) of this invention in the order of the process. (D)-(e) is the partial cross section figure which showed the manufacturing method of the semiconductor device of Embodiment 2 in the order of the process. (A)-(c) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 3) of this invention in the order of the process. (D)-(e) is the partial cross section figure which showed the manufacturing method of the semiconductor device of Embodiment 3 in the order of the process. (A)-(d) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 4) of this invention in the order of the process. (E)-(g) is the partial cross section figure which showed the manufacturing method of the semiconductor device of Embodiment 4 in the order of the process. (A)-(d) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 5) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 6) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 7) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 8) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another Embodiment (Embodiment 9) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another Embodiment (Embodiment 10) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 11) of this invention in the order of the process. (A)-(f) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 12) of this invention in the order of the process. (A) And (b) is the partial cross section figure which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 13) of this invention. (A), (b1)-(b3), (c1)-(c3) are the planes which showed the manufacturing method of the semiconductor device which is further another embodiment (Embodiment 14) of this invention in order of the process. It is a figure and a partial sectional view. FIG. 38 is a plan view showing a wiring pattern of the semiconductor device of the fourteenth embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment 1)
1 to 22 are cross-sectional views or plan views showing an example of the manufacturing method of the semiconductor device of this embodiment in the order of steps. Hereinafter, it demonstrates in order of a process using drawing.

First, as shown in FIG. 1, a semiconductor substrate 1 made of, for example, p ⁻ type single crystal silicon is prepared, and an element isolation region 2 is formed on the main surface of the semiconductor substrate 1. The element isolation region 2 can be formed as follows, for example. First, a silicon oxide film (SiO) and a silicon nitride film (SiN) are sequentially formed on the main surface of the semiconductor substrate 1, and the silicon nitride film is etched using a patterned photoresist film. A shallow groove is formed in the semiconductor substrate 1 using the nitride film as a mask. After that, an insulating film for embedding the shallow groove, for example, a silicon oxide film is deposited, the silicon oxide film in a region other than the shallow groove is removed by using a CMP (Chemical Mechanical Polishing) method, and a silicon nitride film is further formed by a wet etching method or the like. Remove. Thereby, the element isolation region 2 is formed.

  Next, impurities are ion-implanted using the patterned photoresist film as a mask to form p-well 3 and n-well 4. The p well 3 is ion-implanted with an impurity having a p-type conductivity, such as boron (B), and the n well 4 is ion-implanted with an impurity having an n-type conductivity, such as phosphorus (p). Thereafter, an impurity for controlling the threshold value of the MISFET may be ion-implanted into each well region.

Next, a silicon oxide film to be the gate insulating film 5, a polycrystalline silicon film to be the gate electrode 6, and a silicon oxide film to be the cap insulating film 7 are sequentially deposited to form a laminated film, which is then patterned by photolithography. The laminated film is etched using the resist film as a mask. Thereby, the gate insulating film 5, the gate electrode 6, and the cap insulating film 7 are formed. The gate insulating film 5 can be formed by, for example, a thermal CVD method, and the gate electrode 6 can be formed by a CVD (Chemical Vapor Deposition) method. In order to reduce the resistance value of the gate electrode 6, an n-type or p-type impurity may be doped according to the channel type of the MISFET. In other words, the gate electrode of the n-channel MISFET may be doped with n-type impurities, and the gate electrode of the p-channel MISFET may be doped with p-type impurities. In this case, an ion implantation method can be used. Note that a refractory metal silicide film such as WSi _x , MoSi _x , TiSi _x , or TaSi _x may be stacked on the gate electrode 6, and a barrier metal layer such as titanium nitride (TiN) or tungsten nitride (WN) is formed. A metal layer such as tungsten may be formed therebetween. Thereby, the sheet resistance value of the gate electrode 6 can be reduced, and the operating speed of the MISFET can be improved. The cap insulating film 7 can be deposited by, for example, a CVD method.

  Next, after depositing a silicon oxide film on the semiconductor substrate 1 by, for example, the CVD method, the silicon oxide film is anisotropically etched to form side wall spacers 8 on the side walls of the gate electrode 6. Thereafter, n-type impurities (for example, phosphorus and arsenic) are ion-implanted into the p-well 3 using the photoresist film as a mask, and n-type semiconductor regions 9 are formed on both sides of the gate electrode 6 on the p-well 3. N-type semiconductor region 9 is formed in a self-aligned manner with respect to gate electrode 6 and sidewall spacer 8. The n-type semiconductor region 9 functions as a source / drain region of the n-channel MISFET Qn. Similarly, using a photoresist film as a mask, p-type impurities (for example, boron) are ion-implanted into the n-well 4 to form p-type semiconductor regions 10 on both sides of the gate electrode 6 on the n-well 4. The p-type semiconductor region 10 is formed in a self-aligned manner with respect to the gate electrode 6 and the sidewall spacer 8, and functions as a source and drain region of the p-channel MISFET Qp.

  Note that a low concentration impurity semiconductor region may be formed before the sidewall spacers 8 are formed, and a high concentration impurity semiconductor region may be formed after the sidewall spacers 8 are formed to form a so-called LDD (Lightly Doped Drain) structure.

  Next, as shown in FIG. 2, after a silicon oxide film is deposited on the semiconductor substrate 1 by a sputtering method or a CVD method, the silicon oxide film is polished by, for example, a CMP method, thereby planarizing the surface. A one-layer insulating film 11 is formed. The first interlayer insulating film 11 may be formed of a laminated film such as a silicon nitride film, an SOG (Spin On Glass) film, a BPSG (Boron Phosphor Silicate Glass) film, or a PSG (Phosphor Silicate Glass) film.

  Next, a connection hole 12 is formed in the first interlayer insulating film 11 using a photolithography technique. The connection hole 12 is formed in a necessary portion on the n-type semiconductor region 9 or the p-type semiconductor region 10.

  Next, the plug 13 is formed in the connection hole 12 as follows, for example. First, a titanium nitride (TiN) film is formed on the entire surface of the semiconductor substrate 1 including the inside of the connection hole 12. The titanium nitride film can be formed by, for example, a CVD method. Since the CVD method is excellent in the step coverage of the film, a titanium nitride film can be formed with a uniform film thickness in the fine connection hole 12. Next, a tungsten (W) film that fills the connection hole 12 is formed. The tungsten film can be formed by, for example, a CVD method. Similarly, if the CVD method is used, the fine connection hole 12 can be filled with tungsten. Next, the plug 13 can be formed by removing the titanium nitride film and the tungsten film in a region other than the connection hole 12 by, for example, a CMP method. Before forming the titanium nitride film, for example, a titanium (Ti) film may be deposited, and heat treatment may be performed to silicide the semiconductor substrate (n-type or p-type semiconductor regions 9 and 10) at the bottom of the connection hole 12. . By forming such a silicide layer, the contact resistance at the bottom of the connection hole 12 can be reduced.

  Next, for example, a tungsten film is formed on the entire surface of the semiconductor substrate 1, and this tungsten film is patterned by a photolithography technique to form the wiring 14 of the first wiring layer. The tungsten film can be formed by a CVD method or a sputtering method.

  Next, as shown in FIG. 3, an insulating film, such as a silicon oxide film, covering the wiring 14 is formed, and this insulating film is planarized by CMP to form a second interlayer insulating film 15.

  Next, a photoresist film having an opening in a region where a connection hole is to be formed is formed on the second interlayer insulating film 15, and etching is performed using this photoresist film as a mask. Thereby, a connection hole 16 is formed in a predetermined region of the second interlayer insulating film 15.

  Next, the plug 17 is formed in the connection hole 16. The plug 17 can be formed as follows. First, a barrier layer is formed on the entire surface of the semiconductor substrate 1 including the inside of the connection hole 16, and a copper (Cu) film that fills the connection hole 16 is formed. Thereafter, the copper film and the barrier film in the region other than the connection hole 16 are removed by the CMP method to form the plug 17.

  The barrier layer has a function of preventing the diffusion of copper into the periphery of the second interlayer insulating film 15 and the like. For example, a titanium nitride film can be exemplified. Note that the film is not limited to the titanium nitride film, and may be another metal film as long as it has a copper diffusion preventing function. For example, tantalum (Ta) or tantalum nitride (TaN) can be used instead of titanium nitride. The barrier layer in the next step and below will be described by exemplifying a titanium nitride film, but it can be replaced with tantalum, tantalum nitride, or the like as described above.

  The copper film functions as a main conductive layer and can be formed by, for example, a plating method. A thin copper film can be formed as a seed film by sputtering before the plating film is formed. Further, the copper film may be formed by a sputtering method. In this case, after the copper film is formed by sputtering, the copper film may be fluidized by heat treatment to improve the filling characteristics in the connection hole or the wiring groove. The case where the copper film in the next step and below is formed by plating is exemplified, but the sputtering method may be used as described above.

  Next, as shown in FIG. 4, a stopper insulating film 18 is formed on the second interlayer insulating film 15, and an insulating film 19 for forming a second wiring layer is further formed. The stopper insulating film 18 is a film that becomes an etching stopper when a groove is formed in the insulating film 19, and a material having an etching selectivity with respect to the insulating film 19 is used. The stopper insulating film 18 is a silicon nitride film, for example. The insulating film 19 is made of a material having a low dielectric constant in order to keep the line capacitance between wirings low. The insulating film 19 is a silicon oxide film, for example. The stopper insulating film 18 and the insulating film 19 are formed with the second layer wiring described below. For this reason, the total film thickness is determined by the design film thickness required for the second wiring layer. In consideration of reducing the inter-wiring capacitance, it is desirable that the thickness of the stopper insulating film 18 made of a silicon nitride film having a high dielectric constant is as thin as possible if the film thickness is sufficient to achieve the stopper function.

  Next, a photoresist film having an opening in the wiring pattern is patterned on the insulating film 19, and first etching is performed using the photoresist film as a mask. A part of the wiring trench 20 is formed in the insulating film 19 by this first etching. In this etching, a condition is selected in which the silicon oxide film is easily etched and the silicon nitride film is not easily etched. Thus, the stopper insulating film 18 (silicon nitride film) is used as an etching stopper. Thereafter, a second etching is performed by selecting a condition for etching the silicon nitride film. As described above, since the stopper insulating film 18 is formed to be sufficiently thin, over-etching in the second etching may be small, and excessive etching of the second interlayer insulating film 15 can be suppressed. Thus, by using the two-stage etching, the depth of the wiring groove 20 can be formed uniformly and reliably.

  Next, the wiring 21 of the second wiring layer is formed inside the wiring groove 20. Wiring 21 includes a barrier layer and a main conductive layer. The barrier layer is, for example, a titanium nitride film, and the main conductive layer is, for example, copper. The wiring 21 is formed as follows. First, a titanium nitride film is formed on the entire surface of the semiconductor substrate 1 including the inside of the wiring trench 20, and then a copper film that fills the wiring trench 20 is formed. For example, a CVD method is used to form the titanium nitride film, and a plating method is used to form the copper film. Before the copper film is formed by plating, a copper seed film can be formed by sputtering, for example. Thereafter, the copper film and the titanium nitride film in the region other than the wiring trench 20 are removed by CMP to form the wiring 21. As described above, the titanium nitride film can be replaced with another material, and the copper film can be formed by another manufacturing method such as sputtering.

  Next, as shown in FIG. 5, a stopper insulating film 22, an interlayer insulating film 23, a wiring forming stopper insulating film 24, and a wiring forming insulating film 25 are formed on the wiring 21 and insulating film 19 of the second wiring layer. Sequentially formed. The stopper insulating films 22 and 24 are made of a material having an etching selection ratio with respect to the interlayer insulating film 23 or the insulating film 25 and can be, for example, a silicon nitride film. On the other hand, the interlayer insulating film 23 or the insulating film 25 can be a silicon oxide film.

  Next, a wiring groove 26 is formed in the insulating film 25 and the stopper insulating film 24, and a connection hole 27 is formed in the interlayer insulating film 23 and the stopper insulating film 22. For the formation of the wiring groove 26 and the connection hole 27, a method for forming a groove 44 and a hole 45 of a fifth wiring layer, which will be described later, which is a groove and hole forming method according to the present invention, can be applied. Since it will be described in detail in the description of the fifth wiring layer, description thereof is omitted here.

  Next, the wiring 28 of the third wiring layer is formed inside the wiring groove 26 and the connection hole 27. A connecting member that connects the wiring 28 and the wiring 21 that is the lower layer wiring is formed integrally with the wiring 28. That is, the wiring 28 is formed by a so-called dual damascene method. For example, the wiring 28 is formed as follows. First, a titanium nitride film serving as a barrier layer is formed on the entire surface of the semiconductor substrate 1 including the inside of the wiring groove 26 and the connection hole 27 by, for example, a CVD method, and then a copper film filling the wiring groove 26 and the connection hole 27 is formed by, for example, a plating method. To form. Thereafter, the copper film and the titanium nitride film in the region other than the wiring trench 26 are removed by using the CMP method, and the wiring 28 formed integrally with the connection member is formed.

  As in the second wiring layer described above, a so-called single damascene method may be used in which a connection member (plug) is first formed and then the wiring 28 is formed in the wiring groove.

  Next, as shown in FIG. 6, a stopper insulating film 29, an interlayer insulating film 30, a wiring forming stopper insulating film 31, and a wiring forming insulating film 32 are sequentially formed on the insulating film 25 and the wiring. These insulating films 29 to 32 are the same as the stopper insulating film 22, the interlayer insulating film 23, the wiring forming stopper insulating film 24, and the wiring forming insulating film 25, respectively. Further, the connecting hole 33a for the connecting member is formed in the stopper insulating film 29 and the interlayer insulating film 30, and the wiring groove 33b is formed in the stopper insulating film 31 and the insulating film 32 in the same manner as in the third wiring layer. As a method of forming the groove 33a and the hole 33b, a method for processing the groove 44 and the hole 45 of the fifth wiring layer described below can be applied. Further, the wiring 33 of the fourth wiring layer is formed in the same manner as the wiring 28 of the third wiring layer. The wiring 33 is formed by a dual damascene method in which the connection member connected to the lower wiring 28 is formed as described above, but may be formed by a single damascene method in which the connection member and the wiring are formed separately. This is the same as in the case of the third wiring layer.

  Next, a method for forming a fifth wiring layer, which is a method for forming grooves and holes according to the present invention, will be described. As shown in FIG. 7, insulating films 34 to 38 are sequentially deposited on the wiring 33 and the insulating film 32 of the fourth wiring layer. The insulating films 34 and 36 are each made of, for example, a silicon nitride film, and have a film thickness of 50 nm, for example. The insulating film 35 is made of, for example, a silicon oxide film and has a thickness of, for example, 450 nm. The insulating film 37 is made of, for example, a silicon oxide film and has a thickness of, for example, 350 nm. The insulating film 38 is made of, for example, a silicon nitride film and has a film thickness of, for example, 100 nm.

  The silicon nitride film (insulating films 34, 36, and 38) can be formed using, for example, a plasma CVD method. By using the plasma CVD method, the film formation temperature can be lowered. The wiring forming process is a process close to the final process in the manufacturing process (so-called pre-process) of the semiconductor device, and therefore has a temperature that does not affect the device structure (impurity diffusion layer, silicide layer, etc.) already formed (for example, 400). It is desirable to process at a low temperature of about 0 ° C. The plasma CVD method has a great merit as a film forming method meeting the demand for such a low temperature. Further, the silicon oxide films (insulating films 35 and 37) can be formed by using, for example, a plasma CVD method. When the plasma CVD method is used, TEOS (Tetraethylorthosilicate) can be used as a source gas. When a silicon oxide film (hereinafter referred to as a TEOS oxide film) is formed using TEOS, the cluster fluidity during film formation can be increased, and a silicon oxide film having excellent step coverage can be formed. In addition, a dense silicon oxide film can be formed at a relatively low film formation temperature (for example, 400 ° C. or lower). Instead of the TEOS oxide film, a low dielectric constant SOG (Spin On Glass) film may be used. For example, an SOG film containing fluorine. If SOG having a low dielectric constant is used, the capacitance between wirings can be reduced, which can contribute to the improvement of the performance of the semiconductor device.

  A connection hole 45 is formed in the insulating films 34 and 35 as will be described later, and the insulating film 34 functions as an etching stopper when the connection hole 45 is formed. That is, the insulating film 35 is etched under the condition that the insulating film 34 is not easily etched with respect to the insulating film 35. The silicon nitride film applied to the insulating film 34 is a material having a higher dielectric constant than the silicon oxide film, and it is desirable that the film thickness be as thin as possible in order to reduce the capacitance between the wirings. As the film thickness of the insulating film 34, the minimum necessary film thickness required for the etching stopper when forming the connection hole can be selected. By keeping the thickness of the insulating film 34 low, the inter-wiring capacitance between the wiring layers can be reduced. The 50 nm conforms to such a requirement.

  A wiring groove 44 is formed in the insulating films 36 and 37 as will be described later, and the insulating film 36 functions as an etching stopper when the wiring groove 44 is formed as in the case of the insulating films 34 and 35. The insulating film 36 is only required to have a function as an etching stopper when the wiring groove is formed. Like the self-aligning method, the insulating film 36 functions as an etching stopper when forming the wiring groove, and at the time of forming the connection hole. Both functions as an etching mask are not required. For this reason, the film thickness of the insulating film 36 can be made thinner than in the case of the self-alignment method, and the capacitance between wirings can be reduced. Since a silicon nitride film is also applied to the insulating film 36, it is desirable that the silicon nitride film be as thin as possible as in the case of the insulating film 34. The 50 nm conforms to such a requirement.

  As will be described later, the insulating film 38 functions as a mask when forming the wiring trench. As will be described later, since the insulating film 38 can be removed at the time of wiring formation, the thickness of the insulating film 38 does not affect the capacitance between the wirings (device characteristics). Therefore, the thickness of the insulating film 38 only needs to be larger than the thickness that functions as a mask, and is not necessarily the minimum necessary thickness. The said 100 nm considers such conditions.

  In the present embodiment, a silicon nitride film is exemplified as a stopper film when forming the connection hole 45 or the wiring groove 44. However, if the material has an etching selectivity with respect to the silicon oxide film or the SOG film, silicon is used. The nitride film is not limited. For example, another silicon oxide film having an etching selectivity with respect to the TEOS oxide film may be used.

  The film thickness of the silicon oxide film (insulating films 35 and 37) can be arbitrarily selected depending on the thickness required for the wiring and the separation distance between the wiring layers. However, the design value for the wiring thickness is selected on the condition that the necessary wiring cross-sectional area can be secured in relation to the wiring width, and the separation distance between the wiring layers is designed based on the withstand voltage between the wirings or the capacitance between the wirings. A value is selected. Therefore, the thickness of the silicon oxide film is selected in consideration of these design values.

  Next, as shown in FIG. 8, a resist film 39 is formed on the insulating film 38 by using a photolithography technique. The resist film 39 is patterned so that an opening is formed in a region where a wiring groove which is the wiring pattern 40a and the stacked via portion 40b is formed, that is, the wiring groove pattern and the via pattern. The pattern width dL is, for example, 350 nm.

  Further, as shown in FIG. 13A, the wiring pattern 40a is formed with the same width in the portion where it is formed linearly. That is, as shown in FIG. 13B, in the region where the connection hole is formed, a pattern is formed in the wiring groove pattern in consideration of misalignment between the connection hole photomask and the wiring groove photomask. Although a region (so-called dock bone region D) wider than the width (wiring groove width) may be provided, such a wide region is not formed in this embodiment. Therefore, the wiring interval Sa can be formed to the minimum, the integration degree of the wiring formation can be improved, and the logic can be highly integrated. In addition, since the wiring pattern 40a is straight and simple, exposure light interference during photolithography does not occur, and the processing accuracy of the development pattern can be improved.

  Note that an antireflection film may be formed before the resist film 39 is formed. In this embodiment, since the CMP method is used to form the fourth wiring layer, and the insulating films 34 to 38 are formed on the fourth wiring layer using the CVD method, the insulating film 38 is formed on the insulating film 38. It is formed by flattening. However, the insulating film is generally transparent in the wavelength region of the exposure light, and if the antireflection film is not formed, the exposure light reaches the wiring 33 of the fourth wiring layer, and scattered light is generated by the wiring 33 and scattered. The exposure accuracy of the resist film 39 by light is lowered, and precise processing is hindered. However, when an antireflection film is formed on the insulating film 38, such scattered light is not generated, and the processing (patterning) accuracy of the resist film 39 can be improved.

Next, as shown in FIG. 9, a dry etching process is performed in the presence of the resist film 39, and the wiring groove pattern 40 a, the insulating film 38 (also an antireflection film if an antireflection film is formed). 40b is transferred. The dry etching conditions are selected so that the silicon nitride film is etched. That is, the pressure is, for example, 50 mTorr, the etching gas is, for example, a mixed gas of CHF ₃ , O ₂ , and Ar, the flow rates are, for example, 20, 20, 200 sccm, the RF (Radio Frequency) input power is, for example, 1200 W, and the substrate temperature is, for example, 0 The condition of ° C can be selected. When such a condition is selected, the etching rate of the insulating film 38 which is a silicon nitride film and the etching rate of the underlying insulating film 37 (silicon oxide film) are substantially the same. That is, it is difficult to selectively etch the insulating film 38 with respect to the insulating film 37. However, as described above, the thickness of the insulating film 38 is sufficiently thin with respect to the insulating film 37, and the amount of etching of the insulating film 37 is not reduced even if the overetching is slightly performed during the etching process of the insulating film 38. The amount is relatively small compared to the film thickness. For this reason, selectivity is not particularly required in this etching process.

When an antireflection film is formed, the following conditions can be selected for etching the antireflection film. That is, for example, the pressure is 750 mTorr, the etching gas is CHF ₃ , CF ₄ , Ar mixed gas, the flow rate is 10, 90, 950 sccm, the RF input power is 900 W, and the substrate temperature is 40 ° C., for example. You can select conditions.

  Next, as shown in FIG. 10, the resist film 39 is removed. In this manner, a wiring groove pattern layer to which the wiring groove patterns 40a and 40b are transferred is formed. The wiring groove pattern layer is made of an insulating film 38 that is a silicon nitride film.

  Next, as shown in FIG. 11, an antireflection film 41 is formed so as to cover the insulating film 38 which is a wiring groove pattern layer, and a resist film 42 is further formed. For the antireflection film 41, for example, an organic material such as a novolac resin can be used. In the present embodiment, since the insulating film 38 is thinly formed as described above, the groove pattern 40 (steps of the insulating film 38) is filled by merely applying the antireflection film 41 normally, and the antireflection film 41 is formed. The surface can be planarized. That is, the antireflection film 41 functions as a flattening film for flattening the surface. By providing the antireflection film as a flattening film, the resist film 42 is formed flat to prevent the exposure focus from being shifted due to scattering or a step due to exposure, and the patterning accuracy of the resist film 42 can be improved.

Next, as shown in FIG. 12, a hole pattern 43 is formed in the resist film 42. The formation of the hole pattern 43 uses a normal photolithography technique by irradiation with exposure light shaped into a hole pattern and development. In this embodiment, as shown in FIG. 13 (a), the diameter _{d H} of the hole pattern 43, the groove pattern 40a, 40b same as to form the pattern width _{d L} of. For this reason, when the mask alignment between the groove patterns 40a and 40b and the hole pattern 43 is shifted, the hole pattern 43 is formed so as to protrude from the groove patterns 40a and 40b as shown in FIG. In general, since it is difficult to accurately match the groove patterns 40a and 40b and the hole pattern 43, the present embodiment assumes that the groove patterns 40a and 40b and the hole pattern 43 are formed to be shifted. That is, in the case of the present embodiment, the hole pattern 43 is also formed on a region where the openings of the groove patterns 40a and 40b are not formed, that is, a region where the insulating film 38 is left. In this respect, as shown in FIG. 13B, it is different from the case of having a region (dogbone region D) in which a part of the wiring groove G is expanded. In such a case, it is necessary to make the wiring pitch Pb larger than the wiring pitch Pa in the case of FIG. 13A (Pb> Pa), and the wiring density decreases. In addition, since the dog bone region D is formed in consideration of mask misalignment of the hole pattern 43, a film corresponding to the insulating film 38 (consisting of a silicon nitride film) is not formed below the hole pattern 43. As a result, the etching conditions of the connection hole described below are different from the present embodiment. That is, in the present embodiment, the hole pattern 43 is transferred under the condition that the silicon nitride film 38 is etched, but in the case shown in FIG. 13B, the etching is performed under such a condition that the silicon nitride film 38 is not etched. Is done. As a result, as will be described later with reference to FIGS. 17 and 22, interlayer connection wirings 50 a and 50 b are formed in the connection holes 45 having a planar shape of the hole pattern 43, and the sum of the groove patterns 40 a and 40 b and the hole pattern 43 is obtained. Wirings 49a and 49b are formed in the wiring grooves 44a and 44b having a planar shape.

Note that a cross section taken along line AB in FIG. 13A corresponds to AB in FIG. As described above, in the present embodiment, the width d _L of the wiring pattern 40a and the via portion 40b and the diameter d _H of the hole pattern 43 are formed to be the same, so that the wiring pattern 40a and the via portion which are groove patterns are formed. The interval between the wires 40b and the wiring pitch can be reduced, and the wiring can be densified and the logic can be highly integrated. Furthermore, by transferring the hole pattern 43 in a condition for etching the insulating film 38, the connection hole 45 can be formed in the planar shape of the hole pattern 43, the wiring 49a it is possible to make the caliber d _H, 49b of the pattern Can be made to be the sum of the groove patterns 40a and 40b and the hole pattern 43, the overlapping area of the wirings 49a and 49b and the connection hole 45 can be the plane shape of the hole pattern 43. The resistance of the wirings 49a and 49b can be reduced. Thus, in this embodiment, the wiring can be densified and the resistance of the wirings 49a and 49b can be reduced. That is, also in the via part 40b, the planar shape of the via wiring 49b is the sum planar shape of the groove pattern 40b and the hole pattern 43, and the overlapping area of the via wiring 49b and the connection hole 45 is set to the plane of the hole pattern 43. Since the shape can be obtained, the resistance of the stacked via portion 49b which is a via wiring can be reduced. That is, the interlayer connection wirings 50 a and 50 b can be formed in the planar shape of the hole pattern 43 having the same dimensions as the width Lw of the wirings 49 a and 49 b. Further, as shown in FIG. 13C, the wiring 40c having a wiring width wider than the wirings 49a and 49b, such as a power supply wiring and a clock wiring for supplying a GND potential or Vcc (Vcc> GND potential), is provided with a dog bone. It does not have to be, and is formed linearly with the same width, so that the processing accuracy can be improved. That is, in the present embodiment, the groove patterns 40a, 40b, and 40c shown in FIGS. 13 (a) and 13 (c) are formed.

Next, as shown in FIG. 14, an etching process is performed in the presence of the resist film 42 in which the hole pattern 43 is formed, and the hole pattern 43 is partially formed on the antireflection film 41, the insulating films 37 and 36, and the insulating film 38. Transcript. For the etching of the antireflection film 41, as described above, the pressure is 750 mTorr, the etching gas is a mixed gas of CHF ₃ , CF ₄ , and Ar, the flow rates are respectively 10, 90, 950 sccm, and the RF input power is 900 W, for example. For example, a substrate temperature of 40 ° C. can be selected. The following two methods can be employed for the etching process of a part of the insulating films 37 and 36 and the insulating film 38.

The first method is a method of etching the hole pattern 43 as shown in FIG. 14 in one step. In this case, the conditions for the etching process are selected so that the silicon nitride film and the silicon oxide film are etched at the same etching rate. For example, it is possible to select a condition where the pressure is 50 mTorr, the etching gas is a mixed gas of CHF ₃ , O ₂ , and Ar, the flow rates are 50, 10, 500 sccm, the RF input power is 3200 W, and the substrate temperature is −20 ° C. When such conditions are selected, the insulating film 38 made of a silicon nitride film, the insulating film 37 made of a silicon oxide film, and the insulating film 36 made of a silicon nitride film are etched at substantially the same speed. The etching depth (depth of the hole pattern 43) can be controlled by the etching processing time.

The second method is a first step of etching in which a part of the insulating film 38 is removed under the condition that the silicon nitride film is etched, and a selective etching in which the silicon oxide film is etched but the silicon nitride film is difficult to etch. This is a method of performing three-stage etching, which is a second step etching that etches the insulating film 37 under conditions and a third step etching that etches the insulating film 36 under conditions where the silicon nitride film is etched. According to such a three-stage method, the etching depth of the hole pattern 43 can be easily controlled. That is, by making the second stage etching selective etching, the insulating film 36 can function as a stopper for the second stage etching process, and the depth of the hole pattern 43 is made uniform without time management. can do. The etching conditions of the first step and the third step are, for example, a pressure of 30 mTorr, an etching gas of a mixed gas of C ₄ F ₈ , O ₂ , and Ar, the flow rates thereof are 12, 7, 400 sccm, the RF input power is 3400 W, A condition where the substrate temperature is 0 ° C. can be selected. As the etching conditions for the second step, for example, the pressure is 50 mTorr, the etching gas is a mixed gas of CHF ₃ and O ₂ , the flow rates are 20, 20 sccm, the RF input power is 1200 W, and the substrate temperature is 0 ° C., respectively. .

  In both the first method and the second method, the hole pattern 43 is formed so as to penetrate the insulating film 38. That is, even if the hole pattern 43 and the groove patterns 40a and 40b are formed out of alignment, the hole pattern 43 is not formed in a self-aligned manner with respect to the groove patterns 40a and 40b, and the opening diameter of the hole pattern 43 is as designed. The value dH can be secured. That is, the hole pattern 43 has a hole diameter dH irrespective of the groove patterns 40a and 40b, and there is no problem of a decrease in the connection hole diameter as in the conventional self-alignment system.

  In either of the first method and the second method, the hole pattern 43 is formed in the insulating film 36 through the insulating film 36 at this stage. That is, the hole pattern 43 is transferred to the insulating film 36. This is because the connection hole is simultaneously formed in the etching process for forming the wiring groove as will be described later. That is, when the insulating film 37 is etched to form the wiring groove, if the hole pattern 43 is formed in the insulating film 36 through the insulating film 36, the insulating film 35 in the hole pattern 43 region is simultaneously etched. In addition, a part of the connection hole can be formed simultaneously with the wiring groove. This point will be described in detail later.

  In the case of the first method, a step S is formed at the bottom of the hole pattern 43 as shown in the figure due to the misalignment between the hole pattern 43 and the groove patterns 40a and 40b. Even if such a level difference S occurs, as will be described later, the insulating film 34 functions as a stopper, so that the etching depth at the bottom of the hole is made uniform, and no problem occurs.

  Next, as shown in FIG. 15, the resist film 42 and the antireflection film 41 are removed by using, for example, an ashing method. At this stage, the groove pattern 40a, 40b by the insulating film 38 (groove pattern layer), the insulating films 36, 37, and the hole pattern 43 by a part of the insulating film 38 are formed.

  Thereafter, as shown in FIG. 16, etching is performed in the presence of the groove patterns 40 a and 40 b and the hole pattern 43 to transfer the groove patterns 40 a and 40 b to the insulating film 37 and the hole pattern 43 to the insulating film 35. Thereby, the wiring grooves 44a and 44b and a part of the connection hole 45 are formed. That is, since the insulating film 38 is formed in a region other than the groove patterns 40a and 40b and the hole pattern 43, this functions as a mask, and the insulating film 37 is etched in the region of the groove patterns 40a and 40b. In the region of the hole pattern 43, since the hole pattern is already formed in the insulating films 37 and 36, the insulating film 35 is etched. This etching proceeds simultaneously in both the groove and hole pattern regions, and a part of the wiring grooves 44a and 44b and the connection hole 45 are formed simultaneously. That is, since the connection hole 45 is formed in the planar shape of the hole pattern 43, the dimension Lw of the connection hole 45 is configured to be substantially equal to the wiring width Lw of the wiring grooves 44a and 44b. Thereby, the resistance of the wirings 49a and 49b can be reduced.

The conditions for this etching process are selected so that the silicon nitride film is difficult to etch and the silicon oxide film is etched. That is, for example, the pressure is 30 mTorr, the etching gas is a mixed gas of C ₄ F ₈ , Ar, O ₂ , and CO, the flow rates are 20, 500, 9, 100 sccm, the RF input power is 3600 W, and the substrate temperature is −20. It can be set to ° C.

  If such conditions are selected, the silicon nitride film is difficult to be etched and the silicon oxide film is easily etched, so that the insulating film 36 functions as a groove etching stopper and the insulating film 34 functions as a hole etching stopper. As a result, some over-etching is allowed and the uniformity of the groove depth and the hole depth can be improved. Further, it is not necessary to control the groove depth and the hole depth by time management, and the groove and hole processing can be performed stably. Furthermore, it is not necessary to align the etching end points of the groove bottom and the hole bottom, and either the groove or the hole may end the etching first. Even when the step S at the bottom of the hole pattern 43 exists, the step S is absorbed at the overetching stage, and the flatness of the hole bottom can be realized.

  However, it is preferable to optimize the film thicknesses of the insulating films 35 and 37 so as to align the etching end points of the grooves and holes as much as possible. By aligning the etching end time, the thickness of the insulating films 34 and 36 functioning as stoppers can be reduced, that is, the thickness of the silicon nitride film having a high dielectric constant can be reduced, thereby contributing to the reduction of the capacitance between the lines. .

Next, as shown in FIG. 17, an etching process is performed under conditions where the silicon nitride film is etched, and the insulating film 38, the insulating film 36 at the bottom of the groove patterns 40a and 40b, and the insulating film 34 at the bottom of the hole pattern 43 are etched. . Thereby, the wiring grooves 44a and 44b and the connection hole 45 are completed. The conditions for this etching process are, for example, a pressure of 50 mTorr, an etching gas of a mixed gas of CHF ₃ , O ₂ and Ar, a flow rate of 20, 20, 400 or 600 sccm, an RF input power of 1200 W, and a substrate temperature of 0, respectively. The condition of ° C can be selected. Although the silicon oxide film can also be etched by this etching treatment, the insulating films 38, 36, and 34 are sufficiently thin as compared with the insulating films 35 and 37. . The insulating film 38 is formed thicker than the insulating films 36 and 34. However, since the insulating film 38 functions as a mask at the time of simultaneous etching of the grooves and holes, the film thickness is reduced. Is easily etched away.

  In this etching step, it is sufficient that the insulating film 34 at the bottom of the hole pattern 43 is removed, and the insulating films 36 and 38 are not necessarily removed. That is, the purpose of this process is completion of the connection hole 45, and it is sufficient if the connection hole 45 is opened. However, as described above, the insulating films 36 and 38 are also etched at the same time as the insulating film 34. If the insulating film 36 is etched, the silicon nitride film, which is a high dielectric constant material at the bottom of the wiring trench, is removed, so This can contribute to a reduction in capacity. Further, even if the insulating film 38 is removed, the inter-wiring capacitance can be reduced similarly. Such an effect exists.

  Next, as shown in FIG. 18, a barrier metal layer 46 is formed. The barrier metal layer 46 has a function of preventing the diffusion of copper, which is a main component of the wiring and the interlayer connection wiring, and improving the adhesion between the copper and the silicon oxide film. As the barrier metal layer 46, for example, a tantalum (Ta) film can be used. When the tantalum film is applied to the barrier metal layer 46, the film thickness is about 100 nm on the insulating film 37 (on the substrate plane). Note that tantalum nitride (TaN), titanium nitride (TiN), or the like may be used instead of the tantalum film. Even these metal compound films can be applied to the barrier metal layer 46 as long as copper diffusion can be prevented. For the barrier metal layer 46, for example, a long throw sputtering method in which the distance between the target and the substrate is about 200 mm can be used. Thereby, the barrier metal layer 46 can be formed with a relatively uniform film thickness at the bottom of the fine connection hole 45. Note that a CVD method may be used instead of the long throw sputtering method, and a normal sputtering method may be used.

  Next, as shown in FIG. 19, a seed layer 47 is formed on the barrier metal layer 46. The seed layer 47 is a layer that serves as a seed for forming a copper plating layer described below, and is made of copper. For the seed layer 47, the above-described long throw sputtering method can be used, but instead, a CVD method or a normal sputtering method may be used. The film thickness of the seed layer 47 is about 100 nm on the substrate plane.

  Next, as shown in FIG. 20, a copper plating layer 48 is formed. As the plating method, either electrolytic plating or electroless plating may be used. The thickness of the plating layer 48 is about 300 nm on the substrate plane. As a result, the wiring grooves 44a and 44b and the connection hole 45 are simultaneously filled.

  In the present embodiment, the formation of the copper film (plating layer 48) by the plating method is shown, but it may be formed by the sputtering method. In this case, the seed layer 47 is not necessary. When a copper film is formed by sputtering, the copper can be reflowed by heat treatment so that copper is embedded in the connection hole 45 and the wiring grooves 44a and 44b.

  Next, as shown in FIG. 21, the plating layer 48 and the seed layer 47 are polished using a CMP method. Since copper has a high polishing rate, the copper portion is first removed.

  Further, the polishing is continued, and the barrier metal layer 46 (tantalum film) on the insulating film 37 is also removed as shown in FIG. Thus, the barrier metal layer 46 and the copper film (plating layer 48 and seed layer 47) other than the region of the wiring groove 44 are removed.

  For polishing by the CMP method, a polishing slurry containing an oxidizing agent such as hydrogen peroxide in which alumina abrasive grains are dispersed can be used. Further, it is possible to adopt a method in which the copper film and the barrier metal layer (tantalum film) are collectively polished with the same platen. The time required for polishing was 3 minutes including removal of the barrier metal layer 46 (100% polishing) for 2.5 minutes and over-polishing 0.5 minutes. After polishing by the CMP method, the polishing abrasive grains and copper adhering to the substrate surface can be removed by two-step brush scrub cleaning including cleaning using an aqueous ammonia solution having a concentration of 0.1% and cleaning using pure water. .

  As described above, the wirings 49a and 49b in the fifth wiring layer and the interlayer connection wirings 50a and 50b connected to the wiring 33 in the fourth wiring layer are completed. It is clear from the above description that the interlayer connection wirings 50a and 50b are formed integrally with the wirings 49a and 49b. Thereby, the dimension Lw of the interlayer connection wirings 50a and 50b can be configured to be substantially equal to the wiring width Lw of the wirings 49a and 49b. Further, the planar shape of the interlayer connection wirings 50 a and 50 b is configured by the planar shape of the hole pattern 43, and the wirings 49 a and 49 b are configured by the planar shape of the sum of the groove patterns 40 a and 40 b and the hole pattern 43.

  Thereafter, an arbitrary wiring layer equal to or higher than the sixth wiring layer can be formed by the same method, but detailed description is omitted. As described above, the wiring 28 in the third wiring layer and the wiring 33 in the fourth wiring layer are also formed by the same method as the wirings 49a and 49b in the fifth wiring layer. Of course, the wirings of the first wiring layer and the second wiring layer may be formed by the same method as the wirings 49a and 49b of the fifth wiring layer.

According to this embodiment, in addition to the effects described in the above steps, fine wiring can be formed with high reliability and low inter-wiring capacitance. That is, since the connection hole can be formed with the opening diameter of the hole pattern as in the case of the front hole method, the wiring cross-sectional area of the interlayer connection wiring can be secured, while the resist into the deep hole which has been a problem in the case of the front hole method Alternatively, it is not necessary to fill with an antireflection material. For this reason, problems such as a decrease in reliability due to residual resist or antireflection material do not occur. Further, in this embodiment, since the insulating film 36 functioning as an intermediate stopper can be formed thin, an increase in inter-wiring capacitance does not occur as is a problem in the self-alignment method. Further, by forming the hole pattern 43 with the same diameter d _H and the same pattern width d _{L as} the groove patterns 40a and 40b, the pitch of the wirings 49a and 49b can be reduced, and the wiring density can be improved and integrated. . Further, after forming the groove patterns 40a and 40b, the hole pattern 43 is formed, and the hole pattern 43 is transferred to the groove patterns 40a and 40b. That is, the silicon nitride film 38 is etched into the shape of the hole pattern 43, thereby The connection wirings 50a and 50b can be formed in the planar shape of the hole pattern 43, and the resistance of the wirings 49a and 49b can be reduced. In this manner, the wiring pitch can be reduced, the wiring density can be improved and integrated, and the resistance of the wirings 49a and 49b can be reduced.

  In the present embodiment, the formation of the hole pattern 43 is stopped in the middle of the insulating film 35 in the step of FIG. 14, but may be performed until the surface of the insulating film 34 is reached as shown in FIG. Even in such a case, since the insulating film 34 (silicon nitride film) is formed, it acts as a mask in the step of removing the resist film 42 and the antireflection film 41 as in FIG. 15 (FIG. 26). 26, even if the groove patterns 40a and 40b are transferred to the insulating film 37 as in FIG. 16, the insulating film 34 functions as an etching stopper at the time of this transfer.

  Further, in the stacked via portion 49b connecting the upper and lower wirings among the wirings, the formation of the groove pattern for forming the wiring grooves can be omitted. That is, as shown in FIG. 27, patterning of the wiring pattern 51 extending in the wiring layer is performed without patterning the portion connecting the upper and lower wirings. Next, as shown in FIG. A resist film 53 on which 52b is formed is formed. Next, the etching process in FIG. 14 is performed in the presence of the resist film 53. In this etching, since the insulating film 38 is etched under the condition that the silicon nitride film is etched, the insulating film 38 may be formed below the hole pattern 52b as shown in FIG. In such a case, it is not necessary to consider the misalignment between the wiring groove pattern 40b and the connection hole pattern 43 in the portion connecting the upper and lower wirings, the process can be simplified, and the resistance of the via wiring 49b can be secured at a low resistance.

  FIG. 23A shows a planar pattern of the wiring 49a formed according to this embodiment. FIGS. 23B and 23C are a cross-sectional view taken along line AB and a cross-sectional view taken along line CD in FIG. 23A, respectively. As shown in the figure, even if the wiring pitch Pa is reduced, the diameter dh of the connection hole 50a becomes larger than the diameter W, the resistance of the connection hole portion can be reduced, and the degree of integration can be improved and the resistance of the connection hole portion can be reduced.

  On the other hand, FIG. 24 shows, as a comparison, the case where the connection holes are formed by self-alignment (the case where the silicon nitride film 38 is not etched in the step of FIG. 14). As shown in the figure, when the hole pattern 43 is formed so as to be out of alignment with the wiring 49a, the connection hole is formed in an overlapping portion of the hole pattern 43 and the wiring 49a. For this reason, the diameter d ′ of the connection hole is smaller than the diameter d of the hole pattern 43 (d ′ <d), and the resistance of the connection hole portion is increased. If the diameter of the hole pattern 43 is increased to prevent this, the pitch Pc of the wiring 49a must be increased in consideration of pattern misalignment, and becomes larger than the pitch Pa in the present embodiment. (Pc> Pa). However, in the case of forming by self-alignment as shown in FIG. 24, it is not necessary to perform two-stage etching in the etching process shown in FIG. 14, and the corresponding etching process can be simplified to be a one-stage etching process. There is a merit.

(Embodiment 2)
30 and 31 are partial cross-sectional views illustrating a method of manufacturing a semiconductor device according to another embodiment of the present invention in the order of steps. 30 and 31 show only the fifth wiring layer of the first embodiment, and the left side portion in FIGS. 1 to 29 is shown to simplify the drawings.

  In the manufacturing method of the present embodiment, after the steps similar to those up to FIG. 12 in the first embodiment, as shown in FIG. 30A, the insulating films 34 to 38 are sequentially formed on the fourth wiring layer. After forming and patterning the groove pattern 40 on the insulating film 38, an antireflection film 41 and a resist film 42 are formed, and a hole pattern 43 is formed in the resist film 42. Note that, as shown in FIG. 13A, the hole pattern 43 is also disengaged from the groove pattern 40.

Next, as shown in FIG. 30B, an etching process is performed using the resist film 42 in which the hole pattern 43 is formed as a mask. The etching conditions for the antireflection film 41 are the same as those in the first embodiment. The etching conditions for the insulating film 36 are different from those in the first embodiment, and are performed under the condition that the silicon oxide film is etched and the silicon nitride film is difficult to be etched. For example, it is possible to select a condition in which the pressure is 50 mTorr, the etching gas is a mixed gas of CHF ₃ and O ₂ , the flow rates are 20, 20 sccm, the RF input power is 1200 W, and the substrate temperature is 0 ° C. Under such conditions, the silicon oxide film is etched, but the silicon nitride film is difficult to etch, so the insulating film 38 is not etched, and the insulating film 38 functions as an etching mask for the insulating film 37 together with the resist film 42. Therefore, the insulating film 37 in the region where the insulating film 38 (silicon nitride film) is formed is not etched, and the hole pattern 43 is not formed in the region where the hole pattern 43 and the groove pattern 40 are shifted. Is formed in a self-aligned manner with respect to the insulating film 38. For this reason, the connection hole is not formed out of the wiring groove, and the dimension between the wirings is small, and even if the wiring is formed at a high density, the influence of mask displacement between the wiring groove and the connection hole does not occur.

  Also in this embodiment, the hole pattern 43 needs to be transferred to the insulating film 36. When the insulating film 36 is etched, it is necessary to perform the etching under conditions where the silicon nitride film is etched. Therefore, in the present embodiment, when the hole pattern 43 is transferred to the insulating films 37 and 36, the first step etching under the condition that the silicon nitride film is difficult to etch and the second condition under which the silicon nitride film is etched. This is done in two stages, step etching.

  Next, the resist film 42 and the antireflection film 41 are removed in the same manner as in the process of FIG. 15 of the first embodiment (FIG. 30C), and then the wiring trench is processed in the same manner as in the process of FIG. The groove pattern 40 is transferred to the insulating film 37, and the hole pattern 43 is transferred to the insulating film 35 (FIG. 31D). Further, as shown in FIG. 31E, the insulating film 38, which is a silicon nitride film, the insulating film 36 at the bottom of the groove pattern 40, and the insulating film 34 at the bottom of the hole pattern 43 are removed to form a wiring groove 44 and a connection hole 45. To do. Subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, the connection hole 45 is formed in a self-aligned manner with respect to the wiring groove 44, which can contribute to the improvement of the wiring formation density.

(Embodiment 3)
32 and 33 are partial cross-sectional views showing a method of manufacturing a semiconductor device according to still another embodiment of the present invention in the order of steps. 32 and 33, only the fifth wiring layer of the first embodiment is shown as in the second embodiment, and the left side portion in FIGS. 1 to 29 is shown to simplify the drawing.

  In the manufacturing method of the present embodiment, after the same steps as those up to FIG. 12 in the first embodiment, insulating films 34 to 38 are sequentially formed on the fourth wiring layer, and a groove pattern is formed in the insulating film 38. 40 is patterned. Thereafter, a resist film 42 having an antireflection film 41 and a hole pattern 43 is formed. In the present embodiment, a case where the hole pattern 43 is not out of alignment with the groove pattern 40 will be described (FIG. 32A).

  Next, as shown in FIG. 32B, an etching process is performed using the resist film 42 in which the hole pattern 43 is formed as a mask. The etching conditions for the antireflection film 41 are the same as those in the first embodiment. By this etching process, the hole pattern 43 is transferred to the insulating films 37 and 36. The etching process in this case is performed after the first step etching under the condition that the insulating films 37 and 36 are continuously etched under the condition that the silicon nitride film is etched, or the silicon oxide film is etched but the silicon nitride film is not etched. Any one of the two-step etchings of the second-step etching depending on the conditions under which the silicon nitride film is etched can be selected. The conditions exemplified above can be selected as the conditions under which the silicon nitride film is etched and the conditions under which the silicon oxide film is etched but the silicon nitride film is difficult to etch.

  Also in this embodiment, the hole pattern 43 needs to be transferred to the insulating film 36.

  Next, the resist film 42 and the antireflection film 41 are removed in the same manner as in the step of FIG. 15 of the first embodiment (FIG. 32C), and then the wiring trench is formed in the same manner as in the step of FIG. 16 of the first embodiment. The groove pattern 40 is transferred to the insulating film 37, and the hole pattern 43 is transferred to the insulating film 35 (FIG. 33D). Further, as shown in FIG. 33 (e), the insulating film 38, which is a silicon nitride film, the insulating film 36 at the bottom of the groove pattern 40, and the insulating film 34 at the bottom of the hole pattern 43 are removed to form a wiring groove 44 and a connection hole 45. To do. Subsequent steps are the same as those in the first embodiment.

(Embodiment 4)
34 and 35 are partial cross-sectional views illustrating a method of manufacturing a semiconductor device according to another embodiment of the present invention in the order of steps. 34 and 35, only the fifth wiring layer of the first embodiment is shown as in the second embodiment, and the left side portion in FIGS. 1 to 29 is shown to simplify the drawings.

  In the manufacturing method of the present embodiment, after the same steps as those up to FIG. 15 in the first embodiment, the insulating films 34 to 38 are sequentially formed on the wiring 33 and the insulating film 32 of the fourth wiring layer, A groove pattern 40 is formed in the insulating film 38. Thereafter, using the resist film having the hole pattern 43, the hole pattern 43 is transferred to the insulating films 37 and 36, and the resist film (and the antireflection film) is removed (FIG. 34A).

  However, the thickness of the insulating film 38 is 70 nm, which is thinner than that in the first embodiment (100 nm).

  Next, as shown in FIG. 34B, the groove pattern 40 of the wiring groove is transferred to the insulating film 37 and the hole pattern 43 is transferred to the insulating film 35. Etching conditions for this transfer are the same as in the first embodiment. In the etching at the time of this transfer, since the insulating film 38 is formed as thin as 70 nm, the end portion of the insulating film 38 is etched during the etching and recedes. As a result, as shown in FIG. 34B, a gentle shoulder 54 is formed at the end of the groove pattern 40. Further, after the transfer of the groove pattern 40 to the insulating film 37 is completed and the insulating film 36 is exposed at the bottom of the groove pattern 40, the insulating film 36 is exposed to the etching atmosphere. If the etching is further continued at this time, the end portion of the insulating film 36 is similarly retracted by the etching, and a gentle shoulder portion 55 is also formed at the end portion of the hole pattern 43.

  By forming such shoulder portions 54 and 55, the opening portions of the wiring grooves and the connection holes are widened, and the metal film can be easily embedded. The cross-sectional shape of the shoulder portions 54 and 55 is a shape in which the width of the wiring groove or the connection hole is increased with a greater inclination toward the surface from the principle of formation (retreat by etching of the end portion of the mask layer). It becomes.

  Next, as shown in FIG. 34C, the insulating film 38, the insulating film 36 at the bottom of the groove pattern 40, and the insulating film 34 at the bottom of the hole pattern 43 are removed by etching. Thereby, the wiring groove 44 and the connection hole 45 are formed. The etching conditions in this step are the same as in the first embodiment.

  Next, a barrier metal layer 46 is formed in the same manner as in the step of FIG. 18 of the first embodiment (FIG. 34 (d)). Further, as in the steps of FIGS. 19 and 20 in the first embodiment, the seed layer 47 and A plating layer 48 is formed (FIG. 35E). In this embodiment, since the opening of the connection hole 45 and the wiring groove 44 is rounded by the shoulders 54 and 55, the barrier metal layer 46 and the seed layer 47 can be easily sputtered. . That is, since the opening is widened, the film is easily formed on the side wall and bottom surface of the groove or hole. Further, since the opening is widened in the formation of the plating layer 48, the embedding characteristic is excellent.

  Next, as shown in FIG. 35 (f), the plating layer 48 and the seed layer 47 are polished by the CMP method, and as shown in FIG. 35 (g), the barrier metal layer 46 is also removed by the CMP method. The CMP method in this step is the same as that in the first embodiment.

  However, in the polishing by the CMP method of this embodiment, the polishing is not stopped in a state where the barrier metal layer 46 on the insulating film 37 is removed (just etching), but the upper surface of the insulating film 37 is also polished. Overetching (overpolishing) is performed as described above. This over-etching is performed until the width of the shoulder portion 54 of the wiring groove 44 is reduced beyond a certain level. By performing over-etching in this way, the rounding portion of the shoulder portion 54 can be removed and the wiring width can be reduced to prevent a short circuit between wirings or a reduction in withstand voltage. That is, if the polishing is completed with the shoulder 54 remaining rounded, the distance between the wirings is shortened by the extent of the shoulder 54, causing a short circuit between adjacent wirings and a decrease in withstand voltage between adjacent wirings. There is a possibility. However, if the surface of the insulating film 37 is excessively polished and removed to a portion corresponding to the shoulder portion 54 as in the present embodiment, the expansion of the wiring width is reduced, and the above-described problems do not occur.

  The subsequent steps are the same as those in the first embodiment.

  According to the present embodiment, the openings of the wiring trench 44 and the connection hole 45 are formed widely so that the formation of the barrier metal layer 46, the seed layer 47, and the plating layer 48 can be facilitated or the embedding characteristics can be improved. it can.

  Further, by over-polishing the CMP method at the time of wiring formation, the widened portion of the opening of the wiring groove 44 can be removed, and the wiring spacing can be kept wide to reduce the leakage current between the wirings and improve the withstand voltage.

  In the present embodiment, the wiring metal is formed by the plating method, but may be formed by reflow by sputtering and heat treatment. In particular, when reflow is used, the formation of the shoulder portions 54 and 55 (rounding portions) of the present embodiment promotes smooth metal atom flow, and the effect of improving the embedding characteristics is remarkable.

(Embodiment 5)
The fifth embodiment is different in the formation method of the shoulder portions 54 and 55 of the fourth embodiment. That is, the shoulders 54 and 55 of the fourth embodiment can be realized by a method as shown in FIG. FIG. 36 is a partial cross-sectional view showing a method of manufacturing a semiconductor device according to still another embodiment of the present invention in the order of steps.

  That is, the groove pattern 40 is transferred to the insulating film 37 as in the step shown in FIG. 16 of the first embodiment (FIG. 36A). At this time. Etching is stopped so that the hole pattern 43 does not reach the insulating film 34. At this stage, the insulating film 38 is sufficiently thick (for example, 100 nm) so that the shoulder of the groove pattern 40 does not occur.

  Next, as shown in FIG. 36B, the insulating film 38 and a part of the insulating film 36 are etched under the condition that the silicon nitride film is etched. At this stage, the end portions 56 of the insulating films 38 and 36 are removed by etching.

  Next, as shown in FIG. 36C, the etching is continued under the condition that the silicon oxide film is etched but the silicon nitride film is difficult to etch. Since the silicon nitride film is not formed on the end portions 56 of the insulating films 38 and 36, the end portion 56 does not function as an etching mask, and the silicon nitride film is thinly formed on this portion. Therefore, the shoulder 57 is formed by this etching process.

  Thereafter, as shown in FIG. 36D, the insulating film 38, the insulating film 36 at the bottom of the groove pattern 40, and the insulating film 34 at the bottom of the hole pattern 43 are removed by etching. Thereby, the wiring groove 44 and the connection hole 45 are formed. Subsequent steps are the same as those in the fourth embodiment.

  According to the present embodiment, since the rounding is formed on the shoulder portion 57 as in the fourth embodiment, the same effect as in the fourth embodiment can be obtained.

(Embodiment 6)
FIG. 37 is a partial cross-sectional view showing an example of the manufacturing method of the semiconductor device of the present invention in the order of steps. In FIG. 37, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and the wiring portion and a portion of the interlayer connection wiring in the lower layer are shown to simplify the drawing.

  In the present embodiment, a case where the insulating film 36 functioning as an intermediate stopper in Embodiment 1 is not provided will be described.

  First, as shown in FIG. 37A, insulating films 34 and 35 and an insulating film 38 are sequentially formed on the lower wiring 33. The insulating films 34 and 38 are made of, for example, a silicon nitride film, and the insulating film 35 is made of, for example, silicon. The insulating films 34, 35, and 38 made of an oxide film are the same as those in the first embodiment. However, since the insulating film 35 serves as the insulating film 37 with a single layer, the film thickness is 850 to 900 nm. Next, the groove pattern 40 is transferred to the insulating film 38 using the resist film 39 as in the first embodiment.

  Next, as shown in FIG. 37B, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is further formed in the embodiment. 1 is formed.

  Next, as shown in FIG. 37C, the hole pattern 43 is transferred to the insulating film 35 using the resist film 42 as a mask. The transfer is performed by etching under the condition that the silicon oxide film is etched as in the first embodiment, and the depth of the hole pattern 43 in the insulating film 35 is 500 nm. The depth control of the hole pattern 43 is performed by managing the etching process time.

  Next, as shown in FIG. 37D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

  Next, as shown in FIG. 37E, the groove pattern 40 is transferred to the insulating film 35 using the insulating film 38 having the groove pattern 40 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. The depth of the groove pattern 40 is 400 nm, and the depth control is performed by managing the etching processing time.

  Since the hole pattern 43 is transferred to the insulating film 35 in advance during the etching process, the region of the hole pattern 43 is also etched at the same time, and the groove pattern 40 is etched at a depth of 400 nm. Reaches the insulating film 34.

  Next, as shown in FIG. 37 (f), the insulating film 38 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, since the silicon nitride film that is an intermediate stopper is not formed, the silicon nitride film having a high dielectric constant is not formed at the bottom of the wiring trench. As a result, the wiring capacitance can be reduced and the performance of the semiconductor device can be improved.

(Embodiment 7)
FIG. 38 is a partial cross-sectional view showing an example of the manufacturing method of the semiconductor device of the present invention in the order of steps. In FIG. 38, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and the wiring portion and an interlayer connection wiring portion below it are shown to simplify the drawing.

  In the present embodiment, the case where there is no insulating film 36 functioning as an intermediate stopper in the first embodiment and the marker layer 58 is provided in the insulating film for forming the wiring groove and the connection hole will be described.

  First, as shown in FIG. 38A, the insulating film 34, the insulating film 35, the marker layer 58, the insulating film 37, and the insulating film 38 are sequentially formed on the lower wiring 33. The insulating films 34, 35, 37, and 38 are the same as those in the first embodiment. For the marker layer 58, for example, a silicon nitride film, PSG (Phosphor-Silicate-Glass), BPSG (Boron-Phosphor-Silicate-Glass) or the like can be used, and the film thickness can be 10 to 50 nm. The marker layer 58 can be used as a marker for etching as will be described later. The insulating films 35 and 37 are formed to have a total film thickness of 850 nm, and the marker layer 58 is formed so as to be positioned at the hole pattern formation depth described in the next step. For example, the position is 500 nm from the upper surface of the insulating film 37. That is, the thickness of the insulating film 35 is set to about 350 nm, and the thickness of the insulating film 37 is set to about 500 nm (at this time, the thickness of the marker layer is ignored).

  Next, the groove pattern 40 is transferred to the insulating film 38 using the resist film 39 as in the first embodiment.

  Next, as shown in FIG. 38B, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is further formed in the embodiment. 1 is formed.

  Next, as shown in FIG. 38C, the hole pattern 43 is transferred to the insulating film 35 using the resist film 42 as a mask. The transfer is performed by an etching process under the condition that the silicon oxide film is etched as in the first embodiment. The depth of the hole pattern 43 is detected by the marker layer 58. That is, since the marker layer 58 contains nitrogen (N), boron (B), phosphorus (P), etc., plasma emission analysis (plasma spectroscopic analysis) of the etching process is performed, and the marker layer of nitrogen, boron, phosphorus, etc. The element emission contained in 58 is monitored, and when this emission is detected, the etching is stopped and the depth of the hole pattern 43 can be controlled. Thereby, the depth control of the hole pattern 43 can be easily performed.

  Next, as shown in FIG. 38D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

  Next, as shown in FIG. 38E, the groove pattern 40 is transferred to the insulating film 35 using the insulating film 38 having the groove pattern 40 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. The depth of the groove pattern 40 is 400 nm, and the depth control is performed by managing the etching processing time. Since the hole pattern 43 is transferred to the insulating film 35 in advance during this etching process, the region of the hole pattern 43 is also etched at the same time, and the bottom of the hole pattern 43 reaches the insulating film 34 as in the sixth embodiment. It is the same.

  Next, as shown in FIG. 38F, the insulating film 38 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, since a silicon nitride film having a high dielectric constant is not used for the intermediate layer, the inter-wiring capacitance can be reduced and the performance of the semiconductor device can be improved. The pattern depth can be easily controlled.

  In the semiconductor device formed by the manufacturing method of the present embodiment, a marker layer is formed below the wiring bottom.

(Embodiment 8)
FIG. 39 is a partial cross-sectional view showing an example of a method of manufacturing a semiconductor device according to the present invention in the order of steps. In FIG. 39, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and a wiring portion and a portion of an interlayer connection wiring below it are shown to simplify the drawing.

  First, as shown in FIG. 39A, insulating films 34 to 37, a marker layer 58, an insulating film 37 ′, and an insulating film 38 are sequentially formed on the lower wiring 33. The insulating films 34, 36, and 38 are made of, for example, a silicon nitride film, and the insulating films 35, 37, and 37 'are made of, for example, a silicon oxide film. These insulating films are the same as those in the first embodiment. The marker layer 58 is the same as that in the seventh embodiment.

  The total thickness of the insulating films 37 and 37 ′ is 450 nm, and the position of the marker layer 58 is 400 nm from the upper surface of the insulating film 37 ′. That is, the thickness of the insulating film 37 is 50 nm if the thickness of the marker layer 58 is ignored.

  Next, the groove pattern 40 is transferred to the insulating film 38 using the resist film 39 as in the first embodiment.

  Next, as shown in FIG. 39B, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is formed in the embodiment. 1 is formed.

  Next, as shown in FIG. 39C, the hole pattern 43 is transferred to the insulating film 35 using the resist film 42 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched but the silicon nitride film is difficult to etch. That is, the insulating film 36 that is a silicon nitride film is used as an etching stopper. Thereby, the pattern depth of the hole pattern 43 can be easily controlled. Further, the insulating film 36 at the bottom of the hole pattern 43 is removed by etching.

  Next, as shown in FIG. 39D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

  Next, as shown in FIG. 39E, the groove pattern 40 is transferred to the insulating film 37 'using the insulating film 38 having the groove pattern 40 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. Here, the marker layer 58 is used for controlling the etching depth of the groove pattern 40. In other words, element emission including nitrogen, boron, phosphorus, etc. in the marker layer 58 is monitored by plasma emission analysis, and when this emission is detected, etching is stopped and the depth of the groove pattern 40 can be controlled. Thereby, the depth control of the groove pattern 40 can be easily performed. The depth of the groove pattern 40 is formed with good controllability to 400 nm which is the formation depth of the marker layer 58. Since the hole pattern 43 is transferred to the insulating film 35 in advance during this etching process, the region of the hole pattern 43 is also etched at the same time, and the bottom of the hole pattern 43 reaches the insulating film 34 as in the sixth embodiment. It is the same. Since the insulating film 34, which is a silicon nitride film, is formed, no problem occurs even if some over-etching is performed at the bottom of the hole pattern 43.

  Next, as shown in FIG. 39F, the insulating film 38 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, although a silicon nitride film having a high dielectric constant is used for the intermediate layer, since the silicon nitride film is formed below the bottom surface of the wiring trench, it is greatly increased in the capacitance between wirings. Does not contribute. That is, the silicon nitride film (the insulating film 36 is formed in contact with the interlayer connection wiring connecting the wirings, and such an interlayer connection wiring is not formed entirely in the wiring formation region. Since the interlayer connection wiring is formed only in a very small part, the total capacity of the capacitor composed of the interlayer connection wiring and the insulating film 36 is reduced. It is possible to easily control both the depth control and the depth control of the pattern 40. That is, the wiring groove and the connection hole can be formed precisely, and the improvement in the precision in the depth direction (ease of processing) is a stopper insulating film. This provides room for reducing the thickness of the (insulating films 34, 36) and provides the possibility of reducing the capacitance between the wirings, that is, contributing to improving the performance of the semiconductor device.

(Embodiment 9)
FIG. 40 is a partial cross-sectional view showing an example of the manufacturing method of the semiconductor device of the present invention in the order of steps. In FIG. 40, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and the wiring portion and the portion of the interlayer connection wiring in the lower layer are shown to simplify the drawing.

  In this embodiment, the case where the insulating film 36 in Embodiment 8 is not used will be described.

  First, as shown in FIG. 40A, insulating films 34 and 35, a marker layer 58, an insulating film 35 ', and an insulating film 38 are sequentially formed on the lower wiring 33. The insulating films 34 and 38 are made of, for example, a silicon nitride film, and the insulating films 35 and 35 'are made of, for example, a silicon oxide film. These insulating films are the same as those in the first embodiment. The marker layer 58 is the same as that in the seventh embodiment.

  The total thickness of the insulating films 35 and 35 ′ is 850 nm, and the position of the marker layer 58 is 400 nm from the upper surface of the insulating film 35 ′. That is, the thickness of the insulating film 35 is 450 nm if the thickness of the marker layer 58 is ignored.

  Next, the groove pattern 40 is transferred to the insulating film 38 using the resist film 39 as in the first embodiment.

  Next, as shown in FIG. 40B, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is further formed in the embodiment. 1 is formed.

  Next, as shown in FIG. 40C, the hole pattern 43 is transferred to the insulating films 35 and 35 'using the resist film 42 as a mask. The transfer is performed by an etching process under the condition that the silicon oxide film is etched. Further, the depth of the hole pattern 43 is controlled by time management, and the depth is set to 500 nm. In this etching, the hole pattern 43 penetrates the marker layer 58, but the plasma emission from the marker layer is ignored.

  Next, as shown in FIG. 40D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

  Next, as shown in FIG. 40E, the groove pattern 40 is transferred to the insulating film 35 'using the insulating film 38 having the groove pattern 40 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. Here, the marker layer 58 is used to control the etching depth of the groove pattern 40 as in the eighth embodiment. That is, elemental light contained in the marker layer 58 is monitored by plasma emission analysis, and etching is stopped when the light emission is detected, and the depth of the groove pattern 40 is controlled. Thereby, the depth control of the groove pattern 40 can be easily performed. Since the hole pattern 43 is transferred to the insulating film 35 in advance during this etching process, the region of the hole pattern 43 is also etched at the same time, and the bottom of the hole pattern 43 reaches the insulating film 34 as in the sixth embodiment. It is the same. Since the insulating film 34, which is a silicon nitride film, is formed, no problem occurs even if some over-etching is performed at the bottom of the hole pattern 43.

  Next, as shown in FIG. 40F, the insulating film 38 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, a silicon nitride film having a high dielectric constant is not used for the intermediate layer, and an increase in inter-wiring capacitance due to the silicon nitride film does not occur. As a result, the performance of the semiconductor device can be improved. On the other hand, the formation of the wiring groove 44 can be performed with good controllability using the marker layer 58.

(Embodiment 10)
FIG. 41 is a partial cross-sectional view showing an example of the manufacturing method of the semiconductor device of the present invention in the order of steps. In FIG. 41, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and the wiring portion and a portion of the interlayer connection wiring in the lower layer are shown to simplify the drawing.

  First, as shown in FIG. 41A, an insulating film 34, insulating films 59, 59 ', and an insulating film 38 are sequentially formed on the lower wiring 33. The insulating films 34 and 38 are made of, for example, a silicon nitride film, and the insulating films 59 and 59 'are made of, for example, a silicon oxide film. A connection hole is formed in the insulating film 59, and an interlayer connection wiring is formed in the connection hole. That is, the insulating film 59 functions as an interlayer insulating film. A wiring groove is formed in the insulating film 59 ', and a wiring is formed in the wiring groove. That is, the insulating film 59 'functions as a line insulating film.

  A TEOS oxide film can be used for the insulating film 59, but a material having an etching selectivity with respect to the TEOS oxide film can be used for the insulating film 59 '. For example, SOG (Spin On Glass). As described above, by using a material having an etching selectivity with respect to the insulating film 59 as the insulating film 59 ′, the insulating film 59 can be used as an etching stopper when the groove pattern is transferred to the insulating film 59 ′. . Further, a low dielectric constant material such as organic SOG or fluorine-containing SOG can be used for the insulating film 59 '. Thus, by using the low dielectric constant material for the inter-line insulating film (insulating film 59 '), the inter-line capacitance between the same layer wirings can be reduced. On the other hand, the capacitance between the wiring layers can be reduced by increasing the film thickness of the insulating film 59. Note that the thickness of the insulating film 59 is 450 nm, and the thickness of the insulating film 59 ′ is 400 nm.

  Next, the groove pattern 40 is transferred to the insulating film 38 using the resist film 39 as in the first embodiment.

  Next, as shown in FIG. 41B, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is further formed in the embodiment. 1 is formed.

Next, as shown in FIG. 41C, the hole pattern 43 is transferred to the insulating films 59 and 59 ′ using the resist film 42 as a mask. This transfer process is first performed by two-stage etching, which is a first process by etching using a mixed gas of CHF ₃ and C ₄ F ₈ and a second process by etching using C ₄ F ₈ gas. The etching of the first process is a condition where the SOG is etched but the TEOS oxide film is difficult to etch, and the etching stops on the upper surface of the insulating film 59 (TEOS oxide film). That is, the insulating film 59 is used as an etching stopper for the first process. Thereby, the depth adjustment of the hole pattern 43 can be performed easily, and the uniformity of the depth can be improved. On the other hand, the etching in the second process is a condition for etching the TEOS oxide film, and the hole pattern 43 can be transferred to the insulating film 59. The etching depth by the second treatment is about 50 nm.

  Next, as shown in FIG. 41D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

Next, as shown in FIG. 41E, the groove pattern 40 is transferred to the insulating film 59 ′ using the insulating film 38 having the groove pattern 40 as a mask. The transfer is performed under the condition that both the SOG and TEOS oxide films (insulating films 59 and 59 ′) are etched (etching using a mixed gas of C ₄ F ₈ ). As a result, the groove pattern 40 is transferred to the insulating film 59 ′, and the hole pattern 43 is transferred deeper to the insulating film 59. The depth of the groove pattern 40 is controlled by time management of the etching process. Since the insulating film 34 is formed at the bottom of the hole pattern 43, some over-etching does not cause a problem. On the other hand, the bottom of the hole pattern 43 needs to reach the top surface of the insulating film 34 when the bottom of the groove pattern 40 reaches the top surface of the insulating film 59. For this reason, a sufficiently deep hole pattern 43 needs to be formed at the stage of the process shown in FIG. In addition, the difference in etching rate between the insulating film 59 ′ (SOG) and the insulating film 59 (TEOS oxide film) in the process of FIG. 41E is considered to be the hole in the step of FIG. 41C. This is reflected in the depth of the pattern 43. Such adjustment of the depth of the hole pattern 43 can be performed by etching in the second process.

  Next, as shown in FIG. 41 (f), the insulating film 38 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  According to the manufacturing method of the present embodiment, a silicon nitride film having a high dielectric constant is not used for the intermediate layer, and an increase in inter-wiring capacitance due to the silicon nitride film does not occur. Further, the depth of the hole pattern 43 and the depth of the groove pattern 40 can be adjusted with good controllability by utilizing the difference in the etching rates of the insulating films 59 and 59 '. Further, by using a low dielectric constant material (organic SOG, fluorine-containing SOG) or the like for the inter-line insulating film (insulating film 59 '), the capacitance between the wirings can be reduced, and the performance of the semiconductor device can be improved.

  Of course, a low dielectric constant material such as organic SOG or fluorine-containing SOG may be used for the insulating film 59, and a TEOS oxide film may be used for the insulating film 59 '.

(Embodiment 11)
FIG. 42 is a partial cross-sectional view showing an example of the manufacturing method of the semiconductor device of the present invention in the order of steps. In FIG. 42, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and a wiring portion and an interlayer connection wiring portion below it are shown to simplify the drawing.

  First, as shown in FIG. 42A, insulating films 34 to 37, a hard mask layer 60, and a transfer mask layer 61 are sequentially formed on the lower wiring 33. The insulating films 34 to 37 are the same as those in the first embodiment. The hard mask layer 60 is a metal layer and is made of, for example, tungsten. The transfer mask layer 61 is, for example, a TEOS oxide film. The film thicknesses of the hard mask layer 60 and the transfer mask layer 61 are, for example, 200 nm and 100 nm, respectively. The hard mask layer 60 can be formed by, for example, sputtering or CVD.

  The transfer mask layer 61 and the hard mask layer 60 function as a transfer mask for the groove pattern 40 in the same manner as the insulating film 38 in the first embodiment. The transfer mask is preferably as thick as possible from the viewpoint of preventing the shoulder of the pattern. However, if a transfer mask that is too thick is used, embedding with an antireflection film cannot be performed sufficiently, and a step is formed when forming a resist film in which a hole pattern is formed, and the formation accuracy of the hole pattern decreases. In the present embodiment, the transfer mask layer 61 and the hard mask layer 60 can prevent shouldering during the formation of the groove pattern 40 and reduce the step of the transfer mask.

  Next, a resist film 39 having a groove pattern 40 is formed as in the first embodiment, and the groove pattern 40 is transferred to the transfer mask layer 61 using the resist film 39.

  Next, as shown in FIG. 42B, an antireflection film 41 for embedding the groove pattern 40 of the transfer mask layer 61 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is further formed. It forms similarly to the form 1. Since the level difference of the transfer mask layer 61 at this stage is at most 100 nm, the level difference can be sufficiently filled with the antireflection film 41.

  Next, as shown in FIG. 42C, the hole pattern 43 is transferred to a part of the hard mask layer 60, the insulating films 37 and 36, and the insulating film 35 using the resist film 42 as a mask. The depth of the hole pattern 43 is controlled by time management of the etching process.

  Next, as shown in FIG. 42D, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment. Further, the groove pattern 40 is transferred to the hard mask layer 60 using the transfer mask layer 61 as a mask. This transfer is performed under conditions where tungsten is selectively etched.

  Next, as shown in FIG. 42E, the groove pattern 40 is transferred to the insulating film 37 using the transfer mask layer 61 having the groove pattern 40 and the hard mask layer 60 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Although the transfer mask layer 61 is etched and removed by this etching, the groove pattern 40 is accurately transferred because the hard mask layer 60 exists. Etching conditions are the same as in the first embodiment. The depth of the groove pattern 40 can be controlled by causing the insulating film 36 to function as an etching stopper. In the present embodiment, the insulating film 36 is not particularly necessary. In this case, the depth of the groove pattern 40 can be controlled by time management of the etching process in this step. In this etching process, the hole pattern 43 is transferred to a part of the insulating film 35 through the insulating film 36 in advance, so that the region of the hole pattern 43 is also etched at the same time, and the bottom of the hole pattern 43 is the insulating film. Reaching 34 is the same as in the first embodiment.

  Next, as shown in FIG. 42F, the insulating film 36 at the bottom of the groove pattern 40 and the insulating film 34 at the bottom of the hole pattern 43 are removed, and the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

  In the present embodiment, the hard mask layer 60 is not removed at this stage and is left on the insulating film 37. Since the hard mask layer 60 is made of a metal film, the conductivity of the substrate surface is lowered in the step of forming a plating layer to be a wiring, and the plating layer can be easily formed. In this case, it goes without saying that the hard mask layer 60 is removed in the CMP polishing step for forming the wiring.

  According to the manufacturing method of the present embodiment, since the wiring groove pattern 40 is formed using the hard mask layer 60, the processing accuracy of the groove pattern 40 can be improved. On the other hand, since the transfer of the groove pattern 40 to the hard mask layer 60 is performed using the transfer mask layer 61, the resist film 42 having the hole pattern 43 can be formed with high accuracy.

  Note that the order of the hard mask layer 60 and the transfer mask layer 61 may be changed. That is, it is sufficient that the hard mask layer 60 and the transfer mask layer 61 function as a mask in total when transferring the groove pattern 40 to the insulating film 37, and the formation order is not a problem.

(Embodiment 12)
FIG. 43 is a partial cross-sectional view showing an example of a method of manufacturing a semiconductor device of the present invention in the order of steps. In FIG. 43, an arbitrary portion of the fifth wiring layer of the first embodiment is shown, and the wiring portion and the portion of the interlayer connection wiring below it are shown to simplify the drawing.

  First, as shown in FIG. 43A, insulating films 34 and 35 are sequentially formed on the lower wiring 33. The insulating films 34 and 35 are the same as those in the sixth embodiment. Next, a resist film 62 is formed on the insulating film 35. A groove pattern 40 is formed in the resist film 62. As described above, in this embodiment, a film corresponding to the insulating film 38 is not formed, and a groove pattern is directly formed by a resist film. For example, photosensitive polyimide can be used as the material of the resist film 62. By using photosensitive polyimide in this way, an etching selectivity can be given to the resist film for hole pattern described in the next step, and the resist film for hole pattern can be selectively used with respect to the resist film 62. Can be removed.

  Next, as shown in FIG. 43B, a resist film 63 having a hole pattern 43 is formed on the resist film 62. As the resist film 63, an ordinary resist film (for example, a novolak photoresist film) is used.

  Next, as shown in FIG. 43C, the hole pattern 43 is transferred to the insulating film 35 using the resist film 63 as a mask. The depth of the hole pattern 43 in the insulating film 35 is 500 nm. The depth control of the hole pattern 43 is performed by managing the etching process time.

  Next, as shown in FIG. 43D, the resist film 63 is removed. For example, an oxygen plasma ashing method is used as the removal method. According to oxygen plasma ashing, since the polyimide resist film has ashing resistance, it is possible to leave the resist film 62 and remove only the resist film 63.

  Next, as shown in FIG. 43E, the groove pattern 40 is transferred to the insulating film 35 using the resist film 62 having the groove pattern 40 as a mask. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. The depth of the groove pattern 40 is 400 nm, and the depth control is performed by managing the etching processing time.

  Since the hole pattern 43 is transferred to the insulating film 35 in advance during the etching process, the region of the hole pattern 43 is also etched at the same time, and the groove pattern 40 is etched at a depth of 400 nm. Reaches the insulating film 34. This is the same as in the sixth embodiment.

  Next, as shown in FIG. 43F, the resist film 62 is removed. The resist film 62 is removed by wet etching using, for example, butyl acetate as a solvent. Further, the insulating film 34 at the bottom of the hole pattern 43 is removed. Thereby, the wiring groove 44 and the connection hole 45 are completed. This removal step is performed by an etching process under the condition that the silicon nitride film is etched. The subsequent steps are the same as those in the first embodiment.

(Embodiment 13)
FIG. 44A is a cross-sectional view showing an example of the method for manufacturing a semiconductor device of the present invention, and is a cross-sectional view showing a method for exposing the resist film 42 for forming the hole pattern 43 in the first embodiment.

  In FIG. 11 of the first embodiment, after the resist film 42 is applied and formed, a hole pattern 43 is formed using photolithography as shown in FIG. 12. This stage is shown in more detail in FIG. ).

  In FIG. 44A, a marker 64 of the fourth wiring layer is formed in the same layer as the wiring 33 of the fourth wiring layer. Further, what is formed on the resist film 42 is a hole pattern mask 65. The mask 65 is provided with a marker 66 of the mask 65 together with the hole pattern 43.

  Here, the resist film 42 is exposed using the mask 65, and alignment (mask alignment) of the mask 65 is performed with reference to the marker 64 of the fourth wiring layer (lower layer wiring). That is, the alignment of the mask 65 is performed so that the marker 64 of the fourth wiring layer and the marker 66 of the mask 65 coincide with each other, and then exposure light is irradiated from the upper surface of the mask 65 to expose the resist film 42. The photosensitive portion 67 is removed by the subsequent chemical treatment, and the hole pattern 43 is formed as shown in FIG.

  By such a manufacturing method, alignment of the hole pattern 43 can be performed easily and accurately. That is, as described in the first embodiment, the groove pattern 40 is formed in the insulating film 38. However, if the hole pattern 43 is formed based on the groove pattern 40, mask alignment becomes difficult. That is, the film thickness of the insulating film 38 is as thin as 100 nm, and the insulating film 38 is generally transparent to visible light. Therefore, even if a marker is provided on the insulating film 38, it is difficult to detect the marker. Even if it is detected, it is difficult to read the marker of the insulating film 38, so it is difficult to align the marker of the mask 65 with reference to it. On the other hand, since the marker 64 of the wiring 33 is made of metal, reading with a mask aligner is easy and mask alignment can be performed accurately. In addition, by forming the hole pattern 43 with reference to the marker 64 of the lower layer wiring, the deviation between the lower layer wiring 33 and the connection hole 45 can be suppressed to the minimum, and a reliable contact between the upper and lower wirings can be realized. On the other hand, the groove pattern 40 is formed on the basis of the marker 64 of the lower layer wiring. However, as described above, even if a mask shift occurs with respect to the hole pattern 43, no problem occurs. Therefore, according to the present embodiment, as described above, the alignment of the hole pattern 43 can be easily and accurately performed.

  As shown in FIG. 44B, a marker 68 is also provided on the insulating film 38, and alignment can be performed by aligning the marker 66 of the mask 65 with the center of the marker 68 and the marker 64. Even in this case, the mask 65 can be easily aligned, and the reading error of the marker 68 on the insulating film 38 can be minimized.

(Embodiment 14)
FIG. 45 is a plan view and a sectional view showing still another embodiment of the present invention. In the present embodiment, the shape of the hole pattern 43 in the second embodiment is set such that the length (dimension) in the direction (y direction) perpendicular to the wiring groove direction (x direction) is larger than the width of the groove pattern 40. The case will be described. That is, as shown in the plan view of FIG. 45A, the length Ly in the y direction of the hole pattern 43 is made larger than the width Lw of the wiring groove (groove pattern 40). The length Ly in the y direction of the hole pattern 43 is configured by, for example, the width Lw + the alignment margin. In such a case, according to the manufacturing method of the second embodiment, the etching end in the y direction of the hole pattern 43 is defined by the groove pattern 40, that is, formed in a self-aligned manner in the groove pattern 40. The aperture diameter is not reduced below the aperture Lw. On the other hand, since the dimension of the hole pattern 43 in the y direction is defined by the groove pattern 40, it is not formed larger than the width Lw of the groove pattern 40. As a result, the cross-sectional area (Lw × Lx) of the interlayer connection wiring 50 can be secured to reduce its resistance, and the dimension between the wirings can be minimized, so that the performance and integration of the semiconductor device can be improved. Can contribute to high reliability.

  Next, description will be made according to cross-sectional views (b1, c1 to b3, c3). 45 (b1) to (b3) are cross-sectional views taken along the line bb ′ in FIG. 45 (a), and FIGS. 45 (c1) to (c3) are cc ′ in FIG. 45 (a). A line sectional view is shown.

  First, as shown in FIGS. 45 (b1) and (c1), the insulating films 34 and 35 and the insulating film 38 similar to those of the sixth embodiment are sequentially formed on the lower wiring 33, and the insulation is performed similarly to the first embodiment. The groove pattern 40 is transferred to the film 38. Thereafter, an antireflection film 41 for embedding the groove pattern 40 of the insulating film 38 is formed in the same manner as in the first embodiment, and a resist film 42 having a hole pattern 43 is formed in the same manner as in the first embodiment. At this time, as shown in FIG. 45C1, the hole pattern 43 is formed wider than the groove pattern 40 in the c-c ′ line direction (y direction).

  Next, as shown in FIGS. 45B2 and 45C2, the hole pattern 43 is transferred to the insulating film 35 using the resist film 42 as a mask. The transfer is performed by etching under the condition that the silicon oxide film is etched but the silicon nitride film is difficult to be etched, as in the second embodiment. Therefore, as shown in FIG. 45 (c2), in the y direction, the hole pattern 43 is formed in a self-aligned manner with respect to the groove pattern 40, and the insulating film 38 covering the hole pattern 43 of the resist film 42 is a part thereof. Is etched, and the insulating film 35 under the insulating film 38 is not etched.

  The depth of the hole pattern 43 in the insulating film 35 is 500 nm, and the depth is controlled by managing the etching process time.

  Next, the resist film 42 and the antireflection film 41 are removed. The removal method is the same as in the first embodiment.

  Next, as shown in FIGS. 45B3 and 45C3, the insulating film 35 is etched using the insulating film 38 (groove pattern 40) as a mask. As a result, the groove pattern 40 is transferred to the insulating film 35. The transfer is performed by an etching process under conditions where the silicon oxide film is etched. Etching conditions are the same as in the first embodiment. Thereby, the dimension Lw of the connection hole 45 can be made substantially equal to the width Lw of the wiring 44. The depth of the groove pattern 40 is 400 nm, and the depth control is performed by managing the etching processing time. Since the hole pattern 43 is transferred to the insulating film 35 in advance during the etching process, the region of the hole pattern 43 is also etched at the same time, and the groove pattern 40 is etched at a depth of 400 nm. The bottom reaches the insulating film 34 as in the first embodiment. The subsequent steps are the same as those in the first embodiment. Thereby, the wiring 44 and the connection hole 45 are formed as in the first embodiment, and the wiring 49 (interlayer connection wiring 50) is formed there.

  According to the manufacturing method of the present embodiment, the hole pattern 43 of the resist film 42 is formed widely, and the hole pattern is formed in a self-aligned manner with respect to the insulating film 38 (groove pattern 40). Even if a deviation occurs in the mask alignment with the groove pattern 40, the deviation can be absorbed in the y direction. Moreover, even if a shift | offset | difference arises in ay direction, a connection hole is not missing and the cross-sectional area (caliber) can be ensured to the caliber Lw as designed. That is, the dimension Lw of the connection hole 45 can be made substantially equal to the width Lw of the wiring 44. Thereby, the resistance of the wiring 49 can be reduced, the reliability of the interlayer wiring connection can be improved, and the performance and reliability of the semiconductor device can be improved. Even if the width Ly in the y direction of the hole pattern 43 is formed to be larger than the width Lw of the wiring groove, the width in the y direction of the hole pattern 43 formed in the insulating film 35 is defined by the wiring width Lw and larger than that. It is never formed. For this reason, the wiring interval can be set to the minimum of the design, the wiring density can be improved, and the semiconductor device can be highly integrated.

  FIG. 46A shows a planar pattern of the wiring 49a formed by this embodiment. FIG.46 (b) shows the GH sectional view taken on the line in (a). As shown in the drawing, a connection hole (a hatched portion) is formed at the overlapping portion of the pattern of the wiring 49a and the hole pattern 43. The diameter of the connection hole formed is the same as the width W of the wiring 49a, and the resistance of the connection hole portion can be lowered.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments of the invention. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, the above-described embodiments can be applied in combination with each other without departing from the spirit thereof. For example, the shoulder rounding described in the fourth and fifth embodiments can be applied to other embodiments except the eleventh embodiment.

  In the above embodiment, the silicon nitride film is exemplified as the insulating film 38 for the one having the insulating film 38. However, other materials may be used as long as they have an etching selectivity with respect to the underlying silicon oxide film. For example, tungsten, titanium nitride (TiN), aluminum (Al), tantalum (Ta), molybdenum (Mo), or a nitride thereof may be used.

  The semiconductor device manufacturing method of the present invention can be applied to a manufacturing process of a semiconductor device having a multilayer wiring structure formed by using, for example, a damascene method.

1 Semiconductor substrate
2 Device isolation region
3 p-well
4 n-well
5 Gate insulation film
6 Gate electrode
7 Cap insulation film
8 Sidewall spacer
9 n-type semiconductor region
10 p-type semiconductor region
11 First interlayer insulating film
12 Connection hole
13 plugs
14 Wiring
15 Second interlayer insulating film
16 Connection hole
17 plug
18 Stopper insulation film
19 Insulating film
20 Wiring groove
21 Wiring
22 Stopper insulation film
23 Interlayer insulation film
24 Stopper insulation film
25 Insulating film
26 Wiring groove
27 Connection hole
28 Wiring
29 Stopper insulation film
30 Interlayer insulation film
31 Stopper insulation film
32 Insulating film
33 Wiring
34 Insulating film
35 Insulating film
35 'Insulating film (silicon oxide film)
36 Insulating film (silicon nitride film)
37 Insulating film
37 'Insulating film (silicon nitride film)
38 Insulating film (silicon nitride film)
39 resist film 40a, 40b groove pattern
41 Anti-reflective coating
42 resist film 43, 43a, 43b hole pattern 44a, 44b wiring groove
45 Connection hole
46 Barrier metal layer
47 Seed layer
48 Plating layer 49a, 49b Wiring 50a, 50b Interlayer connection wiring
51 Wiring pattern 52a, 52b Hole pattern
53 Resist film
54 shoulder
55 shoulder
56 edge
57 shoulder
58 Marker layer
59 Insulating film
59 'Insulating film (silicon nitride film)
60 Hard mask layer
61 Transfer mask layer
62 Resist film
63 Resist film
64 markers
65 mask
66 Marker
67 Photosensitive area
68 Marker
D Dogbone area
G Wiring groove
Lw width (wiring width)
Ly width
Qn n-channel MISFET
Qp p channel MISFET
S steps
d _H aperture
d _L pattern width

Claims (10)

A method for manufacturing a semiconductor device, comprising:
(A) a step of sequentially forming a first stopper insulating layer, a first insulating layer and a stopper layer on a semiconductor substrate;
(B) transferring the wiring groove pattern to the stopper layer;
(C) After the step (b), a step of forming a hole pattern layer of connection holes on the stopper layer;
(D) In the presence of the hole pattern layer, etching is performed under conditions for removing the stopper layer and the first insulating layer, and etching is performed until the first stopper insulating layer is reached. Forming a process,
(E) removing the hole pattern layer;
(F) performing a etching process in the presence of the hole pattern formed in the first insulating layer and the stopper layer in which the wiring groove pattern is formed, and forming a wiring groove in the first insulating layer;
A method for manufacturing a semiconductor device, comprising: A method of manufacturing a semiconductor device according to claim 1,
In the step (c), the hole pattern layer is configured to have a shape that opens a stacked via portion. A method of manufacturing a semiconductor device according to claim 1 or 2,
A method of manufacturing a semiconductor device comprising a step of forming a planarizing film between the step (b) and the step (c). A method of manufacturing a semiconductor device according to claim 3,
The method of manufacturing a semiconductor device, wherein the planarizing film is an antireflection film. A method for manufacturing a semiconductor device according to any one of claims 1 to 4,
A method of manufacturing a semiconductor device, wherein the wiring groove and the connection hole are formed in the step (f), and then a conductive film is embedded in the wiring groove and the connection hole to form a wiring and an interlayer connection member. . A method for manufacturing a semiconductor device according to any one of claims 1 to 5,
The plane shape of the hole pattern in the step (c) is transferred to form the plane shape of the connection hole,
A method of manufacturing a semiconductor device, wherein the sum of the pattern planar shape of the wiring groove pattern and the hole pattern in steps (b) and (c) is transferred to form a planar shape of the wiring. A method for manufacturing a semiconductor device according to any one of claims 1 to 5,
The method of manufacturing a semiconductor device, wherein the mask in the step (b) is composed of a resist or a hard mask. A method for manufacturing a semiconductor device according to any one of claims 1 to 5,
The method of manufacturing a semiconductor device, wherein the diameter of the connection hole and the wiring width of the wiring are substantially equal. A method for manufacturing a semiconductor device according to any one of claims 1 to 5,
The first insulating layer includes a first interlayer insulating layer, a second stopper insulating layer, and a second interlayer insulating layer,
In the step (f), a wiring groove is formed in the second interlayer insulating layer by etching until reaching the second stopper insulating layer. A method of manufacturing a semiconductor device according to claim 9,
After the step (f), the method for manufacturing a semiconductor device includes a step of removing the second stopper insulating layer in the wiring trench.

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