JP4563922B2 - Device test apparatus and device test method - Google Patents

Description

  The present invention relates to a device test apparatus and a device test method for testing a component.

  Conventionally, when testing a component such as an IC, a test board on which a socket corresponding to the connection terminal of the component is mounted is created for each component, and various tests are performed by connecting the test board to an LSI tester.

In addition, with a connection board for package type ICs, the pitch of the zero punching force connector and the pitch of the mating motherboard's zero punching force connector can be changed, and both are connected and shared. There is technology to plan.
JP-A-11-30644

  In the former technique described above, it is necessary to create a test board for each component with different connection terminals, which requires a large number of test boards in the case of various types of inspections, and increases the cost. There was a problem that it was not possible to improve work efficiency by exchanging the tested parts.

  Further, the latter technique described above requires a complicated mechanism that allows the pitch to be changed between the zero push-out force connector on the connection board and the zero push-out force connector on the motherboard, and a plurality of test parts. The block 1 and the block 2 that are equipped with the slidable type are divided into blocks that are being tested and blocks that are not being tested, the former being tested, and the latter being unable to be operated efficiently. there were.

  In order to solve these problems, the present invention mounts a socket board having a connection portion (for example, a socket) corresponding to each component on a common test board connected to a test apparatus, and makes the socket board a slide type. A part group under test and a part group for replacement work can be exchanged.

  In the present invention, a socket board having a connection portion (for example, a socket) corresponding to each component is mounted on a common test board connected to a test apparatus, and the socket board is slid to replace a group of parts under test and replacement work. By making the parts group interchangeable, even if the parts are different, only the socket board is created exclusively for the part, making it possible to easily and inexpensively test parts with any connection terminal and socket board. It is possible to perform efficient work by dividing the parts into a part group under test and a part group for replacement work.

In the present invention, a socket board having a connection portion (for example, a socket) corresponding to each component is mounted on a common test board connected to a test apparatus, and the socket board is slid to replace a group of parts under test. It was possible to replace the parts group for work.
The execution speed was improved by minimizing the above.

FIG. 1 shows a structural diagram of one embodiment of the present invention.
1A shows a top view, and FIG. 1B shows a front view.

  In FIG. 1, a socket substrate 1 is provided with a socket 2 on which a number of components to be tested are mounted divided into a block 1 and a block 2, respectively. (B) of FIG. 3 (FIG. 3 and FIG. 4). In addition, it is good also as a structure where it is set as the block 1,2, ... n and any one block enters between the support | pillar support | pillars 4 of (b) of FIG.

  The socket 2 is a socket to which a test target component (for example, an IC or the like) is mounted, and is a socket that varies depending on the number and position of connection parts (connection terminals) of the test target component.

  The common test board 7 is composed of the upper common frame board 3 and the lower common board 6 in FIG. 1, and the common test board 7 is moved downward by the force of air. The pad (gold pad) 31 of the common frame board 3 is connected to the pogo pin 61 of the common board 6 for testing.

  As shown in FIG. 1A, the common frame board 3 has a socket substrate 1 mounted in a slidable state, and is attached to either the block 1 on the socket substrate 1 or the socket 2 of the block 2. This is for connecting the terminal of the mounted component to the pogo pin 61 of the common board 6.

  The pad (gold pad) 31 is provided on the lower surface of the common frame board 3 and is for contacting and connecting to the pogo pins 61 of the common board 6.

  The support column 4 is a support column that guides the common frame board 3 so that the common frame board 3 translates downward against the force of the spring 5 when the pressing support column 41 is pressed downward by the force of an air cylinder (not shown).

  The spring 5 gives the common frame board 3 a force to move upward when an air cylinder (not shown) pushes up the holding column 41 upward.

  The common board 6 is a terminal of a component (such as an IC) that is mounted on the socket 2 to be tested while the pad (gold pad) 31 on the lower surface of the common frame board 3 contacts the pogo pin 61 provided on the upper surface of the common board 6. Are connected to the test head unit 12 of the LSI tester via the coaxial cable 8, the test board 10 of the LSI tester, and the pogo pin 11.

  The pogo pin 61 is provided on the upper surface of the common board 6 and is in contact with and connected to a pad (gold pad) 31 provided on the lower surface of the common frame board 3.

  The coaxial cable 8 is a coaxial cable that connects the pogo pin 61 of the common board 6 and the test board 10 of the LSI tester.

The support 9 is a support for fixing the common board 6 to the test board 10 of the LSI tester.
The test board 10 of the LSI tester is a test board for connecting a terminal (connection unit) of an LSI to be subjected to an LSI test.

  The pogo pin 11 is a pin that connects the test board 10 of the LSI tester and the test head unit 12 of the LSI tester.

  Next, in accordance with the flowchart of FIG. 2, the operation when testing a component (such as an LSI) under the structure of FIG. 1 will be described in detail.

FIG. 2 shows a flowchart for explaining the operation of the present invention.
In FIG. 2, the common test board 7 is set in S1. This is done by setting the common test board 7 including the common board 6 and the common frame board 3 of FIG.

  In S2, the socket substrate 1 is set. In the state where the common test board 7 is set in S1, the socket substrate 1 shown in FIG. 1 is further set as shown in FIG.

  In S3, an IC (test product) is set in the sockets (1) and (2). This is because the left socket (1) (block 1) and the right socket (2) (block 2) of the socket 2 on the socket substrate 1 of FIG. Insert) and set.

  In S4, the socket substrate 1 is aligned with the test position (1). This is because, after setting the IC in the socket 2 of the socket substrate 1 in S3, the test position ((1), block 1) is adjusted so that it enters between the holding columns 41 of FIG. The state a) (the state to be tested in block 1) is set.

  In S5, the lever of the air cylinder is turned on. This turns on the lever of the air cylinder not shown in FIG.

In S <b> 6, the pressing column 41 is lowered and the socket substrate 1 is pressed.
In S 7, the socket substrate 1 is attached to the common test board 7. In S5, S6, and S7, a lever of an air cylinder (not shown) is turned on, and the holding column 41 of FIG. 1 is moved downward by the force of the air cylinder, and the socket substrate 1 and the common frame board 3 are moved by the holding column 41. Are pressed together to oppose the force of the spring 5 to bring the pad (gold pad) 31 on the lower surface of the common frame board 3 into contact with the pogo pins 61 on the upper surface of the common board 6. As a result, the socket of the block 1 2 is connected to a pogo pin 61 of the common board 6.

  S8 starts the test. In S7, the terminal of the IC of the block 1 is connected to the coaxial cable 8, the test board 10 of the LSI tester, the pogo pin 11, and the test head unit 12 of the LSI tester via the pogo pin 61, and an LSI (not shown) is connected. Various kinds of known tests of the IC are performed with a testing machine.

  In S9, the test (1) and (2) ICs (test products) are exchanged for untested products (S9 is not performed for the first time). As shown in FIG. 4 which will be described later, for example, as shown in FIG. 4A, the block 1 on the socket substrate 1 is slid and positioned between the pressing columns 41 of FIG. When the test is being performed, the IC (test product) is exchanged for the block 2 that has already been tested (the first test is not completed because the test has not been completed). As a result, while starting the test at S8 and ending the test at S10, it is possible to replace other group 2 ICs (test products) that have not been tested and prepare for the next test.

In S10, the test ends.
S11 turns off the lever of the air cylinder.

In S12, the holding column 41 is raised and the socket substrate 1 is opened.
In S 13, the socket substrate is detached from the common test board 7.

  In S14, the socket substrate 1 is moved to (2) (or (1)). In S11 to S14, when the test is completed in S10, the lever of the air cylinder (not shown in FIG. 1) is turned off, the holding column 41 is moved upward, and the common frame board 3 is moved upward by the force of the spring 5. The socket substrate 1 is opened, the socket substrate 1 is slid, and another untested block is moved so as to come between the pressing columns 41. Then, S5 and subsequent steps are repeated in the same manner, and the test of the untested IC replaced in S9 is started.

  As described above, only by mounting ICs to be tested on groups 1 and 2 on the socket substrate 1 and turning on an air cylinder (not shown), the holding column 41 is automatically attached to the socket substrate 1 and the common frame board. 3 is moved downward, the pad (gold pad) 31 on the lower surface of the common frame board 3 is brought into contact with the pogo pin 61 on the upper surface of the common board 6, and the IC terminal inserted into the socket 2 of the socket substrate 1 is subjected to the LSI test. The test is performed by connecting to the machine, and by replacing the ICs of the group not being tested on the socket substrate 1 during the test, the test target is automatically installed in the socket 2 of the socket substrate 1 by simply mounting it. It is possible to perform a test, and during the test, a group of tested groups on the socket substrate 1 can be removed and an untested IC can be attached to the socket 2, so that simultaneous testing can be performed. Efficiently it is possible to perform the replacement and testing of the IC.

FIG. 3 shows an example of the socket substrate of the present invention.
3A shows the socket substrate (front surface), FIG. 3B shows the socket substrate (back surface), and FIG. 3C shows an enlarged view of FIG. 3B. Here, as shown in FIG. 3A, the socket substrate 1 is mounted with a socket whose surface matches the pins of the IC to be tested. In the state shown in the drawing, the left block 1 and the right block 2 Two (or three or more) may be provided. Then, on the back surface of the socket substrate 1, as shown in FIG. 3B and further enlarged in FIG. 3C, the socket terminal 11 for soldering the socket terminal (pin), and the like, A common gold pad portion 12 is provided on the substrate connected to the terminal 11 of the socket by the pattern wiring 13.

  As described above, a socket for mounting a test IC is disposed on the front surface of the socket substrate 1, and a common gold pad portion 12 connected to the terminal 11 of the socket by the pattern wiring 13 is provided on the rear surface. Even if there is a difference in the number and position of the pins of the test IC, it is only necessary to create the socket substrate 1, and it can be easily tested regardless of the number and position of the IC that is produced at low cost. In addition, it is possible to improve the work efficiency by alternately performing the test and the exchange work for the group 1 and the group 2 in parallel.

  FIG. 3D shows an example of a state in which the socket substrate 1 is removed. In the illustrated state in which the socket substrate 1 is removed from the common frame board 3 in FIG. 1, there are only one group of probe sockets 13 provided on the upper surface of the common frame board 3. In the state of FIG. 3D, the socket substrate 1 of FIGS. 3A to 3C is mounted, and the gold pad portion 12 of the substrate of FIG. 3C is exactly at the position of the probe socket 13. If they match, both will be connected. 3 (d), the socket substrate 1 mounted thereon is moved in the left-right direction, and the gold pad portion 12 of either the block 1 or the block 2 is brought into contact with and connected to the probe socket 13, and the test and It is possible to improve the work efficiency by simultaneously exchanging ICs.

FIG. 4 shows a slide explanatory view of the present invention.
4A shows a state in which the block 1 is tested, and FIG. 4B shows a state in which the block 2 is tested. 4A shows a state in which the socket substrate 1 is moved to the right and the block 1 is tested, and FIG. 4B shows a state in which the socket substrate 1 is moved to the left and the block 2 is tested. If any one of the blocks 1 and 2 is being tested, remove the tested IC from the other blocks 2 and 1 from the socket 2 and attach the untested IC to the socket 2. Do.

  As described above, the blocks 1 and 2 are provided on the socket substrate 1 and slid, the test is performed with one of the blocks positioned at the test position, and the other IC is removed simultaneously in parallel during the test to create a new IC. By attaching, the test and the replacement work can be executed simultaneously in parallel, and the IC can be tested efficiently.

  In the present invention, a socket board having a connection portion (for example, a socket) corresponding to each component is mounted on a common test board connected to a test apparatus, and the socket board is slid to replace a group of parts under test. It is a device test apparatus and a device test method in which work parts can be exchanged.

1 is a structural diagram of an embodiment of the present invention. It is an operation | movement explanatory flowchart of this invention. It is an example of the socket board | substrate of this invention. It is slide explanatory drawing of this invention.

Explanation of symbols

1: socket board 2: socket 3: common frame board 31: pad 4: support post 41: holding support post 5: spring 6: common board 61: pogo pin 7: common test board 10: test board 12 of LSI tester 12: LSI tester Test head section

Claims (4)

In a device testing device that tests parts,
Corresponding to the type of connection of the parts, both when providing a plurality of sets of connection portions for mounting a plurality of components of the first face common connection portion a plurality of sets of the common test board on the other side, the substrate provided with ,
A connecting portion is provided on one surface to slide and connect any one of a plurality of common connecting portions provided on the other surface of the substrate in the direction of the connecting portion to the common board. A common frame board provided with a connection part to the common board on the surface and a connection part that is connected or disconnected by bringing the connection part provided on the other surface of the common frame board closer or further away on one surface A device test apparatus comprising: a common board provided with a common board provided with a connection portion connected to the testing machine on another surface.   A direction in which the common frame board constituting the common test board is approached to the common board disposed below, as a connection portion provided on the other surface of the common frame board is connected or disconnected by being closer or farther away. The device test apparatus according to claim 1, wherein the device test apparatus is connected by moving to or connected to the common board and disconnected. In a device test method for testing a component,
Corresponding to the type of connection of the parts, both when providing a plurality of sets of connection portions for mounting a plurality of components of the first face common connection portion a plurality of sets of the common test board on the other side, the substrate provided with ,
A connecting portion is provided on one surface to slide and connect any one of a plurality of common connecting portions provided on the other surface of the substrate in the direction of the connecting portion to the common board. A common frame board provided with a connection part to the common board on the surface and a connection part that is connected or disconnected by bringing the connection part provided on the other surface of the common frame board closer or further away on one surface And a common board provided with a connecting portion for connecting to the testing machine on the other surface, and a common test board consisting of
A test component group is inserted into the board and mounted on the common frame board, and the board is moved to connect the connection part of any one of the group of parts close to the connection part of the common board for testing. After the test is completed, the test is performed by repeatedly moving the board to the next group of parts to be tested in a state where the connection part of the parts group on the board is away from the connection part of the common board. Device test method. From the start of the test to the end of the test, after taking out the part group that has completed the test on the board, a new part group to be tested is mounted, the part group test and the part group replacement The device testing method according to claim 3, wherein the device testing is performed in parallel.

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