JP4563623B2 - Photosensitive resin plate developing method and developing device - Google Patents

Photosensitive resin plate developing method and developing device Download PDF

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JP4563623B2
JP4563623B2 JP2001245476A JP2001245476A JP4563623B2 JP 4563623 B2 JP4563623 B2 JP 4563623B2 JP 2001245476 A JP2001245476 A JP 2001245476A JP 2001245476 A JP2001245476 A JP 2001245476A JP 4563623 B2 JP4563623 B2 JP 4563623B2
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photosensitive resin
resin plate
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developing
temperature
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JP2003057842A (en
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巳吉 渡辺
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Asahi Kasei E Materials Corp
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Asahi Kasei E Materials Corp
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Description

【0001】
【発明の属する技術分野】
本発明は、段ボール印刷、軟包装印刷、フィルム印刷、プレプリント印刷、ラベル印刷のようなフレキソ印刷に供される感光性樹脂版の製造方法と製造装置に関するものであり、特に環境に優しく生産性の高い現像方法および現像装置に関する。
【0002】
【従来の技術】
フレキソ印刷に代表される凸版印刷用の版材として感光性樹脂版が使用されており、この感光性樹脂版の1つであるAFP(商標名、旭化成製)はシート状感光性樹脂版として代表的な商品であり、製版装置としてもAFP−1500/AFP−2000(商標名、旭化成製)などが市販されている。
このシート状感光性樹脂版構成体として特開2000−155418号公報には、125μm厚みの透明なポリエステルフィルムなどを支持体とし、その上に熱可塑性エラストマー、少なくとも一つのエチレン性不飽和化合物、及び紫外線に感応する少なくとも一つの開始剤を含む感光性エラストマー組成物からなる感光性樹脂を3mm厚み程度に被覆し、この感光性樹脂の表層にネガフィルムとの接触をなめらかにする目的で、スリップ層または保護層と呼ばれるエチルセルロースの4〜6μmの薄膜層が設けられていることが記載されている。このようなシート状感光性樹脂版構成体からフレキソ印刷版を製版するには、まずフィルム支持体を通して全面に紫外線露光(バック露光と呼ぶ)を施して均一な光硬化層を設け、感光性樹脂層側から紫外光を選択的に透過するネガフィルムなどの透明画像担体を介して紫外線露光(レリーフ露光と呼ぶ)を施し、露光された感光性樹脂が光硬化して画像を形成し、次に未露光部分の感光性樹脂を塩素系溶剤であるパークロロエチレン(1,1,1-トリクロロエチレン)単独またはn-ブタノールのようなアルコールとの組み合わせ、或いは非塩素系の代替溶剤であるソルビット(商標名、マクダミッド製)のような溶剤現像液で洗浄除去することによりレリーフ画像が形成される。
【0003】
同様に欧州特許第261910号報には、アクリル酸エステルのモノマーおよびポリマー、およびケトン光重合/光架橋剤が支持体上に被覆され、水現像可能な感光性樹脂版の例が記載されている。こちらもネガフィルムを介して紫外光を選択的に照射することにより感光性樹脂の架橋を促進させ光硬化させた後に、未露光部分の感光性樹脂を水性現像液で洗浄除去することによりレリーフ画像が形成される。
上記2例のシート状感光性樹脂版構成体のみならず、殆どの感光性樹脂版の製造工程では未露光感光性樹脂の洗浄除去工程の後に、必要な後処理を施すことによってフレキソ印刷に供される感光性樹脂版を製造するという方法が採られている。
【0004】
すなわち、現像処理後の感光性樹脂版を長時間(1〜12時間)にわたって乾燥することにより、感光性樹脂版に残存する溶剤現像液を蒸発させ、そしてその後の仕上げ処理(光化学処理や化学処理)により感光性樹脂版の表面粘着性を低減させると共に、物性強度を印刷のストレスに耐えうるレベルまで向上させて、その後の印刷に用いられる。これらの従来技術では、感光性樹脂版を製造するために必要とされる工程時間が長時間であること、或いは複数の処理工程を連続して行う必要があること等に加えて、洗浄除去工程において毒性の副生成廃棄物が生成しうる。溶剤現像液による洗浄除去工程の場合には、溶媒形態および少なくとも1個の末端エチレン基を有する付加重合可能化合物含有形態の両方において毒性でありうる有機溶剤廃棄物が生成される。同様に、水性現像液による洗浄除去工程においても、毒性効果を有しうる同様の付加重合可能化合物を含有する汚染廃水副生成物が生成されうる。このような副生成物はそのまま自然環境或いは直接下水への排出ができない廃棄物であるため、産業廃棄物処分業者にその処分を委託しなければならない。その量は多量であり、その処分を委託するコストも高く、経済的に問題となっている。
【0005】
また、特開平5−19469号報ではシート状感光性樹脂版の現像方法として、露光工程後の感光性樹脂版を高温に加熱して未露光樹脂を溶融状態とし、当該溶融樹脂を不織布に吸収させ未露光樹脂の少なくとも75%を除去する吸収除去工程を提唱している。当方式は乾式で現像処理されるため、洗浄除去工程で生成される有機溶剤廃棄物や汚染廃水副生成物が無くなる代わりに未露光樹脂を含んだ大量の不織布廃棄物が発生する。また、不織布による吸収方式であるためレリーフ画像の深度が深い領域の未露光樹脂の除去性能が十分ではなく、例えば深いレリーフ深度が必要とされる段ボール印刷のような厚手版の現像処理としては不適である。
【0006】
【発明が解決しようとする課題】
本発明は、その要望に応えるものであり、露光工程後の感光性樹脂版に対する現像液の循環使用により現像廃液の発生量を抑制して廃棄処分コストを大幅に低減すると同時に、現像後の長時間の乾燥工程が不要となり生産性が向上し、さらに深いレリーフ深度を必要とする厚手版の製造を可能とする現像方法と現像装置を提供するものである。
【0007】
【課題を解決するための手段】
本発明者は、上記課題を解決するために鋭意研究を重ねた結果、露光工程後のシート状感光性樹脂版を温度制御して未露光樹脂を溶融状態にすると共にフィルム支持体の熱変形を防止しながら、現像液に特殊な洗浄剤成分を含有させず、ほぼ水からなる現像液単一か若しくは気体を混入した気液二相の現像液を用いて物理的力により未露光樹脂を感光性樹脂版から除去する。次にリンス処理で現像液を洗い流し、圧気水切り処理で感光性樹脂版の表面に残存するリンス水を吹き飛ばした後に、短時間の乾燥処理と後露光処理を行い、版表面に粘着性がなく画像再現性に優れ、印刷での耐刷性も良好な感光性樹脂版が得られる知見を得て、本発明を完成するに至った。
【0008】
すなわち、本発明は、下記の通りである。
1.露光後の感光性樹脂版を温度制御しながら、現像液を高圧で噴射する工程を含むことを特徴とする、感光性樹脂版の現像方法。
2.現像液に気体が混入されていることを特徴とする、1.記載の感光性樹脂版の現像方法。
3.現像液の温度が40℃以上であることを特徴とする、1.〜2.のいずれかに記載の感光性樹脂版の現像方法。
【0009】
4.現像液を1MPa以上30MPa以下の圧力下で噴射するとを特徴とする、1.〜3.のいずれかに記載の感光性樹脂版の現像方法。
5.現像液の温度が100℃を越えることを特徴とする、4.記載の感光性樹脂版の現像方法。
6.感光性樹脂版を構成する感光性樹脂層が未硬化感光性樹脂の溶融温度以上、或いは40〜200℃に温度制御されることを特徴とする、1.〜5.のいずれかに記載の感光性樹脂版の現像方法。
【0010】
7.感光性樹脂版を構成する支持体が支持体の熱変形温度以下、或いは40〜200℃に、感光性樹脂層とは独立して温度制御されることを特徴とする、1.〜6.のいずれかに記載の感光性樹脂版の現像方法。
8.現像液が水性現像液であることを特徴とする、1.〜7.のいずれかに記載の感光性樹脂版の現像方法。
9.混入した未硬化感光性樹脂をフィルターで除去した現像液を循環して使用することを特徴とする、1.〜8.のいずれかに記載の感光性樹脂版の現像方法。
【0011】
10.現像液を噴射後、感光性樹脂版の表面を水でリンスし、該水がそのまま現像液へ混入することを特徴とする、9.に記載の感光性樹脂版の現像方法。
11.現像液を40℃以上に加熱することが出来るヒーターを用いることを特徴とする、1.〜10.のいずれかに記載の感光性樹脂版の現像方法。
12.現像液を1MPa以上30MPa以下の圧力下で吐出することが出来るポンプを用いることを特徴とする、1.〜11.のいずれかに記載の感光性樹脂版の現像方法。
【0012】
13.現像液を100℃を越える温度に加熱することが出来るヒーター、或いは100℃を越える温度に加熱された気体を混入させる機構を用いることを特徴とする、12.に記載の感光性樹脂版の現像方法。
14.現像液を1MPa以上30MPa以下の圧力下で噴射するノズルを1個以上用いることを特徴とする、1.〜13.のいずれかに記載の感光性樹脂版の現像方法。
15.感光性樹脂版を構成する感光性樹脂層を未硬化感光性樹脂の溶融温度以上、或いは40〜200℃に温度制御することが出来る機構を用いることを特徴とする、1.〜14.のいずれかに記載の感光性樹脂版の現像方法。
【0013】
16.感光性樹脂版を構成する支持体を感光性樹脂層とは独立して支持体の熱変形温度以下、或いは40〜200℃に温度制御することが出来る機構を用いることを特徴とする、1.〜15.のいずれかに記載の感光性樹脂版の現像方法。
17.タンク内に蓄えられた現像液の表層、及び/又は現像液が流れる配管中にメッシュフィルター、オイル吸着マットフィルター、不織布フィルター、紙フィルター、或いはそれらを組み合わせた複合フィルターから選択される1以上のフィルターが備えられており、現像液をこれらフィルターでろ過することを特徴とする、1.〜16.のいずれかに記載の感光性樹脂版の現像方法。
【0014】
18.露光後の感光性樹脂版を温度制御する手段と現像液を高圧噴射する手段を有し、1.〜17.のいずれかに記載の感光性樹脂版の現像方法に用いられることを特徴とする、感光性樹脂版の現像装置。
19.タンク内に蓄えられた現像液の表層、及び/又現像液が流れる配管中にフィルターを有し、該フィルターがロール巻き態様で備えられ、所定版数の感光性樹脂版を現像処理後に所定長さで巻き取られる機構を有することを特徴とする、18.に記載の感光性樹脂版の現像装置。
【0015】
【発明の実施の形態】
本発明の実施例は、図1に示すように、露光工程後のシート状感光性樹脂版の支持体背面をドラム外周面と密着させて感光性樹脂版を保持し、ドラムを回転させながら、感光性樹脂層の温度を制御して未露光樹脂を溶融状態とし、水性現像液単一又はこれに気体を混入した気液二相の水性現像液を特定の条件で高圧下、噴射させて現像した後、必要に応じて、主として水を用いたリンス、及び圧気を用いた水切り工程を伴う一連の工程からなるドラム方式と呼ばれる現像方法である。この他に感光性樹脂版を平面定盤でフラットな状態で保持し同様な処理を行う平面方式を用いることもできる。
【0016】
以下、本発明に係わる現像方法及び現像装置についてその実施例の概要を説明する。
図1は、ドラム方式と呼ばれる現像方法が適用された現像装置の一例の模式図である。同図に示すように、露光工程後のシート状感光性樹脂版を保持して回転する版装着ドラム120と、感光性樹脂版を温調制御する版加熱ヒーターボックス140と、高圧の現像液噴射とその後のリンス水処理や圧気水切り処理を連続して行う処理槽110と、現像液を収容し加熱する現像液タンク112と、現像液の高圧化を行う高圧プランジャーポンプ130と、該高圧化された現像液を更に加熱する高圧水加熱ヒーター135から構成されている。
【0017】
まず版装着ドラム120の構成について説明する。版装着ドラム120の材質は磁石が作用するマルテンサイト系のステンレスであり、現像対象の感光性樹脂版200の先端をスプリングアクション方式にて挟持する版先端クランプ機構122と、版尻を固定する着脱式のマグネットクランプ123を備え、モーターを備えたドラム回転機構121に連結されている。
【0018】
版装着ドラム120外周面にて、感光性樹脂層を外側(支持体背面がドラム外周面と密着)に向けて保持された感光性樹脂版200に対して高圧の現像液を吹き付ける噴射ノズル132が、ドラム軸芯方向に沿って所定の速度で往復動する手段を備えたノズルヘッダー131上に等間隔で複数個配列されている。該ノズルヘッダー131の入力側には耐温性や耐圧性に優れた高温・高圧専用配管134や高圧水加熱ヒーター135を介して高圧プランジャーポンプ130と接続され、高圧プランジャーポンプ130の入力側には、供給配管133を介して現像液タンク112が接続されている。また版装着ドラム120の外周囲には、赤外〜遠赤外領域の熱線を放射して感光性樹脂版200を温度制御しながら未露光樹脂を溶融状態にする版加熱ヒーター141を収容している版加熱ヒーターボックス140が設けられている。
【0019】
図2は版装着ドラム120の内部構造とドラム外周面の温度制御機構を詳しく説明するためのものである。感光性樹脂版200を構成する支持体として、一般的にはポリエステルのような薄いフィルムを使用しており、ポリエステルフィルムの溶融温度は220℃前後であるが、所定温度を越えると徐々に収縮して熱変形する特性を有しており、例えば110℃、10分間程度の加熱でも0.数%近く収縮する。該フィルム支持体の熱変形を防止するため、支持体背面と密着している版装着ドラム120外周面より、感光性樹脂版200の温度制御機構とは独立した支持体単独の温度制御を行うことが好ましい。支持体の温度制御の一例として、図2では版装着ドラム120を中空構造とし、送液ポンプ181にて温調制御タンク180に収容され温度制御されている温調流体400を図2の矢印方向へ送出し、給液配管182とロータリージョイント183を介して版装着ドラム120内部へと供給する。該ドラム120内部に供給された温調流体400はドラム120筒体と熱交換を行いながらドラム120外周面を所定温度に維持させることにより、支持体が熱変形する温度まで昇温しない機構となっている。熱変換を終えた温調流体400はロータリージョイント184と排液配管185を介して温調制御タンク180へと帰還して再利用される。また、温調流体として液体の他に気体を使用しても同様な効果が得られる。
【0020】
処理槽110内には現像処理後に感光性樹脂版200表面に残存する現像液を洗い流すためにリンス水を噴霧する噴射ノズル151が、ノズルヘッダー150上に等間隔で複数個配列されている。該ノズルヘッダー150の入力側はホース152と電磁弁153を介して水道水配管と接続されている。リンス処理後に、感光性樹脂版200表面に残存するリンス水を圧気で吹き飛ばす水切りノズル160が圧気配管161と電磁弁162を介してコンプレッサーと接続されている。
【0021】
次に現像液タンク112の構成について説明する。現像液を所定の温度まで加熱、或いは所定の温度で保温する加熱ヒーター113が設けられており、更に現像液タンク112内に収容している現像液の表層には、現像液内に混入した未硬化樹脂を濾過するために、未硬化樹脂の濾過特性に応じてメッシュフィルター、オイル吸着マットフィルター、不織布フィルター、紙フィルター、或いはそれらを組み合わせた複合フィルターが設置される。ここでは一例として不織布フィルター171が設けられており、不織布ロール巻き原反供給機構170と不織布巻き取り機構172、及びロール群を備えることにより所定版数の感光性樹脂版を現像処理した後に、濾過面積に応じて不織布フィルター171を所定長さ巻き取る構造となっている。フィルターは、現像液が流れる配管中に設けることもできる。
【0022】
以上の構成における現像装置では、感光性樹脂版200が装着されたドラム120が、図1の矢印方向へ回転を開始すると、版加熱ヒーター141から赤外〜遠赤外線が放射されて感光性樹脂版200が加熱されると共に、高圧プランジャーポンプ130が運転を開始する。現像液タンク112内で所定の温度まで加熱された現像液300は高圧プランジャーポンプ130で吸引されて高圧力が加えられた状態で高圧水加熱ヒーター135を通過しながら、必要に応じて100℃を越える温度まで加温されてノズルヘッダー131へと供給される。ノズルヘッダー131に供給された現像液300はノズル132の噴射口から微粒化或いは均等化された状態で感光性樹脂版200に噴射される。噴射ノズル132から吹き出された現像液300は感光性樹脂版200に当たった後、不織布フィルタ−171を介して未硬化樹脂が取り除かれて現像液タンク112内に再び帰還してくる。そして現像液タンク112に接続された供給配管133を介してまた高圧プランジャーポンプ130内へと吸引されて循環使用される。引き続いて、感光性樹脂版200表面に残存する現像液300を洗い落とすために、電磁弁153を開き水道から直接に供給される水をリンス水噴射ノズル151から吹き付ける。このリンス水はそのまま現像液タンク112内へと流れ込み現像液300として利用される。リンス処理終了後に電磁弁162を開きコンプレッサーから供給される圧縮空気を水切りノズル160より感光性樹脂版200に吹き付けて残存するリンス水を吹き飛ばす。この後、ドラム120から感光性樹脂版200を取り外し、次工程の乾燥や後露光処理行い印刷版となる。
【0023】
以上、実施例で説明したように、シート状感光性樹脂版を前面と背面の両面から温度制御することにより、支持体の熱変形を防止しながら未露光樹脂を溶融状態とし、高圧スプレー現像を行う方法及び装置は、通常の手法により露光工程に供された、シート状感光性樹脂印刷版に対して適用できる。
すなわち、所定の画像がデザインされたネガフィルムを介して露光されたシート状感光性樹脂版を、上記の現像装置の開閉扉111を開け、該樹脂版200を処理槽110に挿入して版先端をクランプ機構122にて挟持させた後、版装着ドラム120を適当な位置まで回転させて版尻をマグネットクランプ123にて固定する。このようにドラム120外周面に現像前の樹脂版200の感光性樹脂層を外側に向けて巻き付けて固定させた後、上記の現像処理を行うことができる。
【0024】
以下、本発明の実施の態様についてより具体的に説明する。
本発明では、水性現像液を用いる。ここでいう、水性現像液とは、現像液の組成のうち、水の占める割合が最大であることを示す。従来、水系現像が可能なシート状感光性樹脂版の一般的な水系現像液としては、化学的作用で樹脂を溶解することにより現像を行うために、界面活性剤水溶液1〜5%を含有させたものが用いられるが、この現像方法では現像工程によって除去された未硬化樹脂が現像液中に溶け込むため、樹脂成分だけを現像液中から除去することが困難となる。このような、未硬化感光性樹脂を含有する現像液は、その樹脂溶解性が低下するばかりでなく、後続の後露光工程による印刷版表面の粘着性除去の効果にも好ましくない影響を及ぼす。これに対し、本発明で用いるの水性現像液は、界面活性剤水溶液を含有しない水道水であり、疎水性の樹脂成分は本発明の水性現像液中に溶け込むことができず、現像工程後、使用済みの水性現像液から未硬化樹脂成分だけを除去することが容易となる。
【0025】
このように、本発明においては、水性現像液を用いることによって、現像後の水性現像液に含まれる未硬化樹脂と現像液の分離が容易となり、現像液の循環使用、ひいては現像液の長寿命化を図ることができる。
本発明においては、前記、水性現像液中の樹脂成分を分離、除去するために装置の適当な箇所にフィルター類を設置することで、上記現像液の寿命延長効果をさらに増大させることもできる。例えば、現像液を感光性樹脂版に噴射後、使用済み現像液が収容される現像液タンク(図1、112)の表層にメッシュフィルター、オイル吸着マットフィルター、不織布フィルター、紙フィルター、或いはそれらを組み合わせた複合フィルターなどのフィルター類(図1、171)を設置する。現像液がそれらフィルター類を通過して、現像液タンクに戻ることによって、現像液中の大半の未硬化樹脂がフィルターで濾過され、水性現像液をリサイクルすることができる。
【0026】
本発明で用いるの水性現像液には、該現像液を噴射したときの未硬化樹脂の除去効率を向上させるために気体を含ませることもできる。気体としては空気や水蒸気が好ましく、特に水性現像液の温度を100℃以上に昇温させたい場合は水蒸気を使用することが好ましい。空気を水性現像液中に混入する場合、空気圧力は現像効果の点から0.1MPa以上が好ましい。
【0027】
本発明に用いる水性現像液の温度は40℃以上であることが好ましい。水性現像液を40℃以上にすることにより、一般的に40℃以上に加熱されて溶融状態となっている感光性樹脂版の未硬化樹脂が、水性現像液により冷却されて粘性抵抗が増加し除去効果に悪影響を及ばすことを防止できる。安定した未硬化樹脂除去効果を得るためには、水性現像液の温度が未硬化樹脂の溶融温度近傍に保たれることが好ましく、未硬化樹脂の溶融温度が100℃を越えるような場合には、大気圧下での水性現像液の沸騰温度以上となるため、後記する1MPa以上30MPa以下に加圧された後の高圧水性現像液を高圧水加熱ヒーター135にて100℃を越える温度に加熱したり、前記100℃を越える水蒸気を混入させることが好ましい。
【0028】
また、水性現像液は、感光性樹脂版に対して噴射されたときの物理的衝撃による未硬化樹脂除去効果を十分に発揮するために1MPa以上、30Mpa以下の高圧で感光性樹脂版に噴射させることが好ましい。物理的衝撃による現像効果の点で1MPa以上、レリーフ形状特に線幅が500μm以下である独立線や面積率が5%以下であるハイライト網点の損傷防止の点で30MPa以下が好ましい。
【0029】
また、本発明に用いるシート状感光性樹脂版は、高圧水性現像液による安定した未硬化樹脂除去効果を得るために、未硬化樹脂の溶融温度以上、或いは40〜200℃に温度制御されることが好ましい。
また、本発明に用いるシート状感光性樹脂版は、上記の如く温度制御されて高温となるため、支持体が支持体の熱変形温度以下、或いは40〜200℃に、感光性樹脂層とは独立して温度制御されることが好ましい。
【0030】
以下、実施例につき詳細に説明する。
上記現像工程を実施するための典型的な現像装置は、内部に温調流体を流すことにより外周面が温度制御可能な中空ドラムと、該ドラム外周面で感光性樹脂層を外側に向けて感光性樹脂版を保持し数〜数十RPMの回転数で回転しながら、該ドラム外周囲より赤外〜遠赤外線を放射して感光性樹脂版の未硬化樹脂を溶融状態に温度制御する版加熱ヒーターを備え、水性現像液を1MPa以上30MPa以下の圧力で吐出することが出来る高圧ポンプと、該加圧された水性現像液を100℃以上に加熱可能な高圧水加熱ヒーターを経て供給された水性現像液を感光性樹脂層に向けて噴射するノズルから構成されている。
【0031】
現像工程において、水性現像液の噴射又は噴出方向は、未硬化樹脂を除去可能な限り特に制限されず、感光性樹脂層表面に対して若干斜め方向であってもよいが、通常は感光性樹脂層表面に対してほぼ垂直方向(例えば0〜15°程度)が好ましい。水性現像液の噴射は、単一又は複数のノズル(例えば、並列に配されたノズル群など)を用いて行うことができ、ノズル現像処理幅が感光性樹脂版の処理幅に満たない場合は、ドラムの軸芯方向に沿って噴射ノズルが移動しながら水性現像液を噴射する。また、ノズルと感光性樹脂層表面との距離はノズル(或いはポンプ)出口の吐出圧力とノズル型式に応じて未硬化樹脂を除去可能な限り特に制限されず、高圧均等扇形ノズルVNP−1/8M−6549(いけうち製)のような型式であれば一般的には50〜200mm程度である。
【0032】
現像終了後も、ドラムの回転を継続させながら、感光性樹脂版の表面に残った水性現像液を洗い流すため、水を感光性樹脂版表面に吹き付けてリンスする。このリンス水の組成構成は水単一が好ましく、リンス水の水圧及び噴射方向、時間、温度、方式は、感光性樹脂版表面に残った現像液を洗い流すことが可能な限り特に制限されない。またリンス水はそのまま現像液に混入し、その後は現像液として使用する。本発明における現像工程では、現像液を高温下しかつ高圧下でスプレー噴射による現像液の微粒化によって、現像液組成中の水成分が蒸発し、排気機構によって大気中へと排出されるため現像液が減少していく。そこで前記リンス水を現像液中に取り込むことによって、現像液量を一定に保つことができる。従来の界面活性剤を含有した化学活性の高い現像液と異なり、リンス水が現像液に混入しても、現像液中の界面活性剤量の割合が減少することにより、現像効果が低下し、ひいては、現像廃液の交換時期を早めるおそれはない。
【0033】
リンス工程終了後も、ドラムの回転を継続させながら、通常感光性樹脂版表面に残ったリンス水を除去するために、圧気ブローノズルによる水切り工程を設ける。圧気ブローの圧気圧及び噴射方向、時間、温度、方式は、感光性樹脂版表面に残ったリンス水を吹き飛ばすことが可能な限り特に制限されない。感光性樹脂版表面にリンス水が残っていると、後続する工程へ感光性樹脂版を搬送する時に水が滴り落ちて作業環境を悪化させる。
【0034】
水切り工程終了後は、ドラムの回転を止め、現像工程が終わった感光性樹脂版をドラムから取り外し、公知である乾燥、或いは後露光を経て印刷版となる。
次に、水性現像液が、化学活性の高い従来の現像液に劣らない、若しくはこれを上回る性能を有することを実施例及び比較例によりさらに詳細に説明する。尚、本発明の実施態様はこの実施例に限定されるものではない。
【0035】
【実施例1】
版厚2.54mm(ポリエステルフィルム支持体厚み125μm)、サイズ762mm1016mmのシート状感光性樹脂版AFP−HD(旭化成製。以後樹脂版HDと記載)を、AFP−1500露光機(旭化成製)を用いて露光工程まで終了した版を作成した。露光量はレリーフ深度1.0mm、また133LPI/3%のハイライト形成が可能となる適正露光条件であるバック露光255mJ/cm2、レリーフ露光6000mJ/cm2とした。
【0036】
外径350mmφ幅1200mmと樹脂版HDを横長の状態で保持し、ドラム内部に温調流体(水或いはオイル)を流してドラム外周面を温度制御しながら回転する中空ドラムを備え、該ドラム外周囲より熱線を放射して樹脂版HDの未露光樹脂を溶融状態に温度制御しながら、同時に高圧スプレー現像が行えるドラム型実験機の現像液タンク(容量200L)に水を投入し、予め90℃に昇温した熱水を用いて高圧スプレー現像を行う。また、現像液タンクの上方には現像済み熱水に混入した未露光樹脂を除去するスパンボンド不織布(旭化成製)を備え、濾過された熱水が現像液タンクに帰還して循環再利用される構造となっている。
【0037】
露光工程後の樹脂版HDの支持体背面をドラム外周面に密着させて保持し、1rpm(周速度:1100mm/min)の回転速度でドラムを回転させながら、80℃辺りから未露光樹脂が軟化していく熱溶融特性を有する樹脂版HDを熱線ヒーターにて110℃に温度制御しながら、併せて中空ドラム内部に80℃以下の温調流体を流して樹脂版HDポリエステルフィルム支持体の昇温を100℃以下に抑制することにより熱変形を防止する。高圧スプレー機構としては、吐出圧力15MPaの高圧プランジャーポンプを用い、ノズル噴出口と樹脂版HD間の距離100mmの位置にて高圧均等扇形ノズル(いけうち製、型式:VNP−1/8M−6549)を並列に複数個配列したノズルで15分間現像した。ついで現像した版を水道水でリンスし、さらにリンスした版の表面に残ったリンス水をエアーガンで吹き飛ばし、5分ほど乾燥機に放置した。その後、370nmに中心波長をもつ紫外線蛍光灯を用いて1000mJ/cm2、続いて254nmに中心波長をもつ殺菌灯を用いて版表面全体に1750mJ/cm2の後露光処理を行い印刷版が得られた。
【0038】
得られた印刷版表面を触感にて評価したが、べとつき感や粘着性もなく、表面に異物などが付着してもそれらを取り除くことは容易であった。またネガフィルムにて100μm幅独立線や500μm幅白抜き線に対応する印刷版のレリーフ画像を測定したところ、100μm独立線では約100μmのレリーフ幅、500μm幅白抜き線ではレリーフ白抜き幅は約480μm、深度は約210μmであった。更に133LPI/3%網点のドット根本部の損傷を顕微鏡にて確認したが、特に亀裂など認められず、長時間の印刷でも良好な印刷品質を維持していた。
【0039】
【比較例1】
実施例1と同一の露光条件で樹脂版HDを作成した。
ついで、ソルビット(マクダミッド製)を現像液として、AFP−1500現像機の回転するドラムに版を両面テ−プで貼り付けて、液温25℃で5分間現像をおこない、60℃で1時間乾燥させた。その後、実施例1と同一の後露光条件で後露光処理を行い印刷版が得られた。
得られた印刷版表面を触感にて評価したが、べとつき感や粘着性もなく、表面に異物などが付着してもそれらを取り除くことは容易であった。またネガフィルムにて100μm幅独立線や500μm幅白抜き線に対応する印刷版のレリーフ画像を測定したところ、100μm独立線では約98μmのレリーフ幅、500μm幅白抜き線ではレリーフ白抜き幅は約480μm、深度は約207μmであった。更に133LPI/3%網点のドット根本部の損傷を顕微鏡にて確認したが、特に亀裂など認められず、長時間の印刷でも良好な印刷品質を維持していた。
【0040】
【実施例2】
版厚7.0mm(ポリエステルフィルム支持体厚み188μm)、サイズ762mm1016mmのシート状感光性樹脂版AFP−SQ(旭化成製。以後樹脂版SQと記載)を、AFP−1500露光機を用いて露光工程まで終了した版を作成した。露光量はレリーフ深度2.0mm、また85LPI/5%のハイライト形成が可能となる適正露光条件であるバック露光2000mJ/cm2、レリーフ露光5000mJ/cm2とした。
【0041】
実施例1で使用したドラム型実験機を使用して同一の現像条件で樹脂版SQを現像した。ついで実施例1と同様に現像した版を水道水でリンスし、さらにリンスした版の表面に残ったリンス水をエアーガンで吹き飛ばし、5分ほど乾燥機に放置した。その後、370nmに中心波長をもつ紫外線蛍光灯を用いて1000mJ/cm2、続いて254nmに中心波長をもつ殺菌灯を用いて版表面全体に1000mJ/cm2の後露光処理を行い印刷版が得られた。
得られた印刷版表面を触感にて評価したが、べとつき感や粘着性もなく、表面に異物などが付着してもそれらを取り除くことは容易であった。またネガフィルムにて250μm幅独立線や500μm幅白抜き線に対応する印刷版のレリーフ画像を測定したところ、250μm独立線では約220μmのレリーフ幅、500μm幅白抜き線ではレリーフ白抜き幅は約550μm、深度は約196μmであった。更に85LPI/5%網点のドット根本部の損傷を顕微鏡にて確認したが、特に亀裂など認められず、長時間の印刷でも良好な印刷品質を維持していた。
【0042】
【比較例2】
実施例2と同一の露光条件で樹脂版SQを作成した。
ついで、比較例1と同様にソルビットを現像液として、AFP−1500現像機の回転するドラムに版を両面テ−プで貼り付けて、液温25℃で10分間現像をおこない、60℃で1時間乾燥させた。その後、実施例2と同一の後露光条件で後露光処理を行い印刷版が得られた。
得られた印刷版表面を触感にて評価したが、べとつき感や粘着性もなく、表面に異物などが付着してもそれらを取り除くことは容易であった。またネガフィルムにて250μm幅独立線や500μm幅白抜き線に対応する印刷版のレリーフ画像を測定したところ、250μm独立線では約215μmのレリーフ幅、500μm幅白抜き線ではレリーフ白抜き幅は約555μm、深度は約190μmであった。更に85LPI/5%網点のドット根本部の損傷を顕微鏡にて確認したが、特に亀裂など認められず、長時間の印刷でも良好な印刷品質を維持していた。
【0043】
【発明の効果】
以上説明したように、本発明による感光性樹脂版の現像方法は、未露光樹脂を溶融状態に温度制御しながら物理的作用を利用した高圧噴射現像を行うので、感光性樹脂が不溶性の水性現像液を用いた印刷版現像が可能である。使用済みの現像液から感光性樹脂を分離除去した後これを現像液として再利用することが容易となるため、現像廃液の量が減少し、環境保全に有利で、且つ廃液処分コストの大幅な削減も達成できる。更に、現像後の長時間の乾燥工程が不要となり生産性が向上し、さらに深いレリーフ深度を必要とする厚手版の製造も可能である。
【図面の簡単な説明】
【図1】本発明の実施に好適な現像装置の概略構成を示す縦断面図である。
【図2】本発明の一実施形態にかかるドラム外周面温度制御の概略構成を説明する横断面図である。
【符号の説明】
100:現像装置
110:処理槽
111:開閉扉
112:現像液タンク
113:現像液加熱ヒーター
120:版装着ドラム
121:ドラム回転機構
122:版先端クランプ機構
123:マグネットクランプ
130:高圧プランジャーポンプ
131:揺動機能付きノズルヘッダー
132:現像液噴射ノズル
133:供給配管
134:高温・高圧配管
135:高圧水加熱ヒーター
140:版加熱ヒーターボックス
141:版加熱ヒーター
150:リンス水ノズルヘッダー
151:リンス水噴射ノズル
152:リンス水ホース
153:リンス水電磁弁
160:圧気水切りノズル
161:圧気配管
162:圧気電磁弁
170:不織布ロール巻き原反供給機構
171:不織布フィルター
172:不織布巻き取り機構
180:温調制御タンク
181:送液ポンプ
182:給液配管
183、184:ロータリージョイント
185:排液配管
200:シート状感光性樹脂版
300:現像液
400:温調流体
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and an apparatus for producing a photosensitive resin plate used for flexographic printing such as cardboard printing, flexible packaging printing, film printing, preprint printing, and label printing, and is particularly environmentally friendly and productive. The present invention relates to a high development method and a development apparatus.
[0002]
[Prior art]
A photosensitive resin plate is used as a plate material for letterpress printing represented by flexographic printing, and one of the photosensitive resin plates, AFP (trade name, manufactured by Asahi Kasei), is a representative sheet-shaped photosensitive resin plate. AFP-1500 / AFP-2000 (trade name, manufactured by Asahi Kasei) and the like are commercially available as plate making apparatuses.
As this sheet-like photosensitive resin plate constituting body, JP 2000-155418 A uses a transparent polyester film having a thickness of 125 μm as a support, on which a thermoplastic elastomer, at least one ethylenically unsaturated compound, and For the purpose of coating a photosensitive resin comprising a photosensitive elastomer composition containing at least one initiator sensitive to ultraviolet rays to a thickness of about 3 mm, and smoothing the contact with the negative film on the surface layer of the photosensitive resin. Alternatively, it is described that a 4 to 6 μm thin film layer of ethyl cellulose called a protective layer is provided. In order to make a flexographic printing plate from such a sheet-like photosensitive resin plate structure, first, an ultraviolet light exposure (called back exposure) is performed on the entire surface through a film support to provide a uniform photocured layer, and a photosensitive resin is obtained. UV exposure (called relief exposure) is performed through a transparent image carrier such as a negative film that selectively transmits UV light from the layer side, and the exposed photosensitive resin is photocured to form an image, Unexposed photosensitive resin perchlorethylene (1,1,1-trichloroethylene) alone or in combination with alcohol such as n-butanol, or non-chlorine alternative solvent Sorbitt (trademark) A relief image is formed by washing and removing with a solvent developer such as “McDamid”.
[0003]
Similarly, EP 261910 describes an example of a photosensitive resin plate which is coated with a monomer and polymer of an acrylate ester and a ketone photopolymerization / photocrosslinking agent on a support and is developable in water. . This also promotes the crosslinking of the photosensitive resin by selectively irradiating ultraviolet light through a negative film, and after photocuring, the photosensitive resin in the unexposed area is washed away with an aqueous developer to remove the relief image. Is formed.
In addition to the two sheet-shaped photosensitive resin plate structures described above, most of the photosensitive resin plate manufacturing processes are subjected to flexographic printing by performing the necessary post-treatment after the washing and removing process of the unexposed photosensitive resin. The method of manufacturing the photosensitive resin plate to be manufactured is taken.
[0004]
That is, by drying the photosensitive resin plate after the development treatment for a long time (1 to 12 hours), the solvent developer remaining on the photosensitive resin plate is evaporated, and the subsequent finishing treatment (photochemical treatment or chemical treatment). ) Reduces the surface tackiness of the photosensitive resin plate and improves the physical property strength to a level that can withstand the stress of printing, and is used for subsequent printing. In these prior arts, in addition to the fact that the process time required for producing the photosensitive resin plate is long, or that it is necessary to perform a plurality of processing steps in succession, the cleaning removal step Toxic by-product waste can be produced. In the case of a solvent developer wash-off step, organic solvent waste is produced that can be toxic both in solvent form and in an addition polymerizable compound-containing form having at least one terminal ethylene group. Similarly, contaminated wastewater by-products containing similar addition-polymerizable compounds that can have toxic effects can also be produced in the washing and removal step with an aqueous developer. Since such a by-product is a waste that cannot be discharged directly into the natural environment or directly into sewage, it must be entrusted to an industrial waste disposal contractor. The amount is large, and the cost of entrusting the disposal is high, which is an economic problem.
[0005]
In JP-A-5-19469, as a method for developing a sheet-shaped photosensitive resin plate, the photosensitive resin plate after the exposure process is heated to a high temperature to bring the unexposed resin into a molten state, and the molten resin is absorbed into the nonwoven fabric. An absorption removal process is proposed that removes at least 75% of the unexposed resin. Since this method is a dry development process, a large amount of non-exposed resin waste containing unexposed resin is generated instead of eliminating organic solvent waste and contaminated waste water by-product generated in the washing and removing process. In addition, the removal method of unexposed resin in areas where the depth of the relief image is deep is not sufficient due to the absorption method using non-woven fabric, and is not suitable for development processing of thick plates such as cardboard printing that requires a deep relief depth, for example. It is.
[0006]
[Problems to be solved by the invention]
The present invention responds to this demand, and by reducing the amount of development waste generated by circulating the developer to the photosensitive resin plate after the exposure process, the disposal cost can be greatly reduced, and at the same time, It is an object of the present invention to provide a developing method and a developing apparatus that can increase the productivity because a time drying step is not required, and can produce a thick plate that requires a deeper relief depth.
[0007]
[Means for Solving the Problems]
As a result of intensive research to solve the above-mentioned problems, the present inventor has controlled the temperature of the sheet-like photosensitive resin plate after the exposure process to bring the unexposed resin into a molten state and to thermally deform the film support. While preventing, the developer does not contain a special cleaning agent component, and the unexposed resin is exposed by physical force using a single developer consisting of almost water or a gas-liquid two-phase developer mixed with gas. Remove from the adhesive resin plate. Next, the developer is washed away by a rinsing process, and the rinse water remaining on the surface of the photosensitive resin plate is blown off by a pressurized water draining process, followed by a short drying process and a post-exposure process, and the plate surface is not sticky. Obtaining knowledge that a photosensitive resin plate having excellent reproducibility and good printing durability can be obtained, and the present invention has been completed.
[0008]
That is, the present invention is as follows.
1. A method for developing a photosensitive resin plate, comprising a step of spraying a developer at a high pressure while controlling the temperature of the photosensitive resin plate after exposure.
2. 1. Gas is mixed in the developer, The developing method of the photosensitive resin plate of description.
3. 1. The temperature of the developer is 40 ° C. or higher. ~ 2. The method for developing a photosensitive resin plate according to any one of the above.
[0009]
4). 1. A developer is jetted under a pressure of 1 MPa to 30 MPa. ~ 3. The method for developing a photosensitive resin plate according to any one of the above.
5). 3. The temperature of the developer exceeds 100 ° C. The developing method of the photosensitive resin plate of description.
6). The temperature of the photosensitive resin layer constituting the photosensitive resin plate is controlled to be equal to or higher than the melting temperature of the uncured photosensitive resin, or 40 to 200 ° C. ~ 5. The method for developing a photosensitive resin plate according to any one of the above.
[0010]
7). 1. The temperature of the support constituting the photosensitive resin plate is controlled to be equal to or lower than the thermal deformation temperature of the support or from 40 to 200 ° C. independently of the photosensitive resin layer. ~ 6. The method for developing a photosensitive resin plate according to any one of the above.
8). 1. The developer is an aqueous developer, ~ 7. The method for developing a photosensitive resin plate according to any one of the above.
9. 1. A circulating developer used after removing unmixed photosensitive resin mixed with a filter; ~ 8. The method for developing a photosensitive resin plate according to any one of the above.
[0011]
10. 8. After jetting the developer, the surface of the photosensitive resin plate is rinsed with water, and the water is directly mixed into the developer. The development method of the photosensitive resin plate of description.
11. 1. A heater capable of heating the developer to 40 ° C. or higher is used. -10. The method for developing a photosensitive resin plate according to any one of the above.
12 1. A pump capable of discharging a developer under a pressure of 1 MPa to 30 MPa is used. ~ 11. The method for developing a photosensitive resin plate according to any one of the above.
[0012]
13. 11. A heater capable of heating the developer to a temperature exceeding 100 ° C. or a mechanism for mixing a gas heated to a temperature exceeding 100 ° C. is used. The development method of the photosensitive resin plate of description.
14 1. One or more nozzles for injecting the developer under a pressure of 1 MPa to 30 MPa are used. ~ 13. The method for developing a photosensitive resin plate according to any one of the above.
15. 1. A mechanism capable of controlling the temperature of the photosensitive resin layer constituting the photosensitive resin plate at a temperature equal to or higher than the melting temperature of the uncured photosensitive resin or 40 to 200 ° C. is used. -14. The method for developing a photosensitive resin plate according to any one of the above.
[0013]
16. 1. Use a mechanism capable of controlling the temperature of the support constituting the photosensitive resin plate to be equal to or lower than the thermal deformation temperature of the support, or 40 to 200 ° C., independently of the photosensitive resin layer. -15. The method for developing a photosensitive resin plate according to any one of the above.
17. One or more filters selected from a mesh filter, an oil adsorption mat filter, a non-woven filter, a paper filter, or a composite filter combining them in the surface layer of the developer stored in the tank and / or in the piping through which the developer flows. And the developer is filtered through these filters. -16. The method for developing a photosensitive resin plate according to any one of the above.
[0014]
18. Having means for controlling the temperature of the exposed photosensitive resin plate and means for jetting a developer at high pressure; -17. A photosensitive resin plate developing apparatus, which is used in the method for developing a photosensitive resin plate according to any one of the above.
19. The surface layer of the developer stored in the tank and / or the pipe through which the developer flows has a filter, the filter is provided in a roll winding mode, and a predetermined number of photosensitive resin plates are developed for a predetermined length after development processing. 18. It has the mechanism wound up by the length, The developing device for photosensitive resin plate described in 1.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
In the embodiment of the present invention, as shown in FIG. 1, while holding the photosensitive resin plate in close contact with the drum outer peripheral surface, the back surface of the sheet-shaped photosensitive resin plate after the exposure step is rotated, The temperature of the photosensitive resin layer is controlled to bring the unexposed resin into a molten state, and a single aqueous developer or a gas-liquid two-phase aqueous developer mixed with gas is jetted under high pressure under specific conditions. Then, if necessary, a developing method called a drum system comprising a series of steps mainly involving rinsing using water and a draining process using pressurized air. In addition, it is possible to use a planar method in which the photosensitive resin plate is held in a flat state on a flat surface plate and the same processing is performed.
[0016]
An outline of embodiments of the developing method and the developing apparatus according to the present invention will be described below.
FIG. 1 is a schematic diagram of an example of a developing device to which a developing method called a drum system is applied. As shown in the figure, a plate mounting drum 120 that holds and rotates a sheet-shaped photosensitive resin plate after the exposure process, a plate heater box 140 that controls the temperature of the photosensitive resin plate, and a high-pressure developer injection And a processing tank 110 that continuously performs a rinsing water treatment and a pressurized air draining process, a developer tank 112 that contains and heats the developer, a high-pressure plunger pump 130 that increases the pressure of the developer, and the pressure increase The high-pressure water heater 135 further heats the developed developer.
[0017]
First, the configuration of the plate mounting drum 120 will be described. The material of the plate mounting drum 120 is martensitic stainless steel on which a magnet acts, and a plate tip clamping mechanism 122 that clamps the tip of the photosensitive resin plate 200 to be developed by a spring action method, and a detachment that fixes the plate bottom. A magnet clamp 123 of the type is provided, and is connected to a drum rotating mechanism 121 having a motor.
[0018]
A jet nozzle 132 that sprays a high-pressure developer onto the photosensitive resin plate 200 held on the outer peripheral surface of the plate mounting drum 120 with the photosensitive resin layer facing outward (the back of the support is in close contact with the outer peripheral surface of the drum). A plurality of nozzle headers 131 are arranged at equal intervals on a nozzle header 131 provided with means for reciprocating at a predetermined speed along the drum axis direction. The nozzle header 131 is connected to the input side of the high-pressure plunger pump 130 through the high-temperature / high-pressure dedicated pipe 134 and the high-pressure water heater 135 that are excellent in temperature resistance and pressure resistance. Is connected to the developer tank 112 via a supply pipe 133. In addition, a plate heater 141 that accommodates the unexposed resin in a molten state while controlling the temperature of the photosensitive resin plate 200 by radiating heat rays in the infrared to far-infrared region is accommodated around the outer periphery of the plate mounting drum 120. A plate heater box 140 is provided.
[0019]
FIG. 2 is a diagram for explaining in detail the internal structure of the plate mounting drum 120 and the temperature control mechanism of the drum outer peripheral surface. A thin film such as polyester is generally used as a support constituting the photosensitive resin plate 200, and the melting temperature of the polyester film is around 220 ° C., but when it exceeds a predetermined temperature, it gradually shrinks. For example, even when heated at 110 ° C. for about 10 minutes. Shrinks near several percent. In order to prevent thermal deformation of the film support, the temperature of the support alone is controlled independently from the temperature control mechanism of the photosensitive resin plate 200 from the outer peripheral surface of the plate mounting drum 120 in close contact with the back of the support. Is preferred. As an example of the temperature control of the support, in FIG. 2, the plate mounting drum 120 has a hollow structure, and the temperature control fluid 400 that is housed in the temperature control tank 180 by the liquid feed pump 181 and is temperature controlled is indicated by the arrow in FIG. To the inside of the plate mounting drum 120 via the liquid supply pipe 182 and the rotary joint 183. The temperature adjusting fluid 400 supplied to the inside of the drum 120 is a mechanism that does not raise the temperature to a temperature at which the support is thermally deformed by maintaining the outer peripheral surface of the drum 120 at a predetermined temperature while exchanging heat with the drum 120 cylinder. ing. After the heat conversion, the temperature control fluid 400 is returned to the temperature control tank 180 through the rotary joint 184 and the drain pipe 185 and reused. The same effect can be obtained by using a gas in addition to the liquid as the temperature control fluid.
[0020]
In the processing tank 110, a plurality of spray nozzles 151 for spraying rinse water to wash away the developer remaining on the surface of the photosensitive resin plate 200 after the development processing are arranged on the nozzle header 150 at equal intervals. The input side of the nozzle header 150 is connected to a tap water pipe via a hose 152 and a solenoid valve 153. After the rinsing process, a drain nozzle 160 that blows away rinse water remaining on the surface of the photosensitive resin plate 200 with pressurized air is connected to a compressor via a pressurized air pipe 161 and an electromagnetic valve 162.
[0021]
Next, the configuration of the developer tank 112 will be described. A heater 113 is provided for heating the developer to a predetermined temperature or keeping the developer at a predetermined temperature. Further, the surface layer of the developer stored in the developer tank 112 is not mixed with the developer. In order to filter the cured resin, a mesh filter, an oil adsorption mat filter, a nonwoven fabric filter, a paper filter, or a composite filter combining them is installed according to the filtration characteristics of the uncured resin. Here, as an example, a nonwoven fabric filter 171 is provided, and after developing a predetermined number of photosensitive resin plates by providing a nonwoven fabric roll winding raw material supply mechanism 170, a nonwoven fabric winding mechanism 172, and a roll group, filtration is performed. The nonwoven fabric filter 171 is wound up by a predetermined length according to the area. The filter can also be provided in a pipe through which the developer flows.
[0022]
In the developing device having the above configuration, when the drum 120 on which the photosensitive resin plate 200 is mounted starts to rotate in the direction of the arrow in FIG. 1, infrared to far infrared rays are emitted from the plate heater 141, and the photosensitive resin plate. As 200 is heated, the high pressure plunger pump 130 begins operation. The developer 300 heated to a predetermined temperature in the developer tank 112 is sucked by the high-pressure plunger pump 130 and passes through the high-pressure water heater 135 in a state where a high pressure is applied. It is heated to a temperature exceeding the temperature and supplied to the nozzle header 131. The developer 300 supplied to the nozzle header 131 is sprayed from the spray port of the nozzle 132 onto the photosensitive resin plate 200 in a state of being atomized or equalized. After the developer 300 blown out from the spray nozzle 132 hits the photosensitive resin plate 200, the uncured resin is removed through the nonwoven fabric filter-171 and returns to the developer tank 112 again. Then, it is sucked into the high-pressure plunger pump 130 through the supply pipe 133 connected to the developer tank 112 and circulated for use. Subsequently, in order to wash off the developer 300 remaining on the surface of the photosensitive resin plate 200, the electromagnetic valve 153 is opened and water supplied directly from the tap water is sprayed from the rinse water spray nozzle 151. This rinse water flows into the developer tank 112 as it is and is used as the developer 300. After completion of the rinsing process, the electromagnetic valve 162 is opened and the compressed air supplied from the compressor is blown from the drain nozzle 160 onto the photosensitive resin plate 200 to blow off the remaining rinse water. Thereafter, the photosensitive resin plate 200 is removed from the drum 120, and the next plate is dried and post-exposure processed to form a printing plate.
[0023]
As described above, the temperature of the sheet-shaped photosensitive resin plate is controlled from both the front surface and the back surface so that the unexposed resin is melted while preventing thermal deformation of the support, and high-pressure spray development is performed. The method and apparatus to perform can be applied with respect to the sheet-like photosensitive resin printing plate provided to the exposure process by the normal method.
That is, the sheet-like photosensitive resin plate exposed through a negative film on which a predetermined image is designed is opened on the opening / closing door 111 of the developing device, the resin plate 200 is inserted into the processing tank 110, and the front end of the plate Is clamped by the clamp mechanism 122, and then the plate mounting drum 120 is rotated to an appropriate position and the plate bottom is fixed by the magnet clamp 123. Thus, after the photosensitive resin layer of the resin plate 200 before development is wound around the outer peripheral surface of the drum 120 and fixed to the outside, the above development processing can be performed.
[0024]
Hereinafter, embodiments of the present invention will be described more specifically.
In the present invention, an aqueous developer is used. As used herein, the aqueous developer indicates that the proportion of water in the composition of the developer is the largest. Conventionally, as a general aqueous developer of a sheet-like photosensitive resin plate capable of aqueous development, in order to develop by dissolving the resin by a chemical action, 1 to 5% aqueous surfactant solution is included. However, in this developing method, the uncured resin removed in the developing step is dissolved in the developing solution, so that it is difficult to remove only the resin component from the developing solution. Such a developer containing an uncured photosensitive resin not only lowers the resin solubility, but also adversely affects the effect of removing the tackiness of the printing plate surface in the subsequent post-exposure process. On the other hand, the aqueous developer used in the present invention is tap water not containing an aqueous surfactant solution, and the hydrophobic resin component cannot be dissolved in the aqueous developer of the present invention. It is easy to remove only the uncured resin component from the used aqueous developer.
[0025]
As described above, in the present invention, by using the aqueous developer, it becomes easy to separate the uncured resin and the developer contained in the aqueous developer after the development, and the circulating use of the developer, and thus the long life of the developer. Can be achieved.
In the present invention, the effect of extending the life of the developer can be further increased by installing filters at appropriate locations in the apparatus for separating and removing the resin component in the aqueous developer. For example, after spraying the developer onto the photosensitive resin plate, a mesh filter, an oil adsorption mat filter, a nonwoven fabric filter, a paper filter, or the like are applied to the surface layer of the developer tank (FIG. 1, 112) containing the used developer. Filters such as a combined composite filter (FIG. 1, 171) are installed. When the developer passes through these filters and returns to the developer tank, most of the uncured resin in the developer is filtered through the filter, and the aqueous developer can be recycled.
[0026]
The aqueous developer used in the present invention may contain a gas in order to improve the removal efficiency of the uncured resin when the developer is jetted. As the gas, air or water vapor is preferable. In particular, when it is desired to raise the temperature of the aqueous developer to 100 ° C. or higher, it is preferable to use water vapor. When air is mixed in the aqueous developer, the air pressure is preferably 0.1 MPa or more from the viewpoint of the developing effect.
[0027]
The temperature of the aqueous developer used in the present invention is preferably 40 ° C. or higher. By setting the aqueous developer to 40 ° C. or higher, the uncured resin of the photosensitive resin plate generally heated to 40 ° C. or higher and being in a molten state is cooled by the aqueous developer to increase the viscous resistance. An adverse effect on the removal effect can be prevented. In order to obtain a stable effect of removing the uncured resin, the temperature of the aqueous developer is preferably maintained in the vicinity of the melting temperature of the uncured resin. When the melting temperature of the uncured resin exceeds 100 ° C. In order to reach the boiling temperature of the aqueous developer under atmospheric pressure, the high-pressure aqueous developer after being pressurized to 1 MPa to 30 MPa, which will be described later, is heated to a temperature exceeding 100 ° C. with the high-pressure water heater 135. It is preferable that water vapor exceeding 100 ° C. is mixed.
[0028]
In addition, the aqueous developer is sprayed onto the photosensitive resin plate at a high pressure of 1 MPa or more and 30 MPa or less in order to sufficiently exert the effect of removing the uncured resin due to physical impact when sprayed onto the photosensitive resin plate. It is preferable. It is preferably 1 MPa or more from the viewpoint of the development effect due to physical impact, and 30 MPa or less from the viewpoint of preventing damage to the relief shape, particularly an independent line having a line width of 500 μm or less and a highlight halftone dot having an area ratio of 5% or less.
[0029]
Further, the sheet-like photosensitive resin plate used in the present invention is temperature-controlled at a temperature equal to or higher than the melting temperature of the uncured resin or 40 to 200 ° C. in order to obtain a stable uncured resin removal effect by the high-pressure aqueous developer. Is preferred.
In addition, since the sheet-shaped photosensitive resin plate used in the present invention is heated at a high temperature as described above, the support is at a temperature equal to or lower than the thermal deformation temperature of the support, or 40 to 200 ° C. It is preferable that the temperature is controlled independently.
[0030]
Hereinafter, the embodiments will be described in detail.
A typical developing apparatus for carrying out the above developing step is a hollow drum whose outer peripheral surface can be controlled by flowing a temperature adjusting fluid therein, and a photosensitive resin layer facing outward on the outer peripheral surface of the drum. Plate heating that holds the photosensitive resin plate and rotates it at a rotational speed of several to several tens of RPM, and controls the temperature of the uncured resin of the photosensitive resin plate to a molten state by emitting infrared to far infrared rays from the outer periphery of the drum Aqueous water supplied through a high-pressure pump equipped with a heater and capable of discharging an aqueous developer at a pressure of 1 MPa to 30 MPa, and a high-pressure water heater capable of heating the pressurized aqueous developer to 100 ° C. or higher It is comprised from the nozzle which injects a developing solution toward the photosensitive resin layer.
[0031]
In the development step, the direction of jetting or ejecting the aqueous developer is not particularly limited as long as the uncured resin can be removed, and may be slightly oblique with respect to the surface of the photosensitive resin layer. A direction substantially perpendicular to the layer surface (for example, about 0 to 15 °) is preferable. The aqueous developer can be sprayed using a single nozzle or a plurality of nozzles (for example, a group of nozzles arranged in parallel). When the nozzle development processing width is less than the processing width of the photosensitive resin plate The aqueous developer is ejected while the ejection nozzle moves along the axial direction of the drum. Further, the distance between the nozzle and the surface of the photosensitive resin layer is not particularly limited as long as uncured resin can be removed according to the discharge pressure of the nozzle (or pump) outlet and the nozzle type, and the high-pressure uniform fan nozzle VNP-1 / 8M. If it is a model like -6549 (made by Ikeuchi), it is generally about 50-200 mm.
[0032]
After the development is completed, water is sprayed on the surface of the photosensitive resin plate to rinse away the aqueous developer remaining on the surface of the photosensitive resin plate while continuing to rotate the drum. The composition of the rinsing water is preferably single water, and the water pressure and the jetting direction, time, temperature, and mode of the rinsing water are not particularly limited as long as the developer remaining on the photosensitive resin plate surface can be washed away. The rinse water is directly mixed in the developer, and thereafter used as a developer. In the development process of the present invention, the developer is atomized by spraying the developer at a high temperature and under a high pressure, whereby the water component in the developer composition is evaporated and discharged to the atmosphere by the exhaust mechanism. The liquid decreases. Therefore, the amount of the developer can be kept constant by taking the rinse water into the developer. Unlike conventional highly active developers containing surfactants, even if rinsing water is mixed in the developer, the ratio of the amount of surfactant in the developer decreases, thereby reducing the development effect. As a result, there is no risk of expediting the replacement of the developer waste.
[0033]
In order to remove the rinsing water remaining on the surface of the photosensitive resin plate while continuing the rotation of the drum even after the rinsing process is completed, a water draining process using a pressurized air blow nozzle is provided. There are no particular restrictions on the pressure and pressure of the air blow and the jetting direction, time, temperature, and method, as long as the rinse water remaining on the surface of the photosensitive resin plate can be blown away. If rinse water remains on the surface of the photosensitive resin plate, the water drops when the photosensitive resin plate is transported to the subsequent process, thereby deteriorating the working environment.
[0034]
After completion of the draining process, the rotation of the drum is stopped, the photosensitive resin plate after the development process is removed from the drum, and a printing plate is obtained through known drying or post-exposure.
Next, it will be described in more detail by way of examples and comparative examples that the aqueous developer has performance that is not inferior to or exceeds that of a conventional developer having high chemical activity. The embodiment of the present invention is not limited to this example.
[0035]
[Example 1]
A sheet-shaped photosensitive resin plate AFP-HD (made by Asahi Kasei, hereinafter referred to as resin plate HD) having a plate thickness of 2.54 mm (polyester film support thickness 125 μm) and size 762 mm 1016 mm was used with an AFP-1500 exposure machine (manufactured by Asahi Kasei). A plate finished up to the exposure process was prepared. The exposure amount is a relief depth of 1.0 mm, and back exposure of 255 mJ / cm, which is an appropriate exposure condition that enables the formation of 133 LPI / 3% highlights. 2 , Relief exposure 6000mJ / cm 2 It was.
[0036]
A hollow drum that holds an outer diameter of 350 mm, a width of 1200 mm, and a resin plate HD in a horizontally long state, and that rotates while controlling the temperature of the outer peripheral surface of the drum by flowing a temperature adjusting fluid (water or oil) inside the drum, Water is poured into a developer tank (capacity 200 L) of a drum type experimental machine capable of simultaneously performing high-pressure spray development while controlling the temperature of the unexposed resin of the resin plate HD to a molten state by radiating more heat rays and preliminarily reaching 90 ° C. High-pressure spray development is performed using heated hot water. In addition, a spunbond nonwoven fabric (manufactured by Asahi Kasei) that removes unexposed resin mixed in the developed hot water is provided above the developer tank, and the filtered hot water is returned to the developer tank and recycled. It has a structure.
[0037]
The back of the resin plate HD after the exposure process is held in close contact with the outer peripheral surface of the drum, and the unexposed resin softens from around 80 ° C. while rotating the drum at a rotation speed of 1 rpm (peripheral speed: 1100 mm / min). The temperature of the resin plate HD polyester film support is increased by controlling the temperature of the resin plate HD having a heat melting property to 110 ° C. with a hot wire heater and flowing a temperature control fluid of 80 ° C. or less into the hollow drum. Is suppressed to 100 ° C. or lower to prevent thermal deformation. As a high-pressure spray mechanism, a high-pressure plunger pump with a discharge pressure of 15 MPa is used. The film was developed for 15 minutes using a plurality of nozzles arranged in parallel. Subsequently, the developed plate was rinsed with tap water, and the rinse water remaining on the surface of the rinsed plate was blown off with an air gun and left in a dryer for about 5 minutes. Thereafter, 1000 mJ / cm using an ultraviolet fluorescent lamp having a central wavelength at 370 nm. 2 Then, using a germicidal lamp having a central wavelength at 254 nm, the entire plate surface is 1750 mJ / cm 2 A post-exposure treatment was performed to obtain a printing plate.
[0038]
The obtained printing plate surface was evaluated by tactile sensation, but there was no stickiness and tackiness, and it was easy to remove them even if foreign matter adhered to the surface. In addition, when a relief image of a printing plate corresponding to a 100 μm wide independent line or a 500 μm wide white line was measured on a negative film, a relief width of about 100 μm was obtained for a 100 μm independent line, and a relief white width was about 500 μm wide white line. The depth was 480 μm and the depth was about 210 μm. Further, the damage of the dot base portion of 133 LPI / 3% dot was confirmed with a microscope, but no cracks were observed, and good print quality was maintained even during long-time printing.
[0039]
[Comparative Example 1]
A resin plate HD was prepared under the same exposure conditions as in Example 1.
Next, using Sorbit (made by McDamid) as the developer, the plate was attached to the rotating drum of the AFP-1500 developing machine with double-sided tape, developed at a liquid temperature of 25 ° C. for 5 minutes, and dried at 60 ° C. for 1 hour. I let you. Thereafter, a post-exposure treatment was performed under the same post-exposure conditions as in Example 1 to obtain a printing plate.
The obtained printing plate surface was evaluated by tactile sensation, but there was no stickiness and tackiness, and it was easy to remove them even if foreign matter adhered to the surface. In addition, when a relief image of a printing plate corresponding to a 100 μm wide independent line or a 500 μm wide white line was measured with a negative film, a relief width of about 98 μm was obtained for the 100 μm independent line, and a relief white width was about 500 μm wide white line. The depth was 480 μm and the depth was about 207 μm. Further, the damage of the dot base portion of 133 LPI / 3% dot was confirmed with a microscope, but no cracks were observed, and good print quality was maintained even during long-time printing.
[0040]
[Example 2]
A plate-shaped photosensitive resin plate AFP-SQ (manufactured by Asahi Kasei Co., Ltd., hereinafter referred to as resin plate SQ) having a plate thickness of 7.0 mm (polyester film support thickness of 188 μm) and a size of 762 mm and 1016 mm is exposed to an exposure process using an AFP-1500 exposure machine. Created a finished version. The exposure amount was set to a relief depth of 2.0 mm, a back exposure of 2000 mJ / cm <2> and a relief exposure of 5000 mJ / cm <2>, which are appropriate exposure conditions that enable highlight formation with 85 LPI / 5%.
[0041]
The resin plate SQ was developed under the same development conditions using the drum type experimental machine used in Example 1. Next, the developed plate was rinsed with tap water in the same manner as in Example 1, and the rinse water remaining on the surface of the rinsed plate was blown off with an air gun and left in a dryer for about 5 minutes. Thereafter, 1000 mJ / cm using an ultraviolet fluorescent lamp having a central wavelength at 370 nm. 2 Then, using a germicidal lamp having a central wavelength at 254 nm, the entire plate surface is 1000 mJ / cm 2 A post-exposure treatment was performed to obtain a printing plate.
The obtained printing plate surface was evaluated by tactile sensation, but there was no stickiness and tackiness, and it was easy to remove them even if foreign matter adhered to the surface. In addition, when a relief image of a printing plate corresponding to a 250 μm wide independent line or a 500 μm wide white line was measured on a negative film, a relief width of about 220 μm was obtained for the 250 μm independent line, and a relief white width was about 500 μm wide white line. The depth was 550 μm and the depth was about 196 μm. Further, the damage of the dot base portion of 85 LPI / 5% halftone dot was confirmed with a microscope, but no cracks were observed, and good print quality was maintained even during long-time printing.
[0042]
[Comparative Example 2]
A resin plate SQ was prepared under the same exposure conditions as in Example 2.
Next, as in Comparative Example 1, sorbite was used as the developer, the plate was attached to the rotating drum of the AFP-1500 developing machine with double-sided tape, developed at a liquid temperature of 25 ° C. for 10 minutes, and 1 at 60 ° C. Let dry for hours. Thereafter, a post-exposure treatment was performed under the same post-exposure conditions as in Example 2 to obtain a printing plate.
The obtained printing plate surface was evaluated by tactile sensation, but there was no stickiness and tackiness, and it was easy to remove them even if foreign matter adhered to the surface. In addition, when a relief image of a printing plate corresponding to a 250 μm wide independent line or a 500 μm wide white line was measured with a negative film, the relief width of about 215 μm was obtained for the 250 μm independent line, and the relief white width was about 500 μm wide white line. The depth was 555 μm and the depth was about 190 μm. Further, the damage of the dot base portion of 85 LPI / 5% halftone dot was confirmed with a microscope, but no cracks were observed, and good print quality was maintained even during long-time printing.
[0043]
【The invention's effect】
As described above, the method for developing a photosensitive resin plate according to the present invention performs high-pressure jet development using a physical action while controlling the temperature of an unexposed resin in a molten state, so that an aqueous development in which the photosensitive resin is insoluble is performed. Printing plate development using a liquid is possible. Since it is easy to separate and remove the photosensitive resin from the used developer, it can be reused as a developer. This reduces the amount of waste developer, which is advantageous for environmental conservation and has a large waste disposal cost. Reductions can also be achieved. Furthermore, a long drying process after development is not required, and the productivity is improved, and a thick plate requiring a deep relief depth can be produced.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a schematic configuration of a developing device suitable for carrying out the present invention.
FIG. 2 is a cross-sectional view illustrating a schematic configuration of drum outer peripheral surface temperature control according to an embodiment of the present invention.
[Explanation of symbols]
100: Development device
110: Treatment tank
111: Open / close door
112: Developer tank
113: Developer heater
120: Plate mounting drum
121: Drum rotation mechanism
122: Plate tip clamping mechanism
123: Magnet clamp
130: High pressure plunger pump
131: Nozzle header with swing function
132: Developer spray nozzle
133: Supply piping
134: High temperature / high pressure piping
135: High pressure water heater
140: Plate heater box
141: Plate heater
150: Rinse water nozzle header
151: Rinse water spray nozzle
152: Rinse water hose
153: Rinse water solenoid valve
160: Pressurized water drain nozzle
161: Pressure air piping
162: Pressure pneumatic solenoid valve
170: Nonwoven fabric roll feed mechanism
171: Nonwoven filter
172: Non-woven fabric winding mechanism
180: Temperature control tank
181: Liquid feed pump
182: Liquid supply piping
183, 184: Rotary joint
185: Drainage piping
200: Sheet-like photosensitive resin plate
300: Developer
400: Temperature control fluid

Claims (19)

露光後の感光性樹脂版を温度制御しながら、現像液を高圧で噴射する工程を含むことを特徴とする、感光性樹脂版の現像方法。A method for developing a photosensitive resin plate, comprising a step of spraying a developer at a high pressure while controlling the temperature of the photosensitive resin plate after exposure. 現像液に気体が混入されていることを特徴とする、請求項1記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein a gas is mixed in the developer. 現像液の温度が40℃以上であることを特徴とする、請求項1〜2のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein the temperature of the developer is 40 ° C. or higher. 現像液を1MPa以上30MPa以下の圧力下で噴射するとを特徴とする、請求項1〜3のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein the developer is jetted under a pressure of 1 MPa to 30 MPa. 現像液の温度が100℃を越えることを特徴とする、請求項4記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 4, wherein the temperature of the developer exceeds 100 ° C. 感光性樹脂版を構成する感光性樹脂層が未硬化感光性樹脂の溶融温度以上、或いは40〜200℃に温度制御されることを特徴とする、請求項1〜5のいずれかに記載の感光性樹脂版の現像方法。The photosensitive resin layer according to claim 1, wherein the photosensitive resin layer constituting the photosensitive resin plate is temperature-controlled at a temperature equal to or higher than a melting temperature of the uncured photosensitive resin or 40 to 200 ° C. Development method of the photosensitive resin plate. 感光性樹脂版を構成する支持体が支持体の熱変形温度以下、或いは40〜200℃に、感光性樹脂層とは独立して温度制御されることを特徴とする、請求項1〜6のいずれかに記載の感光性樹脂版の現像方法。The temperature of the support constituting the photosensitive resin plate is controlled to be equal to or lower than the thermal deformation temperature of the support, or 40 to 200 ° C, independently of the photosensitive resin layer. The development method of the photosensitive resin plate in any one. 現像液が水性現像液であることを特徴とする、請求項1〜7のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein the developer is an aqueous developer. 混入した未硬化感光性樹脂をフィルターで除去した現像液を循環して使用することを特徴とする、請求項1〜8のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to any one of claims 1 to 8, wherein a developer obtained by removing mixed uncured photosensitive resin with a filter is circulated and used. 現像液を噴射後、感光性樹脂版の表面を水でリンスし、該水がそのまま現像液へ混入することを特徴とする、請求項9に記載の感光性樹脂版の現像方法。10. The method for developing a photosensitive resin plate according to claim 9, wherein after the developer is sprayed, the surface of the photosensitive resin plate is rinsed with water, and the water is mixed into the developer as it is. 現像液を40℃以上に加熱することが出来るヒーターを用いることを特徴とする、請求項1〜10のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein a heater capable of heating the developer to 40 ° C. or higher is used. 現像液を1MPa以上30MPa以下の圧力下で吐出することが出来るポンプを用いることを特徴とする、請求項1〜11のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to claim 1, wherein a pump capable of discharging the developer under a pressure of 1 MPa to 30 MPa is used. 現像液を100℃を越える温度に加熱することが出来るヒーター、或いは100℃を越える温度に加熱された気体を混入させる機構を用いることを特徴とする、請求項12に記載の感光性樹脂版の現像方法。The photosensitive resin plate according to claim 12, wherein a heater capable of heating the developer to a temperature exceeding 100 ° C or a mechanism for mixing a gas heated to a temperature exceeding 100 ° C is used. Development method. 現像液を1MPa以上30MPa以下の圧力下で噴射するノズルを1個以上用いることを特徴とする、請求項1〜13のいずれかに記載の感光性樹脂版の現像方法。The method for developing a photosensitive resin plate according to any one of claims 1 to 13, wherein at least one nozzle for injecting the developer under a pressure of 1 MPa to 30 MPa is used. 感光性樹脂版を構成する感光性樹脂層を未硬化感光性樹脂の溶融温度以上、或いは40〜200℃に温度制御することが出来る機構を用いることを特徴とする、請求項1〜14のいずれかに記載の感光性樹脂版の現像方法。15. The mechanism according to claim 1, wherein a mechanism capable of controlling the temperature of the photosensitive resin layer constituting the photosensitive resin plate at a temperature equal to or higher than a melting temperature of the uncured photosensitive resin or 40 to 200 ° C. is used. A method for developing a photosensitive resin plate according to claim 1. 感光性樹脂版を構成する支持体を感光性樹脂層とは独立して支持体の熱変形温度以下、或いは40〜200℃に温度制御することが出来る機構を用いることを特徴とする、請求項1〜15のいずれかに記載の感光性樹脂版の現像方法。A mechanism that can control the temperature of the support constituting the photosensitive resin plate to be equal to or lower than the thermal deformation temperature of the support or from 40 to 200 ° C. independently of the photosensitive resin layer is used. The developing method of the photosensitive resin plate in any one of 1-15. タンク内に蓄えられた現像液の表層、及び/又は現像液が流れる配管中にメッシュフィルター、オイル吸着マットフィルター、不織布フィルター、紙フィルター、或いはそれらを組み合わせた複合フィルターから選択される1以上のフィルターが備えられており、現像液をこれらフィルターでろ過することを特徴とする、請求項1〜16のいずれかに記載の感光性樹脂版の現像方法。One or more filters selected from a mesh filter, an oil adsorption mat filter, a non-woven filter, a paper filter, or a composite filter combining them in the surface layer of the developer stored in the tank and / or in the piping through which the developer flows. The method for developing a photosensitive resin plate according to claim 1, wherein the developer is filtered through these filters. 露光後の感光性樹脂版を温度制御する手段と現像液を高圧噴射する手段を有し、請求項1〜17のいずれかに記載の感光性樹脂版の現像方法に用いられることを特徴とする、感光性樹脂版の現像装置。It has a means to temperature-control the photosensitive resin plate after exposure, and a means to inject a developing solution at high pressure, It is used for the development method of the photosensitive resin plate in any one of Claims 1-17 characterized by the above-mentioned. , Development device for photosensitive resin plate. タンク内に蓄えられた現像液の表層、及び/又は現像液が流れる配管中にフィルターを有し、該フィルターがロール巻き態様で備えられ、所定版数の感光性樹脂版を現像処理後に所定長さで巻き取られる機構を有することを特徴とする、請求項18に記載の感光性樹脂版の現像装置。The surface layer of the developer stored in the tank and / or the pipe through which the developer flows has a filter, the filter is provided in a roll winding mode, and a predetermined number of photosensitive resin plates have a predetermined length after development processing. The photosensitive resin plate developing device according to claim 18, further comprising a mechanism that can be wound up.
JP2001245476A 2001-08-13 2001-08-13 Photosensitive resin plate developing method and developing device Expired - Fee Related JP4563623B2 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03500935A (en) * 1988-05-31 1991-02-28 ナップ・システムズ・(ユーエスエイ)・インコーポレーテッド Apparatus and method for processing printing plates
JPH046562A (en) * 1990-04-19 1992-01-10 W R Grace & Co Method of forming picture
JPH07333860A (en) * 1994-06-14 1995-12-22 Toyobo Co Ltd Treatment method and treatment apparatus of wash out liquid for photosensitive resin plate
JP2000162770A (en) * 1999-01-01 2000-06-16 Toyobo Co Ltd Photosensitive resin composition
WO2002033490A1 (en) * 2000-10-13 2002-04-25 Asahi Kasei Kabushiki Kaisha Method and apparatus for developing photosensitive resin relief printing plate
JP2007122075A (en) * 2000-10-13 2007-05-17 Asahi Kasei Chemicals Corp Method and apparatus for developing photosensitive resin relief printing plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03500935A (en) * 1988-05-31 1991-02-28 ナップ・システムズ・(ユーエスエイ)・インコーポレーテッド Apparatus and method for processing printing plates
JPH046562A (en) * 1990-04-19 1992-01-10 W R Grace & Co Method of forming picture
JPH07333860A (en) * 1994-06-14 1995-12-22 Toyobo Co Ltd Treatment method and treatment apparatus of wash out liquid for photosensitive resin plate
JP2000162770A (en) * 1999-01-01 2000-06-16 Toyobo Co Ltd Photosensitive resin composition
WO2002033490A1 (en) * 2000-10-13 2002-04-25 Asahi Kasei Kabushiki Kaisha Method and apparatus for developing photosensitive resin relief printing plate
JP2007122075A (en) * 2000-10-13 2007-05-17 Asahi Kasei Chemicals Corp Method and apparatus for developing photosensitive resin relief printing plate

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