JP4557392B2 - Receiver module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a light receiving module for receiving a remote control signal such as a television receiver, and more particularly to a mounting structure thereof.
[0002]
[Prior art]
Conventionally, a remote control using light such as infrared rays has been used to remotely control a television receiver or the like. FIG. 5 is a diagram showing a system configuration on the receiving unit side of the remote control device using light.
[0003]
In FIG. 5, when light Lc modulated at a predetermined frequency from the transmitter of the remote control device enters the detection photodiode 51, the resistance value changes according to the incident light. The current change due to this is converted into a voltage change by the current-voltage converter 52, and the output transistor 59 is turned on and off sequentially through the amplifier 53, the coupling capacitor 54, the limiter 55, the band pass filter 56, the detector 57, and the comparator 58. The on / off state of the output transistor 59 is obtained by demodulating the signal modulated by the operation signal on the transmission side, and is output as an operation signal from the output terminal Rout to the microcomputer (not shown) via the power supply voltage Vcc and the resistor R. Processing based on this signal is performed.
[0004]
FIG. 6 shows a module configuration on the receiving unit side of the remote control device. In FIG. 6, an IC 61 obtained by converting the components shown in FIG. 5 into an IC is added to a condensing lens 62, a power supply Vcc lead pin 63-1, an output terminal Vout lead pin 63-2, and a ground Gnd lead pin 63-. 3 is provided to constitute a light receiving IC.
[0005]
The holder 64 accommodates the light receiving IC, shields the IC 61, and is attached to the substrate 67.
[0006]
For this purpose, the side plates 65 and 66 of the holder 64 have flat stopper portions 65a and 66a on the surface abutting against the substrate 67, and ground pins 65b extending beyond the substrate 67 and bent at a tip end in a triangular shape. 66b is formed. On the other hand, the board 67 is provided with holes through which the lead pins 63-1 to 63-3 are inserted and holes through which the ground pins 65b and 66b are inserted.
[0007]
Then, the light receiving module 60 in which the light receiving IC is accommodated in the holder 64 is inserted into the corresponding holes through the lead pins 63-1 to 63-3 and the ground pins 65b and 66b. As a result, the light receiving module 60 is slightly dimensioned to the ground pins 65b and 66b and its insertion hole due to the stopper portions 65a and 66a of the holder 64 and the ground pins 65b and 66b whose tip portions are bent in a triangular shape. Even if there is shakiness, it is stably mounted on the horizontal substrate 67 in an upright state. Thereafter, the lead pins 63-1 to 63-3 and the ground pins 65b and 66b are soldered to required wirings on the back surface side of the substrate 67, respectively.
[0008]
[Problems to be solved by the invention]
By the way, as shown in FIG. 7, it is necessary to separate the front-end | tip part of the board | substrate 67 of the television receiver 71 from the front part 73 of the receiver only by the fixed distance l1 in order to make an assembly easy. On the other hand, when the light receiving module 60 is provided in the television receiver 71, the light receiving part (lens 62) of the light receiving module 60 is desired to be as close as possible to the light receiving window 73 provided in the front part of the receiver (distance). There is a request of l2).
[0009]
For this reason, the shape of the light receiving module 60 is changed from a rectangular parallelepiped shape mounted on the substrate 67 in an upright state, and the mounting portion to the lower substrate is left as before, as in the light receiving module 60 'shown by the broken line in FIG. It is conceivable to form a portion, for example, that has a condensing lens and an IC on the upper side of the television receiver 71 so as to approach the front surface portion 73 of the television receiver 71.
[0010]
However, when the dovetail shape is formed like the light receiving module 60 'shown by the broken line in FIG. 7, the weight balance is lost. Therefore, in the mounting structure with the stopper portion of the holder and the ground pin as shown in FIG. When mounted on a horizontal substrate, it is difficult to stably mount the substrate in an upright state, and there is a possibility that a vertical displacement occurs. Due to this positional shift, a shift or variation in the directivity of the light receiving module occurs.
[0011]
In addition, it may be possible to eliminate the dimensional margin between the ground pin and its insertion hole, or to work while holding the light receiving module 60 ′, but there are problems that the workability when mounting the board is poor.
[0012]
Such a problem is also the same when trying to mount the light receiving module in an upright state on a vertically arranged substrate, and there is a possibility that a vertical position shift may occur.
[0013]
Accordingly, the present invention provides a light receiving module in which a light receiving IC is accommodated in a holder, and the holder is formed in a shape that can be mounted upright on a mounting surface such as a substrate. It is an object of the present invention to provide a light receiving module having a mounting structure that can eliminate positional displacement in the vertical direction during mounting and prevent deterioration of work efficiency during mounting.
[0014]
[Means for Solving the Problems]
The light receiving module disclosed in the present specification is a light receiving module in which a sealing body in which a circuit element including a light receiving element is sealed is accommodated in a holder, and the mounting portion of the holder is a stopper that comes into contact with a mounting surface And a pin that extends beyond the mounting surface, and the lead pin from the sealing body extends beyond the mounting surface and has a stopper at the intermediate portion so as to contact the mounting surface A portion is provided.
[0015]
According to the light receiving module disclosed in the present specification, the light receiving IC including the sealing body is accommodated in a holder, and the holder is attached in an upright manner with respect to a mounting surface such as a substrate. In the formed light-receiving module, by having a double-stopper structure with a stopper portion at the mounting portion of the holder, a pin extending beyond the mounting surface, and a bent portion that contacts the mounting surface of the lead pin of the light-receiving IC In addition, it is possible to reduce the positional deviation in the vertical direction when mounting on a mounting surface such as a substrate.
[0016]
Further, since the lead pins of the light receiving IC need only be bent at a predetermined position, it is possible to cope with the manufacturing without changing the mold.
[0017]
Further, the holes on the mounting surface such as the substrate through which the pins of the holder and the lead pins of the light receiving IC are inserted can be formed with a space, so that the work efficiency at the time of mounting is not deteriorated.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
A light receiving module according to an embodiment of the present invention will be described below with reference to the drawings.
[0019]
FIG. 1 is a diagram showing the configuration of a light receiving module according to a first embodiment of the present invention, where FIG. 1 (a) is a front view, FIG. 1 (b) is a side view, and FIG. The figure is shown. FIG. 2 is a diagram showing a state in which the light receiving module according to the first embodiment is mounted so as to stand upright on a substrate arranged in a horizontal state.
[0020]
In FIG. 1, a sealing body 11 is obtained by sealing all or a part of the components on the receiving unit side of the remote control device shown in FIG. A power supply Vcc lead pin 13-1, an output terminal Vout lead pin 13-2, and a ground Gnd lead pin 13-3 are provided. Hereinafter, these configurations are collectively referred to as a light receiving IC. The encapsulant 11 may encapsulate all the circuit elements except the photodiode 51 in one chip, or may be configured by a phototransistor or the like instead of the photodiode 51, and all the circuit elements in FIG. May be integrated into an IC. Further, the module shown in FIG. 5 configured by a plurality of IC chips may be sealed. Furthermore, only a part of the circuit element of FIG. 5 may be sealed.
[0021]
In the present embodiment, the shape of the light receiving module 10 is a part in which the condensing lens 12 and the sealing body 11 are accommodated in a part on the upper side of the attachment part to the lower substrate. Is formed so as to be shifted to one side.
[0022]
For this reason, the holder 14 accommodates the light receiving IC on the upper side thereof and shields the sealing body 11. The side plates 15 and 16 of the holder 14 are formed, for example, in a dovetail shape such that the upper light receiving IC accommodating portion and the lower mounting portion are displaced with respect to the substrate as the mounting surface. Yes.
[0023]
The side plates 15 and 16 have stoppers 15a and 16a that are flat on the surface in contact with the substrate, and ground pins 15b that extend beyond the substrate and are bent in a triangular shape. 16b is formed. In addition, 15b and 16b may not be a ground pin for grounding but may be a simple pin.
[0024]
On the other hand, the lead pins 13-1 to 13-3 of the light receiving IC are pulled out from the sealing body 11 and then approach the lower side of the side plates 15 and 16 in accordance with the shape of the side plates 15 and 16. Bending portions 13-1a to 13-3a are provided. Further, each lead pin 13-1 to 13-3 has positioning bent portions 13-1 b to 13-3 b so that the position of each lead pin is flush with the stopper portions 15 a and 16 a of the side plates 15 and 16. It is formed in a triangular shape.
[0025]
As described above, the holder 14 is formed in a shape such that the light receiving IC accommodating portion and the mounting portion are displaced with respect to the substrate as the mounting surface, for example, a dovetail shape. Has flat stopper portions 15a, 16a that contact the substrate and ground pins 15b, 16b extending beyond the substrate. Further, the lead pins 13-1 to 13-3 of the light receiving IC are extended beyond the contact surface of the substrate, and the bent portions 13-1b to 13- for positioning at the intermediate portion so as to contact the substrate. 3b.
[0026]
Next, the mounting of the light receiving module 10 according to the first embodiment on the substrate 17 will be described with reference to FIG.
[0027]
The substrate 17 is provided inside an electric product such as a television receiver, but is disposed near the front surface of the electric device so that the light receiving module 10 can easily receive light for operation from the outside. The substrate 17 is provided with holes for inserting the ground pins 15b and 16b of the holder 14 and the lead pins 13-1 to 13-3 of the light receiving IC in order to install the light receiving module 10 near the end thereof. ing. These holes are slightly larger than the dimensions of each pin to facilitate insertion of each pin.
In addition, wiring for electrically connecting the inserted ground pins 15b and 16b and lead pins 13-1 to 13-3 is provided on one surface of the substrate.
[0028]
Now, the ground pins 15b and 16b and the lead pins 13-1 to 13-3 of the light receiving module 10 are inserted into the holes of the substrate 17, and the stopper portions 15a and 16a of the side plates 15 and 16 are applied to the upper surface of the substrate 17, respectively. Insert until touching. In a state where the stopper portions 15a and 16a are in contact with the surface of the substrate 17, the tip portions of the inserted ground pins 15b and 16b bent in a triangular shape are in contact with the back surface of the substrate. As a result, the light receiving module 10 is temporarily attached to the substrate 17 by the ground pins 15b and 16b and the stopper portions 15a and 16a.
[0029]
Further, in this state, the lead pins 13-1 to 13-3 inserted into the holes of the substrate 17 are such that the lower end side of the bent portions 13-1 b to 13-3 provided in the intermediate portion contacts the surface portion of the substrate 17. Touched and positioned.
[0030]
The inserted ground pins 15b and 16b and lead pins 13-1 to 13-3 are electrically connected to required wirings on the back side of the substrate 17, respectively.
[0031]
Thus, the contact surfaces of the stopper portions 15a and 16a of the side plates 15 and 16 to the surface of the substrate 17 and the contact surfaces of the bent portions 13-1b to 13-3b of the lead pins 13-1 to 13-3 are similarly provided. Forms the same mounting surface and acts as a double stopper.
[0032]
Therefore, in the light receiving module in which the light receiving IC is accommodated in the holder 14 and the holder 14 is formed in a shape in which the light receiving IC accommodating portion and the mounting portion are displaced with respect to the mounting surface of the substrate 17. Even if the weight balance is lost, the positional deviation in the vertical direction can be reduced when attached to the substrate 17, so that the deviation of the directivity of the light receiving module and the variation can be reduced.
[0033]
Further, the bent portions 13-1a to 13-3a, the bent portions 13-1b to 13-3b of the lead pins 13-1 to 13-3 of the light receiving IC, and the ground pins 15b and 16b of the side plates 15 and 16 are in predetermined positions. Since it is only necessary to bend it with a metal mold, there is no need to change the mold in its manufacture.
[0034]
Further, since the holes of the substrate 17 through which the ground pins 15b and 16b of the holder 14 and the lead pins 13-1 to 13-3 of the light receiving IC are inserted can be formed with a space, the work efficiency during mounting is deteriorated. Will not be invited.
[0035]
FIG. 3 is a diagram illustrating shapes that can be taken as bent portions provided on the lead pins 13 of the light receiving IC.
[0036]
FIG. 3A shows a triangular bent portion as shown in FIG. FIG. 2B shows a serrated bent portion, and FIG. 2C shows a semicircular bent portion. Reference numeral 17 denotes an exemplary substrate. In addition, as a bending part, it is not restricted to these illustrated shapes, What is necessary is just to bend and form a lead pin.
[0037]
FIG. 4 is a view showing a state in which the light receiving module according to the second embodiment of the present invention is horizontally mounted so as to stand upright on a substrate arranged in a vertical state. FIG. The figure and the figure (b) have shown the side view.
[0038]
In FIG. 4, since the light receiving module 40 is mounted horizontally with respect to the substrate 47 arranged vertically, the light receiving module 40 is rotated by the weight of the portion in which the condensing lens 42 and the sealing body 41 on the right side are accommodated. You will receive a moment. In addition, the sealing body 41 is comprised similarly to the sealing body 11 of FIG.
[0039]
For this reason, the side plates 45 and 46 of the holder 44 are provided with flat stopper portions 45a and 46a that come into contact with the substrate above the center position with respect to the substrate 47 that is the mounting surface. There are provided ground pins 45b and 46b extending beyond the tip and bent in a triangular shape. In addition, contact portions 45c and 46c that contact the surface of the substrate 47 are formed below the center position.
[0040]
On the other hand, the sealing body 41 is an IC formed from the components on the receiver side of the remote control device, and includes a condensing lens 42, a power supply lead pin 43-1, an output terminal lead pin 43-2, and a ground. A lead pin 43-3 is provided to constitute a light receiving IC. The lead pins 43-1 to 43-3 are provided with bent portions 13-1a to 13-3a along the side plates 45 and 46 after being drawn downward from the sealing body 41. Further, each of the lead pins 43-1 to 43-3 has bending portions 43-1b to 43-3b for positioning so that the positions of the lead pins are flush with the stopper portions 45a and 46a of the side plates 45 and 46, respectively. Is formed.
[0041]
Thus, the light receiving IC accommodating portion and the mounting portion of the holder 44 are formed, and the mounting portion of the holder 44 includes the stopper portions 45 a and 46 a that come into contact with the substrate 47 and the ground extending beyond the substrate 47. Pins 45b and 46b. In addition, the lead pins 43-1 to 43-3 of the light receiving IC are extended beyond the contact surface of the substrate, and the positioning bent portions 43-1b to 43-3 are arranged in the middle so as to contact the substrate. 3b.
[0042]
In order to attach the light receiving module 40, the substrate 47 is provided with holes for inserting the ground pins 45b and 46b of the holder 44 and the lead pins 43-1 to 43-3 of the light receiving IC. These holes are slightly larger than the dimensions of each pin to facilitate insertion of each pin. In addition, wiring for electrically connecting the inserted ground pins 45b and 46b and lead pins 43-1 to 43-3 is provided on one surface of the substrate.
[0043]
Now, the ground pins 45b and 46b and the lead pins 43-1 to 43-3 of the light receiving module 40 are inserted into the holes of the substrate 47 until the stopper portions 45a and 46a of the side plates 45 and 46 come into contact with the surface of the substrate 47. insert. In a state where the stopper portions 45a and 46a are in contact with the surface of the substrate 47, the tip portions of the inserted ground pins 45b and 46b bent in a triangular shape are in contact with the back surface of the substrate. Further, the contact portions 45 c and 46 c formed on the lower side of the side plate contact the surface of the substrate 47. Accordingly, the light receiving module 40 is temporarily attached to the substrate 47 by the ground pins 45b and 46b and the stopper portions 45a and 46a.
[0044]
Further, in this state, the lead pins 43-1 to 43-3 inserted through the holes of the substrate 47 are such that the left end side of the bent portions 43-1b to 43-3 provided in the intermediate portion contacts the surface portion of the substrate 47. Touched and positioned.
[0045]
The inserted ground pins 45b and 46b and lead pins 43-1 to 43-3 are electrically connected to respective wirings on the back surface side of the substrate 47.
[0046]
As described above, the contact surfaces of the stopper portions 45a and 46a of the side plates 45 and 46 to the surface of the substrate 47, the contact portions 45c and 46c to the surface of the substrate 47, and the bent portions of the lead pins 43-1 to 43-3. The contact surfaces of 43-1b to 43-3b form the same mounting surface, and each acts as a stopper.
[0047]
Therefore, the light receiving IC is accommodated in the holder 44, and the holder 44 is formed in a shape that can be attached to the mounting surface of the substrate 47 in which the light receiving IC accommodating portion and the mounting portion are provided vertically. Even if a rotational moment due to horizontal mounting is applied to the light receiving module, the position shift in the vertical direction can be reduced when mounted on the substrate 47 by the action of each stopper. It can be reduced.
[0048]
Further, the bent portions 43-1a to 43-3a, the bent portions 43-1b to 43-3b of the lead pins 43-1 to 43-3 of the light receiving IC, and the ground pins 45b and 46b of the side plates 45 and 46 are in predetermined positions. Since it is only necessary to bend it with a metal mold, there is no need to change the mold in its manufacture. In each embodiment, each pin is provided with a bent portion. However, for example, a bent portion may be provided only on the outer pin, or instead of bending, a protruding portion may be provided and used as a stopper. Anyway.
[0049]
Further, since the holes of the substrate 47 through which the ground pins 45b and 46b of the holder 44 and the lead pins 43-1 to 43-3 of the light receiving IC are inserted can be formed with a margin, work efficiency during mounting is deteriorated. Will not be invited.
[0050]
【The invention's effect】
According to the light receiving module disclosed in the present specification , the light receiving module is formed in such a shape that the light receiving IC is accommodated in the holder, and the holder is mounted upright with respect to a mounting surface such as a substrate. The mounting surface of the substrate or the like by adopting a double stopper structure of a pin extending beyond the mounting surface of the stopper portion and the mounting surface of the holder and a bent portion that contacts the mounting surface of the lead pin of the light receiving IC It is possible to reduce the positional deviation in the vertical direction at the time of attachment to the light receiving module, and to reduce the deviation and variation in the directivity of the light receiving module.
[0051]
Further, since the lead pins of the light receiving IC need only be bent at a predetermined position, it is possible to cope with the manufacturing without changing the mold.
[0052]
In addition, since the holes on the mounting surface such as the substrate through which the pins of the holder and the lead pins of the light receiving IC are inserted can be formed with a space, work efficiency during mounting is not deteriorated.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a light receiving module according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a state where the light receiving module according to the first embodiment of the present invention is mounted on a substrate.
FIG. 3 shows an example of a bent portion of the lead pin according to the first embodiment of the present invention.
FIG. 4 is a diagram showing a configuration of a light receiving module according to a second embodiment of the present invention.
FIG. 5 is a diagram showing a system configuration on the receiving unit side of a remote control device using light.
FIG. 6 is a diagram showing a configuration of a conventional light receiving module.
FIG. 7 is a diagram illustrating an arrangement example of a light receiving module on a television receiver.
[Explanation of symbols]
10, 40 Light receiving module 11, 41 Sealing body 12, 42 Condensing lenses 13-1 to 13-3, 43-1 to 43-3 Lead pins 13-1a to 13-3a, 43-1a to 43-3a Bending Parts 13-1b to 13-3b, 43-1b to 43-3b Bending parts 14, 44 Holders 15, 16, 45, 46 Side plates 15a, 16a, 45a, 46a Stopper parts 15b, 16b, 45b, 46b Ground pin 17, 47 Substrate

Claims (4)

A circuit element including a light receiving element;
A sealing body that seals the circuit element;
A lower portion that has a mounting portion including a first stopper portion that contacts the mounting surface and a pin that extends beyond the mounting surface; and a housing portion that stores the sealing body. And a holder that is mounted upright with respect to the mounting surface, and an upper side that is displaced with respect to the mounting surface.
A lead pin that extends from the sealing body beyond the mounting surface and is bent so as to approach the lower side, and has a second stopper portion provided to contact the mounting surface;
And a light receiving module for preventing tilting of the holder due to gravity .   The light receiving module according to claim 1, wherein the holder has a dovetail shape.   A circuit element including a light receiving element;
  A sealing body that seals the circuit element;
  A mounting surface substantially parallel to the direction of gravity;
  A lower portion that has a mounting portion that includes a first stopper portion that abuts against the mounting surface and a pin that extends beyond the mounting surface, and that accommodates the sealing body; An upper side having a portion, and a holder attached upright with respect to the mounting surface;
  A lead pin extending from the sealing body beyond the mounting surface and bent toward the mounting surface and having a second stopper portion provided so as to contact the mounting surface;
  And a light receiving module for preventing tilting of the holder due to gravity. +
  The light receiving module according to claim 1, wherein the second stopper portion is formed by bending the lead pin.

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