JPH0888494A - Photodetector for remote control and its manufacture - Google Patents

Abstract

PURPOSE: To suppress the deformation of the end of a lead frame to be inserted into a board when a shielding case is mounted at the board. CONSTITUTION: Since leads 12 of a lead frame 10 are coupled to each other by a reinforcing member 15, the bending and the deformation of the leads 12 are suppressed. When a board 40 is mounted at a shielding case 20, the ends of the leads 12 can be easily inserted into the board 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a remote control (remote control) device used for AV equipment such as a television (TV), a video tape recorder (VTR), an audio system, and other electric appliances, and a light from a transmitting unit. The present invention relates to a light receiving element mounted on a device body so as to receive a signal and a method for manufacturing the same.

[0002]

2. Description of the Related Art A cordless remote control device is adopted in AV equipment such as a television (TV), a video tape recorder (VTR) and an audio. This remote control device has a transmitting unit for transmitting an optical signal and a light receiving unit mounted on the AV device body. The light receiving unit is provided with a light receiving element that receives an optical signal transmitted from the transmitting unit.

FIG. 6 shows an example of a light receiving element for remote control.
This remote-control light receiving element 80 is provided on one surface of a printed circuit board 82 arranged in a metal shield case 81.
The IC chip 83 is directly bonded by Ag paste or the like. Further, on the other surface of the printed board 82, a photodiode 84, a capacitor chip,
Resistor chips etc. are soldered. A lens portion 85 is provided in the photodiode 84, and the lens portion 85 is exposed to the outside through an opening provided in the shield case 81.

Each base end of a 3-pin connector 86 is soldered to the printed circuit board 82, and each pin of the connector is covered with a connector resin 87. The middle of each connector 86 is bent at a right angle,
Each tip portion extends to the outside of the shield case 81. The shield case 81 is provided with a pair of terminal portions 81 a extending in the same direction as the tip portions of the respective connectors 86.

In such a remote-control light-receiving element 80, the tip of each connector 86 is inserted into the substrate 40,
Each terminal portion 81a of the shield case 81 is attached to the substrate 40 while being soldered to the substrate 0. Substrate 4 to which the light receiving element 80 for remote control is attached
When 0 is attached to a device body such as a TV, the lens portion 85 faces the outside from the casing of the device body. In this way, the light receiving element 8 mounted on the substrate 40
The distance between the substrate 40 and the tip of the lens unit 85 is accurately set to a predetermined value of 12 mm, 16 mm, or 20 mm so that the lens unit 85 of 0 is arranged at a predetermined position of the device body. The length of the shield case 81 is set accurately.

In such a remote-control light-receiving element 80, the tip of each connector 86 extending from the shield case 81 may be bent or deformed when the tip of each connector 86 is inserted into the substrate 40. is there. Each connector 86
If the tip end of B is bent or deformed, it cannot be easily inserted into the substrate 40, and there is a problem that the work efficiency is reduced.

For such a remote control light receiving element 80, a remote control light receiving element using a lead frame has been developed. An example of a remote control light receiving element using a lead frame is shown in FIGS. 7 (a) and 7 (b). This remote control light receiving element 90 is a photodiode chip, I
The C chip, the capacitor chip, and the resistor chip have a lead frame 91 directly bonded by silver (Ag) paste.

The photodiode of the lead frame 91,
The portion on which the IC chip, the capacitor chip, the resistance chip, etc. are mounted is covered with a light-transmissive resin mold body 92 molded by transfer molding. Then, on the mold body 92, so as to face the photodiode in the mold body 92,
A hemispherical lens portion 93 is provided.

A mold body 92 which covers a part of the lead frame 91 is housed in a metal shield case 94. The shield case 94 has a box-shaped case body 94a that covers the molded body 92, and a pair of legs 94b arranged on both sides of one end of the case body 94a. Each leg portion 94b has a long plate shape extending in a direction opposite to the protruding direction of the lens portion 93 along each side surface of the case main body portion 94a, and the tip end portion of each leg portion 94b has a substrate 4 a.
It is a terminal portion 94c inserted into 0. Each leg 9
The terminal portions 94c of 4b are bent so as to project in directions away from each other, and when inserted into the substrate 40, the respective terminal portions 94c are locked to the substrate 40 to prevent the entire shield case 94 from coming off. .

The lead frame 91 has three lead portions 91a extending from the mold body 92. Each lead portion 91a extends from the mold body 92 in a direction orthogonal to each leg portion 94b from the end portion on the opposite side to the end portion where each leg portion 94b of the shield case 94 is arranged. The middle of the lead portion 91a is bent at a right angle so as to be parallel to each leg portion 94b. Stoppers 91b that project to the left and right are provided at positions near the tips of the two outer lead portions 91a. The stopper 91b serves as each terminal portion 94c of the shield case 94.
Is attached to the substrate 40 so that the tip portion of the lead portion 91a is not inserted into the substrate 40 by more than a required length.

The hemispherical lens portion 93 provided on the mold body 92 is a case body portion 94 of the shield case 94.
It is in a state of protruding from a.

The remote control light receiving element having such a structure is
Each leg portion 94b of the shield case 94 is provided on the substrate 40.
The terminal portion 94c provided at the tip portion of the lead frame 91 is inserted, and the tip portions of the lead portions 91a of the lead frame 91 are inserted. Each lead portion 9 of the lead frame 91
1a is the substrate 4 up to the position where the stopper 91b is provided.
Inserted at 0. Then, the tip portions of the lead portions 91a of the lead frame 91 are soldered to the printed wirings provided on the substrate 40, respectively.

The remote-control light-receiving element 90 mounted on the substrate 40 in this way is in a state of being entirely self-supporting on the substrate 40 by the shield case 94. Then, by mounting the substrate 40 in a predetermined position on the device body in such a state, the lens portion 93 is exposed from the casing of the device body to the outside. Board 40
And the distance from the tip of the lens portion 93 protruding from the case body 94a of the shield case 94 to the TV
12 mm, 16 mm by the shield case 94 so that the tip of the lens portion 93 faces the outside from the casing of the device body when mounted on the device body such as
It is accurately set to either mm or 20 mm.

[0014]

A remote control light receiving element 90 utilizing a lead frame shown in FIG. 7 is a remote control light receiving element 8 using a 3-pin connector 86 shown in FIG.
The number of components is smaller than 0, and since the IC chip and the like are directly bonded on the lead frame 91 by Ag paste or the like, it is not necessary to solder the IC chip and the assembling work is easy. It has the advantage of being. Further, since the shield case 94 supports the lead frame 91 in a self-supporting state with respect to the substrate 40 and secures the distance between the substrate 40 and the tip of the lens portion 93, the entire remote control light receiving element 90 is provided. Board 40
Can be stably attached to. Further, the shield case 94 also functions as an electromagnetic shield for the main body of the device having the built-in high gain amplifier.

However, such a light receiving element 9 for remote control is used.
Even at 0, each lead portion 91a of the lead frame 91 is in a state of extending long from the mold body 92. The length of each lead portion 91a from the bent portion to the substrate 40 is as shown in FIG.
It is about 2.3 times longer than the length of the extending portion of each connector 86 from the shield case 81 in the light receiving element 80 shown in FIG. For this reason, the tip of each lead portion 91a may be bent or deformed more easily than the tip of the connector 86. If the tip portion of each lead portion 91a is curved or deformed, it is not easy to insert it into the substrate 40.

Further, each lead portion 9 of the lead frame 91
1a is thinner than the connector 86 of the light receiving element shown in FIG. While the width of the connector 86 is about 0.5 mm, the width of each lead portion 91a is about 0.4 mm, and the strength of each lead portion 91a is weaker than the strength of the connector 86. ing. Further, a lead frame 91 to which an IC chip or the like is directly bonded
Since it is necessary to form a circuit pattern on the substrate, the iron-based metal plate that constitutes the lead frame 91 is required to have punching property, workability, plating property, and the like, and therefore, inferior in spring property and the like. Has become. As a result, each lead portion 91
The strength of a is also lowered, and
There is a possibility that a may be easily deformed.

As described above, in the remote-control light receiving element 90 using the lead frame 91, the lead portions 91a are easily deformed, and the lead portions 91a cannot be easily inserted into the substrate 40. is there.

The present invention solves such a problem, and an object thereof is to suppress the bending and deformation of the lead portion in the lead frame and to easily insert the light into the substrate for the remote controller. An object is to provide an element and a manufacturing method thereof.

[0019]

A light receiving element for a remote controller according to the present invention has a photodiode for receiving an optical signal from a transmission unit, and is mounted on a main body of a device while being mounted on a substrate. A light receiving element for remote control, which has a mounting portion on which the photodiode is mounted,
A lead frame having a plurality of lead portions extending from the mounting portion so that each tip portion is inserted into the substrate, a light-transmissive resin mold body covering the mounting portion of the lead frame, and the mold body. Of the lead frame of the lead frame extending from the mold body, and a shield case having a case main body that accommodates the inside thereof, and a leg extending from the case main body so that the tip end is inserted into the substrate. The present invention is characterized in that it comprises: a reinforcing member for connecting the vicinity of the front end portion to be inserted into the substrate, with which the above object is achieved.

The reinforcing member is formed of a light-transmissive resin forming the mold at the same time when the mold is formed, or has a heat resistance different from that of the light-transmitting resin forming the mold. The excellent resin is molded at the same time when molding the molded body.

[0021]

In the light receiving element for remote control of the present invention, since the lead portions of the lead frame are connected to each other by the reinforcing member, the bending and deformation of the lead portions are suppressed, and the shield case is When attached to the substrate, the tip portions of the lead portions can be easily inserted into the substrate.

The reinforcing member is used for molding the molded body.
By molding using a part of the resin that makes up the molded body, it is efficient and without sacrificing economy.
Can be manufactured. On the other hand, the reinforcing member may be made of a resin having excellent heat resistance, which is different from the resin forming the mold body when molding the mold body.
In this case, when the tip ends of the lead portions are inserted into the board and soldered, the reinforcing member is not likely to be damaged by high heat during soldering.

[0023]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a front view showing an example of a light receiving element for remote control of the present invention, and FIG. 2 is a side view of the light receiving element for remote control. This light receiving element for remote control has a lead frame 10 in which a photodiode chip, an IC chip, a capacitor chip, and a resistor chip are directly bonded to a mounting portion 11 by silver (Ag) paste.

The mounting portion 11 of the lead frame 10 on which the photodiode and the like are mounted is covered with the photodiode and the like by a molded body 30 of a light-transmissive resin molded by transfer molding. Then, the mold body 30 is added to the mold body 30.
A hemispherical lens portion 14 is provided so as to face the photodiode therein.

The mold body 30 that covers the mounting portion 11 of the lead frame 10 is housed in the case body 21 of the metallic shield case 20. A pair of long plate-shaped legs 22 extending along each side surface of the case body 21 are provided on both sides of one end of the case body 21.
The tip of each leg 22 serves as a terminal 24 that is inserted into the substrate 40. Each terminal portion 24 has a widthwise dimension that is half the widthwise dimension of each leg portion 22.
It is designed so that they do not face each other. Each terminal part 2
The tip portions of 4 are bent so as to project in directions away from each other, and when inserted in the substrate 40, the respective terminal portions 24 are locked to the substrate 40 and prevent the entire shield case 20 from coming off.

The lead frame 10 has three lead portions 12 extending from the mold body 30. Each lead portion 12 extends from the mold body 30 in a direction orthogonal to each leg 22 from the end opposite to the end where each leg 22 of the shield case 20 is arranged. Part 1
The middle of 2 is bent at a right angle so as to be parallel to each leg 22. Stoppers 12a that project to the left and right sides are provided at positions near the tips of the two outer lead portions 12, respectively. The stopper 12a is provided so that the tip portion of the lead portion 12 is not inserted into the substrate 40 over a required length when the terminal portions 24 of the shield case 20 are attached to the substrate 40.

The hemispherical lens portion 14 provided on the mold body 30 is a case body portion 21 of the shield case 20.
It is protruding from.

Each lead portion 1 in the lead frame 10
The two are reinforced by being connected to each other by one reinforcing member 15. The reinforcing member 15 is made of, for example, a light-transmissive resin similar to that of the mold body 30.
On the upper side of the stopper 12a formed on the lead portion 12, the lead portions 12 that are adjacent to each other in an orthogonal state to the lead portions 12 are connected to each other so that the tips of the lead portions 12 do not bend or deform. ing.

The remote control light-receiving element having such a configuration is
Substrate 40 that is attached to the main body of equipment such as TV and VTR
The terminal portion 24 provided at the tip of each leg portion 22 of the shield case 20 is inserted into and attached to. At this time,
At the same time, the tips of the lead portions 12 of the lead frame 10 are inserted into the substrate 40. The lead portions 12 of the lead frame 10 are inserted into the substrate 40 up to the position where the stopper 12 is provided. Since the lead portions 12 are connected to each other, bending and deformation of the tip portions of the lead portions 12 are suppressed, and the tip portions of the lead portions 12 can be easily inserted into the substrate 40. Then, when the front end of each lead portion 12 of the lead frame 10 is inserted into the substrate 40, each lead portion 12 with respect to the printed wiring provided on the substrate 40.
Is soldered.

In such a state, the lead frame 10
Is entirely supported by the shield case 20 on the substrate 40, and the lens portion 14 protruding from the case body portion 21 of the shield case 20 when the substrate 40 is mounted on a device body such as a TV. The tip of the is exposed from the casing of the device body to the outside. The distance from the substrate 40 to the tip of the lens portion 14 protruding from the case main body portion 21 of the shield case 20 is equal to the shield case 2
By 0, it is accurately set to 16 mm,
When the substrate 40 is attached to the device body, the lens unit 14
The tip is surely exposed from the casing of the device body to the outside.

While the distance from the substrate 40 to the tip of the lens portion 14 is 16 mm, the lead frame 1
Each of the lead portions 12 of 0 has a length of about 5.1 mm from the portion where the reinforcing member 15 is attached to the tip portion. Therefore, each lead portion 12 is bent and deformed at a portion of 5.1 mm from the reinforcing member 15 to the tip.
Therefore, a large force is required to deform the tip portion of each lead portion 12 inserted into the substrate 40, and the amount of deformation is also small.

For example, the light receiving element 8 for remote control shown in FIG.
0, the length from the bent portion to the tip of the connector 86 extending from the shield case is about 8 mm. In the remote control light receiving element 90 shown in FIG. 7, the length from the bent portion to the tip of each lead portion 91a is It is about 18.5 mm,
The force required to deform the connector 86 and the lead portion 91a into a state of being bent by 5 ° is the light receiving element for remote control 8 when the force required for the light receiving element for remote control 90 is 1.
In the case of 0, 2.3 times is required, the change amount of the tip of the connector 86 is about 0.7 mm, and the change amount of the lead 91a is about 1.6 m.
It was m. On the other hand, in the light-receiving element for remote control of the present embodiment, the force required to bend the tip portion of the lead 12 to the angle of 5 ° is 3.6 times, and the tip of each lead portion in this case is required. Was about 0.4 mm.

The reinforcing member 15 is, for example, a mold body 30.
It is designed to be molded at the same time when molding. FIG. 3 is a schematic configuration diagram of a mold used for manufacturing the molded body 30. In the mold 50, the lead frame connected body 1 in which a plurality of lead frames 10 are connected is arranged. The lead frame linked body 1 includes the lead frames 10
The tip portions of the lead portions 12 in the
Are connected to each other, and the base ends of the lead portions 12 adjacent to the mounting portions 11 are connected to each other by a tie bar 17 which is parallel to the cradle 16. Then, the pair of lead frame linked bodies 1 is placed in the mold 50 with the mounting portions 11 being brought close to each other.

In the mold 50, each lead frame connected body 1
Of the molding cavities 52 arranged in a row so as to accommodate the mounting portions 11 of the respective lead frames 10 and the lead portions 12 of the respective lead frames 10.
The reinforcing member cavities 54 are arranged in one row so that the vicinity of the tip end of each of them is housed inside. A mold liner 53 is formed between the mold cavities 52 arranged in a row, and the mold liner 53 is a pot (heating chamber) to which the molten resin forming the resin mold body 30 is supplied. ) 51 in succession. The mold liner 53 and the mold cavities 52 arranged in a line on each side of the mold liner 53 are connected via a gate 55.

Reinforcing member cavities 5 arranged in a row
4, the reinforcing member cavities 54 adjacent to each other are in communication with each other, and the reinforcing member cavities 54 close to the pot 51 are connected to the reinforcing member liner 56 via the gate 57. There is. The reinforcing member runner 56 communicates with the pot 51 that supplies the molten resin that forms the mold body 30.

The die 50 having such a structure is used for mounting the lead frames 10 in the lead frame assembly 1 on the mounting portion 1.
It is used for resin-molding each mounting portion 11 in a state where a photodiode or the like is mounted on 1. The lead frame linked body 1 is a mounting portion 1 of each lead frame 10.
1 is located in each mold cavity 52 of the mold 50, and all the lead portions 12 of each lead frame 10 in the vicinity of the cradle 16 are located in the reinforcing member cavity 54.

In such a state, the light transmissive molten resin is supplied from the pot 51 to the mold liner 53 and the reinforcing liner 56, respectively. Then, molten resin is filled into the mold cavities 52 from the mold liner 53 through the gates 55, and the reinforcing member runners 56 to the gates 57 are filled.
The molten resin is sequentially filled into the cavity 54 for each reinforcing member through the through holes. When the molten resin in each mold cavity 52 and the molten resin in each reinforcing member cavity 54 cure, the lead frame linked body 1 is taken out from the mold 50.

The resin cured in each mold cavity 52 is transferred to the mold runner 5 by each gate 55.
3 can be easily cut with the resin in the resin 3, and the hardened resin in each of the reinforcing member cavities 54 can also be cut by the gate 57.
Thus, the resin in the reinforcing member runner 56 can be easily cut.

In this case, the reinforcing members 15 hardened in the reinforcing member cavities 54 are in a state of being connected to each other by the hardened resin, but in the next step, a cutting die is used. It is designed to be cut. The resin that connects the reinforcing members 15 to each other is preferably thin so that it can be easily cut. The work of cutting the resin that connects the reinforcing members 15 to each other is performed when the tie bar 17 is cut for each lead portion 12 of each lead frame 10 of the lead frame connected body 1 or the cradle 16 is cut. When
You may make it cut simultaneously.

As described above, the reinforcing members 15 are provided to connect the lead portions 12 to each other and suppress the deformation of the tip portions of the lead portions 12.
There is no particular problem even if peeling, voids or the like occur in the resin that constitutes No. 5. The fluidity of the resin into the cavity 54 for the reinforcement member can be adjusted by giving priority to the fluidity of the resin in the runner 53 for the mold by adjusting the thickness of the runner 56 for the reinforcement member, etc. The molded body 30 made of a resinous resin can be molded without impairing its quality.

As described above, when the molding body 30 made of the light-transmissive resin is molded, the resin is used to simultaneously manufacture the reinforcing member 15, so that a special member for manufacturing the reinforcing member 15 can be obtained. There is no need to add additional steps, and there is no fear of impairing work efficiency and economy.

FIG. 4 is a schematic configuration diagram of another embodiment of the mold used for manufacturing the light receiving element for remote control of the present invention.
This mold 60 is of a multi-plunger type using a multi-pot, and a pot 69 for a reinforcing member is provided separately from a pot 61 for molding which communicates with a cavity 62 for molding the mold 30. From the reinforcing member pot 69, a molten resin different from the light transmissive resin forming the mold body 30 is supplied, and the reinforcing member 15 is molded by the molten resin.

The mold cavity 62 is made of a light-transmissive molten resin from the mold runner 63 to each gate 65.
And is supplied to each mold cavity 62 via. On the other hand, from the reinforcing member pot 69, the resin having excellent heat resistance is supplied to the reinforcing member runner 66.
And through each gate 67 a cavity 64 for each reinforcing member
Will be supplied in order.

As described above, in the method of molding each reinforcing member 15 with a resin having excellent heat resistance different from the light-transmissive resin forming the mold body 30, the lead frame 1
When each of the lead portions 12 of No. 0 is inserted into the substrate 40, when the lead portion 12 of each lead portion 12 is soldered to the substrate 40, the reinforcing member 15 close to the substrate 40 is exposed to a high temperature during soldering. It is not affected and therefore the soldering operation can be carried out at high temperature and for a long time. As a result, the reliability of soldering between the tip of each lead portion 12 and the substrate 40 is improved.

In addition, since the reinforcing member 15 is made of a resin having excellent heat resistance as described above, deterioration of the reinforcing member 15 during soldering is prevented, so that each lead 12 of the lead frame 10 is prevented. Even if the stopper 12a is not integrally formed, the function of the stopper 12a is fulfilled by the reinforcing member 15.

FIG. 5 is a schematic configuration diagram of still another embodiment of a mold used for manufacturing the light receiving element for remote control of the present invention. This mold 70 also has a molding pot 71 that communicates with a molding cavity 72 for molding the molding body 30 through a molding runner 73 and each gate 75.
Separately from the above, a reinforcing member pot 79 for supplying the molten resin forming the reinforcing member 15 is provided. The reinforcing member pot 79 supplies molten resin having excellent heat resistance to the reinforcing member runner 76, and
Communicate with each of the reinforcing member cavities 74 via a gate 77.

Also in the mold 70 of this embodiment, the mold body 30 is used.
Since the reinforcing member 15 is formed of a resin having excellent heat resistance, which is different from the light-transmissive resin constituting the above, the reliability of soldering between the lead portions 12 and the substrate is improved. Further, it is not necessary to provide the stopper 12a on each lead portion 12.

Further, since molten resin is supplied from the reinforcing member runners 76 to the reinforcing member cavities 74 through the gates 77, respectively, the reinforcing member runners 76 are filled with the molten resin. Since each of the reinforcing members 15 formed by cutting is easily cut from the resin in the reinforcing member runner 76, the step of cutting the resin connecting the reinforcing members 15 to each other is not necessary in the next step. , Workability is improved.

In the above embodiment, the substrate 40 and the substrate 4
The case where the distance from the tip of the lens portion 14 protruding from the shield case 20 attached to 0 is 16 mm has been described, but even when the distance is 12 mm or 20 mm,
The present invention can be applied.

Further, the lead portion 12 of the lead frame 10
In contrast, the distance between the substrate 40 and the tip of the lens portion 14 (12
mm, 16 mm, 20 mm), and a plurality of reinforcing members 15 respectively corresponding to the lead portion 12 are provided so that the reinforcing member 15 corresponding to the distance between the substrate 40 and the tip of the lens portion 14 remains at the tip portion of the lead portion 12. It may be configured to cut 12.

[0052]

As described above, according to the light receiving element for remote control of the present invention, since the vicinity of the tip of each lead portion in the lead frame is connected to each other by the reinforcing member, A large force is required to bend or deform the tip portion, and the bending or deformation of the tip portion of each lead portion is suppressed. Therefore, it becomes easy to insert the tip of each lead portion into the substrate. Further, in the method for manufacturing a light receiving element for a remote controller of the present invention, the reinforcing member is molded at the same time when the mold body of the mounting portion of the lead frame on which the photodiode is mounted is molded, so that the reinforcing member can be manufactured efficiently. You can

[Brief description of drawings]

FIG. 1 is a front view showing an example of a light receiving element for remote control of the present invention.

FIG. 2 is a side view of the light receiving element for remote control.

FIG. 3 is a schematic configuration diagram showing an example of an internal structure of a mold used for manufacturing the remote control light-receiving element.

FIG. 4 is a schematic configuration diagram showing another example of the internal structure of a mold used for manufacturing the light receiving element for remote control.

FIG. 5 is a schematic configuration diagram showing still another example of the internal structure of the mold used for manufacturing the light-receiving element for remote control.

FIG. 6 is a front view showing an example of a conventional light receiving element for remote control.

7A is a front view showing another example of a conventional remote-control light receiving element, and FIG. 7B is a side view thereof.

[Explanation of symbols]

 10 lead frame 11 mounting part 12 lead part 14 lens part 15 reinforcing member 20 shield case 21 case body 22 leg part 30 mold body 40 substrate 50 mold 51 pot 52 mold cavity 53 mold runner 54 reinforcing member cavity 56 reinforcing member Runner 60 Mold 61 Pot 62 Mold cavity 63 Mold runner 64 Reinforcement member cavity 66 Reinforcement member runner 70 Mold 71 Pot 72 Mold cavity 73 Mold runner 74 Reinforcement member cavity 76 Reinforcement member runner

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 31/10 H05K 1/18 A 8718-4E

Claims (4)

[Claims] 1. A light-receiving element for a remote controller, which has a photodiode for receiving an optical signal from a transmission unit and is mounted on a main body of the apparatus while being mounted on a substrate, wherein the photodiode And a lead frame having a plurality of lead portions extending from the mounting portion so that each tip is inserted into the substrate, and a light-transmissive resin covering the mounting portion of the lead frame. Of the mold body, a case body for accommodating the mold body therein, a shield case having a leg extending from the case body so that the tip end is inserted into the substrate, and a shield case extending from the mold body. A light receiving element for remote control, comprising: a reinforcing member that connects the vicinity of the leading end portion of each lead portion of the lead frame inserted into the substrate. 2. The light-receiving element for remote control according to claim 1, wherein the reinforcing member is formed of a light-transmissive resin forming a mold body. 3. The light receiving element for a remote controller according to claim 1, wherein the reinforcing member is formed of a resin having excellent heat resistance. 4. A method for manufacturing a light-receiving element for remote control, comprising simultaneously forming the mold body and the reinforcing member of the light-receiving element for remote control according to claim 1.