JP4546882B2 - Glaze etching apparatus and glaze etching method - Google Patents

Description

  The present invention relates to a glaze etching apparatus and a glaze etching method using chemical etching.

As a thermal head substrate, a glazed substrate in which the surface of a substrate made of alumina or a ceramic material is coated with a glaze layer made of glass has been widely used. A glazed substrate 1 ′ having a convex surface portion 1d shown in FIG. 11B on the substrate surface is known. In this glazed substrate 1 ′, as shown in FIG. 11A, after the glazed layer 1b having a certain thickness covering the entire surface of the substrate 1a is etched away to form a convex portion 1c, the glazed layer 1b is refired. Thus, it is obtained by deforming the convex portion 1c into the convex portion 1d. The etching process of the glaze layer 1b is generally performed by a chemical etching method in which the glaze substrate is immersed in a hydrofluoric acid-based etchant, and a large number of glaze substrates can be etched simultaneously. Conventionally, in order to prevent the precipitate generated by the reaction between the hydrofluoric acid-based etching solution and barium contained in the glaze layer from covering the glaze layer surface and causing the etching reaction to stagnate or roughen the glaze layer surface. The etching time for one time is set to a short time and etching is performed in several times, and the precipitate is removed every time one etching is completed. Conventional glaze etching methods are described in Patent Documents 1 to 4, for example.
JP 2005-47030 A JP 2001-105641 A JP-A-8-310025 JP 2004-335925 A

  By the way, in recent thermal heads, in order to reduce the size of the head, it has been proposed to form a heat generating portion on the inclined surface of the convex portion of the glazed substrate. However, the convex portion of the glazed substrate formed by the conventional method has a large variation in the slope angle, and if the heat generating portion is formed at the slope position of this convex portion, the print density becomes uneven, leading to deterioration in print quality and yield. .

  Accordingly, the present inventor has carefully examined a large number of glazed substrates in which variations in the slope angle of the convex portion have occurred, and studied the factors of the variability, and as a result, the glazed substrate before refiring shown in FIG. It has been found that the height (thickness) h of the convex portion correlates with the slope angle θ (the width dimension w of the convex portion) of the convex portion of the glazed substrate after refiring shown in FIG. From this correlation, in order to suppress the variation in the slope angle θ (the width dimension w of the convex surface portion) of the convex portion of the glazed substrate, the glazing etching accuracy is increased and the convex portion height h of the glazed substrate before refiring is accurately set. It is necessary to stipulate.

  An object of the present invention is to obtain a glaze etching apparatus and a glaze etching method capable of realizing high-precision etching with a simple configuration and process based on the above problem awareness.

  The present invention focuses on eliminating variations in etching reaction rates among a plurality of glazed substrates immersed in an etching solution, and eliminating variations in etching reaction rates within the etched surface of a glazed substrate.

  That is, the present invention is an embodiment of a glaze etching apparatus that chemically etches a glaze surface of a glazed substrate, and an etching bath containing an etchant that corrodes the glaze surface, and the glazed substrate faces each other in the etching bath. A squeegee unit that is positioned in parallel between a carrier that holds a plurality of sheets in parallel in a pair of states and immerses the glazed surface in an etching solution and a facing glazed surface of a plurality of glazed substrates supported by the carrier. And an ultrasonic vibrator for applying ultrasonic vibration to the etching solution, and a relative motion in two orthogonal directions in a plane parallel to the glazed substrate and the glazed substrate and the squeegee unit in the ultrasonically vibrating etching solution. And a driving means for providing the power.

  According to the above configuration, the etching solution that is ultrasonically vibrated comes into contact with the glaze surface, and the glaze surface is corroded while removing etching residues (reaction products) precipitated or deposited on the glaze surface. The etching of the surface is promoted, and the etching rate can be maintained satisfactorily even after the etching processing time has elapsed. Furthermore, since the glazed substrate and the squeegee unit are given relative motion in two orthogonal directions, the etching solution flows without staying in one place, and the etching is promoted substantially evenly between the plurality of glazed substrates. Etching is promoted substantially uniformly over the entire glaze surface of each glazed substrate. As a result, even in a plurality of glazed substrates and in the glazed surface of each glazed substrate, variations in etching depth are small, and high-precision etching is realized.

  As a more specific configuration, the carrier preferably holds the glazed surfaces of a plurality of glazed substrates parallel to the vertical direction. In this case, the drive means includes a vertical swing unit that swings the carrier in the vertical direction and a left and right swing unit that collectively swings the squeegee unit in the horizontal direction.

  The squeegee unit can be mounted on the carrier while being movable in the horizontal direction. According to this aspect, the squeegee unit swings integrally with the carrier via the vertical swing unit in the vertical direction, and swings independently of the carrier via the horizontal swing unit in the horizontal direction.

  The squeegee unit is provided with a plurality of rod-like bodies arranged at equal intervals in a plane parallel to the glaze surface of the glazed substrate, and the plurality of rod-like bodies are positioned between the opposing glaze surfaces of the plurality of glazed substrates. Is preferred. If a plurality of rod-like bodies are provided, the moving distance of each rod-like body is shortened, and the drive mechanism of the squeegee unit can be miniaturized.

  It is practical for the ultrasonic vibrator to apply ultrasonic vibration to the etching solution from the vertically lower side of the glazed substrate.

  Further, according to the aspect of the glaze etching method for chemically etching the glaze surface of the glaze substrate, the present invention includes a step of forming an etching mask on the glaze surface of the glaze substrate, and immersing the glaze substrate in an etchant that corrodes the glaze surface. A step of positioning the squeegee parallel to the glazed surface of the glazed substrate, a step of applying ultrasonic vibration to the etching solution, and the glazed substrate and the squeegee in the ultrasonically vibrating etching solution. And a step of etching the glaze surface of the glazed substrate while imparting relative motion in two orthogonal directions within a plane parallel to the substrate.

  The glazed substrate can be swung in the vertical direction by immersing it in an etching solution with the glazed surface parallel to the vertical direction, and the squeegee can be swung in the horizontal direction independently of the glazed substrate. Further, it is preferable that the squeegee be swung in the vertical direction integrally with the glazed substrate.

  It is preferable that a plurality of the glazed substrates are held in parallel in a pair of states in which the glazed surfaces face each other and are immersed in the etching solution, and the squeegees are respectively positioned in parallel between the pair of glazed surfaces facing each other. If the glazed surfaces of the glazed substrates face each other in this manner, one squeegee can be shared by a pair of glazed substrates, and the number of squeegees provided can be reduced.

  As the squeegee, a squeegee unit including a plurality of rod-like bodies arranged at equal intervals in a plane parallel to the glaze surface of the glazed substrate can be used. When this squeegee unit is used, a plurality of rod-shaped bodies are positioned in parallel between the facing glaze surfaces of the plurality of glazed substrates.

  It is practical to apply ultrasonic vibration to the etching solution from the vertical lower side of the glazed substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the glaze etching apparatus and the glaze etching method which can implement | achieve highly accurate etching with a simple structure and process can be obtained.

  FIG. 1 is a cross-sectional view showing a glazed substrate which is an etching target of the present invention. The glazed substrate 1 is formed so that the surface of a substrate 1a made of alumina or a ceramic material and excellent in heat dissipation is entirely covered with a glazed layer 1b made of glass. The glaze layer 1b is formed with a film thickness of about 100 to 200 μm, for example, by a printing method. The glazed substrate 1 is used for a thermal head substrate, an image sensor substrate, and the like.

  2 to 5 show the configuration of a glaze etching apparatus according to an embodiment of the present invention. As shown in FIG. 2, the glaze etching apparatus 10 includes an etching tank 12 that contains an etching solution 11, an ultrasonic vibrator 13 that applies ultrasonic vibration to the etching solution 11, and a plurality of glazed substrates 1 in the etching tank 12. A carrier 14 to be held, a squeegee unit 15 for stirring the etching solution 11, a vertical swing unit 16 for swinging the carrier 14 in the vertical direction (vertical direction in the figure), and a squeegee unit 15 in the horizontal direction (horizontal direction in the figure). ), The start button 18 that is manually operated by the user, the drive power supply 19, and the power supply from the drive power supply 19 is operated, and the start button 18 is turned on or off. Operates or operates the ultrasonic vibrator 13, the vertical swing unit 16, and the left / right swing unit 17 when operated. And a control circuit 20 for locked.

  The etchant 11 is a hydrofluoric acid-based etchant mainly containing hydrofluoric acid and nitric acid, and corrodes the glaze layer 1 b of the glazed substrate 1. The ultrasonic vibrator 13 is disposed on the bottom surface of the etching tank 12 and starts or stops ultrasonic vibration of about 28 to 45 kHz when a drive start or stop command is received from the control circuit 20. The ultrasonic vibration generated by the ultrasonic vibrator 13 is applied to the etching solution 11 from the lower side in the vertical direction of the plurality of glazed substrates 1 held by the carrier 14.

  The carrier 14 holds a plurality of glazed substrates 1 arranged in a line. In this holding state, as shown in FIG. 4, the glazed surface 1b of each glazed substrate 1 is oriented parallel to the vertical direction (the vertical direction in the figure), and further, a pair of adjacent glazed substrates 1 are connected to each other's glazed layer (glazed surface). ) 1b faces.

  The vertical swing unit 16 includes a vertical movable arm 16 a integrated with the carrier 14, and swings the vertical movable arm 16 a in the vertical direction based on a command from the control circuit 20. As shown in FIGS. 2 and 3, the vertical movable arm 16 a has a planar inverted T shape (FIG. 2) and an L-shaped cross section (FIG. 3), and extends horizontally and is bonded and fixed to the carrier 14. 16b, and a vertical support portion 16c that extends in a vertical direction from substantially the center of the horizontal support portion 16b and supports the horizontal support portion 16b and the carrier 14. The horizontal support portion 16 b constitutes the bottom surface of the carrier 14, and the end portion of the vertical support portion 16 c is connected to the vertical swing unit 16. When the vertically swinging unit 16 swings the vertically movable arm 16a (vertical support portion 16c) in the vertical direction, the carrier 14 also swings integrally through the horizontal support portion 16b, and a plurality of glazes held by the carrier 14 are supported. The substrate 1 also swings in the vertical direction. The carrier 14 can be inserted into and removed from the etching tank 12 through the vertical swing unit 16.

  As shown in FIGS. 2, 4, and 5, the squeegee unit 15 includes a plurality of squeegees 15a made of a rod-like body that is long in the vertical direction, and a connecting support portion 15b that extends in the horizontal direction and integrally supports the plurality of squeegees 15a. And have. The squeegees 15a are positioned in parallel between the opposing glaze surfaces 1b of the plurality of glazed substrates 1 held by the carrier 14 (FIG. 4), and a plurality of squeegees 15a are arranged at substantially equal intervals in a plane parallel to each glaze surface 1b. (FIG. 5). In the present embodiment, the distance between the pair of facing glaze surfaces 1b is set to 10 mm, and the diameter of the squeegee 15a to be used is set to 5 mm. Therefore, the distance between the glaze surface 1b and the squeegee 15a is 2. It is 5 mm. 4 is a schematic cross-sectional view showing the arrangement of the glazed substrate 1 and the squeegee unit 15 as viewed from the side, and FIG. 5 is a schematic cross-sectional view as seen from the front.

  The left and right oscillating unit 17 is provided as a pair at both ends of the connection support portion 15b of the squeegee unit 15, and the left and right movable arms 17a bonded and fixed to both ends of the connection support portion 15b are based on a command from the control circuit 20. Swing horizontally. When the left and right movable arms 17a are swung in the horizontal direction, the plurality of squeegees 15a are swung together via the connection support portion 15b, and the etching solution 11 between the facing glaze surfaces 1b is stirred. The moving distance of each squeegee 15a is shortened as the number of squeegees 15a provided between the pair of glaze surfaces 1b is increased. If the moving distance of the squeegee 15a is shortened, the apparatus can be reduced in size.

  In the squeegee unit 15, the connection support portion 15b is supported on the upper surface of the carrier 14 so as to be movable in the horizontal direction, and moves integrally with the carrier 14 in the vertical direction via the connection support portion 15b. In other words, the plurality of squeegees 15 a swings in the left-right direction while swinging up and down together with the plurality of glazed substrates 1 held by the carrier 14.

  Next, a method for etching the glazed substrate 1 of FIG. 1 using the glazing etching apparatus having the above-described configuration will be described.

  First, the glazed substrate 1 of FIG. 1 is prepared, and an etching mask having a predetermined shape is formed on the glazed surface 1b. The etching mask is formed by a printing method, for example.

  Next, the glaze surfaces 1b of the plurality of glazed substrates 1 face each other to form a pair of glazed substrates 1, and the plurality of glazed substrates 1 are respectively set on the carrier 14 in this pair of states. Subsequently, the squeegee unit 15 is set on the carrier 14 and attached to the glaze etching apparatus (etching tank 12). When the plurality of glazed substrates 1 and the squeegee unit 15 are set on the carrier 14, as shown in FIG. 4 and FIG. 5, each glazed substrate 1 is held with the glazed surface 1b facing in the vertical direction, and between the facing glazed surfaces 1b. A plurality of squeegees 15a are located respectively.

  Subsequently, the etching solution 11 is put into the etching tank 12. As the etchant 11, a hydrofluoric acid-based etchant mainly composed of hydrofluoric acid and nitric acid is used. The temperature of the etching solution 11 is maintained at about room temperature (24 to 25 ° C.).

  The order of setting the carrier 14 and the squeegee unit 15 in the glaze etching apparatus (etching tank 12) and the process of putting the etching solution 11 in the etching tank 12 may be reversed.

  Then, the start button 18 of the glaze etching apparatus is turned on. Then, the control circuit 20 starts the operations of the ultrasonic transducer 13, the vertical swing unit 16, and the left / right swing unit 17, respectively. Specifically, the etching liquid 11 is ultrasonically vibrated by the ultrasonic vibrator 13, and the plurality of glazed substrates 1 (carriers 14) and the plurality of squeegees 15 a are moved up and down in the ultrasonically vibrating etching liquid 11. The plurality of squeegees 15 a are also swung in the horizontal direction via the left / right swing unit 17. The glaze surface 1b is etched by immersing the glazed substrate 1 in the etching solution 11 for about 5 to 10 minutes in this swinging state.

  Since the etching solution 11 that is ultrasonically vibrated comes into contact with the glazed surface 1b of the glazed substrate 1 while being finely oscillated, the etching residue (etching reaction product) precipitated or deposited on the glazed surface 1b is removed, and a new Further, the glaze surface 1b exposed to is corroded. During the etching, the cycle of corrosion of the glaze surface 1b → removal of etching residue → corrosion of the glaze surface 1b is repeated to maintain a good etching reaction rate.

  When the plurality of glazed substrates 1 swing in the vertical direction, the swing causes the etching solution 11 to flow around the glazed substrate 1, so that the new etching solution 11 contacts the glazed surface 1b and corrodes the glazed surface 1b. In addition, the etching is promoted substantially uniformly among the plurality of glazed substrates 1. Thereby, the etching dispersion | variation for every glazed board | substrate 1 is reduced.

  When the squeegee 15a swings in the vertical direction and the left-right direction, the etching solution 11 that flows between the glaze surfaces 1b of the glazed substrate 1 is agitated by this swinging, so the etching solution 11 is between the facing glaze surfaces 1b. Etching is promoted substantially uniformly over the entire area of each glaze surface 1b without staying in one place. Thereby, the variation in etching in the glaze surface 1b is reduced. In the present embodiment, as shown in FIG. 5, since a plurality of squeegees 15a are provided between a pair of facing glaze surfaces 1b, the moving distance of one squeegee 15a is short and high-speed oscillation is realized. Is possible.

  The swing speeds of the vertical swing unit 16 and the left / right swing unit 17 are independently controlled by the control circuit 20. When the rocking speed is slow, the etching rate is increased at the end of the etching mask due to the influence of cavitation, and a dent is generated at the end. In order to reduce the variation in the etching rate, it is preferable to increase the swing speed of the vertical swing unit 16 and the left / right swing unit 17 so as to reduce the influence of cavitation, and the appropriate speed is 200 to 350 mm / sec. Degree.

  When the glazed surface 1b of the glazed substrate 1 is etched to a desired height h as shown in FIG. 11A, the start button 18 is turned off to complete the etching. When the start button 18 is turned off, the control circuit 20 stops all the operations of the ultrasonic transducer 13, the vertical swing unit 16, and the left / right swing unit 17.

  6 to 9 show changes in etching variation depending on the etching method (with or without squeegee). 6 and 7 are examples in which a plurality of the glazed substrates 1 are etched by the etching method of the present embodiment described above, and FIGS. 8 and 9 are etching solutions 11 that are ultrasonically vibrated without using the squeegee 15a. This is a comparative example in which a plurality of glazed substrates 1 are etched by swinging a plurality of glazed substrates 1 in the vertical direction. 6 and 8 show the etching depth variation between the glazed substrates (vertical etching variation in FIG. 10), and FIGS. 7 and 9 show the etching depth variation in the glaze plane (horizontal in FIG. 10). Direction etching variation). 6 to 9, the vertical axis represents the etching depth (μm), and the horizontal axis represents the etching line defined in FIG. 10 (etching depth measurement position). The etching lines [1, 2, 9, 16, 23, 29, 30] in FIG. 6 and FIG. 8 are the positions (positions in the vertical direction) of the glazed substrate 1, and the etching lines [L, L -C, C, CR, R] are in-plane positions (horizontal positions) of the glaze surface 1b.

  The following etching conditions are the same in both the above examples and comparative examples.

Etching solution 11
Composition; HF: HNO ₃ : H ₂ O = 10%: 11.5%: 78.5%
Liquid temperature: 24 ° C
Ultrasonic vibration; 28kHz 600W
Vertical rocking speed: 270 mm / sec Horizontal rocking speed: 70 mm / sec Processing time: 5 minutes Looking at FIG. 6, glazed at each position in the horizontal direction (L, LC, C, RC, R) The line graph showing the variation in the etching depth between the substrates 1 shows almost the same tendency, and the variation in the etching depth is as small as 1 μm or less. Similarly, in FIG. 7, the line graph showing the variation in the etching depth in the glaze surface 1b at each position (1, 2, 9, 16, 23, 29, 30) in the vertical direction has almost the same tendency. It can be seen that there is little variation in etching depth within the glaze surface 1b. The variation of the etching depth in the glaze surface 1b is within 0.2 μm at the minimum and within 0.6 μm at the maximum.

  Referring to FIG. 8, it can be seen that the glazed substrate 1 arranged on the center side in the vertical direction tends to have a smaller etching amount, and the etching depth differs by a maximum of 6.32 μm. Referring to FIG. 9, in the glazed substrate 1 (lines 16, 9, and 23) disposed near the center in the vertical direction, etching is performed at positions (LC and RC) between the center portion and both ends in the horizontal direction. In the glazed substrate 1 (lines 29, 2, 30, 1), which is small in size and arranged at both ends in the vertical direction, the etching amount is large at the horizontal center. The etching depth in the glazed surface 1b varies over 0.6 μm in all the glazed substrates 1 and is different by 2.76 μm at the maximum.

  According to FIG. 6, FIG. 7, FIG. 8, and FIG. 9, it is clear that the variation in the etching depth is smaller in the embodiment than in the comparative example, even between the plurality of glazed substrates 1 and in the glaze surface 1b. It is.

  As described above, according to the present embodiment, in the etching solution 11 that is ultrasonically vibrated, the plurality of glazed substrates 1 and the plurality of squeegees 15a are given relative motion in two orthogonal directions (vertical direction and horizontal direction) to obtain a glazed substrate. 1 is etched. Etching residue (reaction product) is deposited or deposited on the corroded glaze surface 1b, but this etching residue is removed by ultrasonic vibration of the etchant 11, so that the etching of the glaze surface 1b is not hindered. The etching rate can be maintained satisfactorily even after the etching processing time has elapsed. Further, since the etching liquid 11 flows without staying in one place due to the swing of the glazed substrate 1 and the squeegee 15a, the etching is promoted substantially uniformly between the plurality of glazed substrates 1, and similarly, the glazed surface 1b Etching is promoted substantially evenly over the entire area. That is, the variation in the etching depth depending on the position of the glazed substrate 1 and the variation in the etching depth depending on the position in the glazed surface 1b are reduced, and the convex height h of the glazed substrate 1 can be defined with high accuracy.

  In the case where the glazed substrate 1 (FIG. 11A) etched in the present embodiment is used for a partially convex thermal head substrate, for example, a portion in which the convex portion 1c of the glazed substrate 1 is transformed into a convex portion 1d by refiring. A convex-shaped glazed substrate 1 ′ (FIG. 11B) is assumed. At this time, the glazed substrate 1 shown in FIG. 11A has a highly accurate convex height h before refiring (after etching), and thus reduces variations in the shape of the convex portion 1d after refiring. be able to. If the shape variation of the convex surface portion 1d of the glazed substrate 1 ′ is small, the variation of the slope angle θ of the convex surface portion 1d is small, and the position of the heat generating portion formed on the slope of the convex surface portion 1d can be defined with high accuracy, and the printing quality. And the yield can be improved.

  In this embodiment, the glazed substrate 1 (carrier 14) is swung in the vertical direction and the squeegee 15a (squeegee unit 15) is swung in the vertical direction and the horizontal direction. The movement may be in two directions orthogonal to each other in a plane parallel to the glazed substrate 1. When the glazed substrate 1 (carrier 14) is swung in the vertical direction as in this embodiment, the squeegee 15a may be swung only in the horizontal direction.

It is sectional drawing which shows an example of the glazed substrate which is the etching object of this invention. It is a schematic cross section which shows the main structures (an example) of the glaze etching apparatus by this invention seeing from the front side. It is a schematic cross section which shows the structure of the up-and-down rocking | swiveling unit of FIG. 2 seeing from a side surface side. It is a schematic cross section which shows the arrangement | positioning aspect of a glazed substrate and a squeegee unit seeing from a side surface side. It is a schematic cross section which shows the arrangement | positioning aspect of the same glaze board | substrate and a squeegee unit seeing from the front side. It is a graph which shows the dispersion | variation in the etching depth between glaze board | substrates when a several glazed board | substrate is etched using a squeegee (Example). It is a graph which shows the dispersion | variation in the etching depth in a glaze surface at the time of etching a several glazed board | substrate using a squeegee (Example). It is a graph which shows the dispersion | variation in the etching depth between glazed substrates at the time of etching a several glazed substrate without using a squeegee (comparative example). It is a graph which shows the dispersion | variation in the etching depth in a glaze surface when a several glazed board | substrate is etched without using a squeegee (comparative example). It is the schematic diagram which prescribed | regulated the etching line (measurement position of etching depth) used in FIGS. (A) It is sectional drawing which shows the glazed substrate after an etching. (B) It is sectional drawing which shows the partially convex-surfaced glazed substrate formed by rebaking the glazed substrate after an etching.

Explanation of symbols

1, 1 'Glazed substrate 1a Substrate 1b Glazed layer (glazed surface)
DESCRIPTION OF SYMBOLS 1c Convex part 1d Convex part 10 Glaze etching apparatus 11 Etching liquid 12 Etching tank 13 Ultrasonic vibrator 14 Carrier 15 Squeegee unit 15a Squeegee 15b Connection support part 16 Vertical swing unit 16a Vertical movable arm 16b Horizontal support part 16c Vertical support part 17 Left / right swing unit 17a Left / right movable arm 18 Start button 19 Drive power supply 20 Control circuit h Convex height (thickness)
w Width of convex surface θ Slope angle of convex surface

Claims (11)

In a glaze etching apparatus that chemically etches the glaze surface of a glazed substrate,
An etching tank containing an etchant that corrodes the glaze surface;
A carrier for holding the glazed substrate in parallel in a pair of states in which the glazed surfaces face each other in the etching tank, and dipping the glazed surfaces in the etching solution,
A squeegee unit positioned in parallel between the opposing glaze surfaces of a plurality of glazed substrates supported by the carrier,
An ultrasonic vibrator for applying ultrasonic vibration to the etching solution;
Drive means for imparting relative motion in two orthogonal directions in a plane parallel to the glazed substrate to the glazed substrate and the squeegee unit in an ultrasonically vibrating etching solution;
A glaze etching apparatus comprising: 2. The glaze etching apparatus according to claim 1, wherein the carrier holds the glazed surfaces of the plurality of glazed substrates parallel to a vertical direction, and the driving means includes a vertical swing unit that swings the carrier in the vertical direction. A glaze etching apparatus comprising: a left / right swing unit that collectively swings the squeegee unit in a horizontal direction. 3. The glaze etching apparatus according to claim 2, wherein the squeegee unit is mounted on the carrier so as to be movable in a horizontal direction, and swings integrally with the carrier in the vertical direction via the vertical swing unit. And a glaze etching apparatus that swings independently of the carrier in the horizontal direction via the left-right swing unit. 4. The glaze etching apparatus according to claim 1, wherein the squeegee unit includes a plurality of rod-like bodies arranged at equal intervals in a plane parallel to the glaze surface of the glazed substrate. A glaze etching apparatus in which a rod-shaped body is located between the facing glaze surfaces of the plurality of glaze substrates. 5. The glaze etching apparatus according to claim 2, wherein the ultrasonic vibrator applies ultrasonic vibration to the etching solution from a vertically lower side of the glazed substrate. In the glaze etching method for chemically etching the glaze surface of the glazed substrate,
Forming an etching mask on the glaze surface of the glazed substrate;
Immersing the glaze substrate in an etchant that corrodes the glaze surface, and positioning the squeegee parallel to the glaze surface of the glaze substrate;
Applying ultrasonic vibration to the etching solution;
Etching the glazed surface of the glazed substrate while imparting relative motion in two orthogonal directions in a plane parallel to the glazed substrate to the glazed substrate and the squeegee in an ultrasonically vibrating etchant;
A glaze etching method comprising: 7. The glaze etching method according to claim 6, wherein the glazed substrate is immersed in the etching solution in a state where the glazed surface is parallel to the vertical direction and is swung in the vertical direction, and the squeegee is independent of the glazed substrate. A glaze etching method that swings horizontally. 8. The glaze etching method according to claim 7, wherein the squeegee is rocked in the vertical direction integrally with the glazed substrate. 9. The glaze etching method according to claim 6, wherein the glazed substrate is immersed in the etching solution while being held in parallel in a pair of states in which the glaze surfaces face each other, and is immersed in the etching solution. Is a glaze etching method in which each is positioned in parallel between the pair of facing glaze surfaces. 10. The glaze etching method according to claim 9, wherein the squeegee includes a plurality of rod-like bodies arranged at equal intervals in a plane parallel to the glaze surface of the glazed substrate, and the plurality of rod-like bodies are the plurality of glaze substrates. A glaze etching method using a squeegee unit positioned between each facing glaze surface. 11. The glaze etching method according to claim 6, wherein ultrasonic vibration is applied to the etching solution from a vertically lower side of the glazed substrate.

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