JP2006281012A - Substrate cleaning device, substrate cleaning method and manufacturing method of substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To simplify the constitution of a brush and to uniformly clean a substrate. <P>SOLUTION: The substrate 1 is loaded on a plurality of rollers 10 and is moved in a substrate moving direction by the rotation of the rollers 10. A medium reservoir 13 is arranged such that the upper end of a recessed part is very close to the lower surface of the substrate 1, and a medium 3 which overflows from the upper end of the recessed part is supplied to the lower surface of the substrate 1. An ultrasonic vibrator 14 to which a high frequency voltage is applied from a high frequency oscillator 15 generates ultrasonic vibrations, the ultrasonic vibrations are transmitted through the medium 3 to the substrate 1, and thus the substrate 1 is ultrasonically vibrated. When the substrate 1 is ultrasonically vibrated, stains and foreign matters on the substrate 1 are vibrated together with the substrate 1. The vibrated stains and foreign matters hit the brush bristles of a brush 11a brought into contact with the substrate 1 and are peeled off from the substrate 1. The stains and foreign matters peeled off from the substrate 1 are washed away by washing liquid 2 supplied from a nozzle 12a and removed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a substrate cleaning apparatus, a substrate cleaning method, and a substrate manufacturing method using the substrate cleaning apparatus for cleaning a panel substrate, a semiconductor wafer, and the like for a flat panel display device, and in particular, cleaning using a brush while moving the substrate. The present invention relates to a substrate cleaning apparatus, a substrate cleaning method, and a substrate manufacturing method using them.

  In a manufacturing process of a flat panel display device such as a liquid crystal display device or a semiconductor device, a color filter, a circuit pattern, or the like is formed on a substrate such as a panel substrate or a semiconductor wafer by chemical processing such as development or etching. At this time, if dirt or foreign matter is present on the substrate, color filters, circuit patterns, etc. are not formed well. Therefore, the substrate needs to be cleaned when the substrate is received in the manufacturing process and before or after the chemical treatment. . A series of processing including substrate cleaning and chemical solution processing is often performed while moving the substrate using a substrate transport mechanism such as a roller conveyor.

Substrate cleaning is generally performed by washing away dirt, foreign matter, chemicals, etc. on the substrate with a cleaning solution such as pure water. If there is a lot of dirt or foreign matter, or if a particularly high cleaning power is desired, use a brush. Remove dirt and foreign matter from the substrate. Patent Document 1 discloses a technique for uniformly cleaning a substrate by applying ultrasonic vibrations to the brush in a substrate cleaning apparatus that performs cleaning using a brush while moving the substrate.
JP 2004-273623 A

  In a substrate cleaning apparatus that performs cleaning using a brush while moving a substrate, when the substrate is enlarged, the brush must be elongated in accordance with the width of the substrate. When the brush is lengthened, the weight of the brush increases and the brush is deflected. For this reason, the pressure which contacts a board | substrate differs in the center part and both ends of a brush, and there existed a problem that a board | substrate could not be wash | cleaned uniformly.

  On the other hand, in Patent Document 1, an ultrasonic generator is provided on the brush, and the brush bristles are ultrasonically oscillated, so that the substrate can be cleaned evenly even if the bristles are not in contact with the substrate with uniform pressure. I have to. However, as the length of the brush increases with the increase in the size of the substrate, it is desired that the brush is easily attached, adjusted, removed, etc. In order to facilitate the attachment, adjustment, removal, etc. of the brush, There is a demand for simplifying the configuration of the brush and not wanting to provide an extra mechanism on the brush. Moreover, in the technique described in Patent Document 1, a larger ultrasonic generator is required to ultrasonically vibrate a heavy brush as the brush becomes longer.

  Furthermore, in a conventional substrate cleaning apparatus that performs cleaning using a brush while moving the substrate, dirt and foreign matter peeled off from the substrate with the brush are washed away with the cleaning liquid, but until the cleaning liquid flows out of the substrate. In the meantime, there was a problem that dirt and foreign matter in the cleaning liquid reattached to the substrate.

  An object of the present invention is to simplify the configuration of the brush and to clean the substrate uniformly. Moreover, the subject of this invention is suppressing a dirt and a foreign material from adhering to a board | substrate again, and improving a cleaning effect. Furthermore, an object of the present invention is to produce a high-quality substrate.

  The substrate cleaning apparatus of the present invention includes a substrate moving means for moving a substrate, a cleaning liquid supply means for supplying a cleaning liquid to a substrate moved by the substrate moving means, and a direction orthogonal to the moving direction of the substrate moved by the substrate moving means. A brush that contacts the substrate moved by the substrate moving means and a substrate vibrating means that is provided separately from the brush and vibrates the substrate moved by the substrate moving means at a predetermined frequency. It is a thing.

  Further, the substrate cleaning method of the present invention supplies the cleaning liquid to the substrate while moving the substrate, contacts the brush with the substrate over the width in the direction orthogonal to the moving direction of the substrate, and provides a means separate from the brush. It is used to vibrate the substrate at a predetermined frequency.

  When the substrate is vibrated at a predetermined frequency, dirt and foreign matter on the substrate vibrate together with the substrate. The vibrating dirt and foreign matter collide with the brush in contact with the substrate as the substrate moves. At this time, since dirt and foreign matter vibrate, they easily peel off from the substrate due to collision with the brush. Dirt and foreign matter peeled off the substrate are washed away with the cleaning liquid supplied to the substrate and removed. There is no need to vibrate the brush as in Patent Document 1, the configuration of the brush is simplified, and the substrate is cleaned uniformly. In addition, since the substrate is vibrated, dirt and foreign matter in the cleaning liquid are less likely to reattach to the substrate.

  Furthermore, the substrate cleaning apparatus according to the present invention includes a medium supply unit that supplies a medium that transmits vibration to the substrate that is moved by the substrate moving unit, and a vibration source that contacts the medium that transmits vibration. It is what you have. In the substrate cleaning method of the present invention, a medium that transmits vibration is supplied to the substrate, and a vibration generation source is brought into contact with the medium that transmits vibration to vibrate the substrate. The vibration generated by the vibration generation source is transmitted to the substrate through the medium supplied to the substrate, and the substrate vibrates. Since the substrate is vibrated through the medium for transmitting vibration, the substrate is vibrated without hindering the movement of the substrate.

  As a medium for transmitting vibration, a liquid having a viscosity suitable for transmission according to the frequency of vibration is used. As an example, it is possible to use a cleaning liquid such as pure water as a medium and an ultrasonic vibrator as a vibration generation source.

  Furthermore, the substrate cleaning apparatus of the present invention is provided with cleaning liquid supply means and brushes above and below the substrate moved by the substrate moving means. In the substrate cleaning method of the present invention, the cleaning liquid is supplied to both surfaces of the substrate, and the brush is brought into contact with both surfaces of the substrate. When cleaning both surfaces of the substrate, in Patent Document 1, it is necessary to provide a vibration means for each brush. However, since the substrate is vibrated, only one vibration means is required.

  Furthermore, in the substrate cleaning apparatus of the present invention, the substrate moving means moves the substrate while tilting the substrate at a predetermined angle with respect to the horizontal. The substrate cleaning method of the present invention moves the substrate in a state inclined at a predetermined angle with respect to the horizontal. When the substrate is moved in a state inclined at a predetermined angle with respect to the horizontal, the cleaning liquid supplied to the substrate easily flows out of the substrate. Therefore, dirt and foreign matter in the cleaning liquid are less likely to reattach to the substrate.

  In the substrate manufacturing method of the present invention, a predetermined chemical solution treatment is performed after the substrate is cleaned using any one of the above-described substrate cleaning apparatuses or substrate cleaning methods. The substrate is uniformly cleaned with a high cleaning effect, and color filters, circuit patterns, and the like are favorably formed on the substrate.

  According to the substrate cleaning apparatus and the substrate cleaning method of the present invention, the configuration of the brush can be simplified and the substrate can be cleaned uniformly by vibrating the substrate at a predetermined frequency using a means separate from the brush. . Since the configuration of the brush is simplified, it is easy to attach, adjust, and remove the brush. Further, by vibrating the substrate at a predetermined frequency, it is possible to suppress dirt and foreign matter from adhering again to the substrate and improve the cleaning effect.

  Furthermore, according to the substrate cleaning apparatus and the substrate cleaning method of the present invention, the substrate can be vibrated without obstructing the movement of the substrate by vibrating the substrate through the medium transmitting vibration.

  Furthermore, according to the substrate cleaning apparatus and the substrate cleaning method of the present invention, the cleaning liquid is supplied to both surfaces of the substrate, and the brush is brought into contact with both surfaces of the substrate, thereby uniformly cleaning both surfaces of the substrate with one vibration means. Can do.

  Furthermore, according to the substrate cleaning apparatus and the substrate cleaning method of the present invention, the substrate is moved while being inclined at a predetermined angle with respect to the horizontal, thereby further suppressing the reattachment of dirt and foreign matter to the substrate, and cleaning. The effect can be further improved.

  According to the substrate manufacturing method of the present invention, the substrate can be uniformly cleaned with a high cleaning effect, and a color filter, a circuit pattern, and the like can be favorably formed on the substrate. Therefore, a high quality substrate can be manufactured.

  FIG. 1 is a diagram showing a schematic configuration of a substrate cleaning apparatus according to an embodiment of the present invention. The substrate cleaning apparatus includes a roller 10, a brush 11 a, a nozzle 12 a, a medium reservoir 13, an ultrasonic vibrator 14, and a high frequency oscillator 15.

  The substrate 1 is mounted on a plurality of rollers 10 and is moved in the substrate movement direction indicated by an arrow by the rotation of the rollers 10. Each roller 10 is installed at a predetermined interval in the substrate moving direction, and is rotated at a predetermined speed by a driving means (not shown).

  Above the substrate 1 mounted on the roller 10, a brush 11 a is installed over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. The brush 11a includes brush hairs and a holder that holds the brush hairs. The holder of the brush 11a has a predetermined width so that the brush bristles of the brush 11a are in contact with the upper surface of the substrate 1 with substantially the same pressure over the width in the direction orthogonal to the substrate movement direction of the substrate 1 (the depth direction in the drawing). Attached to height and adjusted.

  Further, a nozzle 12 a is installed above the substrate 1 mounted on the roller 10 over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. The nozzle 12a is configured, for example, by providing nozzle openings in a long tube at predetermined intervals in the drawing depth direction or in a slit shape. A cleaning liquid such as pure water is supplied to the nozzle 12a from a cleaning liquid passage (not shown). The nozzle 12 a supplies the cleaning liquid 2 indicated by the broken line from the nozzle opening to the upper surface of the substrate 1. The cleaning liquid 2 from the nozzle 12 a is supplied to the vicinity where the brush bristles of the brush 11 a come into contact with the substrate 1.

  On the other hand, below the substrate 1 mounted on the roller 10, a medium reservoir 13 is installed over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. The medium reservoir 13 is formed with a recess extending in the depth direction of the drawing, and in FIG. 1, the side wall forming the recess is shown in cross section. The medium 3 that transmits vibration is supplied to and stored in the recess of the medium reservoir 13 from the medium passage (not shown), and the accumulated medium 3 overflows from the upper end of the recess. As the medium 3, for example, a cleaning liquid such as pure water is used. The medium reservoir 13 is arranged so that the upper end of the recess is very close to the lower surface of the substrate 1, and supplies the medium 3 overflowing from the upper end of the recess to the lower surface of the substrate 1.

  An ultrasonic transducer 14 is provided on the bottom surface of the concave portion of the medium reservoir 13. A high frequency voltage is applied to the ultrasonic transducer 14 from the high frequency oscillator 15. The ultrasonic vibrator 14 to which the high-frequency voltage is applied generates ultrasonic vibration, and the ultrasonic vibration is transmitted to the substrate 1 through the medium 3, so that the substrate 1 is ultrasonically vibrated.

  When the substrate 1 is ultrasonically vibrated, if dirt or foreign matter exists on the upper surface of the substrate 1, the dirt or foreign matter vibrates together with the substrate 1. The vibrating dirt and foreign matter collide with the brush bristles of the brush 11 a brought into contact with the upper surface of the substrate 1 as the substrate 1 moves. At this time, since dirt and foreign matter vibrate, they easily peel off from the upper surface of the substrate 1 due to collision with the brush hair. Dirt and foreign matter peeled off from the upper surface of the substrate 1 are washed away with the cleaning liquid 2 supplied from the nozzle 12a and removed. At this time, since the substrate 1 is vibrating, dirt and foreign matter in the cleaning liquid 2 are difficult to reattach to the substrate 1.

  FIG. 2 is a diagram showing a schematic configuration of a substrate cleaning apparatus according to another embodiment of the present invention. In the present embodiment, a brush 11b and a nozzle 12b are added to the embodiment shown in FIG. Other components are the same as those of the embodiment shown in FIG.

  Below the substrate 1 mounted on the roller 10, a brush 11 b is installed in front of and behind the medium reservoir 13 over a width in a direction orthogonal to the substrate movement direction of the substrate 1 (the depth direction in the drawing). The configuration of the brush 11b is the same as that of the brush 11a. The holder of the brush 11b has a predetermined width so that the brush bristles of the brush 11b are in contact with the lower surface of the substrate 1 with substantially the same pressure over the width in the direction perpendicular to the substrate movement direction of the substrate 1 (the depth direction in the drawing). Attached to height and adjusted.

  Further, below the substrate 1 mounted on the roller 10, a nozzle 12 b is installed over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. The configuration of the nozzle 12b is the same as that of the nozzle 12a. A cleaning liquid such as pure water is supplied to the nozzle 12b from a cleaning liquid passage (not shown). The nozzle 12 b supplies the cleaning liquid 2 indicated by a broken line from the nozzle opening to the lower surface of the substrate 1. The cleaning liquid 2 from the nozzle 12 b is supplied to the vicinity where the brush bristles of the brush 11 b come into contact with the substrate 1.

  When the substrate 1 is ultrasonically vibrated, if dirt or foreign matter exists on the lower surface of the substrate 1, the dirt or foreign matter vibrates together with the substrate 1. The vibrating dirt and foreign matter collide with the bristles of the brush 11b brought into contact with the lower surface of the substrate 1 as the substrate 1 moves. At this time, since dirt and foreign matter vibrate, they easily peel off from the lower surface of the substrate 1 due to collision with the brush hair. Dirt and foreign matter peeled off from the lower surface of the substrate 1 are washed away with the cleaning liquid 2 supplied from the nozzle 12b and removed. At this time, since the substrate 1 is vibrating, dirt and foreign matter in the cleaning liquid 2 are difficult to reattach to the substrate 1.

  In the present invention, since the substrate is vibrated using a means separate from the brush, only one vibration means is required when cleaning both surfaces of the substrate. Therefore, according to the present embodiment, both surfaces of the substrate can be uniformly cleaned with one vibration means by supplying the cleaning liquid to both surfaces of the substrate and bringing the brush into contact with both surfaces of the substrate.

  FIG. 3 is a diagram showing a schematic configuration of a substrate cleaning apparatus according to still another embodiment of the present invention. In the present embodiment, a medium reservoir 16 and an ultrasonic vibration device 17 are used instead of the medium reservoir 13 and the ultrasonic transducer 14 in the embodiment shown in FIG. Other components are the same as those of the embodiment shown in FIG.

  Below the substrate 1 mounted on the roller 10, an ultrasonic vibration device 17 is installed over a width in a direction (drawing depth direction) orthogonal to the substrate moving direction of the substrate 1. The ultrasonic vibration device 17 includes an ultrasonic vibrator and a vibration transmission member having a mountain-shaped cross section.

  Further, below the substrate 1 mounted on the roller 10, a medium reservoir 16 is installed before and after the ultrasonic vibration device 17 over a width in a direction (depth direction in the drawing) perpendicular to the substrate moving direction of the substrate 1. Has been. A concave portion extending in the depth direction of the drawing is formed in the medium reservoir 16, and in FIG. 3, the side wall and the bottom forming the concave portion are shown in cross section. The medium 3 for transmitting vibration is supplied to and stored in the concave portion of the medium reservoir 16 from the medium passage (not shown), and the accumulated medium 3 overflows from the upper end of the concave portion. As the medium 3, for example, a cleaning liquid such as pure water is used. The medium reservoir 16 is arranged so that the upper end of the recess is very close to the lower surface of the substrate 1, and supplies the medium 3 overflowing from the upper end of the recess to the lower surface of the substrate 1.

  The ultrasonic vibration device 17 is arranged so that the upper end of the vibration transmitting member is in contact with the medium 3 supplied to the lower surface of the substrate 1. A high frequency voltage is applied from the high frequency oscillator 15 to the ultrasonic vibration device 17. The ultrasonic vibration device 17 to which the high frequency voltage is applied generates ultrasonic vibration by the ultrasonic vibrator, and the vibration transmitting member vibrates ultrasonically. The ultrasonic vibration of the vibration transmitting member is transmitted to the substrate 1 through the medium 3, so that the substrate 1 is ultrasonically vibrated.

  According to the embodiment described above, the structure of the brush can be simplified and the substrate can be uniformly cleaned by vibrating the substrate at a predetermined frequency using means different from the brush. Since the configuration of the brush is simplified, it is easy to attach, adjust, and remove the brush. Further, by vibrating the substrate at a predetermined frequency, it is possible to suppress dirt and foreign matter from adhering again to the substrate and improve the cleaning effect.

  Furthermore, the substrate can be vibrated without hindering the movement of the substrate by vibrating the substrate through a medium that transmits vibration.

  FIG. 4 is a diagram showing a schematic configuration of a substrate cleaning apparatus according to still another embodiment of the present invention. In the present embodiment, the substrate 1 is moved substantially horizontally while the embodiment shown in FIG. 3 is moved in a state where the substrate 1 is inclined at a predetermined angle with respect to the horizontal. The substrate cleaning apparatus includes a roller 20, a brush 21 a, a nozzle 22 a, a medium reservoir 26, an ultrasonic vibration device 27, and a high frequency oscillator 15.

  The substrate 1 is mounted on a plurality of rollers 20 and is moved in the substrate moving direction indicated by the arrow by the rotation of the rollers 20. Each roller 20 is installed at a predetermined interval in the substrate moving direction, and is rotated at a predetermined speed by a driving means (not shown). Each roller 20 is installed so as to be inclined so that one end thereof is higher than the other end. Thus, the plurality of rollers 20 allows the substrate 1 to be moved by a predetermined angle θ in a direction perpendicular to the substrate moving direction with respect to the horizontal. Move in an inclined state.

  Above the substrate 1 mounted on the roller 20, a brush 21 a is installed over a width in a direction orthogonal to the substrate moving direction of the substrate 1. The brush 21a is the same as the brush 11a in FIG. 3 except that the brush 21a is installed at a predetermined angle θ with respect to the horizontal in accordance with the inclination of the substrate 1.

  Further, a nozzle 22 a is installed above the substrate 1 mounted on the roller 20 over a width in a direction orthogonal to the substrate movement direction of the substrate 1. The nozzle 22a is the same as the nozzle 12a of FIG. 3 except that it is installed at a predetermined angle θ with respect to the horizontal in accordance with the inclination of the substrate 1.

  On the other hand, an ultrasonic vibration device 27 is installed below the substrate 1 mounted on the roller 20 over a width in a direction perpendicular to the substrate movement direction of the substrate 1. The ultrasonic vibration device 27 is the same as the ultrasonic vibration device 17 of FIG. 3 except that the ultrasonic vibration device 27 is installed at a predetermined angle θ with respect to the horizontal in accordance with the inclination of the substrate 1.

  Further, below the substrate 1 mounted on the roller 20, a medium reservoir 26 is installed across the width in the direction orthogonal to the substrate movement direction of the substrate 1 before and after the ultrasonic vibration device 27. The medium reservoir 26 is the same as the medium reservoir 16 in FIG. 3 except that the medium reservoir 26 is installed at a predetermined angle θ with respect to the horizontal in accordance with the inclination of the substrate 1.

  Dirt and foreign matter on the upper surface of the substrate 1 collide with the brush bristles of the brush 21 a brought into contact with the upper surface of the substrate 1 and are peeled off from the upper surface of the substrate 1. Dirt and foreign matter peeled off from the upper surface of the substrate 1 are washed away with the cleaning liquid 2 supplied from the nozzle 22a and removed. At this time, since the substrate 1 is inclined, the cleaning liquid 2 supplied from the nozzle 22 a to the substrate 1 is likely to flow out of the substrate 1. Therefore, as compared with the embodiment shown in FIG. 3, dirt and foreign matters in the cleaning liquid 2 are more difficult to reattach to the substrate 1.

  According to the present embodiment, by moving the substrate in a state inclined at a predetermined angle with respect to the horizontal, it is possible to further suppress the reattachment of dirt and foreign matter to the substrate and further improve the cleaning effect. .

  In this embodiment, the substrate is moved at a predetermined angle in the direction orthogonal to the substrate movement direction with respect to the horizontal, but the substrate is inclined at a predetermined angle with respect to the horizontal in the substrate movement direction. You may move in a state.

  In the embodiment described above, the substrate is vibrated ultrasonically. However, the substrate may be vibrated at a frequency lower than that of the ultrasonic wave depending on the type of dirt and the size of foreign matter. The medium for transmitting vibrations is not limited to a cleaning liquid such as pure water, and a liquid having a viscosity suitable for transmission according to the frequency of vibration may be used.

  After cleaning the substrate using the substrate cleaning apparatus or the substrate cleaning method of the present invention, the substrate is uniformly cleaned with a high cleaning effect by performing a predetermined chemical treatment, and a color filter, a circuit pattern, or the like is formed on the substrate. It can be formed satisfactorily. Therefore, a high quality substrate can be manufactured.

It is a figure which shows schematic structure of the board | substrate cleaning apparatus by one embodiment of this invention. It is a figure which shows schematic structure of the board | substrate cleaning apparatus by other embodiment of this invention. It is a figure which shows schematic structure of the board | substrate cleaning apparatus by further another embodiment of this invention. It is a figure which shows schematic structure of the board | substrate cleaning apparatus by further another embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Cleaning liquid 3 Medium 10, 20 Roller 11a, 11b, 21a Brush 12a, 12b, 22a Nozzle 13, 16, 26 Medium reservoir 14 Ultrasonic vibrator 15 High frequency oscillator 17, 27 Ultrasonic vibration apparatus

Claims (12)

A substrate moving means for moving the substrate;
Cleaning liquid supply means for supplying a cleaning liquid to the substrate moved by the substrate moving means;
A brush that is arranged over a width in a direction orthogonal to the moving direction of the substrate moved by the substrate moving means, and that contacts the substrate moved by the substrate moving means;
A substrate cleaning apparatus, comprising: a substrate vibration unit provided separately from the brush and configured to vibrate a substrate moved by the substrate movement unit at a predetermined frequency.   The substrate vibration means includes medium supply means for supplying a medium for transmitting vibration to a substrate moved by the substrate moving means, and a vibration generation source in contact with the medium for transmitting vibration. 2. The substrate cleaning apparatus according to 1.   The substrate cleaning apparatus according to claim 2, wherein the medium supply unit supplies a cleaning liquid to the substrate moved by the substrate moving unit, and the vibration generation source includes an ultrasonic transducer.   The substrate cleaning apparatus according to claim 1, wherein the cleaning liquid supply unit and the brush are provided above and below the substrate moved by the substrate moving unit.   The substrate cleaning apparatus according to claim 1, wherein the substrate moving unit moves the substrate while being inclined at a predetermined angle with respect to the horizontal. While moving the board
Supply cleaning liquid to the substrate,
The brush is brought into contact with the substrate over the width in the direction perpendicular to the moving direction of the substrate,
A substrate cleaning method, wherein a substrate is vibrated at a predetermined frequency using a means different from a brush. Supplying a substrate that transmits vibration to the substrate,
The substrate cleaning method according to claim 6, wherein the substrate is vibrated by bringing a vibration generation source into contact with a medium transmitting vibration.   8. The substrate cleaning method according to claim 7, wherein a cleaning liquid is used as a medium for transmitting vibration, and a vibration generation source including an ultrasonic vibrator is used.   The substrate cleaning method according to claim 6, wherein the cleaning liquid is supplied to both surfaces of the substrate, and the brush is brought into contact with both surfaces of the substrate.   The substrate cleaning method according to claim 6, wherein the substrate is moved in a state inclined at a predetermined angle with respect to the horizontal.   6. A substrate manufacturing method, comprising: cleaning a substrate using the substrate cleaning apparatus according to claim 1, and performing a predetermined chemical treatment.   A method for manufacturing a substrate, comprising: cleaning a substrate using the substrate cleaning method according to claim 6, and performing a predetermined chemical treatment.

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