JP4539187B2 - Manufacturing method of chip-shaped electronic component - Google Patents

Description

This invention relates to a manufacturing method of the chip-like electronic component to be performed using the front and back discrimination equipment.

  For example, dry plating is applied to form terminal electrodes of chip-shaped electronic components. In this case, while preventing the plating film from being formed on an undesired portion of the component body or an assembly structure in which a plurality of component bodies can be taken out by dividing later, the plurality of component bodies or the assembly structure thereof are prevented. At the same time, the following methods have been proposed in order to efficiently carry out dry plating and efficiently advance the dry plating process. That is, dry plating is performed with a plurality of component bodies or their collective structures arranged in the same direction, with spacers functioning as masks inserted between the arranged component bodies or their collective structures. Has been proposed (see, for example, Patent Document 1).

  The spacer described in Patent Document 1 has a rectangular cross section, and it is not necessary to distinguish between the front and the back. However, the terminal electrode is not only on the end surface of the component body or the assembly structure thereof, but also on the end surface. The extension dimension of the first extension portion on the first main surface of the terminal electrode is the second extension on the second main surface of the terminal electrode while being formed to extend to a part of the adjacent main surface. In the case where the spacer must be formed so as to be shorter than the extension dimension of the extension portion, a spacer whose cross-sectional shape is simply a rectangle cannot be used. In this case, as the spacer, for example, a spacer having a front and back asymmetric shape in which a notch is formed along the edge of the back main surface, such as a trapezoidal cross section, must be used.

  When a spacer having an asymmetric cross section other than just a rectangle as described above is used to insert the spacer between each of the component body or the assembly structure, the spacer is oriented in a certain direction with respect to the front and back. There must be. Therefore, an apparatus for discriminating the front and back of the spacer is required.

As the front / back discrimination device as described above, for example, a button front / back discrimination device described in JP-A-9-239169 (Patent Document 2) may be diverted. This front / back discrimination device includes an optical sensor having a light projecting unit and a light receiving unit, and irradiates light from the light projecting unit obliquely to a button as a discrimination target, and reflects light reflected on the surface of the button at the light receiving unit. It receives light and tries to determine the front and back of the button based on the level of the amount of light received.
Japanese Patent No. 3427601 JP-A-9-239169

  However, when the front / back discriminating apparatus described in Patent Document 2 is used for discriminating the front / back side of the spacer, the front / back side is discriminated based on the level of the amount of received light. When there is no error, the discrimination between the front and the back based on the level of the amount of received light is low in reliability. Therefore, when inserting the spacer between the component main body or the assembly structure thereof, it is easy to make a mistake in which the front and back sides of the spacer are reversed. An electronic component is manufactured, which causes a reduction in the manufacturing yield of chip-shaped electronic components.

  It is also conceivable that the front and back of the spacer is discriminated visually by an operator. However, in this case, a human error may occur, and there is a problem that productivity is low and labor costs are high.

Therefore, purpose of this invention is to try to provide a manufacturing method of advantageously electronic chip components to be carried out with high front and back discrimination device reliable sides discrimination.

In the method of manufacturing a chip-shaped electronic component according to the present invention , the front side main surface and the back side main surface that face each other are formed, and a notch is formed in the back side main surface, and the outer shape of the front side main surface and the outer shape of the back side main surface A front / back discriminating apparatus used for discriminating the front and back sides of the discrimination target, which are different from each other, is prepared .

The front / back discrimination device includes a front / back discrimination table having a placement surface on which a discrimination target is placed, and a notch portion presence / absence detection sensor composed of a light sensor having a light projecting portion and a light receiving portion. ing. And in order to solve the above-mentioned technical problem, in the first state where the notch portion presence / absence detection sensor is placed on the front / back discrimination table with the back main surface facing the placement surface, By forming a light path from the light projecting part to the light receiving part through the notch part, the light receiving part receives the light from the light projecting part, while the front main surface faces the mounting surface side. In the second state in which the discrimination target is placed on the front / back discrimination table, the light receiving unit is arranged not to receive the light from the light projecting unit.

  The front / back discrimination table has a side wall surface rising from the placement surface, and the discrimination target is preferably positioned by a part of its outer surface coming into contact with the side wall surface.

The method for manufacturing a chip-shaped electronic component according to the present invention further includes a step of preparing a parent substrate, and the parent substrate is primarily divided along a plurality of first dividing lines parallel to each other to form a plurality of stick shapes. A spacer functioning as a mask is inserted between each of the plurality of stick-shaped structures, while the step of obtaining the structure and the primary divided end face that appears by the primary division are directed in the same direction, and the spacers on the front side facing each other A plurality of stick-like structures are formed in a state where the surface and the back-side principal surface respectively cover at least a part of each of the first and second principal faces adjacent to the primary divided end faces of the stick-like structure, respectively. A step of arranging, a step of forming a terminal electrode by performing dry plating toward the primary divided end faces of the plurality of arranged stick-like structures, and each stick-like structure with respect to the primary dividing line And secondary divided along the second dividing line of the plurality interlinked mutually parallel, and a step of obtaining a plurality of electronic chip components.

  In the step of forming the terminal electrode, a main portion of the terminal electrode is formed on the primary division end face, and the terminal extends to at least a part of at least one of the first and second main faces adjacent to the primary division end face. The spacer is formed so as to form an extension of the electrode, and the spacer has a second extension on the second main surface of the terminal electrode, the extension dimension of the first extension on the first main surface of the terminal electrode being It has the shape which forms a notch part along the edge of a back side main surface so that it may become shorter than the extension dimension of an extension part.

Then, the step of arranging the plurality of stick-like structures described above includes a step of discriminating the front and back of the spacer, and a step of inserting only the spacer determined to be appropriate for the front and back between each of the plurality of stick-like structures. The step of determining the front and back of the spacer is performed using the above-described front and back discrimination device with the spacer as the above-mentioned discrimination target.

According to the front and back discrimination apparatus used Oite to the present invention, the light from the light projecting unit according to whether the light receiving unit receives light, it is possible to determine the front and back of the determination object. Therefore, it is not necessary to depend on the level of the amount of light received at the light receiving unit, and therefore, it is possible to prevent a front / back discrimination error from occurring and to perform highly reliable front / back discrimination.

In the front / back discrimination device, when the front / back discrimination table has a side wall surface rising from the placement surface and the discrimination target object is positioned by contacting the side wall surface, the discrimination target object is positioned on the front / back discrimination table. Since the discrimination target is supplied to the next step, it is possible to make it difficult to make an error in taking this out from the front / back discrimination table. Moreover, since the position of the discrimination target on the front / back discrimination table can be made constant, the reliability of the front / back discrimination can be improved. In addition, the light projecting unit and the light receiving unit can be arranged in a shared manner on the placement surface side and the side wall surface side, and the design of the front / back discrimination device can be facilitated.

For this reason, the spacer used for terminal electrodes of the chip-like electronic component as a mask to form by dry plating, by using the front and back discrimination device, if to perform its front and back discrimination, with high productivity Therefore, it is possible to perform the front / back discrimination with high reliability. Therefore, chip-shaped electronic components can be manufactured with a high yield.

  1 to 7 are for explaining a first embodiment of the present invention.

  In the first embodiment, a chip coil 1 as shown in FIG. 1 is manufactured as a chip-shaped electronic component. The chip coil 1 includes a chip-shaped component main body 2 and terminal electrodes 3 and 4 formed on opposite end surfaces of the component main body 2.

  More specifically, a coil conductor 5 extending in a coil shape is formed on one main surface of the component body 2, and ends 6 and 7 of the coil conductor 5 are electrically connected to the terminal electrodes 3 and 4, respectively. Is done. The end portion 7 of the coil conductor 5 connected to the terminal electrode 4 intersects with other portions of the coil conductor 5, and an electric insulating film 8 is formed in the intersecting region, and these coil conductors 5 intersect. Electrical insulation between the parts is achieved.

  Each of the terminal electrodes 3 and 4 extends not only on each end surface of the component body 2 but also on a part of at least one main surface adjacent to each end surface. In the illustrated chip coil 1, the terminal electrodes 3 and 4 are respectively provided with main portions 3a and 4a located on the end surface and an extension portion 3b located on the main surface opposite to the main surface on which the coil conductor 5 is formed. And 4b.

  The extension portions 3b and 4b of the terminal electrodes 3 and 4 act so as to make it easier to form a solder fillet and improve the reliability of connection with the circuit board when the chip coil 1 is soldered onto the circuit board. To do.

  The terminal electrodes 3 and 4 are formed by dry plating such as sputtering or vacuum deposition, for example. In order to efficiently form the terminal electrodes 3 and 4 by dry plating, a method described below with reference to FIGS. 2 to 5 is employed.

  As shown in FIG. 2, first, a parent substrate 10 is prepared. The parent substrate 10 is divided along a plurality of first dividing lines 11 parallel to each other and a plurality of second dividing lines 12 parallel to each other perpendicular to the first dividing lines 11, thereby A component body 2 for the chip coil 1 is provided. Therefore, although not shown in the drawings, a coil conductor 5 and the like are formed on one main surface of the part main body 2 on the parent substrate 10.

  First, the parent substrate 10 described above is primarily divided along the first dividing line 11. Thereby, a plurality of stick-like structures 13 are obtained.

  As shown in FIG. 5, the plurality of stick-like structures 13 finally appear by the above-described primary division while directing the first main surface 17 on which the coil conductors 5 and the like are formed in the same direction. Each end face, that is, the primary divided end faces 14 and 15 are oriented in the same direction, and the spacers 16 functioning as masks are inserted between them.

  In order to obtain the above-described state, the plurality of stick-like structures 13 are loaded in the holder 23 together with the spacers 16 as shown in FIGS. As shown in FIG. 4, the holder 23 has a frame shape that gives three sides out of four sides that form a rectangle as a whole, and each of the two opposite sides is well shown in FIG. 3. As shown, guide grooves 24 and 25 are provided, respectively.

  As shown in FIG. 4, in order to keep the plurality of stick-like structures 13 and spacers 16 by the holder 23, the stick-like structures 13 and the spacers 16 are moved along the guide grooves 24 and 25 of the holder 23. As shown by the arrows 30 in FIG. 3, the pressing members 26 are inserted after being alternately inserted. The pressing member 26 is fixed to the holder 23 while being pressed so as to eliminate the gap between the stick-like structure 13 and the spacer 16.

  The spacers 16 inserted between the respective stick-like structures 13 are first and second adjacent to the primary divided end faces 14 and 15 of the stick-like structure 13, respectively, as well shown in FIG. It covers at least a part of each of the two main surfaces 17 and 18. The spacer 16 has a front-side main surface 31 and a back-side main surface 32 that face each other, but the front-side main surface 31 that covers the first main surface 17 covers the second main surface. A shape wider than 32, more specifically, in this embodiment, the cross section has a trapezoidal shape.

  Thus, in order to make the front-side main surface 31 and the back-side main surface 32 have different areas, the back-side main surface 32 is formed with a notch 33 having a triangular cross section along both end edges thereof. The outer shape of the main surface 31 and the outer shape of the back-side main surface 32 are different from each other. In this embodiment, the front side main surface 31 of the spacer 16 has an area covering the entire surface of the first main surface 17.

  The dimension of the spacer 16 corresponding to the dimension between the primary divided end faces 14 and 15 of the stick-like structure 13 is equal to the dimension between the primary divided end faces 14 and 15 of the stick-like structure 13. Has been. Therefore, when both end portions 27 and 28 in the longitudinal direction of the spacer 16 are fitted and positioned in the guide grooves 24 and 25 of the holder 23 according to the outer shape reference, respectively, the spacer 16 has a stick as shown in FIG. It will be in the state appropriately aligned with respect to the structure 13.

  In a state where the stick-like structure 13 and the spacer 16 are held by the holder 23, as shown by an arrow 29 in FIG. 5, toward the primary divided end faces 14 and 15 of the plurality of arranged stick-like structures 13, Dry plating is applied. As a result, the main portions 3a and 4a of the terminal electrodes 3 and 4 are formed on the primary divided end surfaces 14 and 15, and the second main surface 18 adjacent to the primary divided end surfaces 14 and 15 is partly formed. Extension portions 3b and 4b of extending terminal electrodes 3 and 4 are formed.

  Next, each stick-like structure 13 is divided along the second dividing line 12 shown in FIG. As a result, a plurality of chip coils 21 as shown in FIG. 1 are obtained.

  As described above, in this embodiment, in order to manufacture the chip coil 1, a plurality of primary divisions along the first division line 11 and secondary divisions along the second division line 12 are performed. Only the primary division along the first dividing line 11 is first performed on the parent substrate 10 from which the component body 2 can be obtained, and the terminal electrode 3 is applied to the stick-like structure 13 obtained at this stage. And a dry plating process for forming 4.

  Therefore, since this stick-like structure 13 has a larger size than the individual component main bodies 2, it is easy to handle. For example, the stick-like structure 13 has a high accuracy in the insertion work into the holder 23 used for dry plating. It is not required, and the insertion work is facilitated. As a result, the productivity of the chip coil 1 can be improved.

  In the above-described embodiment, the terminal electrodes 3 and 4 have an extension dimension of the first extension portion on the first main surface 17 of 0, and as a result, the extension of the first extension portion. The situation resulted that the dimension was shorter than the extension dimension of the second extensions 3b and 4b on the second major surface 18. On the other hand, when the extension dimension of the first extension part on the first main surface of the terminal electrode is not 0, but is shorter than the extension dimension of the second extension part on the second main surface. There is also a possibility.

  Even in the latter case, although the specific dimensions are different, the spacer has a front main surface and a back main surface facing each other as in the illustrated spacer 16, and is notched along both end edges of the back main surface. It is possible to use a portion in which the outer shape of the front side main surface and the outer shape of the back side main surface are different from each other. In this case, the front main surface of the spacer has an area that does not cover the first main surface 17 of the stick-like structure 13 entirely.

  When the chip coil is directed to a high frequency application, if there is a metal in the magnetic field generated in the chip coil, the magnetic field is interrupted, and the inductance and Q are reduced, and variations in inductance and the like are increased. In order to solve this problem, if the coil conductor is formed so as not to block the magnetic field, the effective area of the coil conductor is reduced, and the inductance and Q cannot be increased.

  Therefore, as a method for improving the characteristics without reducing the effective area of the coil conductor or increasing the effective area, the area of the extension portion of the terminal electrode on the main surface of the component body can be reduced, or these extension portions It may be possible to eliminate

  The chip coil 21 shown in FIG. 1 can improve the inductance and Q of the chip coil 21 because there is no extension of the terminal electrodes 3 and 4 that block the magnetic field generated in the coil conductor 5.

  In manufacturing the chip coil 1 as described above, especially when the dry plating process shown in FIG. 5 is performed, the spacers 16 inserted between the respective stick-like structures 13 should not be mistaken in the front and back. I must. This is because if the front and back sides of the spacer 16 are reversed when the spacer 16 is inserted, the extension portions 3b and 4b of the terminal electrodes 3 and 4 are not formed in the chip coil 1 or the main surface on which the coil conductor 5 is formed. This is because extension portions corresponding to the extension portions 3b and 4b of the terminal electrodes 3 and 4 are formed.

  Therefore, in the step of arranging the plurality of stick-like structures 13 while inserting the spacers 16, the front and back of the spacers 16 are discriminated, and only the spacers 16 whose front and back are determined to be appropriate are placed between the stick-like structures 13. Should be inserted into.

  In FIG. 6, the front and back of the spacer 16 is discriminated as described above, and a plurality of stick-like structures 13 are inserted while only the spacers 16 that are judged to be appropriate are inserted between the stick-like structures 13. The state which is implementing the process of arranging is shown. In FIG. 6, the stick-like structure 13, the spacer 16, and the holder 23 described above are shown, and the front / back discrimination device 41 is shown as a block. Details of the front / back discrimination device 41 are shown in FIG.

  The plurality of stick-like structures 13 are conveyed in the direction of arrow 43 by the conveyor 42 and picked up by the chuck 44 at a predetermined pickup position. The chuck 44 performs a pickup operation as indicated by a solid line and a broken line and as indicated by a double arrow 45, and then conveys the stick-like structure 13 to the holder 23 as indicated by an arrow 46.

  On the other hand, the plurality of spacers 16 are conveyed in the direction of the arrow 48 by the conveyor 47 and picked up by the chuck 49 at a predetermined pickup position. The chuck 49 performs a pickup operation as indicated by a solid line and a broken line and as indicated by a double arrow 50, and then, as indicated by an arrow 51, first conveys the spacer 16 to the front / back discriminating device 41, and then as indicated by an arrow 52. Thus, the spacer 16 is conveyed to the holder 23.

  As shown in FIG. 7, the front / back discrimination device 41 has a front / back discrimination table 54 having a placement surface 53 for placing the spacer 16 as a discrimination target. The front / back discrimination table 54 also has a side wall surface 55 rising from the placement surface 53. Therefore, by operating the pressing member 56 in the direction of the arrow 57 toward the spacer 56 placed on the placement surface 53, a part of the outer surface of the spacer 16 is brought into contact with the side wall surface 55. The position of the spacer 16 on the front / back discrimination table 54 can be made constant.

  The front / back discriminating apparatus 41 includes a notch portion presence / absence detection sensor 60 that includes an optical sensor having a light projecting unit 58 and a light receiving unit 59. In this embodiment, the light projecting unit 58 is disposed on the placement surface 53 side, and the light receiving unit 59 is disposed on the side wall surface 55 side. This positional relationship may be reversed.

  In FIG. 6, a plurality of spacers 16 are illustrated on the conveyor 47, but among these spacers 16 (a) are opposite to the other spacers 16, and the front and back are inappropriate. In FIG. 7, (a) shows the case where the appropriate front and back spacers 16 are placed, and (b) shows the case where the improper front and back spacers 16 are placed. The notch portion presence / absence detection sensor 60 described above is characterized in that it is arranged as follows.

  That is, as shown in FIG. 7B, in the first state where the spacer 16 is placed on the front / back discrimination table 54 with the back side main surface 32 facing the placement surface 53 side, By forming a light passage 61 through the notch 33 to the light receiving portion 59, the light receiving portion 59 receives the light from the light projecting portion 58. On the other hand, as shown in FIG. In the second state in which the front side main surface 31 faces the mounting surface 53 side and the spacer 16 is placed on the front / back discrimination table 54, the spacer 16 blocks the light from the light projecting unit 58 and the light receiving unit 59 A cutout portion presence / absence detection sensor 60 is arranged so as not to receive light.

  As described above, since the front and back of the spacer 16 can be determined depending on whether or not the light receiving unit 59 receives the light from the light projecting unit 58, for example, there is no need to rely on the level of the amount of light received by the light receiving unit. Therefore, it is possible to prevent a front / back discrimination error from occurring, and to perform front / back discrimination with high reliability.

  As a result of the front / back discrimination as described above, the spacer 16 (a) determined to be unsuitable for the front / back is usually removed and is not supplied to the holder 23. In addition, a device for reversing the front and back of the spacer 16 is introduced so that the spacer 16 (a) determined to be inappropriate for the front and back is supplied to the holder 23 after reversing the front and back. It may be.

  As described above, if the spacer 16 is positioned on the front / back discrimination table 54 by bringing a part of the outer surface of the spacer 16 into contact with the side wall surface 55, the front / back discrimination can be performed with high reliability. At the same time, as indicated by the arrow 52, since the front / back discriminating apparatus 41 supplies the holder 23 to the holder 23, when the spacer 16 is taken out from the front / back discriminating table 54, mistakes can be made less likely to occur.

  If the front / back discrimination device 41 is used to determine the front / back side of the spacer 16 as in the above embodiment, the front / back discrimination can be performed efficiently and with high reliability. The chip coil 1 can be manufactured with a yield.

  In the description with reference to FIG. 7, it is assumed that the posture of the spacer 16 shown in (a) is appropriate for the front and back, and the posture shown in (b) is inappropriate for the front and back. Appropriateness and inadequacy are not absolute, but relatively determined. Accordingly, the state shown in FIG. 7B, that is, a light passage 61 from the light projecting unit 58 to the light receiving unit 59 through the notch 33 is formed, and the light from the light projecting unit 58 is received by the light receiving unit. When 59 receives light, the front and back of the spacer 16 may be appropriate.

  FIGS. 8 to 10 are diagrams corresponding to FIG. 7 for explaining the second to fourth embodiments of the present invention, and particularly show a modification regarding the shape of the discrimination target. 8 to 10, elements corresponding to those shown in FIG. 7 are denoted by the same reference numerals, and redundant description is omitted.

  In the second embodiment shown in FIG. 8, the determination target object 65 has a larger dimension in the thickness direction than the spacer 16 described above, and the cross-sectional shape is a hexagon.

  In the third embodiment shown in FIG. 9, the discrimination target 66 has a notch 33 having a square cross section. As can be seen from this, the cross section of the notch 33 can be any shape.

  In the fourth embodiment shown in FIG. 10, the discrimination target 67 has notches 68 formed along both end edges not only on the back main surface 32 side but also on the front main surface 31 side. Yes. The notch 68 formed in the front main surface 31 is smaller than the notch 33 formed in the back main surface 32.

  In any of the second to fourth embodiments described above, the discrimination target 65, 66, or 67 is placed on the front / back discrimination table 54 with the back main surface 32 facing the placement surface 53 side. In the state 1 (shown), a light path from the light projecting unit 58 to the light receiving unit 59 through the notch 33 is formed, so that the light receiving unit 59 receives the light from the light projecting unit 58. Receive light. On the other hand, in the second state in which the discrimination target 65, 66 or 67 is placed on the front / back discrimination table 54 with the front main surface 31 facing the placement surface 53, light from the light projecting unit 58 is received. The part 59 does not receive light.

  Therefore, the front and back of the discrimination objects 65, 66, and 67 can be determined depending on whether or not the light receiving unit 59 receives light from the light projecting unit 58.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view illustrating a chip coil 1 as an example of a chip-like electronic component for explaining a first embodiment of the present invention, wherein (a) shows a side on which a coil conductor 5 is formed; b) shows the side opposite to the side on which the coil conductor 5 is formed. It is a perspective view which shows the parent substrate 10 prepared in order to manufacture the chip coil 1 shown in FIG. FIG. 2 is a perspective view showing a spacer 16 used for dry plating the terminal electrodes 3 and 4 of the chip coil 1 shown in FIG. It is a front view which shows the holder 23 holding the stick-shaped structure 13 and spacer 16 which were shown in FIG. It is the figure which showed the arrangement | sequence state of the stick-shaped structure 13 and spacer 16 which were shown in FIG. 4 with the cross section which followed the line AA of FIG. In order to obtain a state in which the stick-like structure 13 and the spacer 16 are held by the holder 23 as shown in FIG. 4, a process of arranging a plurality of stick-like structures is performed while the spacer 16 is inserted between each of them. FIG. It is sectional drawing which shows the detail of the front-and-back discrimination apparatus 41 shown in FIG. 6, (a) shows the case where the front and back of the spacer 16 are appropriate, (b) shows the case where the front and back of the spacer 16 (a) are improper. Show. It is a figure corresponding to FIG. 7 for demonstrating the 2nd Embodiment of this invention. It is a figure corresponding to FIG. 7 for demonstrating the 3rd Embodiment of this invention. It is a figure corresponding to FIG. 7 for demonstrating the 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip coil 2 Component body 3, 4 Terminal electrode 3a, 4a Main part of terminal electrode 3b, 4b Extension part of terminal electrode 10 Parent board 11 1st dividing line 12 2nd dividing line 13 Stick-like structure 14, 15 Primary division end face 16 Spacer (object to be distinguished)
Reference Signs List 17 first main surface 18 second main surface 29 arrow indicating dry plating 31 front side main surface 32 back side main surface 41 front / back discriminating device 53 mounting surface 54 front / back discriminating table 55 side wall surface 56 pressing member 58 light projecting unit 59 light receiving Section 60 Notch detection sensor 61 Light path 65, 66, 67 Discrimination target

Claims (2)

A front side and a back side main surface that face each other, a notch is formed in the back side main surface, and the outer shape of the front side main surface and the outer side of the back side main surface are different from each other. A front / back discrimination device used for discrimination,
A front / back discrimination table having a placement surface for placing the discrimination object;
A notch part presence / absence detection sensor comprising a light sensor having a light projecting part and a light receiving part,
The cutout portion presence / absence detection sensor is configured to detect the cutout portion from the light projecting portion in a first state in which the discrimination target is placed on the front / back discrimination table with the back main surface facing the placement surface. By forming a light passage through the notch to the light receiving portion, the light receiving portion receives light from the light projecting portion, while the front main surface is directed to the mounting surface side. In the second state in which the discrimination object is placed on the front / back discrimination table, the light receiving unit is disposed so as not to receive light from the light projecting unit.
Preparing a front / back discrimination device ;
Preparing a parent substrate;
First dividing the parent substrate along a plurality of first dividing lines parallel to each other to obtain a plurality of stick-like structures;
A spacer functioning as a mask is inserted between each of the plurality of stick-shaped structures, with the primary divided end surfaces appearing in the primary division in the same direction, and the front-side main surface and the back-side main surface of the spacer facing each other. A plurality of the stick-like structures are arranged in a state where each surface covers at least a part of each of the first and second main faces adjacent to the primary divided end face of the stick-like structure. And the process of
Forming a terminal electrode by performing dry plating toward the primary divided end faces of the plurality of stick-like structures arranged; and
A step of secondarily dividing each of the stick-like structures along a plurality of parallel second dividing lines orthogonal to the first dividing line to obtain a plurality of chip-like electronic components;
With
In the step of forming the terminal electrode, a main part of the terminal electrode is formed on the primary divided end face, and a part of at least one of the first and second main faces adjacent to the primary divided end face Forming an extension of the terminal electrode extending to
In the spacer, the extension dimension of the first extension portion on the first main surface of the terminal electrode is larger than the extension dimension of the second extension portion on the second main surface of the terminal electrode. In order to shorten, it has a shape that forms a notch along the edge of the backside main surface,
The step of arranging the plurality of stick-like structures includes a step of determining the front and back of the spacer, and a step of inserting only the spacer that is determined to be appropriate for the front and back between each of the plurality of stick-like structures. Prepared,
The step of performing the front / back discrimination of the spacer is performed using the front / back discrimination device with the spacer as the discrimination target,
A method for manufacturing a chip-shaped electronic component. 2. The chip according to claim 1, wherein the front / back discrimination table has a side wall surface rising from the placement surface, and the discrimination target is positioned by a part of an outer surface thereof coming into contact with the side wall surface. Method for manufacturing an electronic component .

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