JP4535409B2 - Spinner - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a spinner as a spin coater used for uniformly applying a coating solution to a plate-shaped object.
[0002]
[Prior art]
In general, a spinner has a chuck for fixing an object to be applied such as an air chuck capable of vacuum suction at one end of a rotating shaft, and the object to be applied is fixed to the chuck. Then, the coating liquid is stored in a separate tank for feeding liquid, and a certain amount of coating liquid is discharged by adjusting the open / close time of the solenoid valve and dropped onto the coated body. By spreading the dropped coating solution on the surface of the substrate by centrifugal force, it is suitable for coating on relatively small plate-like materials. It is often used for the above.
[0003]
Conventionally, as one of electronic components and optical components, there is a composite substrate having a structure in which the surface of a substrate on which various functional films are attached is covered with a thin cover plate such as a glass plate or a film. In order to manufacture such a composite substrate, for example, the substrate and the thin plate are overlapped with an adhesive, and then sandwiched between a pair of plates having high flatness, and the thickness of the adhesive layer is increased to a predetermined thickness. A method has been employed in which the adhesive is cured under pressure. However, with this method, the adhesive protrudes from between the stacked substrates and the thin plate and wraps around the surface that is not related to the adhesion of the substrate or thin plate, so that it is difficult to reuse a highly flat plate used for pressurization. In addition, the accuracy of controlling the thickness of the adhesive layer is insufficient, and it is difficult to pressurize each portion with a constant pressure. Furthermore, since the pressure is applied by the pressure plate, there is a problem that the degree of adhesion is increased and peeling is not easy.
[0004]
Therefore, the substrate is mounted on a vacuum chuck of a spinner, a liquid adhesive is dropped on the substrate, a thin plate such as glass is overlaid on the substrate, and the adhesive is spread over the entire surface by air blowing, and then A method has been proposed in which a spinner is rotated to disperse excess adhesive to bring them into close contact, and then the composite substrate is detached from the vacuum chuck (see, for example, JP-A-55-68040).
[0005]
Although this method can substantially eliminate the drawbacks of the conventional technology, it has been found that the composite substrate produced by this method has a defect that the smoothness of the surface covered with the thin plate is poor. Yes. The reason is that unless the substrate is polished, there is a variation in thickness and the flatness is insufficient, such as glass or film on this substrate or other layers formed on it. This is because when the thin plate is pasted, the thickness unevenness of the lower substrate becomes the unevenness of the surface of the thin plate which is the outermost surface as it is.
[0006]
Therefore, when covering the surface of the substrate to which the functional film has been attached with a thin plate for the cover, the applicant has filed the following method for the purpose of eliminating the unevenness of the thin plate surface as much as possible. (Japanese Patent Application No. 10-340275). That is, a step of fixing a surface plate having a flat surface with improved flatness on a chuck for fixing an object to be coated of a spin coater with the flat surface side facing upward, and a thin plate for coating is placed on the surface plate A step of dropping the adhesive liquid onto the thin plate, placing the functional film on the dropped adhesive and placing the functional film on the lower side, and And a step of removing the surplus portion of the adhesive in the order described by rotating the chuck for fixing the object to be coated.
[0007]
In this method, contrary to the technique described in Japanese Patent Laid-Open No. 55-68040, the thin plate is placed on the lower side, but if it is fixed as it is with an air chuck, it will be bent or damaged, so that flatness is improved. The surface plate is first fixed with an air chuck, etc., and the thin plate is brought into close contact with the surface plate to ensure the flatness of the thin plate on the side in contact with the surface plate, and bonded to the opposite side of the thin plate. By stacking a thick substrate through an agent, a fatal defect of a conventional method is solved.
[0008]
[Problems to be solved by the invention]
In the latter manufacturing method described above, the spinner is not used only for applying the adhesive, but is also used for laminating the thin plates and controlling the thickness of the adhesive. Then, when the substrate is stacked on the adhesive dripped on the thin plate and the air chuck is rotated at a high speed, the adhesive spreads to the periphery between the thin plate and the substrate, and the thickness of the adhesive is reduced accordingly. Although the adhesive protrudes from the surroundings, the excess adhesive that protrudes is shaken off by centrifugal force. At this time, the inside of the spinner's handling is sucked from below, and air flows in from the upper opening and flows downward, but the adhesive swung away by centrifugal force is around Part of the splatters adheres to the wall surface of the housing, but part of the mist moves slightly in the housing, and a part of it moves around and adheres to the upper surface of the substrate. Thus, if an adhesive adheres to the part which will finally become the back surface of a substrate, it will become defective as a product.
[0009]
Note that such a wraparound phenomenon is also a problem with the technique described in Japanese Patent Laid-Open No. 55-68040.
[0010]
The present invention has been made in view of such circumstances, and is to provide a spinner that does not cause defects by devising so that the liquid of the adhesive that bonds the two plates does not wrap around the upper surface. is there.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the spinner of the present invention has a chuck for fixing an object to be coated at the upper end of a rotating shaft, and the chuck is installed in a housing having an open top, and is placed on the chuck. In a spinner that rotates a fixed plate-shaped object to be coated on the surface of the object by centrifugal force by rotating it in the housing, air flows from the upper side and moves downward. The housing is sucked from below so as to generate an airflow flowing into the housing, and the lid is arranged in the housing so that it opens near the center of the substrate and is positioned at a narrow interval above the periphery only. by setting, as come flows air from above through the gap between the lid and the member to be coated, and the lid as the coating liquid scattered by spun off by centrifugal force does not flow back through the gap It is characterized by setting the distance between the coating member.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a schematic configuration diagram showing a preferred example of the spinner according to the present invention in its use state.
[0013]
In FIG. 1, reference numeral 1 denotes a rotating shaft, which has an air chuck 2 capable of vacuum suction at the upper end thereof, to which an object to be coated is fixed. Then, the coating liquid is stored in another liquid feeding pressure tank (not shown), and a predetermined amount of the coating liquid is ejected and dropped onto the coated body by adjusting the opening / closing time of the electromagnetic valve. ing. And it is comprised so that the dripped coating liquid may be spread on the to-be-coated body surface with a centrifugal force by rotating the rotating shaft 1 at high speed after dripping. Reference numeral 2a denotes pins provided at four corners around the upper surface of the air chuck 2 so that the object to be coated does not come off the air chuck 2 during rotation.
[0014]
The air chuck 2 is installed in a housing 3 whose upper part is open. When the spinner is in operation, the inside of the hanging 3 is sucked from below in order to prevent the coating liquid from splashing outside. An airflow is generated by flowing in air from the opening of the airflow. As a feature of the present invention, the lid 4 is disposed on the housing 3 so as to be positioned at a narrow interval above only the peripheral portion of the object to be coated.
[0015]
Here, the method of using the spinner will be described by taking the manufacturing procedure of the composite substrate described in the prior art as a specific example. Refer to FIG. 2 for this description.
[0016]
First, as shown in FIG. 2A, a surface plate 11 is fixed on an air chuck 2 which is a chuck for fixing an object to be coated installed in a rotary coating machine. The surface plate 11 may be fixed by means other than vacuum suction, such as mechanically. The front surface of the surface plate 11, that is, the surface opposite to the surface fixed by the air chuck 2, is processed into a flat surface with improved flatness. Specifically, it is preferable to use a material having a flatness of 0.5 μm or less and a material such as quartz glass. The high flatness of the surface plate 11 in this way means that the flat surface of the product after bonding is created, and the thin plate is in contact with anything other than the surface plate by fixing the thin plate by adhesion. Therefore, there is no need to apply extra stress to the thin plate during the rotation, and the two roles of stable rotation can be obtained.
[0017]
Next, as shown in FIG. 2B, a thin plate 12 for covering is placed on the fixed surface plate 11 and brought into close contact therewith. In order to bring the thin plate 12 into close contact with the surface plate 11, it is only necessary to place the thin plate 12 on the flat surface of the surface plate 11 without any intervention. The size of the thin plate 12 is preferably the same as or slightly larger than the area of the surface plate 11 so that the adhesive does not enter the surface plate 11. Moreover, when a repair agent etc. are used for the surface plate 11, you may make it smaller than a surface plate. When the thin plate 12 is positioned and a part of the end contacts, vacuum contact is performed between the thin plate 12 and the surface plate 11. Or you may use air blow etc. together. In addition, when sticking is poor, an appropriate amount of a volatile organic solvent may be interposed. Note that both the surface plate 11 and the thin plate 12 are cleaned and are used in a clean bench having a high cleanliness in a clean room in order to prevent foreign matters and the like from being mixed during bonding.
[0018]
When the thin plate 12 is placed and brought into close contact with the surface plate 11 in this way, the surface of the surface plate 11 has high flatness, so that the thin plate 12 in close contact therewith has some deflection in the thin plate itself. However, it is corrected by the surface plate 11, and the lower surface of the thin plate 12, that is, the surface in contact with the surface plate 11 has the flatness of the surface plate 11. Here, since the adhesion is improved when the thin plate 12 is charged, it is preferable to increase the reliability of the chuck, but on the contrary, in the case of dust suction or electronic parts, there is a risk of adverse effects due to charging, If there is such a concern, remove the charge beforehand.
[0019]
Next, an appropriate amount of an adhesive is dropped on the thin plate 12 that is in close contact with the surface plate 11. The adhesive is in a liquid feed tank whose temperature is controlled, and the discharge amount is controlled by opening and closing the electromagnetic valve. When the liquid adhesive is dropped by a dispenser or the like, discharge conditions are set so that the amount is sufficient and not excessive for bonding, and care is taken so that bubbles do not enter. After dripping the adhesive, a substrate 14 having functionality is placed on the adhesive 13 as shown in FIG.
[0020]
The substrate 14 used here has a functional film 15 laminated on one side thereof. Then, when the substrate 14 is placed on the dropped adhesive 13 with the functional film 15 facing down, the adhesive 13 between the thin plate 12 and the substrate 14 gradually moves around by the weight of the substrate 14. It spreads.
[0021]
Subsequently, the spinner is rotated in the state shown in FIG. At this time, the planar positional relationship between the lid 4 of the housing 3 and the substrate 14 on the air chuck 2 is as shown in FIG. 3, and the lid 4 rotates in the direction of the substrate 14 as indicated by the hatched portion. Even so, the surrounding area is covered. When the air chuck 2 is rotated by the rotary shaft 1 in this state, the adhesive 13 spreads to the periphery between the thin plate 12 and the substrate 14, and the thickness of the adhesive decreases accordingly, and the excess adhesive that protrudes from the periphery. 13 is swung away to the periphery without contaminating the back surface of the substrate 14 or the surface plate 11 by centrifugal force. At this time, the inside of the housing 3 is sucked from below, and air flows from the upper opening to flow downward, and since there is a lid 4 above, it is shaken off by centrifugal force. A part of the adhesive scattered around is adhered to the wall surface of the housing 3, and the rest flows downward without flowing upward of the housing 3. That is, since air flows from above through a narrow gap between the lid 4 and the substrate 14, the scattered adhesive does not flow around the back side of the substrate 14 against this air flow.
[0022]
After rotation end of the spinner, as shown in FIG. 2 (d), thin 12 and substrate 14 are laminated via a uniform layer of adhesive 13. If the adhesive 13 is ionizing radiation curable, the adhesive is cured by irradiating ionizing radiation (for example, ultraviolet rays, electron beams, etc.) in this state.
[0023]
After the adhesive 13 is cured, the substrate 14 is peeled from the surface plate 11. At the time of peeling, it is preferable to use an air blow or a separator made of reinforced plastic (peeling jig) or the like so as not to damage the glass. At this time, since the interface between the surface plate 11 and the thin plate 12 is only in vacuum contact, it can be easily peeled off.
[0024]
Through the above steps, a composite substrate in a good state in which no adhesive is attached to the back surface of the substrate 14 is manufactured. And the final product is obtained by cutting off the substrate of the portion where the functional film 15 is pasted by dicing.
[0025]
【The invention's effect】
As described above, according to the present invention, the chuck for fixing the object to be coated is provided at the upper end of the rotating shaft, and the chuck is installed in the housing that is open at the top, and is mounted and fixed on the chuck. In a spinner that spreads the coating liquid dropped on the coated body on the surface of the coated body by centrifugal force by rotating the plate-shaped coated body in the housing, air flows from the upper side to the lower side during operation. through the housing so the air flow is generated so as to suction from below to flow, disposing a cover on the housing so as to be positioned at a narrow spacing above the only peripheral portion with an opening in the vicinity of the center portion of the medium to be coated In this way, air flows from above through the gap between the lid and the object to be coated, and the coating liquid spattered and scattered by centrifugal force does not flow back through the gap between the lid and the object to be coated. By setting the, when bonding two plate members with a liquid adhesive using the same, since the liquid of the adhesive does not go around to the upper surface of the product, the bonding is performed without producing defective Can do.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram showing a preferred example of a spinner according to the present invention in its use state.
FIG. 2 is a manufacturing process diagram of a composite substrate used for explaining the present invention.
FIG. 3 is a plan view showing a positional relationship between a lid of a housing and a substrate on an air chuck.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Rotating shaft 2 Air chuck 2a Pin 3 Housing 4 Cover 11 Surface plate 12 Thin plate 13 Adhesive 14 Substrate 15 Functional film

Claims (2)

There is a chuck for fixing the object to be coated at the upper end of the rotating shaft. The chuck is installed in a housing that is open at the top , and the plate-shaped object to be mounted and fixed on the chuck is rotated in the housing. In the spinner that spreads the coating liquid dropped onto the coated body by centrifugal force on the surface of the coated body , the inside of the housing is lowered so that air flows from above and flows downward during operation. gap between so as to suction, by disposing the lid on the housing so as to be positioned at a narrow spacing above the only peripheral portion with an opening in the vicinity of the center portion of the medium to be coated, lid and member to be coated from through was to come flows air from above, the coating liquid scattered by spun off by centrifugal force, characterized in that sets the interval of the lid and the medium to be coated so as not to flow back gap spinner .   The substrate on which the functional film is pasted and the cover thin plate are overlapped with an adhesive, and this overlapped and integrated body is fixed to the chuck as an object to be coated and rotated to scatter excess adhesive. The spinner according to claim 1, wherein the spinner is used to manufacture a composite substrate by bringing them into close contact with each other.

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