JP4502157B2 - Composite substrate manufacturing method and composite substrate manufactured thereby - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention belongs to the technical field of a substrate having an optical functionality such hologram replicating precursor, particularly, a plurality of functional substrate is polygonal with on a transparent substrate, a transparent thereon another The present invention relates to a method of manufacturing a composite substrate having a structure covered with a sheet.
[0002]
[Prior art]
In the manufacturing process of an optical product, a substrate provided with various functions and having a transparent sheet such as a thin glass sheet coated thereon may be used. As a typical one, there is a hologram master, and a reflection or transmission hologram is duplicated from the hologram master. When performing this duplication, in order to increase the duplication efficiency, a plurality of hologram masters having the same characteristics are arranged in parallel (multi-faceted). In this case, the hologram masters having the same characteristics are precisely placed on the same plane. It is necessary to arrange and fix to.
[0003]
Conventionally, the following method is known as a method for producing the above-described multi-sided hologram master. That is, the hologram original plate is arranged and fixed on a vacuum chuck of a spin coater called a spinner, an adhesive is dropped from above, and a transparent substrate having another flat surface is stacked on the adhesive. after removal of excess adhesive rotary applicator is rotated in the state, the adhesive is cured at the adhesive layer became a desired thickness, and finally by releasing the suction of the vacuum chuck hologram duplication master How to get.
[0004]
[Problems to be solved by the invention]
Compared with the method in which the adhesive layer is sandwiched between a pair of highly flat plates and pressurized until the adhesive layer has a predetermined thickness, and the adhesive is cured in that state, the substrate is soiled and bonded by excess adhesive. Although excellent in terms of controlling the thickness of the agent, there are the following problems.
(1) Since vacuum adsorption is used, there is a possibility of distortion if the functional substrates to be arranged are thin.
(2) The dropped adhesive wraps around the array substrate and enters the vacuum suction opening, which may make it difficult to reuse.
(3) There is nothing to coat on the array substrate after fabrication, and the adhesive is exposed around the array substrate, so that a solvent for dissolving the adhesive cannot be used. Will be limited. Also, the array substrate may be easily damaged and may not be usable.
[0005]
The present invention has been made in view of such problems, and its object is to have a structure in which a transparent sheet is coated on a plurality of functional substrates multi-faced on a transparent substrate. An object of the present invention is to provide a method for manufacturing a composite substrate, in which a composite substrate is manufactured, and even when the functional substrates to be arranged are thin, the composite substrate is not distorted and the thickness is uniform.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a method for producing a composite substrate according to the present invention is characterized by sequentially performing the steps described in the following (1) to (8).
(1) A surface plate having a flat surface with improved flatness is fixed on a workpiece fixing chuck of a spin coater with the flat surface side facing up, and a transparent sheet for coating is placed on the surface. The process of making it the state which is doing.
(2) The process of dripping the liquid of an adhesive agent on the transparent sheet stuck on the surface plate.
(3) A step of stacking a transparent substrate for tiling, in which a functional substrate is aligned in a central groove, on the dropped adhesive with the functional substrate facing down.
(4) A step of temporarily curing the adhesive after rotating the chuck for fixing the adherend to remove an excess portion of the adhesive.
(5) A step of removing the tiling transparent substrate while leaving the aligned functional substrate, and then dropping an adhesive liquid onto the aligned functional substrate.
(6) A step of fixing another transparent substrate having a flat surface on the adhesive with the flat surface side down.
(7) A step of rotating the chuck for fixing the object to be coated and removing an excess portion of the adhesive, and then curing the adhesive.
(8) A step of peeling between the flat surface side of the surface plate and the covering transparent sheet.
[0007]
And it is preferable to use an ionizing radiation-curable adhesive as the adhesive and to cure it by irradiation with ionizing radiation.
[0008]
Further, as the tiling transparent substrate, it is preferable to use a transparent substrate in which the side surface of the groove is tapered outward.
[0009]
According to the above method, a hologram duplication master comprising a plurality of hologram masters having the same characteristics as a plurality of functional substrates arranged in parallel on a transparent substrate via an adhesive, and further covered with a transparent sheet. Is manufactured.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, a spin coater called a spinner is used for applying the adhesive. The spinner has an air chuck capable of vacuum suction at one end of a rotating shaft, and an object to be coated is fixed to the air chuck. Then, the coating liquid is stored in a separate tank for feeding liquid, and a certain amount of coating liquid is discharged by adjusting the open / close time of the solenoid valve and dropped onto the coated body. By spreading the dropped coating solution on the surface of the substrate by centrifugal force, it is suitable for coating on relatively small plate-like materials. It is often used for the above. In the present invention, such a spinner is not only used for application of an adhesive, but also used for bonding a transparent sheet and controlling the thickness of the adhesive.
[0011]
1 and 2 are process diagrams showing a manufacturing procedure of a composite substrate according to the present invention, and an embodiment of the present invention will be described below with reference to these drawings.
[0012]
First, as shown in FIG. 1 (a), a surface plate 2 having a flat surface with improved flatness is fixed on an air chuck 1, which is a chuck for fixing an object to be coated, installed in a spin coater. Then, the transparent sheet 3 such as thin glass is stuck on the flat surface in a vacuum contact state without any intervention. Alternatively, the transparent sheet 3 may be stuck on the surface plate 2 in a vacuum contact state without any intervention, and this may be fixed to the air chuck 1 with the transparent sheet 3 side up. Here, the close contact of the transparent sheet 3 to the surface plate 2 is performed in a clean bench having a high cleanliness in a clean room in order to prevent foreign matters from being mixed at the time of pasting, using both washed sheets. If the sticking is poor, an appropriate amount of a volatile organic solvent may be used. The surface plate 2 may be approximately the same size as the transparent sheet 3 in order to prevent warping of the transparent sheet 3, or may be slightly smaller in consideration of releasability and wrapping of the adhesive into the surface plate 2.
[0013]
When the transparent sheet 3 is brought into close contact with the surface plate 2 in this way, the surface of the surface plate 2 has high flatness, so that the transparent sheet 3 in close contact therewith has some deflection in the transparent sheet itself. The surface plate 2 is corrected so that the lower surface of the transparent sheet 3, that is, the surface in contact with the surface plate 2 has the flatness of the surface plate 2. Here, if the transparent sheet 3 is charged, the adhesion is improved, which is preferable in increasing the reliability of the chuck, but in the case of dust suction or electronic parts, there is a risk of adverse effects due to charging, If there is such a concern, remove the charge beforehand.
[0014]
On the other hand, as shown in FIG. 3, a tiling transparent substrate 5 is prepared, and functional substrates 6 are arranged in the grooves without any gaps. The tiling transparent substrate 5 has a wide groove at the center, and the bottom surface 5a of the groove is a flat surface. And it is desirable that the peripheral side surface 5b of the groove has an outwardly tapered shape. In this way, all the functional substrates 6 are pressed against the bottom surface 5a during spinning and do not jump to the periphery, and at the same time, an excess adhesive. Becomes easier to fly to the periphery.
[0015]
Next, as shown in FIG. 1 (b), an appropriate amount of adhesive 4 is dropped on the transparent sheet 3, and then, as shown in FIG. 1 (c), the transparent substrate 5 for tiling in FIG. With the conductive substrate 6 side down, the substrate is placed on the dropped adhesive 4 and stacked, and the natural standing by the weight of the tiling transparent substrate 5 is performed for several minutes. The adhesive 4 is dropped by using a dropper, a dispenser, or the like while taking care not to mix bubbles. Since the temperature of the adhesive is controlled, the viscosity can be kept constant. Moreover, it is desirable to perform the work in an environment where the temperature is effective so that the temperature of the glass used is constant.
[0016]
When the adhesive 4 has spread to the periphery, as shown in FIG. 1 (d), the surface plate 2, the transparent sheet 3, the adhesive 4 and the tiling transparent substrate 5 on the air chuck 1 are integrated with a spinner. Rotate. Due to the rotation of the spinner, the adhesive 4 reaches the periphery between the transparent sheet 3 and the tiling transparent substrate 5, and the thickness of the adhesive 4 decreases accordingly, and the excess adhesive 4 protruding from the periphery is centrifuged. It is swung away around the back surface of the tiling transparent substrate 5 and the surface plate 2 by force. The spinner is rotated until the desired film thickness is obtained between the transparent sheet 3 and the functional substrate 6. The end surface of the surface plate 2 and the tiling transparent substrate 5 is supported by the support pins 8 so as not to fly during this rotation. Moreover, since the surface plate 2 is adsorbed by vacuum suction and bends when the thickness is small, it is preferable that the surface plate 2 has a certain thickness. The thickness of the adhesive 4 can be controlled by adjusting the number of rotations, the rotation time, the viscosity of the adhesive, the standing time after placing the substrate, and the like. Since the spinner rotates at a high speed, it is desirable to add a slope to the high speed, and after the desired film thickness is obtained, it is preferable to gradually reduce the rotation by attaching a slope.
[0017]
After completion of the spinner rotation, the transparent sheet 3 and the tiling transparent substrate 5 are laminated through a uniform adhesive 4 layer. When an ionizing radiation curable material is used for the adhesive 4, the adhesive is temporarily cured by irradiating ionizing radiation (for example, ultraviolet rays, electron beams, etc.) in this state. In this case, the ionizing radiation may be irradiated from the end surface of the tiling transparent substrate 5 by the irradiation device 9 while rotating the air chuck 1 at a low speed as shown in FIG.
[0018]
After the adhesive 4 is temporarily cured by irradiation with ionizing radiation, the tiling transparent substrate 5 is peeled off from the surface plate 2 as shown in FIG. At the time of peeling, it can be pulled away by blowing an air blow on the inclined portion of the peripheral side surface 5b of the groove, or inserting a reinforced plastic separator (peeling jig) or the like so as not to damage the glass.
[0019]
After peeling the transparent substrate 5 for tiling, as shown in FIG. 2 (b), an appropriate amount of the adhesive 4 is dropped again, and then, as shown in FIG. The transparent substrate 7 is stacked with its flat surface down. Then, after standing for a few minutes so that the adhesive 4 spreads over the entire surface, as shown in FIG. 2 (d), the air chuck 1 is rotated so that the excess adhesive 4 is blown to the periphery. Is rotated until a desired film thickness is obtained. After the rotation, if the adhesive 4 is ionizing radiation curable, the adhesive is cured by irradiating ionizing radiation (for example, ultraviolet rays, electron beams, etc.) from above the surface plate 2 by the irradiation device 10. After the curing is completed, the surface plate 2 and the transparent sheet 3 are separated using a separator, and the composite substrate covered with the transparent sheet 3 is completed.
[0020]
【Example】
First, AL glass manufactured by Asahi Glass Co., Ltd. (thermal expansion coefficient: 37 × 10 ⁻⁷ / ° C., thickness: 6.35 mm, 140 mm □, flatness: 5 μm or less) is prepared as a platen, and thin glass ( “AF45” manufactured by SCHOTT Co., Ltd .: thermal expansion coefficient 45 × 10 ⁻⁷ / ° C., thickness 100 μm, 140 mm □) was prepared. Then, this thin glass was stuck to the surface plate in a vacuum contact state without any intervention, and fixed to the spin chuck air chuck with the thin glass side facing up.
[0021]
On the other hand, a transparent substrate for tiling as shown in FIG. 3 (thickness 6.35 mm, size 140 × 140 mm glass plate, groove size 125 × 80 mm, groove depth 0.9 mm, side tilt angle 45 deg) Was prepared, and dozens of hologram masters were arranged in the groove without any gaps.
[0022]
Next, 3 g of ionizing radiation curable adhesive (“Noland 65” manufactured by Norland) was dropped on the thin glass plate, and the transparent substrate for tiling was placed on the hologram original plate side downward from the dropped adhesive. Overlaid in the state.
[0023]
Subsequently, the spinner was rotated at high speed. The number of rotations was 3800 rpm, and the rotation time was 60 seconds. As a result, the adhesive spread to the periphery between the transparent sheet and the transparent substrate for tiling, and the thickness of the adhesive decreased accordingly, and surplus adhesive that protruded from the periphery was shaken off to the periphery by centrifugal force.
[0024]
After the rotation of the spinner was completed, ultraviolet irradiation was performed to temporarily cure the adhesive between the thin plate glass and the hologram original plate. For this temporary curing, a UV irradiation apparatus (handy UV 800, 100 mW / cm ² ) manufactured by Oak Co. was used, and irradiation was performed for 60 seconds from the end face of the substrate.
[0025]
After the adhesive was temporarily cured, air blow was sprayed on the inclined portion of the groove side surface of the tiling transparent substrate, and the tiling transparent substrate and the hologram original plate were peeled off.
[0026]
Subsequently, 4 g of ionizing radiation curable adhesive (“Noland 65” manufactured by Norland) was dropped again, and another transparent substrate (quartz having a thickness of 6.35 mm and a size of 140 × 140 mm) was formed on the dropped adhesive. The plates were stacked with the flat side down. And after standing naturally until the adhesive spread throughout, the air chuck was rotated and the excess adhesive was blown to the periphery. When the desired film thickness was reached, the rotation was terminated, followed by UV irradiation. For UV curing, a UV irradiation device (handy UV 800, 100 mW / cm ² ) manufactured by Oak Co. was used, and irradiation was performed for 30 seconds with uniform irradiation from above the surface plate.
[0027]
After completion of the main curing, the platen and the thin glass were separated using a separator to obtain a hologram duplication master coated with the thin glass.
[0028]
【The invention's effect】
As described above, according to the composite substrate manufacturing method of the present invention, when a composite substrate having a structure in which a transparent sheet is coated on a plurality of functional substrates multi-faced on a transparent substrate is bonded. By using the spinner for bonding with the agent, the film thickness of the adhesive between the transparent sheet and the functional substrate and between the functional substrate and the transparent substrate can be made uniform and thin. In addition, when the transparent sheet and functional substrate are bonded with an adhesive, the spinner is rotated while aligned in the groove of the transparent substrate for tiling. Even in such a case, the functional substrate can be easily realized without being broken, and the apparatus is not so large. Further, since the functional substrate is not directly sucked by vacuum suction, even when the functional substrate is thin, it is not distorted.
[Brief description of the drawings]
FIG. 1 is a process diagram of the first half showing a manufacturing procedure of a composite substrate according to the present invention.
FIG. 2 is a process chart of the latter half showing the manufacturing procedure of the composite substrate according to the present invention.
FIG. 3 is a perspective view of a transparent substrate for tiling in which functional substrates are arranged, and a partially enlarged sectional view thereof.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Air chuck 2 Surface plate 3 Transparent sheet 4 Adhesive 5 Transparent substrate for tiling 6 Functional substrate 7 Transparent substrate 8 Support pins 9, 10 Irradiation device

Claims (4)

The manufacturing method of the composite board | substrate characterized by performing each process as described in following (1)-(8) in order.
(1) A surface plate having a flat surface with improved flatness is fixed on a chuck for fixing an object to be coated of a spin coater with the flat surface side facing up, and a transparent sheet for coating is placed on the surface. The process of making it the state which is doing.
(2) A step of dripping an adhesive liquid onto a transparent sheet in close contact with the surface plate.
(3) A step of stacking a transparent substrate for tiling formed by aligning a functional substrate in a central groove on the dropped adhesive with the functional substrate facing down.
(4) A step of temporarily curing the adhesive after rotating the chuck for fixing the workpiece and removing the excess portion of the adhesive.
(5) A step of dropping an adhesive liquid onto the aligned functional substrate after removing the tiling transparent substrate leaving the aligned functional substrate.
(6) A step of fixing another transparent substrate having a flat surface on the adhesive with the flat surface side down.
(7) A step of rotating the chuck for fixing the object to be coated and removing an excess portion of the adhesive, and then curing the adhesive.
(8) A step of peeling between the flat surface side of the surface plate and the covering transparent sheet. The method for producing a composite substrate according to claim 1, wherein an ionizing radiation curable adhesive is used and the curing is performed by irradiation with ionizing radiation. The method for manufacturing a composite substrate according to claim 1 or 2, wherein a transparent substrate having a tapered side surface of the groove extending outward is used as the transparent substrate for tiling. A composite substrate manufactured by the method according to any one of claims 1 to 3, wherein a plurality of hologram masters having the same characteristics as a plurality of functional substrates are arranged in parallel on a transparent substrate via an adhesive, A composite substrate, further comprising a hologram duplication master coated with a transparent sheet thereon.

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