JP4498502B2 - Manufacturing method of substrate covered with thin plate and manufacturing apparatus thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a substrate covered with a thin plate by bonding another substrate such as thin glass or a film to the substrate bonded with an optical film or the like via an adhesive. .
[0002]
[Prior art]
In the manufacture of electronic components and optical components, a substrate with various functions coated with thin glass is used. Conventionally, in order to manufacture a substrate coated with a thin plate, for example, after the substrate and the thin plate are overlapped with an adhesive, the substrate is sandwiched between a pair of flat plates, and the thickness of the adhesive layer is set to a predetermined thickness. The adhesive was cured until it was. However, with this method, the adhesive that protrudes between the stacked substrate and thin plate goes around the surface that is not related to the adhesion of the substrate or thin plate, so the plate with high flatness used for pressurization is reused. In addition to causing problems, the accuracy of controlling the thickness of the adhesive layer is insufficient, and the larger the parts, the more difficult it is to keep the pressure at each part constant. Further, since the pressure is applied by the pressure plate, there is a disadvantage that the degree of adhesion is increased and the pressure plate and the composite substrate are not easily separated.
[0003]
On the other hand, the substrate is mounted on a vacuum chuck of a spinner, a liquid adhesive is dropped, a thin glass sheet is overlaid thereon, and the adhesive is spread over the entire surface by air blowing, and then the spinner is rotated. Then, a method was considered in which excess adhesive was scattered to bring them into close contact and removed from the vacuum chuck. (Japanese Patent Laid-Open No. 55-68040)
[0004]
Although this method has substantially eliminated the drawbacks of the prior art, it has been found that the composite substrate produced by this method has built-in defects. That is the poor flatness of the surface covered with thin glass.
The reason is that, unless the substrate is polished, the thickness varies and the flatness is insufficient, and a thin glass sheet or the like is pasted on this or another layer formed on this. When combined, the thickness unevenness of the lower substrate becomes unevenness on the surface of the thin plate which is the outermost surface almost as it is.
[0005]
In the above method, after the adhesive is dropped on the substrate, bubbles are likely to be mixed between the thin glass or the substrate and the adhesive when the thin glass is laminated, and the thickness unevenness due to the bubbles is caused on the outermost surface. High precision parts cannot be obtained due to unevenness of the surface of the thin plate.
[0006]
[Problems to be solved by the invention]
Therefore, the problem in the present invention is that a method for producing a substrate covered with a thin plate, in which unevenness on the surface of the thin plate, which occurs in a product when a thin plate is bonded to a substrate in which unevenness in thickness is unavoidable, is eliminated as much as possible, and its production To provide an apparatus.
[0007]
[Means for Solving the Problems]
In the present invention, in order to solve the above-mentioned problem, if a thin plate is directly fixed with an air chuck, it is bent or damaged. Therefore, a surface plate with improved flatness is first fixed with an air chuck or the like, and the surface plate is placed on the surface plate. By attaching the thin plate, the flatness of the thin plate on the side in contact with the surface plate is secured, and the substrate is placed on the opposite side of the thin plate with an adhesive, and the thin plate is placed with the upper chuck down. Lowering the adhesive layer and rotating the upper and lower chucks around one axis to remove the excess part of the adhesive, eliminating the fatal defects of the conventional method It is.
[0008]
That is, the invention of claim 1 is a step of fixing a platen having a flat surface with improved flatness on the upper part of the chuck for fixing the object to be coated of the spin coater with the flat surface side facing down, The step of closely attaching a coating thin plate to the flat surface side, the step of placing a substrate under the chuck for fixing the object to be coated, the step of dripping the adhesive liquid onto the substrate, and until the adhesive and the thin plate come into contact with each other, A step of lowering the upper part of the substrate fixing base and reducing the distance from the lower part, a step of rotating the upper part and the lower part uniaxially, removing an excess part of the adhesive while pressing the adhesive layer with the upper chuck; and The present invention relates to a method for manufacturing a substrate covered with a thin plate, which is performed in the order of description.
[0009]
Further, the invention of claim 2 is the adhesive according to claim 1, wherein the adhesive is curable, and after the step of removing the excess portion of the adhesive by rotating the workpiece fixing chuck, the adhesive is cured. The present invention relates to a method for manufacturing a substrate for performing a process.
The invention of claim 3 relates to a method for manufacturing a substrate according to claim 2, wherein the adhesive is ionizing radiation curable, and the curing step is performed by ionizing radiation irradiation.
[0010]
According to a fourth aspect of the present invention, in the first aspect, the upper part of the chuck for fixing the object to be coated is rotated in synchronization with the two axes by an axis different from the lower part of the chuck, thereby removing an excess portion of the adhesive. The present invention relates to a method for manufacturing a substrate to be removed.
Further, the invention of claim 5 is the invention described in claim 1, wherein the number of rotations of the transfer object fixing chuck is set so that the desired film thickness is obtained by the non-contact optical sensor for measuring the thickness of the adhesive layer. The present invention also relates to a substrate manufacturing method for adjusting the distance between the chuck upper portion and the chuck lower portion.
[0011]
A sixth aspect of the present invention is the manufacturing apparatus using the manufacturing method according to any one of the first to fifth aspects, wherein the surface plate and the coating thin plate are provided on the upper part of the chuck for fixing the object to be coated according to the first aspect. Adhering, fixing, and placing the substrate under the chuck for fixing the object to be coated, and dropping the adhesive liquid onto the substrate, until the bonding stage part and the adhesive and the thin plate are in contact with each other A lowering part that lowers the upper part of the body fixing base and shortens the distance from the lower part, a rotating part that rotates the upper part and lower part of the chuck around the axis, and a hardening process of the adhesive between the bonded substrate and the thin plate after the rotation is completed. The present invention relates to an apparatus for manufacturing a substrate covered with a thin plate, characterized in that an ionizing radiation irradiation unit is provided.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in more detail with reference to embodiments.
FIG. 1 to FIG. 5 are cross-sectional views of main parts for explaining a method and apparatus for producing a substrate covered with a thin plate of the present invention.
In the present invention, it is preferable to use a spin coater called a spinner for applying the adhesive. The spinner has an air chuck capable of vacuum suction at one end of the rotating shaft, and fixes the object to be coated. The coating liquid is stored in a separate pressurized tank, and a fixed amount of paint is discharged by adjusting the opening / closing time of the solenoid valve and dropped onto the coated body.After dropping, the rotating shaft is rotated at a high speed, It spreads paint applied by centrifugal force on the surface of an object to be coated, and is relatively often used for resist coating in the production of electronic parts and the like.
In the present invention, such a spinner is not merely used for the application of an adhesive, but the bonding of thin plates and the control of the thickness of the adhesive (thickness control will be described later, but the distance between the upper part and the lower part of the chuck). It is also used by adjusting.
[0013]
First, as shown in FIG. 1, the surface plate 4 is fixed to an air chuck upper part 5 made of aluminum or the like for fixing an object to be coated, which is installed in a spin coater. The surface plate 4 may be fixed by means other than vacuum suction, such as mechanically. The surface on the surface of the surface plate 4, that is, the surface opposite to the surface fixed with the air chuck is preferably a flat surface with improved flatness, and the flatness is 0.5 μm or less. Use quartz glass. When the flatness is improved in this way, the surface plate 4 and the thin plate 3 are in contact with each other without a gap in the thin plate 3 adhesion step, which will be described below, so that the adhesion is maintained without an operation that continues vacuum suction. Be drunk.
[0014]
In other words, because the flatness of the surface plate 4 is to create the flatness of the surface of the product after bonding, and the thin plate is fixed by close contact, the thin plate does not contact anything other than the surface plate 4, During the rotation, no additional stress is applied to the thin plate, and two roles are achieved in which stable rotation is obtained. Although the conventional air chuck does not consider the flatness at all, there is an opening for vacuum suction, so the object to be coated is sucked into the opening at that part, and the whole is convexly deformed upward There can be. In the present invention, a rigid surface plate is fixed with an air chuck in this respect, and the surface of the surface plate without an opening for vacuum suction is used.
[0015]
Although the size of the surface plate 4 is comparable to the size of the thin plate 3, the surface plate 4 is smaller than the thin plate 3 as shown in FIG. It is preferable because it is shaken off by the rotation of the coating machine, scatters, wraps around the back surface around the thin plate, adheres to the surface plate, and does not require the need for cleaning. On the other hand, if the surface plate 4 is too small, the ability to attach the thin plate 3 decreases, and the thin plate 3 that protrudes from the surface plate has nothing to regulate. This is because it may partially stick and flatness may be lowered. In that sense, the size of the surface plate 4 is preferably about 60 to 90% of the substrate of the coated body. Further, the surface plate 4 should be sufficiently thick so as not to be bent by fixing means such as an air chuck. As an example, the surface plate 4 for placing a thin glass plate of 65 mm × 65 mm and a thickness of 100 μm is 53 mm × 53 mm and a thickness of 6 mm. Incidentally, the size of the substrate is 65 mm × 65 mm and the thickness is 1.1 mm.
[0016]
When the thin plate 3 is brought into contact with the fixed surface plate 4 and brought into close contact therewith, means such as air blow is applied. Because of the close contact, the surface of the surface plate 4 maintains a high degree of flatness. Therefore, the thin plate 3 adhered to the surface plate 4 is corrected by the surface plate 4 even if the thin plate 3 itself is somewhat bent. The upper surface (illustrated) of the surface plate 4, that is, the surface in contact with the surface plate 4 has the flatness of the surface plate 4.
[0017]
FIG. 2 shows a state in which the substrate 1 is placed on the lower part 2 of the air chuck, and the adhesive 6 is dropped on the placed substrate 1. When the liquid adhesive 6 is dropped using a dispenser or the like, discharge conditions are set so that the amount is sufficient and not excessive for bonding, and care is taken so that bubbles do not enter.
FIG. 3 shows a state in which a surface plate 4 is fixed to the air chuck upper portion 5 shown in FIG. 1 and a thin plate for coating is in close contact with the surface plate 4 and is placed on the air chuck lower portion 2 shown in FIG. 2 shows a state in which the adhesive 6 dropped on the substrate 1 and the thin plate 3 are placed on top of each other. Although depending on the weight of the surface plate 4 and the air chuck upper part 5 to be stacked and the discharge amount of the adhesive 6, the adhesive spreads a little and the state shown in FIG.
[0018]
Subsequently, when the spinner is rotated at a high speed, the adhesive spreads to the periphery between the thin plate and the substrate, and the thickness of the adhesive decreases accordingly, and the excess adhesive protrudes from the surroundings. Shake off by force. At this time, the thickness of the adhesive can be controlled by adjusting the viscosity of the adhesive, the rotational speed with respect to the elapsed time (= rotational speed / minute), and the rotational time. Further, the thickness of the adhesive layer 6 is controlled by lowering the air chuck upper part 5 and adjusting the distance between the air chuck upper part 5 and the air chuck lower part 2.
Through the above steps, the thin plate and the substrate are laminated with the adhesive. FIG. 4 shows a stacked state.
[0019]
Depending on the type of adhesive, after that, the rotation is stopped, or after high speed rotation within a predetermined time, the rotation speed is reduced and the adhesive is thermosetting while rotating at a low speed. If there is, it is heated with a heater or hot air, and if the adhesive is ionizing radiation curable, the adhesive is cured by irradiating with ionizing radiation (for example, an electron beam or ultraviolet rays). In the subsequent process, it is necessary to peel off the integrated substrate and thin plate from the surface plate, so use an ionizing radiation curable adhesive as the adhesive and cure it sufficiently by irradiation with ionizing radiation. desirable.
After curing, the surface plate 4 and the thin plate surface are peeled off using a separator such as an air blow or a plastic spatula. In order to facilitate peeling by air blow or separator, if a chamfered part is formed around the surface of the surface plate 4 and a narrow slope is formed around it, stress for peeling is easily applied. good. FIG. 5 shows a laminated state of the substrate 1 covered with the thin plate 3 obtained by peeling in this manner.
[0020]
Next, in the apparatus for manufacturing a substrate coated with a thin plate of the present invention, as shown in FIG. 6A, the surface plate 4 and the covering thin plate 3 are adhered and fixed to the upper part 5 of the chuck for fixing the object to be coated. Then, the substrate 1 is placed on the lower part 2 of the chuck for fixing the object to be coated, and the bonding stage unit 7 is provided on which the liquid of the adhesive 6 is dropped on the substrate 1. Further, until the adhesive 6 and the thin plate 3 come into contact with each other, the upper part 5 of the object fixing base is lowered, and the lowering part 8 that shortens the distance from the lower part 2 and the chuck upper part 5 and the lower part 2 are rotated by the shaft 12. It has a rotating part 9. Moreover, as shown in FIG.6 (b), it has the structure which provided the ionizing radiation irradiation part 10 for performing the hardening process of the adhesive agent 6 between the board | substrate 1 and the thin plate 3 which were bonded after completion | finish of rotation.
[0021]
Further, in order to measure the thickness of the adhesive layer, the non-contact optical sensor 15 is sensed from a part of the opening of the air chuck upper portion 5 so that the adhesive layer 6 has a desired thickness. It is preferable to adjust the number of rotations of the transfer body fixing chuck and the distance between the upper and lower chucks.
Further, not only the air chuck upper part 5 and the lower part 2 are rotated by one axis 12, but the upper part 5 is rotated by the axis 12, and the lower part 2 is rotated by the axis 13 by the respective axes around the respective axes. The film thickness of the adhesive layer can be controlled with higher accuracy.
[0022]
The example implemented by the manufacturing method of this invention is shown below. In this method, a spin coater, which is commonly called a spinner, moves up and down as shown in FIG. 6A, and rotates integrally with a variable distance between the upper and lower portions. . The upper chuck 5 of the spinner has an air chuck capable of performing vacuum suction at one end of a rotating shaft. A flat plate (AL glass polishing product: manufactured by Asahi Glass Co., Ltd., thermal expansion coefficient 37 × 10), which is a flat sheet glass (AF45: manufactured by Schott, thermal expansion coefficient 45 × 10 ⁻⁷ / ° C., thickness 100 μm 140 mm □) ^-7 / ° C., thickness 6.35 mm, 140 mm □, flatness 0.5 μm or less) with nothing intervened in a vacuum contact state and fixed to the air chuck 5 with the thin plate side down. Both plates should be adhered to a flat surface plate in a clean bench in a clean room with a high degree of cleanliness in order to prevent foreign substances from entering during pasting. If sticking is poor, an appropriate amount of volatile organic solvent may be interposed. In order to prevent warping of the thin glass, the surface plate should have substantially the same area as the thin glass.
[0023]
Next, the substrate 1 is placed on the chuck lower portion 2 with the functional film layer facing up. At this time, the end surface of the substrate is supported by the support pins 14 so as not to fly during rotation. Alternatively, it may be adsorbed by vacuum suction, but may be deformed if the substrate is thin. It is desirable to put it in a state where no stress is applied.
A predetermined amount of the adhesive is dropped on the substrate 1 using a dropper or a dispenser while taking care not to allow air bubbles to enter the substrate 1. Since the temperature of the adhesive is controlled, the viscosity of the adhesive can be kept constant.
After dripping, the distance between the upper and lower chucks is reduced until the adhesive comes in contact with the surface of the thin glass, and at the same time, the distance between the chucks is further reduced while rotating. Skip the glue. The thickness of the adhesive layer can be controlled by changing the distance between the upper and lower chucks, the number of rotations of the chuck, the rotation time, and the like. In addition, an opening is provided in a part of the upper chuck 5, and the thickness of the adhesive layer is measured by a non-contact laser displacement sensor (Keyence LT8100) 15 through a surface plate from the opening. It is also possible to end the rotation.
[0024]
If the substrate and the thin plate are simply laminated, the adhesive that protrudes from the glass substrate and the thin plate will turn around and adhere to the surface plate. Not only is the finish beautiful, but the surface plate can be reused.
When the desired film thickness is obtained, the UV adhesive between the glasses has not yet been cured, so that UV irradiation (100 mW / cm ² ) is continuously performed without being eroded by the substrate or the like. Irradiation is performed by the UV irradiation apparatus 10 from the glass end surface while rotating the chuck at a low speed. Alternatively, it is possible to irradiate from above by making the upper material of a transparent material having flatness.
After the adhesive is cured by UV irradiation, the base plate and the bonded substrate can be easily separated using a tool such as an air blower or a separator.
[0025]
【The invention's effect】
According to the invention of claim 1, since the flatness of the surface plate corrects the flatness of the thin plate, a substrate coated with a thin plate having a high surface flatness can be produced.
According to the invention of claim 2, in addition to the effect of the invention of claim 1, since the adhesive is cured, the flatness formed on the surface by bonding can be stably maintained.
According to the invention of claim 3, in addition to the effect of the invention of claim 2, since the adhesive is cured in a very short time by irradiation with ionizing radiation, even if stress is generated by correcting the flatness of the thin plate, Since the curing is complete, it does not return.
[0026]
According to the fourth aspect of the present invention, it is possible to control the thickness of the adhesive layer with higher accuracy by rotating the upper and lower parts of the chuck for fixing the transfer body in synchronism with each other by another shaft.
According to the invention of claim 5, the thickness of the adhesive layer can be measured very accurately by using a non-contact type optical sensor, the number of rotations of the chuck for fixing the transfer object, and between the upper part of the chuck and the lower part of the chuck. By adjusting the distance, a uniform and smooth adhesive layer, that is, a substrate coated with a thin plate having a high surface flatness can be obtained.
[0027]
According to the invention of claim 6, in addition to the effects of any one of claims 1 to 5, the following effects can be exhibited.
(1) When the substrate and the thin plate are bonded together, the excess adhesive can be blown to the periphery of the chuck by rotating the chuck base, and the substrate and the surface plate are not soiled with the excess adhesive.
(2) Even when the functional film on the glass substrate is multifaceted, etc., and the substrate is enlarged, it is easy to realize and the apparatus is not so large.
(3) This manufacturing apparatus can control the viscosity of the adhesive by a heating / cooling device that keeps the adhesive temperature constant, and is easy to be mixed at the time of dropping by controlling the dropping amount by the discharge time when dropping the adhesive. There is no generation of bubbles and stable dripping can be realized.
(4) Since the film thickness of the adhesive layer can be measured during chuck rotation, a desired film thickness can be ensured with good reproducibility.
(5) Since the parallelism of the upper and lower chucks is obtained, the parallelism between the bonded substrate and the thin glass can be obtained with good reproducibility.
(6) When this manufacturing apparatus is used in a clean room or the like, a hepa filter is attached above the apparatus, so that contamination of the product during production is reduced compared to manual manufacturing.
(7) When the adhesive is cured, by monitoring the UV irradiation amount with the integrated light amount, it is possible to ensure a stable irradiation amount to the product without being affected by the deterioration of the UV lamp.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state where a surface plate and a thin plate are fixed to an upper portion of an air chuck.
FIG. 2 is a cross-sectional view showing a state where a substrate is placed under the air chuck and an adhesive is dropped on the substrate.
FIG. 3 is a cross-sectional view showing a state in which the surface plate and the thin plate fixed on the upper part of the air chuck overlap with the adhesive dropped on the substrate placed on the lower part of the air chuck, and the adhesive is spread a little. .
FIG. 4 is a cross-sectional view showing a state in which a thin plate and a substrate are stacked by being sandwiched and pressurized between the upper and lower air chucks and further rotated together with the chuck.
FIG. 5 is a cross-sectional view of a product obtained by the manufacturing method of the present invention.
FIG. 6 is a diagram for explaining the outline of the production apparatus of the present invention.
[Explanation of symbols]
1 Substrate 2 Lower chuck 3 Thin plate 4 Surface plate 5 Upper chuck 6 Adhesive (layer)
7 Bonding stage portion 8 Lowering portion 9 Rotating portion 10 Ionizing radiation irradiating portion 11 Upper and lower chuck alignment shafts 12, 13 Axis 14 Support pin 15 Non-contact optical sensor

Claims (6)

A step of fixing a surface plate having a flat surface with improved flatness on an upper part of a chuck for fixing an object to be coated of a spin coater with the flat surface side facing down, and a thin plate for coating on the flat surface side of the surface plate The step of adhering, the step of placing the substrate under the chuck for fixing the object to be coated, the step of dripping the liquid of the adhesive on the substrate, and the upper part of the substrate fixing base are lowered until the adhesive comes into contact with the thin plate. A step of reducing the distance from the lower portion, a step of rotating the upper portion and the lower portion uniaxially and pressurizing the adhesive layer with the upper chuck, and removing an excess portion of the adhesive in this order. A method of manufacturing a substrate coated with a thin plate. The adhesive is curable, and the adhesive fixing step is performed after the step of removing the surplus portion of the adhesive by rotating the workpiece fixing chuck. A method for producing a substrate coated with a thin plate as described in 1. The method for producing a substrate coated with a thin plate according to claim 2, wherein the adhesive is ionizing radiation curable, and the curing step is performed by ionizing radiation irradiation. 2. The thin plate according to claim 1, wherein an excess portion of the adhesive is removed by rotating the upper part of the chuck for fixing the object to be coated on a shaft different from the lower part of the chuck in synchronization with two axes. Of a substrate coated with Adjust the number of rotations of the transfer object fixing chuck and the distance between the chuck upper part and the lower part of the chuck so that the desired film thickness can be obtained by a non-contact optical sensor for measuring the thickness of the adhesive layer. The manufacturing method of the board | substrate coat | covered with the thin plate of Claim 1 characterized by the above-mentioned. In the manufacturing apparatus using the manufacturing method according to any one of claims 1 to 5, a surface plate and a coating thin plate are closely attached to and fixed to an upper part of a chuck for fixing an object to be coated according to claim 1, to be coated. Stand the substrate under the body fixing chuck, drop the adhesive liquid onto the substrate, lower the upper part of the object fixing base until the bonding stage part and the adhesive and the thin plate come in contact with each other, A lowering part that reduces the distance to the lower part, a rotating part that rotates the upper part and the lower part of the chuck around an axis, and an ionizing radiation irradiating part for performing a curing process of the adhesive between the bonded substrate and the thin plate after the rotation is completed; An apparatus for producing a substrate covered with a thin plate, characterized in that

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