JP4535126B2 - 電子部品 - Google Patents
電子部品 Download PDFInfo
- Publication number
- JP4535126B2 JP4535126B2 JP2007516213A JP2007516213A JP4535126B2 JP 4535126 B2 JP4535126 B2 JP 4535126B2 JP 2007516213 A JP2007516213 A JP 2007516213A JP 2007516213 A JP2007516213 A JP 2007516213A JP 4535126 B2 JP4535126 B2 JP 4535126B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- electronic component
- insulating layer
- shrinkage
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 94
- 230000002265 prevention Effects 0.000 claims description 43
- 238000000605 extraction Methods 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 122
- 239000000843 powder Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 16
- 239000011521 glass Substances 0.000 description 14
- 239000000919 ceramic Substances 0.000 description 13
- 238000010304 firing Methods 0.000 description 10
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 230000008602 contraction Effects 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005672 electromagnetic field Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Description
11 積層体
12 コイル
12A、12B 引き出し電極部
13A、13B 外部電極
16A 第1収縮ズレ防止部
16B 第2収縮ズレ防止部
111〜114 絶縁層
121〜124 導体パターン(導電層)
本実施例では、感光性導体ペーストとして例えば粒径3μmの銀粉末を含むものを準備し、感光性絶縁ペーストとしては、粒径3μmのセラミック粉末を含むもの準備した。このセラミック粉末は、主成分としてK2O−B2O3−SiO2系ガラス粉末を含み、副成分としてBi2O3−B2O3−SiO2系ガラス粉末を含んでいる。本実施例では、低融点ガラス粉末がセラミック粉末中に5wt%含まれている。そして、本実施例では、導体パターン層121〜124のコーナー部に第1収縮ズレ防止部16Aを有し、引き出し電極部12A、12Bに第2収縮ズレ防止16Bを有しない積層体11を作製し、第1収縮ズレ防止部16Aの効果を調べた。
本実施例では、実施例1の電子部品の引き出し電極部に第2収縮ズレ防止部を設けた以外は、実施例1の電子部品と同一要領で電子部品を作製した。そして、この電子部品の引き出し電極部と外部電極との接続状態を調べるために、導通試験を行い、その結果を表2に示した。また、比較例1の電子部品についても同一試験を行い、その結果を表1に示した。
Claims (5)
- 絶縁層が複数積層された積層体と、この積層体内に形成された少なくとも一つの導体パターン層と、を備え、上記導体パターン層は、複数個所に曲折部を有する電子部品であって、上記各曲折部それぞれに上記絶縁層内に食い込む第1収縮ズレ防止部を一体的に設け、且つ、上記各第1収縮ズレ防止部は上記各曲折部の領域内のみにそれぞれ形成されてなることを特徴とする電子部品。
- 上記第1収縮ズレ防止部は、絶縁層の厚さ方向の途中まで形成されてなることを特徴とする請求項1に記載の電子部品。
- 上記導体パターン層から延設された引き出し電極部を有し、上記引き出し電極部に上記絶縁層内に食い込む第2収縮ズレ防止部を一体的に設け、且つ、上記第2収縮ズレ防止部は上記引き出し電極部の領域内に形成されてなることを特徴とする請求項1または請求項2に記載の電子部品。
- 上記第2収縮ズレ防止部は、絶縁層の厚さ方向の途中まで形成されてなることを特徴とする請求項3に記載の電子部品。
- 上記導体パターン層が上記絶縁層を介して上下方向に複数形成され、且つ、上下の上記導体パターン層がビア導体によって互いに電気的に接続されてなることを特徴とする請求項1〜請求項4のいずれか1項に記載の電子部品。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005145393 | 2005-05-18 | ||
JP2005145393 | 2005-05-18 | ||
PCT/JP2006/303877 WO2006123467A1 (ja) | 2005-05-18 | 2006-03-01 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006123467A1 JPWO2006123467A1 (ja) | 2008-12-25 |
JP4535126B2 true JP4535126B2 (ja) | 2010-09-01 |
Family
ID=37431049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007516213A Expired - Fee Related JP4535126B2 (ja) | 2005-05-18 | 2006-03-01 | 電子部品 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4535126B2 (ja) |
WO (1) | WO2006123467A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023149168A1 (ja) * | 2022-02-03 | 2023-08-10 | ローム株式会社 | 回路部品、電子装置および回路部品の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197243A (ja) * | 1997-09-16 | 1999-04-09 | Tokin Corp | 電子部品及びその製造方法 |
JPH11288832A (ja) * | 1998-04-01 | 1999-10-19 | Ngk Spark Plug Co Ltd | 積層インダクタ部品及びその製造方法 |
JP2004207608A (ja) * | 2002-12-26 | 2004-07-22 | Tdk Corp | 積層型電子部品とその製造方法 |
-
2006
- 2006-03-01 JP JP2007516213A patent/JP4535126B2/ja not_active Expired - Fee Related
- 2006-03-01 WO PCT/JP2006/303877 patent/WO2006123467A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1197243A (ja) * | 1997-09-16 | 1999-04-09 | Tokin Corp | 電子部品及びその製造方法 |
JPH11288832A (ja) * | 1998-04-01 | 1999-10-19 | Ngk Spark Plug Co Ltd | 積層インダクタ部品及びその製造方法 |
JP2004207608A (ja) * | 2002-12-26 | 2004-07-22 | Tdk Corp | 積層型電子部品とその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006123467A1 (ja) | 2006-11-23 |
JPWO2006123467A1 (ja) | 2008-12-25 |
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