JP4530789B2 - Circuit board manufacturing method and circuit board - Google Patents

Description

  The present invention relates to a circuit board manufacturing method and a circuit board.

  Conventionally, a flexible circuit board in which a circuit pattern is provided on the surface of an insulating substrate made of an insulating synthetic resin film having flexibility has been used in various electronic devices. As a circuit pattern provided on the flexible circuit board, there is a circuit pattern (resin-containing circuit pattern) formed by applying and curing a conductive paste (resin-containing conductive paste) on a synthetic resin film. When a circuit pattern is formed by applying a conductive paste, the circuit pattern can be easily formed and its manufacturing cost can be reduced compared to the case where a circuit pattern is formed by etching a copper foil. The process that does not occur is possible, the environmental load is low, and the power saving effect can be expected.

However, on the other hand, a circuit pattern using a conventional conductive paste (generally a silver paste) has a specific resistance (volume resistivity) (1.6 × 10 ⁻⁶ [Ω · cm] of a circuit pattern obtained by etching a copper foil. ], The specific resistance (1 × 10 ⁻⁴ to 4 × 10 ⁻⁵ [Ω · cm]) is higher than that of a conventional flexible circuit board having a circuit pattern formed using a conductive paste. It was difficult to pass a high current through the circuit pattern. That is, for example, a switch circuit and a fixed resistor circuit provided on the flexible circuit board need only pass a current of about several mA, so that the specific resistance value of the circuit pattern is not a big problem. Since it is necessary to pass a current of about several tens of mA to the circuit of the chip LED provided on the circuit board, if the resistance value of the circuit pattern is large, a specified current cannot be supplied to the circuit pattern, and the chip LED emits light. In the worst case, pattern interruption may occur due to heating if it is obstructed or high-pressure static electricity or overcurrent flows. On the other hand, in order to prevent this, the pattern width is increased. However, this reduces the size and integration of the flexible circuit board.

  The reason why the specific resistance of the conventional conductive paste (silver paste) is high is that the resin binder is interposed between the silver particles, so that the number of contact points between the silver particles is small. Furthermore, the electrical conduction between the silver particles is physical. This is because contact resistance is generated at each contact location because of only contact.

  Therefore, in recent years, as a paste having a low specific resistance, for example, as shown in Patent Document 1, a paste containing a particulate silver compound having an average particle diameter of about 0.01 to 1 μm has been developed. This type of paste is easily reduced to metallic silver particles by applying it to an insulating substrate and heating it at a temperature considerably lower than the melting temperature of metallic silver itself (for example, 180 ° C.). Melt and fuse together to form a highly conductive metallic silver coating comparable to metallic silver. Therefore, if a circuit pattern is formed using this type of paste, the drawbacks of forming a circuit pattern by etching a copper foil and the disadvantages of forming a circuit pattern by applying a conventional conductive paste are simultaneous. This can be solved and is preferable.

However, when a circuit pattern is to be formed using this paste having a low specific resistance, there are the following problems.
(1) Although the heating temperature at the time of baking the paste is about 140 ° C. to 250 ° C. depending on the material of the paste, a suitable heating temperature is required to be about 180 ° C. or more, so it is inexpensive but has low heat resistance. It may be difficult to use a synthetic resin film (eg, polyethylene terephthalate (PET) film) as an insulating substrate.

(2) Since the circuit pattern formed by the paste has poor adhesion (adhesiveness) to the insulating substrate and at the same time has poor flexibility, the formed circuit pattern can be easily peeled off from the insulating substrate or the insulating substrate can be bent. In such a case, there is a risk of breaking easily. This problem is particularly serious when a flexible synthetic resin film is used as the insulating substrate.
JP 2003-308732 A

  The present invention has been made in view of the above points, and its purpose is to reduce the specific resistance value of a circuit pattern, to allow a high current to flow even in a thin circuit pattern, and to achieve miniaturization and integration, and heat resistance. An object of the present invention is to provide a method of manufacturing a circuit board and a circuit board which can use an insulating substrate made of a material having a low temperature, and at the same time, do not break the circuit pattern or peel off the insulating substrate.

  The invention according to claim 1 of the present application prepares a transfer member whose surface is a transfer surface and an insulating substrate, and applies a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder to the surface of the insulating substrate. A step of forming a resin-containing circuit pattern, and applying a paste containing a metal or a metal compound to the transfer surface of the transfer member and heating at a heating temperature of 140 ° C. to 250 ° C. in the paste The resin-containing circuit is formed by laminating the insulating substrate and the transfer member by fusing the metal fine particles present or the metal fine particles precipitated from the metal compound together to form a fused circuit pattern. A step of laminating a pattern and a fusion-type circuit pattern via a conductive adhesive film previously formed on a fusion-type circuit pattern or a resin-containing type circuit pattern; The fused circuit pattern on the transfer surface of the transfer member is transferred to the insulated substrate side by separating the transfer member from the insulated substrate and the transfer member, whereby the resin-containing circuit pattern and the fused circuit pattern are transferred onto the insulated substrate. And a step of forming a circuit pattern formed by laminating the circuit board. The present invention is an invention corresponding to the first embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 2 of the present application prepares a transfer member whose surface is a transfer surface and an insulating substrate, and applies a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder to the surface of the insulating substrate. Forming a resin-containing circuit pattern, and a part of the resin-containing circuit pattern formed on the insulating substrate when the transfer member and the insulating substrate are opposed to each other. From the metal fine particles or the metal compound present in the paste by applying a paste containing a metal or metal compound to the position of the transfer surface of the opposing transfer member and heating at a heating temperature of 140 ° C. to 250 ° C. The part of the resin-containing circuit is formed by laminating deposited metal fine particles to form a fused circuit pattern and laminating the transfer member and an insulating substrate. A step of laminating the turn and the fused circuit pattern via a conductive adhesive film previously formed on the fused circuit pattern or the resin-containing circuit pattern, and separating the transfer member from the laminated insulating substrate and the transfer member. A first circuit pattern in which the fusion-type circuit pattern on the transfer surface of the transfer member is transferred to the insulating substrate side, thereby laminating the resin-containing circuit pattern and the fusion-type circuit pattern on the insulation substrate; And a step of coexisting and forming a second circuit pattern comprising a resin-containing circuit pattern. The resin-containing circuit pattern constituting the second circuit pattern may be covered with a conductive adhesive film. The present invention is an invention corresponding to the first embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 3 of the present application prepares a transfer member whose surface is a transfer surface and an insulating substrate, and applies a resin-containing conductive paste in which conductive powder is dispersed in a resin binder to the surface of the insulating substrate. A step of forming a resin-containing circuit pattern, and applying a paste containing a metal or a metal compound to the transfer surface of the transfer member and heating at a heating temperature of 140 ° C. to 250 ° C. in the paste The resin-containing circuit is formed by laminating the insulating substrate and the transfer member by fusing the metal fine particles present or the metal fine particles precipitated from the metal compound together to form a fused circuit pattern. A step of laminating a pattern and a fusion-type circuit pattern, and a fusion-type circuit pattern on a transfer surface of the transfer member by separating the transfer member from the laminated insulating substrate and the transfer member Forming a circuit pattern formed by laminating a resin-containing circuit pattern and a fusion-type circuit pattern on the insulating substrate. In the manufacturing method. This invention is an invention corresponding to the second embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

  In the invention according to claim 4, a transfer member having a transfer surface as a transfer surface and an insulating substrate are prepared, and a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder is applied to the surface of the insulating substrate. Forming a resin-containing circuit pattern, and a part of the resin-containing circuit pattern formed on the insulating substrate when the insulating substrate and the transfer member are opposed to each other. By applying a paste containing a metal or a metal compound on the transfer surface of the transfer member facing the substrate and heating at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal compound A part of the resin-containing mold circuit by laminating the insulating substrate and the transfer member; A step of laminating the pattern and the fusion type circuit pattern, and separating the transfer member from the laminated insulating substrate and the transfer member to transfer the fusion type circuit pattern of the transfer member to the insulating substrate side. Forming a first circuit pattern formed by laminating a resin-containing circuit pattern and a fusion-type circuit pattern and a second circuit pattern formed of a resin-containing circuit pattern. The circuit board manufacturing method is characterized. This invention is an invention corresponding to the second embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

  The invention according to claim 5 provides a transfer member having a transfer surface as a transfer surface and an insulating substrate, a step of forming an adhesive film on the surface of the insulating substrate, and a metal on the transfer surface of the transfer member. Alternatively, by applying a paste containing a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles precipitated from the metal compound are fused to each other and melted. A step of forming a contact-type circuit pattern, a step of forming a resin-containing type circuit pattern by applying a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder on the surface of the fusion-type circuit pattern, A step of laminating the adhesive coating and the resin-containing circuit pattern by laminating the insulating substrate and the transfer member; and a transfer member from the laminated insulating substrate and the transfer member. By transferring the fused circuit pattern and the resin-containing circuit pattern laminated on the transfer surface of the transfer member to the insulating substrate side, the resin-containing circuit pattern and the fused circuit pattern are thereby transferred onto the insulating substrate. And a step of forming a circuit pattern formed by laminating the circuit board. This invention is an invention corresponding to the third embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

  According to the sixth aspect of the present invention, there is provided a transfer member having a transfer surface as a transfer surface and an insulating substrate, a step of forming an adhesive film on the surface of the insulating substrate, and a metal on the transfer surface of the transfer member. Alternatively, by applying a paste containing a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles precipitated from the metal compound are fused to each other and melted. A resin-containing conductive paste obtained by dispersing conductive powder in a resin binder is applied to the step of forming the contact-type circuit pattern and the surface of the fusion-type circuit pattern and the surface of the transfer surface of the other transfer member. A step of forming a resin-containing circuit pattern by laminating, and a step of laminating the adhesive coating and the resin-containing circuit pattern by laminating the insulating substrate and a transfer member; Transfer the fused circuit pattern and the resin-containing circuit pattern on the transfer surface of the transfer member to the insulating substrate side by separating the transfer member from the laminated insulating substrate and transfer member, thereby containing the resin on the insulating substrate. Forming a mixed circuit of a first circuit pattern formed by laminating a mold circuit pattern and a fused circuit pattern and a second circuit pattern formed of a resin-containing circuit pattern. It is in the manufacturing method of a circuit board. This invention is an invention corresponding to the third embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

  The invention according to claim 7 of the present invention provides a first and second transfer members having a transfer surface as a transfer surface and an insulating substrate, and a step of forming an adhesive film on the surface of the insulating substrate; By applying a paste containing a metal or a metal compound to the transfer surface of the transfer member and heating at a heating temperature of 140 ° C. to 250 ° C., metal fine particles present in the paste or metal deposited from the metal compound A step of forming a fused circuit pattern by fusing fine particles to each other, and a resin-containing type by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the transfer surface of the second transfer member A step of forming a circuit pattern; and laminating the insulating substrate and the first transfer member to bond the fused circuit pattern of the first transfer member to the adhesive film of the insulating substrate, and A step of transferring the fusion circuit pattern on the transfer surface of the first transfer member to the insulating substrate side by separating the first transfer member from the substrate and the first transfer member; and transferring the fusion circuit pattern. By laminating the insulating substrate and the second transfer member, the fused circuit pattern and the resin-containing circuit pattern are laminated in direct contact with each other, or the fused circuit pattern or the resin-containing circuit is preliminarily contacted. A step of laminating via a conductive adhesive film formed on the pattern, and a resin-containing mold on the transfer surface of the second transfer member by separating the second transfer member from the laminated insulating substrate and the second transfer member Transferring the circuit pattern to the insulating substrate side, thereby forming a circuit pattern formed by laminating the fused circuit pattern and the resin-containing circuit pattern on the insulating substrate. In the method of manufacturing the plate. The present invention is an invention corresponding to the fourth embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 8 provides a first and second transfer members having a transfer surface as a transfer surface and an insulating substrate, a step of forming an adhesive film on the surface of the insulating substrate, By applying a paste containing a metal or a metal compound to the transfer surface of the transfer member and heating at a heating temperature of 140 ° C. to 250 ° C., metal fine particles present in the paste or metal deposited from the metal compound When the first transfer member and the second transfer member are opposed to each other, the fine particles are fused to each other to form a fused circuit pattern, and formed on the transfer surface of the first transfer member. Resin-containing by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder at the position of the second transfer member facing the fusion-type circuit pattern and the position of the other second transfer member. Pattern circuit pattern A step of forming and laminating the insulating substrate and the first transfer member to bond the fused circuit pattern of the first transfer member to the adhesive film of the insulating substrate; A step of transferring the fusing circuit pattern on the transfer surface of the first transfer member to the insulating substrate by separating the first transfer member from the one transfer member; and an insulating substrate on which the fusing circuit pattern is transferred And a second transfer member are laminated so that a part of the resin-containing circuit pattern and the fusion-type circuit pattern are directly in contact with each other, or are previously laminated on the fusion-type circuit pattern or the resin-containing type circuit pattern. And a resin-containing circuit pattern on the transfer surface of the second transfer member by separating the second transfer member from the laminated insulating substrate and the second transfer member. The insulating substrate The first circuit pattern formed by laminating the fusion-type circuit pattern and the resin-containing circuit pattern on the insulating substrate, and the second circuit pattern made of the resin-containing circuit pattern are thereby mixed and formed. And a step of manufacturing the circuit board. The present invention is an invention corresponding to the fourth embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 9 is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, wherein the circuit pattern is a resin-containing circuit made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder. Metals deposited from metal fine particles or metal compounds present in the paste by heating a paste containing metal or metal compound at a heating temperature of 140 ° C. to 250 ° C. via a conductive adhesive film on the pattern The circuit board is characterized in that it is constituted by laminating fusion-type circuit patterns formed by fusing fine particles of each other. The present invention is an invention corresponding to the first embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 10 is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, and the circuit pattern is a resin-containing circuit made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder. By heating a paste containing a metal or a metal compound on a pattern through a conductive adhesive film at a heating temperature of 140 ° C. to 250 ° C., fine particles of metal present in the paste or metal deposited from the metal compound A circuit comprising a first circuit pattern formed by laminating a fused circuit pattern formed by fusing fine particles to each other and a second circuit pattern comprising a resin-containing circuit pattern. On the board. The resin-containing circuit pattern constituting the second circuit pattern may be covered with a conductive adhesive film. The present invention is an invention corresponding to the first embodiment described in the following “Best Mode for Carrying Out the Invention”.

  The invention according to claim 11 is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, and the circuit pattern is a resin-containing circuit made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder. By heating a paste containing a metal or a metal compound on the pattern at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles deposited from the metal compound are fused to each other. The circuit board is characterized in that it is configured by laminating the fusion-type circuit patterns. This invention is an invention corresponding to the second embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

  The invention according to claim 12 is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, wherein the circuit pattern is a resin-containing circuit made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder. By heating a paste containing a metal or a metal compound on the pattern at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles precipitated from the metal compound are fused to each other. In the circuit board, the first circuit pattern formed by laminating the fused circuit patterns and the second circuit pattern formed from the resin-containing circuit pattern are mixed. This invention is an invention corresponding to the second embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

The invention according to claim 13 of the present application is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, wherein the circuit pattern is formed by using conductive powder as a resin binder on an adhesive film formed on the surface of the insulating substrate. By forming a resin-containing circuit pattern composed of a dispersed resin-containing conductive paste and heating a paste containing a metal or a metal compound on the resin-containing circuit pattern at a heating temperature of 140 ° C. to 250 ° C. The circuit board is constituted by laminating fusion type circuit patterns obtained by fusing metal fine particles present in the paste or metal fine particles precipitated from the metal compound to each other. This invention is an invention corresponding to the third embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

The invention according to claim 14 of the present invention is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, wherein the circuit pattern is obtained by dispersing conductive powder in a resin binder on an adhesive film formed on the surface of the insulating substrate. By forming a resin-containing circuit pattern made of a resin-containing conductive paste and heating a paste containing a metal or a metal compound on the resin-containing circuit pattern at a heating temperature of 140 ° C. to 250 ° C. A first circuit pattern formed by laminating a fusion type circuit pattern obtained by fusing together metal fine particles present in the paste or metal fine particles precipitated from the metal compound ; and formed on the surface of the insulating substrate. circuit, characterized in that the second circuit pattern obtained by forming a resin-containing type circuit pattern is configured in a mixed on the adhesive film was In the plate. This invention is an invention corresponding to the third embodiment in the description of the “Best Mode for Carrying Out the Invention” below.

The invention according to claim 15 of the present application is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, and the circuit pattern contains a metal or a metal compound on an adhesive film formed on the surface of the insulating substrate. By heating the paste to be heated at a heating temperature of 140 ° C. to 250 ° C., a fused circuit pattern is formed by fusing metal fine particles present in the paste or metal fine particles precipitated from the metal compound to each other. In addition, a resin-containing circuit pattern made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder is directly laminated on the fusion-type circuit pattern, or laminated through a conductive adhesive film. It is in the circuit board characterized by having. The present invention is an invention corresponding to the fourth embodiment described in the following “Best Mode for Carrying Out the Invention”.

The invention according to claim 16 of the present application is a circuit board in which a circuit pattern is provided on the surface of an insulating substrate, and the circuit pattern contains a metal or a metal compound on an adhesive film formed on the surface of the insulating substrate. The paste is heated at a heating temperature of 140 ° C. to 250 ° C. to form a fusion-type circuit pattern in which metal fine particles present in the paste or metal fine particles precipitated from the metal compound are fused to each other. The resin-containing circuit pattern made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder is directly laminated on the fusion-type circuit pattern, or laminated through a conductive adhesive film. a first circuit pattern, the second circuit pattern obtained by forming a resin-containing type circuit pattern on an adhesive coating formed on the surface of the insulating substrate Lying on the circuit board, characterized in that is configured and down mixed. The present invention is an invention corresponding to the fourth embodiment described in the following “Best Mode for Carrying Out the Invention”.

  According to the first to eighth aspects of the invention, the fused circuit pattern once formed on the transfer surface of the transfer member (the first transfer member in the case of the seventh and eighth aspects) is transferred to the insulating substrate. Therefore, a material having a low heat-resistant temperature that cannot withstand the heating during the formation of the fused circuit pattern can be used as the insulating substrate. The circuit pattern formed at the same time has a fusion circuit pattern, so it has a specific resistance as low as that of the metal itself. Therefore, the specific resistance value of the circuit pattern can be reduced, and even a thin circuit pattern has a high current. Can be provided. In addition, since the circuit pattern can be made thin, the circuit board can be reduced in size and integrated. In addition, since the resin-containing circuit pattern and the fusion-type circuit pattern are laminated, the fusion-type circuit pattern is reinforced by the resin-containing circuit pattern, and the circuit pattern is less likely to break or peel from the insulating substrate.

  According to the invention described in claims 2, 4, 6, and 8, the first circuit pattern formed by easily laminating the resin-containing circuit pattern and the fusion-type circuit pattern on the insulating substrate, and the resin-containing A second circuit pattern made of a mold circuit pattern can be mixed and formed. In other words, among the circuit patterns on the same insulating substrate, the first circuit pattern for flowing a high current and the second circuit pattern for flowing a low current can be selected and formed as necessary. Can be reduced and the manufacturing process can be simplified.

  According to the invention described in claims 9 to 16, since the circuit pattern to be formed uses a fusion-type circuit pattern, it has a specific resistance as low as that of the metal itself. A circuit board can be provided in which the resistance value can be reduced and a high current can flow even in a thin circuit pattern. In addition, since the circuit pattern can be made thin, the circuit board can be reduced in size and integrated. In addition, since the resin-containing circuit pattern and the fusion-type circuit pattern are laminated, the fusion-type circuit pattern is reinforced by the resin-containing circuit pattern, and the circuit pattern is less likely to break or peel from the insulating substrate.

  According to the invention described in claims 10, 12, 14, and 16, since the first circuit pattern and the second circuit pattern are mixed, a high current is generated in each circuit pattern on the same insulating substrate. The first circuit pattern for flowing a current and the second circuit pattern for flowing a low current can be selected and formed as necessary, and the material cost can be reduced and the manufacturing process can be simplified.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
1 and 2 are enlarged cross-sectional views of main parts showing a method for manufacturing the circuit board 1-1 according to the first embodiment of the present invention, and FIG. 3 is an enlarged cross-sectional view of the main parts of the completed circuit board 1-1. In order to manufacture the circuit board (flexible circuit board) 1-1, first, as shown in FIG. 1, an insulating board 30- made of an insulating synthetic resin film (thickness is, for example, 50 to 75 μm) having flexibility. 1 and a transfer member 60-1 having one surface as a transfer surface 65-1.

  In this embodiment, the insulating substrate 30-1 uses a polyethylene terephthalate (PET) film which has low heat resistance but is inexpensive in this embodiment, but other than that, for example, polyphenylene sulfide (PPS) film, polyimide (PI), etc. You may comprise by a film, a polyethylene naphthalate (PEN) film, a polyetherimide film, etc.

  On the other hand, the transfer member 60-1 is provided with a surface layer 63-1 of a fluororesin coat on one surface of a hard plate 61-1 such as a metal plate, and the surface on which the surface layer 63-1 is provided is the transfer surface 65-. 1 is configured. In the surface layer 63-1, a transfer object (in this embodiment, various coatings) can be temporarily disposed on the transfer member 60-1, and then this transfer object is placed on the other member side (in this embodiment, the insulating substrate 30-). It has an adhesive function that can be transferred to the first side. In this embodiment, a hard member is used as the transfer member 60-1. However, for example, a flexible flexible sheet such as a fluororesin sheet may be used. When a fluororesin is used as the flexible sheet, it itself has the function of the surface layer 63-1, so that it is not necessary to separately form the surface layer 63-1. The material of the transfer member 60-1 is a material that can be kept at the heating temperature (140 ° C. to 250 ° C.) when firing the following fused circuit patterns 70a-1 and 70b-1 formed on the transfer surface 65. Choose one.

A resin-containing type comprising a plurality of (three in the figure) resin-containing conductive films by applying a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder on the surface of the insulating substrate 30-1. Circuit patterns 40a-1, 40b-1, and 40c-1 are formed. An example of a specific method for forming the resin-containing circuit patterns 40a-1 to 40c-1 is as follows. A scaly conductive powder (in this embodiment, silver particles having an average particle size of about 1 to 50 μm) is used as a resin binder and organic. A silver paste, which is a general resin-containing conductive paste configured by being dispersed in a solvent, is prepared. Here, as the resin binder, for example, a thermosetting phenol resin or a cross-linked urethane resin is used. Then, this resin-containing conductive paste is applied to the shape of the resin-containing circuit patterns 40a-1 to 40c-1 by screen printing on the insulating substrate 30-1. However, as a coating method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. Next, the resin-containing circuit patterns 40a-1 to 40c-1 are formed by heating and curing at about 160 ° C. (heating time: about 5 minutes). The resin-containing circuit patterns 40a-1 to 40c-1 have a relatively large resistance value with a specific resistance of about 1 × 10 ⁻⁴ to 4 × 10 ⁻⁵ [Ω · cm]. The resin-containing circuit patterns 40a-1 to 40c-1 have a thickness of about 6 μm.

  Next, a conductive adhesive coating 90-1 is applied by screen printing so as to cover at least the resin-containing circuit patterns 40a-1 to 40c-1 of the insulating substrate 30-1. However, as a coating method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. In the present embodiment, the conductive adhesive coating 90-1 is also applied to the surface of the insulating substrate 30-1 on which the resin-containing circuit patterns 40a-1 to 40c-1 are not formed. The conductive adhesive coating 90-1 is of an anisotropic hot melt type that has the property of being electrically connected in the thickness direction by heating and pressing in the thickness direction (not electrically conductive in the surface direction) and bonded. It is a conductive adhesive film, specifically, for example, a nickel powder or a copper powder is silver-plated as a conductive powder in a thermoplastic resin binder (for example, polyester resin, acrylic resin, polystyrene resin, polyvinyl alcohol resin, vinyl chloride resin, etc.) It is formed by applying and curing an electrically conductive paste obtained by kneading a material subjected to the above process.

Next, fused circuit patterns 70a-1 and 70b-1 are formed on the transfer surface 65-1 on the surface layer 63-1 of the transfer member 60-1. These fused circuit patterns 70a-1 and 70b-1 are formed of the resin-containing circuit pattern 40a formed on the insulating substrate 30-1 when the transfer member 60-1 and the insulating substrate 30-1 are opposed to each other. -1 to 40c-1 (two in this embodiment) of the resin-containing circuit patterns 40a-1 and 40b-1 at the position of the transfer surface 65-1 of the transfer member 60-1 facing the resin-containing circuit patterns 40a-1 and 40b-1. The resin-containing circuit patterns 40a-1 and 40b-1 are formed in substantially the same shape. An example of a specific method for forming the fused circuit patterns 70a-1 and 70b-1 will be described. First, a paste containing a silver compound is prepared. There are various types of pastes of this type. Here, a paste made of silver oxide fine particles (silver compound fine particles), an organic silver compound, and an organic solvent is used. When the silver oxide fine particles are heated with heat of about 160 ° C., for example, oxygen is released to return to silver. That is, silver oxide is self-reduced by heating in air (2Ag ₂ O → 4Ag + O ₂ ), and oxygen is separated to form metallic silver fine particles, which are simultaneously fused. On the other hand, if the organic silver compound having a predetermined chemical structure is thermally decomposed by applying heat, the organic component is volatilized and metal silver fine particles are deposited. The silver fine particles deposited at this time are active (R-Ag → Ag + R1 ↑ + R2 ↑ +...). The organic solvent is volatilized by heating. Therefore, as the paste used in this embodiment, an organic silver compound having a specific molecular structure that decomposes at 140 to 200 ° C. or lower and a combination of the organic silver compound and the silver oxide fine particles are used. Then, this paste is applied by screen printing onto the transfer surface 65-1 of the transfer member 60-1. However, as a coating method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. When heated at about 140 to 200 ° C. (preferably 180 ° C. or higher) (heating time is about 10 seconds to 120 minutes), oxygen is separated from the silver oxide fine particles to generate metal silver fine particles, Active silver fine particles having a particle shape smaller than the metal silver fine particles that decompose and precipitate from the organic silver compound enter the gaps between the metal silver fine particles, and the metal silver fine particles and the precipitated silver fine particles are fused. By doing so, it is possible to finally form fused circuit patterns 70a-1 and 70b-1 made of a dense metal conductive continuous fused metal fine particle conductive film. As an organic silver compound which decomposes | disassembles at 140-200 degreeC here, tertiary fatty acid silver salt is suitable, for example. In addition, as such a paste, there exist a paste as described in Unexamined-Japanese-Patent No. 2003-203522, Unexamined-Japanese-Patent No. 2003-309375, etc., for example.

  The average particle size of the silver oxide fine particles is preferably 500 nm or less, but it is also possible to make the particle size larger by adding a reducing agent or the like. A tertiary fatty acid silver salt is a silver salt of a tertiary fatty acid having a total carbon number of 5 to 30 and serves as a lubricant. When kneading silver oxide fine particles and a tertiary fatty acid silver salt into a paste form In addition to pulverizing silver oxide fine particles to promote fine particle formation, it is present around silver oxide fine particles to suppress re-aggregation of silver oxide fine particles and improve dispersibility. 10 nm metallic silver fine particles are deposited and fused to silver fine particles produced by reduction from silver oxide fine particles. Specific examples of such tertiary fatty acid silver salts include silver pivalate, silver neoheptanoate, silver neononanoate, and silver neodecanoate.

  In this embodiment, fine particles of silver oxide (first silver oxide, second silver oxide) are used as the particulate silver compound. Instead, fine particles of silver carbonate, silver acetate, or a mixture thereof may be used. . Further, if a reducing agent is added to the particulate silver compound, even a relatively large fine particle having an average particle diameter of 500 nm or more can be reduced smoothly and can be used easily. Examples of the organic solvent include isophorone, terpineol, triethylene glycol monobutyl ether, and butyl cellosolve acetate.

As described above, the fusion-type circuit patterns 70a-1 and 70b-1 formed as described above are formed of the metal fine particle fusion type conductive film, and this metal fine particle fusion type conductive film. Is a coating film of metallic silver in which metallic silver fine particles are fused together, and its specific resistance is as small as 3-8 × 10 ^-6 [Ω · cm], which is the same as the specific resistance of metallic silver itself It becomes an order. The longer the heating time and the higher the heating temperature, the smaller the specific resistance and the better the adhesion. In the case of a resin-containing conductive film formed using a resin-containing conductive paste obtained by dispersing conventional scale-like silver particles (average particle size of about 1 to 50 μm) in a resin binder, the specific resistance is as described above. Is about 1 × 10 ⁻⁴ to 4 × 10 ⁻⁵ [Ω · cm], but has a very small specific resistance. The fused circuit patterns 70a-1 and 70b-1 have a thickness of about 3 μm.

Next, the transfer member 60-1 and the insulating substrate 30-1 are laminated so that the fused circuit patterns 70a-1 and 70b-1 provided on both of them and the conductive adhesive coating 90-1 are in contact with each other. At this time, some of the resin-containing circuit patterns 40a-1 and 40b-1 and the fusion-type circuit patterns 70a-1 and 70b-1 are provided on the resin-containing circuit patterns 40a-1 and 40b-1. They are laminated via the adhesive coating 90-1. Then, as shown in FIG. 2, when the transfer member 60-1 and the insulating substrate 30-1 are sandwiched by the heating and pressing members A1 and A2 installed above and below, and heated and pressurized, the hot melt type conductive When the adhesive coating 90-1 is melted, the conductive adhesive coating 90-1 and the fused circuit patterns 70a-1 and 70b-1 are bonded. The heating and pressing conditions by the heating and pressing members A1 and A2 are, for example, a heating temperature of 150 ° C., a pressing pressure of 10 kg / cm ² , and a heating and pressing time of 5 to 10 seconds.

  Next, after removing the heating and pressing members A1 and A2, the transfer member 60-1 is separated from the laminated insulating substrate 30-1 and the transfer member 60-1. The fused circuit patterns 70a-1 and 70b-1 are transferred to the insulating substrate 30-1 side, and as shown in FIG. 3, resin-containing circuit patterns 40a-1 and 40b are formed on the insulating substrate 30-1. -1 and fusion circuit patterns 70a-1 and 70b-1 are laminated, and second circuit pattern 81- is formed of first circuit patterns 80-1 and 80-1 and resin-containing circuit pattern 40c-1. 1 is formed as a mixed circuit board 1-1.

  If the above manufacturing method is used, the fusion-type circuit patterns 70a-1 and 70b-1 once formed on the transfer surface 65-1 of the transfer member 60-1 are transferred to the insulating substrate 30-1. The fused circuit patterns 70a-1 and 70b-1 can be formed also on the insulating substrate 30-1 having low heat resistance.

  The first circuit patterns 80-1 and 80-1 formed by laminating the resin-containing circuit patterns 40a-1 and 40b-1 and the fusion-type circuit patterns 70a-1 and 70b-1 have a specific resistance close to that of metallic silver. Therefore, even when a high current of several tens of mA flows, it is not necessary to increase the line width of the circuit pattern as compared with the conventional resin-containing circuit pattern made of only a resin-containing conductive paste. Thereby, the first circuit pattern 80-1 can be used for high current, while the second circuit pattern 81-1 can be used for low current. That is, both the circuit patterns 80-1 and 81-1 can be selectively formed as necessary, so that the material cost can be reduced and the manufacturing process can be simplified. In this embodiment, all of the resin-containing circuit patterns 40a-1 to 40c-1, the fusion-type circuit patterns 70a-1, 70b-1, and the conductive adhesive coating 90-1 are formed by using screen printing. Any pattern or film can be manufactured by the same process, the manufacturing process can be simplified, and the same manufacturing apparatus can be used. From these, the manufacturing of the circuit board 1-1 is facilitated and the manufacturing cost is reduced. Can be planned.

  Further, as in this embodiment, resin-containing circuit patterns 40a-1 and 40b-1 are formed on the upper surface of the insulating substrate 30-1, and a fused circuit pattern 70a- is formed thereon via a conductive adhesive film 90-1. The reason why the first circuit patterns 80-1 and 80-1 are formed by forming 1,70b-1 is as follows. That is, when the fusion-type circuit patterns 70a-1 and 70b-1 are directly applied and formed on the insulating substrate 30-1, the adhesiveness between the two depends on the compatibility between the two. In some cases, the inclusion circuit patterns 40a-1 and 40b-1 are not so good as compared with the adhesion between the two when the inclusion type circuit patterns 40a-1 and 40b-1 are directly applied. Therefore, the resin-containing circuit patterns 40a-1 and 40b-1 are interposed between the insulating substrate 30-1 and the fused circuit patterns 70a-1 and 70b-1. Further, since the resin-containing circuit patterns 40a-1 and 40b-1 use a thermosetting phenol resin, a cross-linked urethane resin, or the like as a resin binder, the adhesiveness can be maintained even after being heated and pressurized. Does not occur. Therefore, a hot-melt type conductive adhesive coating 90-1 is coated on the resin-containing circuit patterns 40a-1 and 40b-1, and this is heated and pressurized during the transfer to thereby create a fusion-type circuit pattern. 70a-1 and 70b-1 were reliably transferred onto the resin-containing circuit patterns 40a-1 and 40b-1 via the conductive adhesive film 90-1, and the laminated state thereof was maintained. Further, since the fused circuit patterns 70a-1 and 70b-1 are thinner and harder than the resin-containing circuit patterns 40a-1 and 40b-1, cracks are easily generated when the insulating substrate 30-1 is bent. Further, by laminating the flexible resin-containing circuit patterns 40a-1 and 40b-1 that are hard to crack, the fusion-type circuit patterns 70a-1 and 70b-1 are reinforced, thereby the insulating substrate 30-1 It is able to cope with bending sufficiently. The number of times the resin-containing circuit patterns 40a-1 to 40c-1 and the fusion-type circuit patterns 70a-1 and 70b-1 are printed is multiple times. In this case, the thickness of these patterns can be increased, and a pattern with a lower resistance can be obtained with a narrow pattern width, thereby allowing a higher current to flow.

  In this embodiment, the conductive adhesive film 90-1 is formed on the resin-containing circuit patterns 40a-1 and 40b-1 on the upper surface of the insulating substrate 30-1. Instead, the conductive adhesive film 90-1 is formed. May be formed on the fused circuit patterns 70a-1 and 70b-1 on the transfer surface 65-1 of the transfer member 60-1. In this case, the insulating substrate 30-1 and the transfer member 60-1 are stacked and heated and pressed, and then formed on the transfer member 60-1 side when the transfer member 60-1 is separated from the insulating substrate 30-1. The conductive adhesive coating 90-1 and the fused circuit patterns 70a-1 and 70b-1 are transferred onto the resin-containing circuit patterns 40a-1 and 40b-1 provided on the insulating substrate 30-1.

  FIG. 4 shows a circuit board (hereinafter referred to as “flexible circuit board”) 100 according to a specific example of the circuit board 1-1 configured by using the first and second circuit patterns 80-1 and 81-1, and the circuit board 1-1. It is a principal part perspective view which shows various components. The flexible circuit board 100 shown in FIG. 4 (the left and right portions of the flexible circuit board 100 are not shown in FIG. 4) is provided on the surface of an insulating substrate 30-1 made of a flexible insulating PET film. The first and second circuit patterns 80-1 and 81-1 are provided. 4 is a circuit board 1-1 shown in FIG. 3.

  That is, in the flexible circuit board 100, a pair of second circuit patterns 81-1 and 81-1 are formed for the switch circuit, and a pair of first circuit patterns 80-1 and 80-1 are formed for the light emitting element. In addition, one first circuit pattern 80-1 is formed for another circuit. One end portions of the second circuit patterns 81-1 and 81-1 for the switch circuit are arranged to face each other, and each end portion has a circular switch contact portion 81a and a C-shape surrounding the switch contact portion 81a. A switch contact portion 81b is provided. Further, one end portions of the first circuit patterns 80-1 and 80-1 for the light emitting elements are arranged to face each other, and electrode fixing land portions 80a and 80a are provided at the respective end portions. Actually, the entire surface excluding the switch contact portions 81a and 81b and the electrode fixing land portions 80a and 80a of the insulating substrate 30-1 on which the first and second circuit patterns 80-1 and 81-1 are formed. In this case, the insulating layer is covered and formed by printing and drying the insulating paint, but this is not shown in the figure. As this insulating paint, for example, an ultraviolet curable resin is used. Note that an insulating film may be coated instead of applying the insulating paint. Then, the metal reversal plate 110 formed by bending and deforming the elastic metal plate so that the center thereof is convex upward is placed immediately above the switch contact portions 81a and 81b, and fixed by an adhesive tape (not shown), Further, the electrode portions 121 and 121 provided on both ends of the light emitting element 120 by placing the light emitting element 120 on the electrode fixing land portions 80a and 80a are connected to the electrode fixing land portions 80a and 80a with a conductive adhesive or a mechanical not shown. Attach by fixing means.

  In this flexible circuit board 100, since the first circuit pattern 80-1 having a low resistance is used as the circuit pattern for light emission of the light emitting element 120 that requires a high current of about several tens of mA, the light emission of the light emitting element 120 is a circuit. Problems such as obstruction caused by high resistance can be reliably prevented. Further, since the second circuit pattern 81-1 having a relatively high resistance value is used as a switch circuit pattern that does not cause a problem even at a low current of about several mA, the material cost is reduced and the printing process is simplified ( For example, it is not necessary to make a layered structure unnecessary for reducing the resistance of the circuit pattern. And since this 1st, 2nd circuit pattern 80-1 and 81-1 were mixed on the flexible circuit board 100 like this flexible circuit board 100, the 1st circuit pattern 80- which flows a high current Even in the case of the flexible circuit board 100 in which 1 and the second circuit pattern 81-1 that allows only a low current to flow are mixed, it is not necessary to increase the line width of the circuit pattern, and the flexible circuit board 100 can be downsized.

[Second Embodiment]
5 and 6 are enlarged cross-sectional views of main parts showing a method for manufacturing the circuit board 1-2 according to the second embodiment of the present invention, and FIG. 7 is an enlarged cross-sectional view of the main parts of the completed circuit board 1-2. In this embodiment, the same or equivalent members as those in the first embodiment are given the same reference numerals (however, only subscripts are different). In this embodiment, the first embodiment is selected by selecting the following resin as the resin-containing conductive paste of the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 made of a resin-containing conductive film. The conductive adhesive coating 90-1 shown in FIG. That is, in order to manufacture this circuit board 1-2, first, as shown in FIG. 5, an insulating board 30-2 made of a flexible insulating synthetic resin film (thickness is, for example, 50 to 75 μm), A transfer member 60-2 having a transfer surface 65-2 as its surface. Here, the material of the insulating substrate 30-2 and the material of the transfer member 60-2 are the same as those in the first embodiment. Therefore, the insulating substrate 30-2 is made of PET film (in addition, for example, PPS film, PI film, PEN film, polyetherimide film, etc. may be used), and a particularly transparent one is used.

  Then, a plurality of resin pastes (three in the figure) are applied to the surface of the insulating substrate 30-2 by applying a resin-containing conductive paste in which conductive powder is dispersed in an ultraviolet curable resin binder by the same formation method as in the first embodiment. Resin-containing circuit patterns 40 a-2, 40 b-2, and 40 c-2 made of a resin-containing conductive film of the present) are formed. That is, the resin-containing conductive paste used in this embodiment is of an ultraviolet curable type, and has a predetermined viscosity and remains in a semi-cured state before being irradiated with ultraviolet rays. An example of a specific method for forming the resin-containing circuit patterns 40a-2 to 40c-2 is as follows. A scaly conductive powder (in this embodiment, silver particles having an average particle diameter of about 0.02 to 5 μm) is UV-cured. A silver paste, which is a resin-containing conductive paste configured by dispersing in a resin binder (for example, rosin acrylate) and an organic solvent, is prepared, and this resin-containing conductive paste is placed on the insulating substrate 30-2. The pattern 40a-2 to 40c-2 is applied by screen printing (however, as the application method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing, etc. in addition to screen printing). ) To form resin-containing circuit patterns 40a-2 to 40c-2.

Next, fused circuit patterns 70a-2 and 70b-2 are formed on the transfer surface 65-2 of the transfer member 60-2 in the same manner as in the first embodiment. These fused circuit patterns 70a-2 and 70b-2 are formed of the resin-containing circuit pattern 40a formed on the insulating substrate 30-2 when the transfer member 60-2 and the insulating substrate 30-2 are opposed to each other. In the position of the transfer surface 65-2 on the surface of the surface layer 63-2 of the transfer member 60-2 facing the resin-containing circuit patterns 40a-2 and 40b-2, which are part of −2 to 40c-2. A plurality of resin-containing circuit patterns 40a-2 and 40b-2 are formed in substantially the same shape. A specific method for forming the fused circuit patterns 70a-2 and 70b-2 is the same as that in the first embodiment. That is, the fusion-type circuit patterns 70a-2 and 70b-2 are formed of a metal fine particle fusion-type conductive film as in the first embodiment. Since the coating film is made of metallic silver in which fine particles are fused together, the specific resistance is as small as about 3 to 8 × 10 ⁻⁶ [Ω · cm], which is the same order as metallic silver.

  Next, as shown in FIG. 6, the transfer member 60-2 and the insulating substrate 30-2 are bonded to the fused circuit patterns 70a-2 and 70b-2 and a part of the resin-containing circuit patterns 40a-2 and 40b-. 2 are laminated so as to face each other. As a result, the semi-cured resin-containing circuit patterns 40a-2 and 40b-2 adhere to the surfaces of the fusion-type circuit patterns 70a-2 and 70b-2. The resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 are directed from the opposite side of the surface on which the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 are provided on the insulating substrate 30-2. When the ultraviolet rays are irradiated, the resin-containing circuit patterns 40a-2, 40b-2, 40c-2 are cured, and at the same time, the resin-containing circuit patterns 40a-2, 40b-2 and the fusion-type circuit pattern 70a-2, 70b-2 is bonded.

  Next, when the transfer member 60-2 is separated from the laminated insulating substrate 30-2 and the transfer member 60-2, the fused circuit patterns 70a-2 and 70b- on the transfer surface 65-2 of the transfer member 60-2. 2 is transferred to the insulating substrate 30-2 side, and as shown in FIG. 7, resin-containing circuit patterns 40a-2 and 40b-2 and a fused circuit pattern 70a-2, Circuit board formed by mixing first circuit patterns 80-2, 80-2 formed by laminating 70b-2 and second circuit pattern 81-2 formed by resin-containing circuit pattern 40c-2 1-2 is configured.

  Similarly to the first embodiment, the first circuit patterns 80-2 and 80-2 formed in this way also have a specific resistance close to that of metallic silver, and therefore a case where a high current of several tens of mA flows. Even if it exists, it is not necessary to make the line width of a circuit pattern thick compared with the resin containing type | mold circuit pattern which consists only of the conventional resin containing electrically conductive paste. Thereby, the first circuit pattern 80-2 can be used for high current, while the second circuit pattern 81-2 can be used for low current. That is, both circuit patterns 80-2 and 81-2 can be selectively formed as necessary, so that the material cost can be reduced and the manufacturing process can be simplified. Further, in this embodiment, all of the resin-containing circuit patterns 40a-2 to 40c-2 and the fusion-type circuit patterns 70a-2 and 70b-2 are formed by using screen printing. Thus, the manufacturing process can be simplified and the same manufacturing apparatus can be used. From these, the manufacturing of the circuit board 1-2 can be facilitated and the manufacturing cost can be reduced.

  Further, a fused circuit pattern 70a-2 is formed on the upper surface of the insulating substrate 30-2 via resin-containing circuit patterns 40a-2 and 40b-2 having excellent adhesion to the insulating substrate 30-2. , 70b-2 is formed to form the first circuit patterns 80-2 and 80-2, so that the first circuit patterns 80-2 and 80-2 are in close contact with the insulating substrate 30-2 as compared with the resin-containing circuit patterns 40a-2 and 40b-2. The fused circuit patterns 70a-2 and 70b-2, which are not very good, can be easily and reliably formed on the insulating substrate 30-2 by transfer. The fusion-type circuit patterns 70a-2 and 70b-2 are reinforced by laminating the resin-containing circuit patterns 40a-2 and 40b-2 so that it can sufficiently cope with the bending of the insulating substrate 30-2. This is the same as in the first embodiment.

  Also, the number of times the resin-containing circuit patterns 40a-2 to 40c-2 and the fusion-type circuit patterns 70a-2 and 70b-2 are printed is a plurality of times. In this case, the thickness of these patterns can be increased, and a pattern with a lower resistance can be obtained with a narrow pattern width, thereby allowing a higher current to flow.

  In this embodiment, the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 are formed on the upper surface of the insulating substrate 30-2. Instead, the resin-containing circuit patterns 40a-2, 40b-2 and 40c-2 may be formed on the transfer member 60-2 side. Specifically, the resin-containing circuit pattern 40a-2 is formed on the fusion-type circuit pattern 70a-2 formed on the transfer member 60-2, and the resin-containing circuit pattern 40b is formed on the fusion-type circuit pattern 70b-2. -2, the resin-containing circuit pattern 40c-2 is screen-printed on the transfer surface 65-2 on the surface layer 63-2 surface (however, as a coating method, in addition to screen printing, inkjet printing, flexographic printing, offset printing, There are letterpress printing, intaglio printing, spray printing, etc.). Next, the transfer member 60-2 and the insulating substrate 30-2 are laminated, and the surface of the insulating substrate 30-2 on the side where the transfer member 60-2 is not laminated is irradiated with ultraviolet rays to form a resin-containing circuit pattern 40a. -2, 40b-2, 40c-2 are cured, and the fused circuit patterns 70a-2, 70b- formed on the transfer member 60-2 side when the transfer member 60-2 is separated from the insulating substrate 30-2. 2 and the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 are transferred onto the insulating substrate 30-2. When the insulating substrate 30-2 is irradiated with light (ultraviolet rays), the heating temperature of the insulating substrate 30-2 is 80 ° C. at maximum, and the insulating substrate 30-2 made of PET film having poor heat resistance can be altered. Absent.

In this embodiment, in order to directly bond the fused circuit patterns 70a-2 and 70b-2 and the resin-containing circuit patterns 40a-2 and 40b-2, the resin-containing circuit patterns 40a-2 and 40b. -2 and 40c-2, UV curable resin-containing conductive paste was used, but instead of the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2, thermoplastic conductive paste (for example, silver powder) Or a paste obtained by kneading a conductive binder such as polyester resin, acrylic resin, polystyrene resin, polyvinyl alcohol resin, vinyl chloride resin, or the like. In this case, after laminating the insulating substrate 30-2 and the transfer member 60-2, they are heated and pressurized (in this embodiment, a heating temperature of 150 ° C., a pressing pressure of 10 kg / cm ² , a heating and pressing time of 5). 10 seconds), and then the transfer member 60-2 is released, so that the fused circuit patterns 70a-2 and 70b-2 on the transfer member 60-2 become the resin-containing circuit pattern 40a- on the insulating substrate 30-2. 2,40b-2. Further, the same thermosetting resin-containing conductive paste as that of the first embodiment may be used as the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2. In this case, the resin-containing circuit patterns 40a-2 and 40b-2 are once brought into a semi-cured state having a slight adhesiveness at a temperature lower than the curing temperature, and then the transfer member 60-2 is laminated on the insulating substrate 30-2. It is necessary to bond the fused circuit patterns 70a-2 and 70b-2 on the transfer member 60-2 and the resin-containing circuit patterns 40a-2 and 40b-2 on the insulating substrate 30-2 by heat curing. .

  As described above, when the manufacturing method according to this embodiment is used, as in the first embodiment, the fused circuit patterns 70a-2 and 70b-2 once formed on the transfer surface 65-2 of the transfer member 60-2. Is transferred to the insulating substrate 30-2, so that the fused circuit patterns 70a-2 and 70b-2 can be formed also on the insulating substrate 30-2 having a low heat resistance such as a PET film. Needless to say, the circuit board 1-2 according to this embodiment can also be applied to the flexible circuit board 100 as shown in FIG. 4 as in the first embodiment.

[Third embodiment]
FIGS. 8 and 9 are enlarged cross-sectional views of main parts showing a method for manufacturing the circuit board 1-3 according to the third embodiment of the present invention, and FIG. 10 is an enlarged cross-sectional view of the main parts of the completed circuit board 1-3. In this embodiment, the same or equivalent members as those in the first embodiment are given the same reference numerals (however, only subscripts are different). In this embodiment, the fused circuit patterns 70a-3, 70b-3 and the resin-containing circuit patterns 40a-3, 40b-3, 40c-3 are all formed on the transfer member 60-3 side, and these Each pattern is adhered and transferred to an adhesive film 85-3 formed on the insulating substrate 30-3 side. That is, in order to manufacture the circuit board 1-3, first, as shown in FIG. 8, a flexible insulating PET film (other than that, for example, PPS film, PI film, PEN film, polyetherimide film) An insulating substrate 30-3 (having a thickness of, for example, 50 to 75 μm) and a transfer member 60-3 having one surface as a transfer surface 65-3 are prepared. Here, the material of the insulating substrate 30-3 and the material of the transfer member 60-3 are the same as those in the first embodiment.

  Then, an adhesive coating 85-3 made of an insulating material is applied to the surface of the insulating substrate 30-3 by screen printing. However, the application method includes flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. The material of the adhesive coating 85-3 may be a hot melt type (thermoplastic) synthetic resin (for example, a polyester resin, an acrylic resin, a polystyrene resin, a polyvinyl alcohol resin, a vinyl chloride resin, etc.), or an ultraviolet curable synthetic resin. Alternatively, a thermosetting synthetic resin (such as a phenol resin or a urethane resin) may be used. In the case of a hot melt type synthetic resin, it may be heated at about 150 ° C. and set in a cured state before being laminated on the transfer member 60-3 described below, but an ultraviolet curable synthetic resin or a thermosetting type resin may be used. In the case of a synthetic resin, it is necessary to make it a semi-cured state having some tackiness by the same method as in the second embodiment without being completely cured.

Next, fused circuit patterns 70a-3 and 70b-3 are formed on the transfer surface 65-3 on the surface of the surface layer 63-3 of the transfer member 60-3. A specific method for forming the fused circuit patterns 70a-3 and 70b-3 is the same as that in the first embodiment. That is, the fusion type circuit patterns 70a-3 and 70b-3 are formed of the same metal fine particle fusion type conductive coating as in the first embodiment. The metal fine particle fusion type conductive coating is composed of metal silver fine particles. Is a coating film of metallic silver which is fused and continuous with each other, and its specific resistance is as small as 3 to 8 × 10 ⁻⁶ [Ω · cm], which is the same order as metallic silver.

  Next, the same material as that of the first embodiment is used for the surface of the fusion-type circuit patterns 70a-3 and 70b-3 and the transfer surface 65-3 of the surface layer 63-3 of the other transfer member 60-3. And resin-containing circuit pattern 40a-3, 40b-3, 40c-3 is formed by apply | coating resin-containing electrically conductive paste by screen printing with a formation method. However, as a coating method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing.

  Next, as shown in FIG. 9, by laminating the insulating substrate 30-3 and the transfer member 60-3, the adhesive coating 85-3 and the resin-containing circuit patterns 40a-3, 40b-3, 40c-3 are stacked. And are laminated. When the adhesive coating 85-3 is a hot melt type synthetic resin, the adhesive coating 85-3 and the resin-containing circuit pattern 40a are heated and pressed between the laminated insulating substrate 30-3 and the transfer member 60-3. −3, 40b-3, 40c-3 may be bonded, and when the adhesive coating 85-3 is an ultraviolet curable synthetic resin, the adhesive coating 85-3 of the laminated insulating substrate 30-3 is not provided. The adhesive coating 85-3 and the resin-containing circuit patterns 40a-3, 40b-3, and 40c-3 may be bonded by irradiating ultraviolet rays from the surface side, and the adhesive coating 85-3 is a thermosetting type. In the case of this synthetic resin, the adhesive coating 85-3 and the resin-containing circuit patterns 40a-3, 40b-3, and 40c-3 are bonded by curing the adhesive coating 85-3 in a semi-cured state having adhesiveness as it is. Just do

  Then, by separating the laminated insulating substrate 30-3 and the transfer member 60-3 from the transfer member 60-3, the fused circuit patterns 70a-3 and 70b-3 on the transfer surface 65-3 of the transfer member 60-3 and The resin-containing circuit patterns 40a-3, 40b-3, and 40c-3 are transferred to the insulating substrate 30-3 side, and as shown in FIG. 10, the resin-containing circuit patterns 40a- are formed on the insulating substrate 30-3. 3, 40b-3, 40c-3 and fused circuit patterns 70a-3, 70b-3, and first circuit patterns 80-3, 80-3, and resin-containing circuit pattern 40c-3. A circuit board 1-3 in which the second circuit pattern 81-3 is mixed is configured.

  Similarly to the first embodiment, the first circuit patterns 80-3 and 80-3 formed in this way have a specific resistance close to that of metallic silver, and therefore a high current of several tens of mA flows. Even if it exists, it is not necessary to make the line width of a circuit pattern thick compared with the resin containing type | mold circuit pattern which consists only of the conventional resin containing electrically conductive paste. Thereby, the first circuit pattern 80-3 can be used for high current, while the second circuit pattern 81-3 can be used for low current. That is, both circuit patterns 80-3 and 81-3 can be selectively formed as necessary, so that the material cost can be reduced and the manufacturing process can be simplified. In this embodiment, all of the resin-containing circuit patterns 40a-3 to 40c-3, the fusion-type circuit patterns 70a-3 and 70b-3, and the adhesive coating 85-3 are formed using screen printing. The pattern can be manufactured by the same process, the manufacturing process can be simplified, and the same manufacturing apparatus can be used. From these, the circuit board 1-3 can be easily manufactured and the manufacturing cost can be reduced.

  As described above, when the manufacturing method according to this embodiment is used, as in the first embodiment, the fused circuit patterns 70a-3 and 70b-3 once formed on the transfer surface 65-3 of the transfer member 60-3. Is transferred to the insulating substrate 30-3, so that the fused circuit patterns 70a-3 and 70b-3 can be formed also on the insulating substrate 30-3 having a low heat resistance such as a PET film. Further, since the adhesive coating 85-3 is formed on the upper surface of the insulating substrate 30-3, the resin-containing circuit patterns 40a-3, 40b-3, 40c-3 and the fused circuit patterns 70a-3, 70b-3 are formed. It can be easily transferred onto the insulating substrate 30-3. Further, the fusion-bonded circuit patterns 70a-3 and 70b-3 are reinforced by the flexible resin-containing circuit patterns 40a-3 and 40b-3 which are hard to crack, thereby preventing the insulating substrate 30-3 from bending. The point which can fully respond | correspond is the same as that of 1st embodiment.

  Also, the number of times the resin-containing circuit patterns 40a-3 to 40c-3 and the fusion-type circuit patterns 70a-3 and 70b-3 are printed a plurality of times (here, the number of times of printing means that the paste is printed once). By increasing the thickness of these patterns, a pattern with even lower resistance can be obtained with a narrow pattern width, thereby allowing a further high current to flow. become. Needless to say, the circuit board 1-3 according to this embodiment can also be applied to the flexible circuit board 100 as shown in FIG. 4 as in the first embodiment.

[Fourth embodiment]
FIG. 11 to FIG. 15 are principal part enlarged sectional views showing a method of manufacturing a circuit board 1-4 according to the fourth embodiment of the present invention, and FIG. 16 is a principal part enlarged sectional view of the completed circuit board 1-4. In this embodiment, the same or equivalent members as those in the first embodiment are given the same reference numerals (however, only subscripts are different). In this embodiment, two transfer members (first and second transfer members 60A-4 and 60B-4) are used, and a fused circuit formed on each of the transfer members 60A-4 and 60B-4. The patterns 70a-4 and 70b-4 and the resin-containing circuit patterns 40a-4, 40b-4, and 40c-4 are transferred onto the insulating substrate 30-4 by separate transfer processes. That is, in order to manufacture this circuit board 1-4, first, as shown in FIG. 11, a flexible insulating PET film (in addition to, for example, PPS film, PI film, PEN film, polyetherimide film, etc.). (Insulating substrate 30-4 having a thickness of, for example, 50 to 75 μm), a first transfer member 60A-4 having one surface as a transfer surface 65A-4, and a structure shown in FIG. A second transfer member 60B-4 having one surface as a transfer surface 65B-4 is prepared. Here, the material of the insulating substrate 30-4 and the materials of the first and second transfer members 60A-4 and 60B-4 are the same as those of the insulating substrate 30-1 and the transfer member 60-1 of the first embodiment. .

  Then, as shown in FIG. 11, an adhesive coating 85-4 made of an insulating material is applied to the surface of the same insulating substrate 30-4 as in the first embodiment by screen printing. However, the application method includes flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. The material of the adhesive coating 85-4 is the same hot-melt type synthetic resin as the adhesive coating 85-3 shown in the third embodiment (for example, polyester resin, acrylic resin, polystyrene resin, polyvinyl alcohol resin, vinyl chloride resin, etc. ), An ultraviolet curable synthetic resin, or a thermosetting synthetic resin (such as a phenol resin or a urethane resin). In the case of a hot melt type synthetic resin, it may be cured by heating at about 150 ° C. before being laminated on the first transfer member 60A-4, but an ultraviolet curable synthetic resin or a thermosetting type resin may be used. In the case of a synthetic resin, it is necessary to make it a semi-cured state having some tackiness by the same method as in the second embodiment without being completely cured.

  Next, as shown in FIG. 11, on the transfer surface 65A-4 of the surface layer 63A-4 of the first transfer member 60A-4, a fused circuit pattern 70a- composed of a metal fine particle fused conductive film. 4, 70b-4 are made of the same material and forming method as in the case of the fusion-type circuit patterns 70a-1 and 70b-1 of the first embodiment (screen printing is used for applying the paste. Similarly, other methods such as inkjet printing may be used.

  On the other hand, as shown in FIG. 14, resin-containing circuit patterns 40a-4, 40b-4, and 40c-4 are formed on the transfer surface 65B-4 on the surface layer 63B-4 of the second transfer member 60B-4. The same material and formation method as in the case of the resin-containing circuit patterns 40a-1, 40b-1, and 40c-1 of the first embodiment (screen printing is used for applying the paste. Other methods such as printing may be used. At this time, the resin-containing circuit patterns 40a-4 and 40b-4 are the insulating substrate 30-4 onto which the fused circuit patterns 70a-4 and 70b-4 are transferred and the second transfer member 60B-4. Are formed at the position of the second transfer member 60B-4 facing the fused circuit patterns 70a-4 and 70b-4 on the insulating substrate 30-4, and the resin-containing circuit pattern 40c. -4 is a second transfer that faces the fused circuit patterns 70a-4 and 70b-4 on the insulating substrate 30-4 when the insulating substrate 30-4 and the second transfer member 60B-4 face each other. It is formed at the position of the second transfer member 60B-4 other than the position of the member 60B-4.

  Further, a conductive adhesive coating 90-4 is applied by screen printing so as to cover at least the resin-containing circuit patterns 40a-4 to 40c-4 on the transfer surface 65B-4 of the second transfer member 60B-4. . However, as a coating method, there are inkjet printing, flexographic printing, offset printing, letterpress printing, intaglio printing, spray printing and the like in addition to screen printing. In this embodiment, the conductive adhesive coating 90-4 is also applied on the transfer surface 95B-4 on which the resin-containing circuit patterns 40a-4 to 40c-4 are not formed. The conductive adhesive film 90-4 is electrically conductive in the thickness direction by heating and pressurizing in the thickness direction similar to the conductive adhesive film 90-1 of the first embodiment (not electrically conductive in the surface direction). It is an anisotropic hot-melt type conductive adhesive film having the property of being bonded.

  First, as shown in FIG. 12, by laminating the insulating substrate 30-4 and the first transfer member 60A-4, the first transfer member 60A-4 is formed on the adhesive film 85-4 of the insulating substrate 30-4. The fused circuit patterns 70a-4 and 70b-4 are bonded. Thereafter, by separating the first transfer member 60A-4 from the laminated insulating substrate 30-4 and the first transfer member 60A-4, the transfer surface 65 of the first transfer member 60A-4 as shown in FIG. -4, the fused circuit patterns 70a-4 and 70b-4 are transferred to the insulating substrate 30-4 side.

  Next, as shown in FIG. 14, the insulating substrate 30-4 to which the fused circuit patterns 70 a-4 and 70 b-4 are transferred and the second transfer member 60 B- 4 are opposed to each other. By laminating, a part of the resin-containing circuit patterns 40a-4 and 40b-4 and the fused circuit patterns 70a-4 and 70b-4 are provided on the resin-containing circuit patterns 40a-4 and 40b-4. The other resin-containing circuit pattern 40c-4 is laminated on the adhesive film 85-4 via the conductive adhesive film 90-4. At this time, the surface of the portion directly formed on the surface of the transfer surface 65B-4 of the surface layer 63B-4 in the conductive adhesive coating 90-4 (the surface on the side facing the insulating substrate 30-4), and the insulating substrate Although it is described that there is a large gap 1 in the drawing of FIG. 15 between the surface of the adhesive coating 85-4 of 30-4, the gap l is actually a very small gap and is insulated. Since the substrate 30-4 and the transfer member 60B-4 are flexible, the surface of the conductive adhesive coating 90-4 and the surface of the adhesive coating 85-4 are extremely small gaps that are in contact with each other when pressed. Then, if the second transfer member 60B-4 and the insulating substrate 30-4 are sandwiched by the heating and pressing members A1 and A2 installed above and below, and heated and pressurized under the same conditions as in the first embodiment, When the hot-melt type conductive adhesive coating 90-4 is melted, the fused circuit patterns 70a-4 and 70b-4 and the resin-containing circuit patterns 40a-4 and 40b-4 are bonded, and at the same time, the resin-containing circuit. The pattern 40c-4 is adhered on the adhesive film 85-4 on the insulating substrate 30-4.

  Next, after removing the heating and pressing members A1 and A2, the second transfer member 60B-4 is separated from the laminated insulating substrate 30-4 and the second transfer member 60B-4 by separating the second transfer member 60B-4. -4 on the transfer surface 65-4, the resin-containing circuit patterns 40a-4, 40b-4, 40c-4 and the conductive adhesive coating 90-4 are all transferred to the insulating substrate 30-4 side. As shown in FIG. 4, a first circuit pattern 80-4 formed by laminating fusion-type circuit patterns 70a-4 and 70b-4 and resin-containing circuit patterns 40a-4 and 40b-4 on an insulating substrate 30-4. , 80-4 and the second circuit pattern 81-4 made of the resin-containing circuit pattern 40c-4 are mixed.

  Similarly to the first embodiment, the first circuit patterns 80-4 and 80-4 formed in this way also have a specific resistance close to that of metallic silver, and therefore a case where a high current of several tens of mA flows. Even if it exists, it is not necessary to make the line width of a circuit pattern thick compared with the resin containing type | mold circuit pattern which consists only of the conventional resin containing electrically conductive paste. Thereby, the first circuit pattern 80-4 can be used for high current, while the second circuit pattern 81-4 can be used for low current. That is, both circuit patterns 80-4 and 81-4 can be selectively formed as necessary, so that the material cost can be reduced and the manufacturing process can be simplified. In this embodiment, all of the resin-containing circuit patterns 40a-4 to 40c-4, the fused circuit patterns 70a-4 and 70b-4, the adhesive film 85-4, and the conductive adhesive film 90-4 are screen-printed. Since all the patterns can be manufactured by the same process, the manufacturing process can be simplified, and the same manufacturing apparatus can be used. From these, the manufacturing of the circuit board 1-4 is facilitated and manufactured. Cost can be reduced.

  If the above manufacturing method is used, the fused circuit patterns 70a-4 and 70b-4 once formed on the transfer surface 65A-4 of the transfer member 60A-4 are transferred to the insulating substrate 30-4 as in the first embodiment. Therefore, the fused circuit patterns 70a-4 and 70b-4 can be formed also on the insulating substrate 30-4 having a low heat resistance such as a PET film. Also, by laminating the fused circuit patterns 70a-4 and 70b-4 and the resin-containing circuit patterns 40a-4 and 40b-4, flexible resin-containing circuit patterns 40a-4 and 40b that are hard to crack. -4 reinforces the fusion-type circuit patterns 70a-4 and 70b-4, and thus can sufficiently cope with the bending of the insulating substrate 30-4, as in the first embodiment.

  Also, the number of times the resin-containing circuit patterns 40a-4 to 40c-4 and the fusion-type circuit patterns 70a-4 and 70b-4 are printed is a plurality of times. By increasing the thickness of these patterns, a pattern with even lower resistance can be obtained with a narrow pattern width, thereby allowing a further high current to flow. become.

  In this embodiment, the conductive adhesive coating 90-4 is formed on the resin-containing circuit patterns 40a-4 to 40c-4 on the surface of the transfer surface 65-4 of the second transfer member 60B-4. In addition, the conductive adhesive film 90-4 is transferred onto at least the surface of the insulating substrate 30-4, on the fused circuit patterns 70a-4 and 70b-4, and on the adhesive film 85-4 facing the resin-containing circuit pattern 40c-4. You may form in. In this case, when the transfer member 60-4 is separated from the insulating substrate 30-4 after being heated and pressurized between the insulating substrate 30-4 and the second transfer member 60B-4, it is formed on the transfer member 60-4 side. The resin-containing circuit patterns 40a-4, 40b-4, and 40c-4 are transferred onto the conductive adhesive film 90-4 provided on the insulating substrate 30-4 side.

  Further, as the resin-containing circuit patterns 40a-4, 40b-4, and 40c-4, the resin-containing circuit patterns 40a-2, 40b-2, and 40c-2 used in the second embodiment are used. If the circuit patterns 40a-4, 40b-4, and 40c-4 themselves serve as the conductive adhesive coating 90-4, the formation of the conductive adhesive coating 90-4 can be omitted. In this case, in FIG. 14 and FIG. 15, the second transfer member 60B-4 on which the conductive adhesive film 90-4 is not formed is laminated on the insulating substrate 30-4, and the fused circuit pattern 70a-4, The resin-containing circuit patterns 40a-4 and 40b-4 are laminated directly on 70b-4, and at the same time, the resin-containing circuit pattern 40c-4 is laminated directly on the adhesive film 85-4, and these laminated surfaces are bonded. Thereafter, the second transfer member 60B-4 may be separated from the insulating substrate 30-4.

  Needless to say, the circuit board 1-4 according to this embodiment can also be applied to the flexible circuit board 100 as shown in FIG. 4 as in the first embodiment.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, the metal fine particle fusion type conductive film constituting the fusion type circuit pattern is applied to the insulating substrate with a paste composed of a particulate silver compound (silver oxide fine particles, etc.), an organic silver compound and an organic solvent. However, the paste that can be used in the present invention is not limited to this example, and various modifications can be made. For example, the metal to be melted is not limited to silver, but copper and other metals (for example, gold, zinc, cadmium, palladium, iridium, ruthenium, osmium, rhodium, platinum, iron, cobalt, nickel, indium, tin, antimony, lead, bismuth) ) And mixtures thereof may be used.

The paste may be, for example, a paste made of an organic silver compound or other organic metal compound and an organic solvent or an aqueous solution in which silver oxide fine particles are not mixed. In other words, any material may be used as long as it heats at 140 ° C. to 250 ° C. to deposit metal fine particles from these organometallic compounds and fuse them together. Further, metal silver or other metal fine particles may be dispersed. That is, for example, as described in JP-A No. 2002-299833, as a paste, metal fine particles having an average particle diameter of 1 to 100 nm can be coordinated with the metal elements contained in the metal fine particles. A paste composition (paste) coated with an organic compound and stably dispersed in a liquid and sintered at a temperature of 250 ° C. or lower is used. The paste is applied onto an insulating substrate and heated at 140 ° C. to 250 ° C. A metal fine particle fusion-type conductive film may be formed by fusing the metal fine particles to each other. That is, in this example, instead of reducing the metal oxide fine particles, a paste in which the metal fine particles themselves are dispersed is used. Fine metal fine particles (nanoparticles) of silver and / or other metals having an average particle diameter of 1 to 100 nm are easily melted at a low heating temperature and fused together to form a continuous metal as in the above embodiment. A thin metal fine particle fusion-type conductive film is formed. The heating time is about 10 seconds to 120 minutes. The metal fine particle fusion-type conductive film thus formed has a specific resistance of about 7 × 10 ⁻⁶ [Ω · cm] (in the case of metal silver fine particles), which is as small as metal silver. Various pastes other than this example have been proposed, and any of these pastes may be used in the present invention. That is, in short, a metal or metal compound-containing paste is applied to an insulating substrate and heated at a heating temperature of 140 ° C. to 250 ° C., so that the metal fine particles present in the paste or the metal deposited from the metal compound A fused circuit pattern having any composition may be used as long as it is a fused circuit pattern in which fine particles are fused to each other.

  In each of the above embodiments, a part of the circuit pattern formed on the insulating substrate is a circuit pattern formed by laminating a fusion circuit pattern and a resin-containing circuit pattern. The circuit pattern may be a circuit pattern formed by laminating a fused circuit pattern and a resin-containing circuit pattern.

  In each of the above embodiments, an insulating synthetic resin film having flexibility is used as the insulating substrates 30-1 to 30-4, and a circuit pattern (first and second circuit patterns 80-1) is formed on the surface of the synthetic resin film. 80-4, 81-1 to 81-4) to provide flexible circuit boards 1-1 to 1-4, but the present invention is not limited to flexible circuit boards 1-1 to 1-4, It may be a circuit board in which circuit patterns (first and second circuit patterns) are provided on the surface of an insulating hard substrate such as glass, and is formed of a thin layer on the surface of a conductive metal substrate or the surface of an insulating substrate. It may be a circuit board in which a circuit pattern (first and second circuit patterns) is provided on the surface of the insulating substrate formed by coating the insulating layer by a printing method or a sputtering method.

  Moreover, in the said embodiment, although the thin-plate-shaped insulating substrate was used as the shape of the insulating substrates 30-1 to 30-4, the shape of the insulating substrate which can be used for this invention is not restricted to the insulating substrate of the said shape, lump shape, A three-dimensional insulating substrate such as a cylindrical shape may be used. That is, it may be a circuit board in which circuit patterns (first and second circuit patterns) are provided on the surface of a three-dimensional insulating substrate such as a block shape or a cylindrical shape.

It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-1 concerning 1st embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-1 concerning 1st embodiment of this invention. It is a principal part expanded sectional view of the circuit board 1-1 concerning 1st embodiment of this invention. It is a principal part perspective view which shows the circuit board 100 concerning one specific example of the circuit board 1-1, and the various components attached to this. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-2 concerning 2nd embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-2 concerning 2nd embodiment of this invention. It is a principal part expanded sectional view of the circuit board 1-2 concerning 2nd embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-3 concerning 3rd embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-3 concerning 3rd embodiment of this invention. It is a principal part expanded sectional view of the circuit board 1-3 concerning 3rd embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-4 concerning 4th embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-4 concerning 4th embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-4 concerning 4th embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-4 concerning 4th embodiment of this invention. It is a principal part expanded sectional view which shows the manufacturing method of the circuit board 1-4 concerning 4th embodiment of this invention. It is a principal part expanded sectional view of the circuit board 1-4 concerning 4th embodiment of this invention.

Explanation of symbols

1-1 Circuit board (flexible circuit board)
30-1 Insulating substrate 40a-1, 40b-1, 40c-1 Resin-containing circuit pattern 60-1 Transfer member 61-1 Hard plate 63-1 Surface layer 65-1 Transfer surface 70a-1, 70b-1 Fusion Mold circuit pattern 80-1 First circuit pattern 81-1 Second circuit pattern 90-1 Conductive adhesive coating 1-2 Circuit boards 40a-2, 40b-2, 40c-2 Resin-containing circuit pattern 30-2 Insulating board 65 -2 Transfer surface 60-2 Transfer members 70a-2, 70b-2 Fusing circuit pattern 1-3 Flexible circuit board (circuit board)
30-3 Insulating substrate 40a-3, 40b-3, 40c-3 Resin-containing circuit pattern 60-3 Transfer member 65-3 Transfer surface 70a-3, 70b-3 Fusing circuit pattern 85-3 Adhesive coating 1- 4 Flexible circuit board (circuit board)
30-4 Insulating substrate 40a-4, 40b-4, 40c-4 Resin-containing circuit pattern 60A-4 First transfer member 60B-4 Second transfer member 65-4 Transfer surfaces 70a-4, 70b-4 Wearable circuit pattern 85-4 Adhesive film 90-4 Conductive adhesive film

Claims (16)

Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the surface of the insulating substrate;
Metal deposited on the transfer surface of the transfer member by applying a paste containing a metal or a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., or metal deposited from the metal compound in the paste A step of fusing fine particles of each other to form a fused circuit pattern;
By laminating the insulating substrate and the transfer member, the resin-containing circuit pattern and the fusion-type circuit pattern are connected to each other via a conductive adhesive film previously formed on the fusion-type circuit pattern or the resin-containing type circuit pattern. Laminating steps;
The fused circuit pattern on the transfer surface of the transfer member is transferred to the insulated substrate side by separating the transfer member from the laminated insulated substrate and the transfer member, and thereby the resin-containing circuit pattern and the fused mold on the insulated substrate. Forming a circuit pattern formed by laminating the circuit pattern;
A method of manufacturing a circuit board, comprising: Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the surface of the insulating substrate;
When the transfer member and the insulating substrate are made to face each other, the metal or the transfer surface of the transfer member facing a part of the resin-containing circuit pattern of the resin-containing circuit patterns formed on the insulating substrate By applying a paste containing a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles deposited from the metal compound are fused to each other and fused. Forming a pattern circuit pattern;
A conductive adhesive film in which the part of the resin-containing circuit pattern and the fused circuit pattern are formed in advance on the fused circuit pattern or the resin-containing circuit pattern by laminating the transfer member and the insulating substrate. Laminating through,
The fused circuit pattern on the transfer surface of the transfer member is transferred to the insulated substrate side by separating the transfer member from the laminated insulated substrate and the transfer member, and thereby the resin-containing circuit pattern and the fused mold on the insulated substrate. Forming a first circuit pattern formed by laminating a circuit pattern and a second circuit pattern composed of a resin-containing circuit pattern; and
A method of manufacturing a circuit board, comprising: Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the surface of the insulating substrate;
Metal deposited on the transfer surface of the transfer member by applying a paste containing a metal or a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., or metal deposited from the metal compound in the paste A step of fusing fine particles of each other to form a fused circuit pattern;
Laminating the resin-containing circuit pattern and the fused circuit pattern by laminating the insulating substrate and the transfer member;
The fused circuit pattern on the transfer surface of the transfer member is transferred to the insulated substrate side by separating the transfer member from the laminated insulated substrate and the transfer member, and thereby the resin-containing circuit pattern and the fused mold on the insulated substrate. Forming a circuit pattern formed by laminating the circuit pattern;
A method of manufacturing a circuit board, comprising: Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the surface of the insulating substrate;
When the insulating substrate and the transfer member are made to face each other, a metal is placed at a transfer surface position of the transfer member that faces a part of the resin-containing circuit pattern of the resin-containing circuit patterns formed on the insulating substrate. Alternatively, by applying a paste containing a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles precipitated from the metal compound are fused to each other and melted. Forming a ring-shaped circuit pattern;
Laminating the part of the resin-containing circuit pattern and the fused circuit pattern by laminating the insulating substrate and the transfer member;
By transferring the transfer member from the laminated insulating substrate and the transfer member, the fused circuit pattern of the transfer member is transferred to the insulating substrate side, whereby the resin-containing circuit pattern and the fused circuit pattern are formed on the insulating substrate. Forming a mixed first circuit pattern and a second circuit pattern made of a resin-containing circuit pattern; and
A method of manufacturing a circuit board, comprising: Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming an adhesive film on the surface of the insulating substrate;
Metal deposited on the transfer surface of the transfer member by applying a paste containing a metal or a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., or metal deposited from the metal compound in the paste A step of fusing fine particles of each other to form a fused circuit pattern;
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder on the surface of the fusion-type circuit pattern;
Laminating the adhesive coating and the resin-containing circuit pattern by laminating the insulating substrate and the transfer member;
By separating the laminated insulating substrate and the transfer member from the transfer member, the fused circuit pattern and the resin-containing circuit pattern laminated on the transfer surface of the transfer member are transferred to the insulating substrate side, thereby Forming a circuit pattern in which a resin-containing circuit pattern and a fusion-type circuit pattern are laminated,
A method of manufacturing a circuit board, comprising: Prepare a transfer member whose surface is the transfer surface and an insulating substrate,
Forming an adhesive film on the surface of the insulating substrate;
Metal deposited on the transfer surface of the transfer member by applying a paste containing a metal or a metal compound and heating at a heating temperature of 140 ° C. to 250 ° C., or metal deposited from the metal compound in the paste A step of fusing fine particles of each other to form a fused circuit pattern;
A resin-containing circuit pattern is formed by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder to the surface of the fusion-type circuit pattern and the transfer surface of the other transfer member. Process,
Laminating the adhesive coating and the resin-containing circuit pattern by laminating the insulating substrate and the transfer member;
By separating the transfer member from the laminated insulating substrate and the transfer member, the fused circuit pattern and the resin-containing circuit pattern on the transfer surface of the transfer member are transferred to the insulating substrate side, thereby containing the resin on the insulating substrate. Forming a first circuit pattern obtained by laminating a mold circuit pattern and a fused circuit pattern and a second circuit pattern comprising a resin-containing circuit pattern,
A method of manufacturing a circuit board, comprising: First and second transfer members having a transfer surface as a transfer surface and an insulating substrate are prepared.
Forming an adhesive film on the surface of the insulating substrate;
By depositing a paste containing a metal or a metal compound on the transfer surface of the first transfer member and heating at a heating temperature of 140 ° C. to 250 ° C., precipitation from the metal fine particles or the metal compound present in the paste Forming a fused circuit pattern by fusing metal fine particles to each other;
Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on the transfer surface of the second transfer member;
After laminating the insulating substrate and the first transfer member, the fused circuit pattern of the first transfer member is adhered to the adhesive film of the insulating substrate, and then from the laminated insulating substrate and the first transfer member. Transferring the fused circuit pattern on the transfer surface of the first transfer member to the insulating substrate side by separating the first transfer member;
By laminating the insulating substrate onto which the fusion-type circuit pattern has been transferred and a second transfer member, the fusion-type circuit pattern and the resin-containing circuit pattern are laminated in direct contact with each other, or are previously fused. A step of laminating via a conductive adhesive film formed on a mold circuit pattern or a resin-containing circuit pattern;
By separating the second transfer member from the laminated insulating substrate and the second transfer member, the resin-containing circuit pattern on the transfer surface of the second transfer member is transferred to the insulating substrate side, and thereby on the insulating substrate. Forming a circuit pattern formed by laminating a fused circuit pattern and a resin-containing circuit pattern;
A method of manufacturing a circuit board, comprising: First and second transfer members having a transfer surface as a transfer surface and an insulating substrate are prepared.
Forming an adhesive film on the surface of the insulating substrate;
By depositing a paste containing a metal or a metal compound on the transfer surface of the first transfer member and heating at a heating temperature of 140 ° C. to 250 ° C., precipitation from the metal fine particles or the metal compound present in the paste Forming a fused circuit pattern by fusing metal fine particles to each other;
The position of the second transfer member facing the fusion circuit pattern formed on the transfer surface of the first transfer member when the first transfer member and the second transfer member are opposed to each other, and Forming a resin-containing circuit pattern by applying a resin-containing conductive paste in which conductive powder is dispersed in a resin binder at the position of the second transfer member other than
After laminating the insulating substrate and the first transfer member, the fused circuit pattern of the first transfer member is adhered to the adhesive film of the insulating substrate, and then from the laminated insulating substrate and the first transfer member. Transferring the fused circuit pattern on the transfer surface of the first transfer member to the insulating substrate side by separating the first transfer member;
By laminating the insulating substrate onto which the fusion-type circuit pattern has been transferred and the second transfer member, a part of the resin-containing circuit pattern and the fusion-type circuit pattern are laminated in direct contact with each other, or previously fused. Laminating via a conductive adhesive film formed on a wearable circuit pattern or a resin-containing circuit pattern;
By separating the second transfer member from the laminated insulating substrate and the second transfer member, the resin-containing circuit pattern on the transfer surface of the second transfer member is transferred to the insulating substrate side, and thereby on the insulating substrate. Forming a first circuit pattern formed by laminating a fusion-type circuit pattern and a resin-containing circuit pattern and a second circuit pattern formed of a resin-containing circuit pattern; and
A method of manufacturing a circuit board, comprising: In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern is a paste containing a metal or a metal compound on a resin-containing circuit pattern made of a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder, with a conductive adhesive film interposed between 140 ° C. and 250 ° C. It is constituted by laminating a fusion type circuit pattern in which metal fine particles existing in the paste or metal fine particles precipitated from the metal compound are fused to each other by heating at a heating temperature of Feature circuit board. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern is a paste containing a metal or a metal compound on a resin-containing circuit pattern made of a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder at a temperature of 140 ° C. to 250 ° C. via a conductive adhesive film. A first circuit pattern formed by laminating a fusion-type circuit pattern in which metal fine particles present in the paste or metal fine particles deposited from the metal compound are fused to each other by heating at a heating temperature; and a resin A circuit board comprising a second circuit pattern composed of a contained circuit pattern. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
In the circuit pattern, a paste containing a metal or a metal compound is heated at a heating temperature of 140 ° C. to 250 ° C. on a resin-containing circuit pattern made of a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder. A circuit board comprising: a fusion-type circuit pattern in which metal fine particles present in the paste or metal fine particles precipitated from the metal compound are fused together. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern is obtained by heating a paste containing a metal or a metal compound at a heating temperature of 140 ° C. to 250 ° C. on a resin-containing circuit pattern made of a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder. A first circuit pattern formed by laminating a fusion type circuit pattern formed by fusing together metal fine particles present in the paste or metal fine particles precipitated from the metal compound, and a resin-containing type circuit pattern. A circuit board characterized by being mixed with a second circuit pattern. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern forms a resin-containing circuit pattern made of a resin-containing conductive paste in which conductive powder is dispersed in a resin binder on an adhesive film formed on the surface of the insulating substrate, and the resin-containing circuit By heating a paste containing a metal or a metal compound on the pattern at a heating temperature of 140 ° C. to 250 ° C., the metal fine particles present in the paste or the metal fine particles precipitated from the metal compound are fused together. A circuit board, comprising: a laminated fused circuit pattern. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern forms a resin-containing circuit pattern made of a resin-containing conductive paste obtained by dispersing conductive powder in a resin binder on an adhesive film formed on the surface of the insulating substrate. By heating a paste containing a metal or a metal compound at a heating temperature of 140 ° C. to 250 ° C., the fine metal particles present in the paste or the fine metal particles precipitated from the metal compound are fused together. A first circuit pattern formed by laminating a fusion-type circuit pattern and a second circuit pattern formed by forming a resin-containing circuit pattern on an adhesive film formed on the surface of the insulating substrate. A circuit board characterized by being made. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern includes fine particles of metal present in the paste by heating a paste containing a metal or a metal compound at a heating temperature of 140 ° C. to 250 ° C. on an adhesive film formed on the surface of the insulating substrate. Alternatively, from a resin-containing conductive paste formed by fusing metal fine particles precipitated from the metal compound to each other and dispersing conductive powder on a resin binder on the fusing circuit pattern A circuit board characterized in that the resin-containing circuit pattern is directly laminated or laminated via a conductive adhesive film. In a circuit board in which a circuit pattern is provided on the surface of an insulating substrate,
The circuit pattern is formed by heating a paste containing a metal or a metal compound on an adhesive film formed on the surface of the insulating substrate at a heating temperature of 140 ° C. to 250 ° C. A fusion-type circuit pattern is formed by fusing metal fine particles precipitated from the metal compound together, and a conductive paste containing resin in which conductive powder is dispersed in a resin binder on the fusion-type circuit pattern. A first circuit pattern configured by directly laminating a resin-containing circuit pattern or laminating via a conductive adhesive film, and a resin-containing circuit pattern on the adhesive film formed on the surface of the insulating substrate A circuit board comprising a second circuit pattern formed and mixed.

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