JPS6149473U - - Google Patents

Info

Publication number
JPS6149473U
JPS6149473U JP13308784U JP13308784U JPS6149473U JP S6149473 U JPS6149473 U JP S6149473U JP 13308784 U JP13308784 U JP 13308784U JP 13308784 U JP13308784 U JP 13308784U JP S6149473 U JPS6149473 U JP S6149473U
Authority
JP
Japan
Prior art keywords
temporary substrate
substrate
resin
circuit board
smoothing circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13308784U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13308784U priority Critical patent/JPS6149473U/ja
Publication of JPS6149473U publication Critical patent/JPS6149473U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Adjustable Resistors (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Contacts (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は何れも本考案の1実施例による平滑化回
路板に係り、第1図は要部平面図、第2図a〜g
は製造工程を示す説明図である。 1…基材、2…保護層、3…接点、4…集電用
の低抗体、5…摺動用の抵抗体、6…リード電極
、7…仮基板、8…レジスト、8a…開孔。
The drawings all relate to a smoothing circuit board according to an embodiment of the present invention, and FIG. 1 is a plan view of the main part, and FIG. 2 is a to g.
FIG. 2 is an explanatory diagram showing the manufacturing process. DESCRIPTION OF SYMBOLS 1... Base material, 2... Protective layer, 3... Contact, 4... Low antibody for current collection, 5... Resistor for sliding, 6... Lead electrode, 7... Temporary substrate, 8... Resist, 8a... Opening.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 仮基板上に印刷・焼成された摺動用のカーボン
樹脂系の低抗体と、同じく仮基板上に金メツキで
形成されたスイツチング用の接点とを、樹脂製基
板に表面面一となるよう転写してなる平滑化回路
板。
The sliding carbon resin-based low antibody printed and fired on the temporary substrate and the switching contacts formed with gold plating on the temporary substrate are transferred flush to the resin substrate. smoothing circuit board.
JP13308784U 1984-09-01 1984-09-01 Pending JPS6149473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13308784U JPS6149473U (en) 1984-09-01 1984-09-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13308784U JPS6149473U (en) 1984-09-01 1984-09-01

Publications (1)

Publication Number Publication Date
JPS6149473U true JPS6149473U (en) 1986-04-03

Family

ID=30691639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13308784U Pending JPS6149473U (en) 1984-09-01 1984-09-01

Country Status (1)

Country Link
JP (1) JPS6149473U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108129A (en) * 2004-09-30 2006-04-20 Teikoku Tsushin Kogyo Co Ltd Method of manufacturing circuit board, and circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108129A (en) * 2004-09-30 2006-04-20 Teikoku Tsushin Kogyo Co Ltd Method of manufacturing circuit board, and circuit board

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