JPS6149473U - - Google Patents
Info
- Publication number
- JPS6149473U JPS6149473U JP13308784U JP13308784U JPS6149473U JP S6149473 U JPS6149473 U JP S6149473U JP 13308784 U JP13308784 U JP 13308784U JP 13308784 U JP13308784 U JP 13308784U JP S6149473 U JPS6149473 U JP S6149473U
- Authority
- JP
- Japan
- Prior art keywords
- temporary substrate
- substrate
- resin
- circuit board
- smoothing circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000009499 grossing Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Adjustable Resistors (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Contacts (AREA)
Description
図面は何れも本考案の1実施例による平滑化回
路板に係り、第1図は要部平面図、第2図a〜g
は製造工程を示す説明図である。
1…基材、2…保護層、3…接点、4…集電用
の低抗体、5…摺動用の抵抗体、6…リード電極
、7…仮基板、8…レジスト、8a…開孔。
The drawings all relate to a smoothing circuit board according to an embodiment of the present invention, and FIG. 1 is a plan view of the main part, and FIG. 2 is a to g.
FIG. 2 is an explanatory diagram showing the manufacturing process. DESCRIPTION OF SYMBOLS 1... Base material, 2... Protective layer, 3... Contact, 4... Low antibody for current collection, 5... Resistor for sliding, 6... Lead electrode, 7... Temporary substrate, 8... Resist, 8a... Opening.
Claims (1)
樹脂系の低抗体と、同じく仮基板上に金メツキで
形成されたスイツチング用の接点とを、樹脂製基
板に表面面一となるよう転写してなる平滑化回路
板。 The sliding carbon resin-based low antibody printed and fired on the temporary substrate and the switching contacts formed with gold plating on the temporary substrate are transferred flush to the resin substrate. smoothing circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13308784U JPS6149473U (en) | 1984-09-01 | 1984-09-01 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13308784U JPS6149473U (en) | 1984-09-01 | 1984-09-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6149473U true JPS6149473U (en) | 1986-04-03 |
Family
ID=30691639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13308784U Pending JPS6149473U (en) | 1984-09-01 | 1984-09-01 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6149473U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006108129A (en) * | 2004-09-30 | 2006-04-20 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing circuit board, and circuit board |
-
1984
- 1984-09-01 JP JP13308784U patent/JPS6149473U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006108129A (en) * | 2004-09-30 | 2006-04-20 | Teikoku Tsushin Kogyo Co Ltd | Method of manufacturing circuit board, and circuit board |
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