JP4524633B2 - 研磨液の供給方法 - Google Patents
研磨液の供給方法 Download PDFInfo
- Publication number
- JP4524633B2 JP4524633B2 JP2005053620A JP2005053620A JP4524633B2 JP 4524633 B2 JP4524633 B2 JP 4524633B2 JP 2005053620 A JP2005053620 A JP 2005053620A JP 2005053620 A JP2005053620 A JP 2005053620A JP 4524633 B2 JP4524633 B2 JP 4524633B2
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- Japan
- Prior art keywords
- polishing liquid
- container
- polishing
- supply line
- liquid supply
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2 :容器
3 :循環装置
31:吸引管
32:吐出管
33:流路
34:継手
4 :ベローズポンプ
5 :ジェットポンプ
51:ノズル部
52:デフューザ部
53:吸込口
6 :圧力計
Claims (2)
- 半導体ウエハの研磨工程に至る研磨液供給ラインに対し、主に純水および砥粒から成り且つ円筒状の可搬式容器に収容されて砥粒が沈降している研磨液を前記容器から供給する方法であって、前記研磨液供給ラインの一部に前記容器を配置し、前記研磨液供給ラインに設けられたポンプの吸引によって前記容器から研磨液を取り出すにあたり、前記容器に対し、当該容器の上端から挿入される吸引管および吐出管の間の流路にベローズポンプを介装して成り且つ前記吐出管の先端にジェットポンプが付設された着脱可能な循環装置を取り付け、前記ジェットポンプを前記容器内の底部近傍で且つ周壁近傍に配置し、前記ジェットポンプから研磨液を略水平方向に噴射することにより、前記循環装置に研磨液を循環させつつ、前記ジェットポンプにより前記容器内の研磨液を攪拌することを特徴とする研磨液の供給方法。
- 研磨液がセリア系またはアルミナ系の研磨液である請求項1に記載の研磨液の供給方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005053620A JP4524633B2 (ja) | 2005-02-28 | 2005-02-28 | 研磨液の供給方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005053620A JP4524633B2 (ja) | 2005-02-28 | 2005-02-28 | 研磨液の供給方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006237508A JP2006237508A (ja) | 2006-09-07 |
JP4524633B2 true JP4524633B2 (ja) | 2010-08-18 |
Family
ID=37044786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005053620A Active JP4524633B2 (ja) | 2005-02-28 | 2005-02-28 | 研磨液の供給方法 |
Country Status (1)
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JP (1) | JP4524633B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5665828B2 (ja) * | 2012-10-18 | 2015-02-04 | 株式会社東芝 | 電池用活物質、非水電解質電池および電池パック |
CN115138234A (zh) * | 2022-06-27 | 2022-10-04 | 上海华力集成电路制造有限公司 | 用于铝化学机械研磨工艺的研磨液混合装置及方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424537B2 (ja) * | 1975-05-09 | 1979-08-22 | ||
JPS5759052U (ja) * | 1980-09-26 | 1982-04-07 | ||
JPH03208555A (ja) * | 1990-01-12 | 1991-09-11 | Takatori Haitetsuku:Kk | ワイヤソーの砥液循環供給装置 |
JP2583763Y2 (ja) * | 1993-06-30 | 1998-10-27 | 日立精工株式会社 | クーラント供給装置 |
JP2003159650A (ja) * | 2001-11-22 | 2003-06-03 | Takatori Corp | ワイヤソー用スラリータンク |
JP2003197577A (ja) * | 2001-12-28 | 2003-07-11 | Matsushita Environment Airconditioning Eng Co Ltd | 研磨用流体の供給装置及び供給方法 |
-
2005
- 2005-02-28 JP JP2005053620A patent/JP4524633B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5424537B2 (ja) * | 1975-05-09 | 1979-08-22 | ||
JPS5759052U (ja) * | 1980-09-26 | 1982-04-07 | ||
JPH03208555A (ja) * | 1990-01-12 | 1991-09-11 | Takatori Haitetsuku:Kk | ワイヤソーの砥液循環供給装置 |
JP2583763Y2 (ja) * | 1993-06-30 | 1998-10-27 | 日立精工株式会社 | クーラント供給装置 |
JP2003159650A (ja) * | 2001-11-22 | 2003-06-03 | Takatori Corp | ワイヤソー用スラリータンク |
JP2003197577A (ja) * | 2001-12-28 | 2003-07-11 | Matsushita Environment Airconditioning Eng Co Ltd | 研磨用流体の供給装置及び供給方法 |
Also Published As
Publication number | Publication date |
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JP2006237508A (ja) | 2006-09-07 |
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