JP4524474B2 - Elastic wave device and manufacturing method thereof - Google Patents

Description

  The present invention relates to an acoustic wave device and a manufacturing method thereof, and more particularly to an acoustic wave device including a sealing resin portion having a cavity above an acoustic wave element and a manufacturing method thereof.

  The acoustic wave device is, for example, various circuits that process radio signals in a frequency band of 45 MHz to 2 GHz, such as a transmission bandpass filter, a reception bandpass filter, a local oscillation filter, an antenna duplexer, an intermediate frequency filter, an FM modulator, and the like. It is used for. In recent years, these signal processing devices have been miniaturized, and electronic components such as acoustic wave devices used are also required to be miniaturized. As an acoustic wave element used for an acoustic wave element device, a surface acoustic wave (SAW) element in which a interdigital electrode (IDT) or reflector is formed using a metal film on a piezoelectric substrate, or a piezoelectric film in which a piezoelectric thin film is sandwiched between metal electrodes. Examples include a thin film resonator (FBAR) element.

  In particular, in portable electronic devices such as mobile telephone terminals, electronic parts are increasingly used as modules. Modularization is performed by surface mounting electronic components and sealing them with resin for cost reduction. Therefore, there is a demand for an acoustic wave device that can be surface-mounted and can withstand the pressure during modular resin sealing. At the same time, in order to maintain the characteristics of the acoustic wave element, it is required to provide a cavity on the upper surface of the functional part (vibration part) of the acoustic wave element. The functional part of the acoustic wave element is an IDT electrode finger in the surface acoustic wave element, and an area where the upper and lower electrodes sandwich the piezoelectric thin film in the piezoelectric thin film resonator element.

In order to satisfy such a requirement, a method of forming a structure (so-called hollow structure) provided with a sealing resin portion having a cavity in contact with a functional portion in an acoustic wave element has been proposed. Patent Document 1 discloses a method of forming a hollow structure by forming a dissolving resin in a region to be a cavity on an acoustic wave element, forming an upper plate on the dissolving resin, and then removing the dissolving resin. (Conventional example 1) is disclosed. In Patent Document 2, a frame structure surrounding the electrical structure element is formed, an auxiliary film is pasted on the frame structure so that the electrical structure element is hollow, and a resin layer is formed thereon. A method (conventional example 2) for forming a hollow structure by removing the frame structure other than the roof portion is disclosed. In Patent Document 3, a resin film is pasted on a piezoelectric substrate on which an acoustic wave element is formed, a resin film on an upper part of a functional part of the substrate on which a plurality of acoustic wave elements are provided is opened, and a circuit board is bonded onto the resin film. A method of forming a hollow structure (conventional example 3) is disclosed. In Patent Document 4, a photosensitive resin is formed on a substrate on which a plurality of acoustic wave elements are provided, the photosensitive resin at the upper part of the functional part of the acoustic wave element is opened, and the substrate of the wiring board assembly is mounted thereon. A method of forming a hollow structure by dividing by dicing (conventional example 4) is disclosed. Patent Document 5 discloses a method of using different resins for the surrounding wall that surrounds the acoustic wave element and the lid for forming the hollow structure. Further, a technique (prior art 5) is disclosed in which a support is provided on a part of the upper surface of the lid in order to prevent the lid from swelling due to a difference in thermal expansion coefficient between the surrounding wall and the lid. ing.
Japanese Patent No. 3291406 Special table 2003-523082 gazette Japanese Patent No. 3196693 Japanese Patent No. 3225906 JP-A-10-93383

  The elastic wave devices formed by the methods of Conventional Examples 1 to 4 cannot withstand the pressure applied during modularization, and the hollow structure is deformed. On the other hand, the method of Conventional Example 5 is intended to suppress the deformation of the hollow structure during modularization. However, its formation is difficult.

  The present invention has been made in view of such a problem, and an object thereof is to provide an elastic wave device having a hollow structure that is not deformed by pressure during modularization and a method for manufacturing the same.

The present invention provides an acoustic wave element provided on the surface of a piezoelectric substrate or a piezoelectric film, a first resin part provided on the piezoelectric substrate and having a cavity on the acoustic wave element, and on the first resin part A provided second resin portion having a modulus of elasticity greater than that of the first resin portion, and a connection electrically connected to the acoustic wave element provided in an opening penetrating the first resin portion. And the second resin part is provided so as to include the entire area where the cavity is projected on the upper surface of the first resin part, and all the edges of the first resin part and the opening part The acoustic wave device is provided apart from all edges of the elastic wave device. According to this invention, since the 2nd resin part is provided in the upper part of the cavity of the 1st resin part, it can suppress that a hollow structure deform | transforms. In addition, the second resin portion has a smaller strain than the first resin portion, and therefore, the deformation of the hollow structure can be further suppressed. Moreover, it can suppress that a residue is formed in the opening part which should form the connection part of a 1st resin part when forming a 2nd resin part.

  The said structure WHEREIN: A said 2nd resin part can be set as the structure containing a filler. According to this configuration, the elastic modulus of the second resin portion can be increased.

  The said structure WHEREIN: A said 2nd resin part can be set as the structure which is photosensitive resin. According to this configuration, the second resin portion can be easily formed by exposure and development.

  The said structure WHEREIN: The said filler can be set as the structure which is a silica filler. According to this configuration, according to this configuration, the elastic modulus of the second resin portion can be further improved.

  The said structure WHEREIN: The said 1st resin part and the said 2nd resin part can be set as the structure containing any one of an epoxy resin and a polyimide resin. According to this configuration, the first resin portion and the second resin portion can be formed inexpensively and easily.

The present invention includes a step of forming an acoustic wave element on a piezoelectric substrate or a piezoelectric film, a step of forming a first resin portion having a cavity on the acoustic wave element on the piezoelectric substrate or the piezoelectric film, look including the whole region defined by projecting the cavity on the upper surface of the first resin section, and wherein the first resin portion to be formed all edges and the elastic wave device and connecting portions for electrically connecting the first resin portion Forming a second resin part having an elastic modulus larger than that of the first resin part so as to be separated from all edges of the opening part, and connecting the connection part to the opening part of the first resin part. And forming the acoustic wave device. According to the present invention, since the second resin part is formed in the upper part of the cavity of the first resin part, it is possible to suppress the deformation of the hollow structure.

  In the above configuration, the step of forming the first resin portion includes a step of forming a first resin film having an opening in the region to be the cavity on the piezoelectric substrate or the piezoelectric film, and a step on the first resin film. And forming a second resin film so that the opening remains as a cavity, removing a predetermined region of the second resin film, and forming the first resin film and the second resin film by the first resin film and the second resin film. Forming the resin portion, and forming the second resin portion includes forming a third resin film, which is a photosensitive resin film, on the second resin film, and the third resin film. And a step of developing the third resin film and forming the second resin portion from the third resin film. According to this structure, the 1st resin part and 2nd resin part which have a cavity can be formed easily.

  In the above configuration, the second resin film is a photosensitive resin film, and the step of forming the first resin portion from the first resin film and the second resin film includes forming a predetermined region of the second resin film. And exposing the predetermined region of the second resin film by exposing the predetermined region of the second resin film, and developing the second resin film to form the first resin portion from the first resin film and the second resin film. The step of forming is performed before the step of forming the third resin film, the step of developing the second resin film, and the step of forming the first resin portion from the first resin film and the second resin film includes The third resin film can be developed and formed at the same time as the second resin portion is formed from the third resin film. According to this configuration, the development of the second resin film and the third resin film can be performed at a time. Therefore, the manufacturing process can be shortened.

  ADVANTAGE OF THE INVENTION According to this invention, the elastic wave device which has a hollow structure which does not deform | transform with the pressure in the case of modularization, and its manufacturing method can be provided.

  First, an experiment conducted by the inventor in order to clarify the problems of the conventional examples 1 to 5 will be described. FIG. 1A to FIG. 1C are diagrams showing an acoustic wave device according to Comparative Example 1 used in the experiment. 1A is a plan view, FIG. 1B is a cross-sectional view taken along the line AA in FIG. 1A, and FIG. 1C is a cross-sectional view taken along the line BB in FIG. 1A shows the acoustic wave element 12, the wiring 16, and the cavity 18 through the resin portion 20, and the acoustic wave element 12 and the wiring 16 are indicated by a solid line, and the cavity 18 is indicated by a broken line. Referring to FIGS. 1A and 1B, an acoustic wave element 12 made of a metal film, such as an IDT and a reflector, is provided on the surface of the piezoelectric substrate 10, and an acoustic wave is further formed on the piezoelectric substrate 10. A resin portion 20 having a cavity 18 is provided on the functional portion of the element 12.

  With reference to FIG. 1A and FIG. 1C, a wiring 16 is formed on the piezoelectric substrate 10, and a resin portion 20 is provided on the wiring 16. A plug metal 30 penetrating the resin portion 20 is provided, and the acoustic wave element 12 and the plug metal 30 are connected by the wiring 16 and the electrode pad 17 on the wiring 16. Solder balls 32 are provided on the plug metal 30. As described above, the acoustic wave element 12 is sealed by the resin portion 20 having a hollow structure, and is connected to the solder ball 32 via the wiring 16 and the plug metal 30. In the acoustic wave device according to Comparative Example 1, the height of the resin portion 20 is about 90 μm, the height of the cavity 18 is about 30 μm, and the width of the cavity 18 is about 500 μm.

  With reference to FIG. 2A to FIG. 2F, a process of forming the resin portion 20 of the acoustic wave device according to Comparative Example 1 will be described. 2 (a) to 2 (c) are cross-sectional views corresponding to the AA cross section of FIG. 1 (a), and FIGS. 2 (d) to 2 (f) are B- It is sectional drawing equivalent to B cross section. 2A and 2D, a first resin film 19 having photosensitivity and containing a novolac type epoxy resin is formed on the piezoelectric substrate 10 on which the acoustic wave element 12 and the wiring 16 are formed. Application is performed using a spin coat method so as to have a film thickness of about 30 μm. Then dry. By exposing and developing, the first resin film 19 on the acoustic wave element 12, the cutting region 64, and the electrode pad 17 is removed. As a result, an opening 60 is formed in the first resin film 19 on the acoustic wave element 12, an opening 62 is formed on the electrode pad 17, and an opening is formed on the cutting region 64. Further, the first resin film 19 is cured by heating in a nitrogen atmosphere at about 200 ° C. for about 1 hour.

  2B and 2E, a film-like photosensitive novolac epoxy having a thickness of about 60 μm so as to hold the openings 60, 62 and the like on the first resin film 19. A second resin film 21 containing a resin is attached using a laminating method. As a result, the opening 60 becomes the cavity 18 and the opening 62 becomes the cavity 66. With reference to FIG. 2C and FIG. 2F, an opening is formed in the cavity on the cutting region 64 formed in the first resin film 19 and in the second resin film 21 on the cavity 66 by development exposure. Is provided. Thereby, the resin part 20 having the cavity 18 on the acoustic wave element 12 and the opening 68 in which the plug metal 30 is to be formed on the electrode pad 17 is formed.

  Since the acoustic wave device according to Comparative Example 1 is protected by the resin part 20 having the cavity 18 on the functional part of the acoustic wave element 12, the functional part of the acoustic wave element 12 is sealed when resin-sealed for modularization. Is protected by a hollow structure. Further, a plug metal 30 is provided on the resin portion 20, and the plug electrode 30 connects the solder ball 32 formed on the resin portion 20 and the acoustic wave element 12. Since the plug metal 30 is formed by filling the opening 68 surrounded by the resin portion 20 with metal, the plug metal 30 can be easily formed. Since the solder ball 32 is provided on the resin part 20, the solder ball 32 can be made higher than the upper surface of the resin part 20, and surface mounting can be performed.

An experiment was conducted to determine whether such an acoustic wave device can withstand modular resin sealing. First, referring to FIG. 3A, the acoustic wave device having the resin portion 20 on the piezoelectric substrate 10 was attached to the printed board 70. Usually, when modularizing, the resin portion 20 is attached to the printed board 70. In this experiment, the piezoelectric substrate 10 is attached to the printed board 70 in order to make it easy to confirm the deformation of the hollow structure. With reference to FIG. 3B, the printed board 70 to which the acoustic wave device was attached was attached in the transfer mold 72. A thermosetting epoxy resin 80 containing a filler heated to 175 ° C. was sealed in a sealing resin injection mold 74. A pressure of 70 kg / cm ² was applied to the thermosetting epoxy resin 80 using a plunger 76 and pushed into the transfer mold die 72. At the time of modular resin sealing, the temperature of the resin 80 is generally 150 ° C. to 200 ° C., and the pressure of the resin 80 to be sealed is generally 30 to 100 Kg / cm ² . In this experiment, the value at the center of these values is used. In this way, the pressure applied during modularization was applied to the acoustic wave device.

  FIG. 4 is a schematic diagram of a cross-sectional SEM photograph of the acoustic wave device after the experiment. In the resin part 20 provided on the piezoelectric substrate 10 by the epoxy resin 80 containing the filler 82, the cavity 18 is crushed and the resin part 20 is deformed. This is presumably because the resin part 20 has the cavity 18 and thus the resin part 20 cannot withstand the pressure of the epoxy resin 80 and is plastically deformed. The elastic modulus of the first resin film 19 and the second resin film 21 used in the elastic wave device according to Comparative Example 1 is 2.4 MPa at room temperature, and 900 MPa at 150 to 200 ° C., which is a temperature applied when modularizing. It will drop to. Thus, with a general resin, the elastic modulus decreases when the temperature becomes high. For this reason, at the time of modular resin sealing, it was thought that the resin part 20 might be plastically deformed by the temperature and pressure.

  Therefore, the deformation state of the hollow structure of the acoustic wave device according to Comparative Example 1 was investigated. With reference to Fig.5 (a), the indenter of the dynamic micro hardness tester (made by Shimadzu Corporation) was pushed into the ceiling part of the elastic wave device which concerns on the comparative example 1. FIG. The amount of dent in the ceiling at this time was D. As described above, when the dent amount D of the ceiling portion was changed, the deformation was not restored when the dent amount D of the ceiling portion exceeded 10 μm, and it was found to be completely plastically deformed when it exceeded 12 μm.

  Furthermore, using a model having the same dimensions as the resin part 20 of Comparative Example 1, the amount of ceiling depression D with respect to the elastic modulus of the resin part 20 when a pressure of 70 kg / cm 2 was applied to the ceiling part of the resin part 20 was calculated. . FIG. 5B shows the result. For the calculation, simulation software ANSYS (trade name) using a finite element was used, and the resin part 20 was assumed to be a complete elastic body. When the temperature of the resin is 900 MPa, which is an elastic modulus of 150 ° C. to 200 ° C., the amount of recess in the ceiling is 22 μm (point A in FIG. 5B). Thus, when the elastic modulus of the resin is 900 MPa, the amount of recess in the ceiling part greatly exceeds 12 μm, which is the elastic limit of the ceiling part. Considering the above, at the time of molding the transfer mold, the elastic modulus of the ceiling portion of the resin portion 20 is reduced due to overheating, and the amount of depression of the ceiling portion exceeds the elastic limit due to pressure, and the resin portion 20 is plastic as shown in FIG. It is thought that it has led to deformation.

  In order that the ceiling part of the resin part 20 does not exceed the elastic limit, the elastic modulus of the ceiling part of the resin part 20 is preferably 1.8 GPa or more from FIG. Thus, the resin of the ceiling part of the resin part 20 is required to have a modulus of elasticity about twice that of a general resin.

  As a means for improving the elastic modulus of the resin at low cost, there is a method of adding a filler to the resin. Then, the elasticity modulus was investigated using resin which added the silica filler whose particle size is 0.01 micrometer-8 micrometers and whose average particle diameter is about 4 micrometers. FIG. 6 shows the elastic modulus normalized by the resin alone before adding the filler to the ratio of the filler added to the resin (weight ratio to the resin). The normalized elastic modulus increases rapidly when the added amount of filler is 40% by weight or more, and the normalized elastic modulus exceeds 2 at 45% by weight or more. In this way, by using a resin with an added amount of filler of 45% by weight or more for the ceiling portion of the resin portion 20, even when modularized, the amount of recess in the ceiling portion of the resin portion 20 is as shown in FIG. It can be within the range of elastic deformation.

  On the other hand, FIG. 7 shows the viscosity of the resin added with the filler normalized by the viscosity of the single resin not added with the filler with respect to the ratio of the filler added to the resin (weight ratio to the resin). When the filler is added, the viscosity of the resin increases. When the added amount of the filler exceeds 60% by weight, the viscosity of the resin rapidly increases, and it is difficult to apply by spin coating. For this reason, the measurement of the viscosity of 60 weight% or more is not performed. As described above, the formation of the resin in which the added amount of the filler exceeds 60% by weight is performed using a printing machine or the like, resulting in an increase in manufacturing cost.

  In the acoustic wave device according to Comparative Example 2, the resin part 20 was formed using a resin to which 45 wt% to 60 wt% of filler was added to the ceiling part. FIG. 8A to FIG. 8F are cross-sectional views for explaining a process of forming a resin portion of the acoustic wave device according to the second embodiment. 8 (a) and 8 (d) are the same as FIGS. 2 (a) and 2 (d) of Comparative Example 1, and the same members are denoted by the same reference numerals and description thereof is omitted. Referring to FIGS. 8B and 8E, a second resin film containing a photosensitive novolak type epoxy resin having a film thickness of about 60 μm to which 45 wt% to 60 wt% of silica filler is added. 21a is pasted using a laminating method. Other configurations are the same as those in FIG. 2B and FIG.

  With reference to FIG. 8C and FIG. 8F, the second resin film is used by using a mask to provide openings in the cavity 66 and the cutting region 64 of the region of the second resin film 21a where the plug metal 30 is to be formed. Ultraviolet rays (UV light) are irradiated to a predetermined area of 21a. FIG. 9A to FIG. 9C are views after the second resin film 21a is developed. 9A is a plan view, and FIGS. 9B and 9C are cross-sectional views taken along lines AA and BB in FIG. 9A, respectively. The same members as those in FIG. 1A to FIG. The shape of the ceiling portion 46 formed from the second resin film 21a is irregular. Further, the filler residue 44 remains in the opening 68 where the plug metal 30 is to be formed and the opening of the cutting region 64. This is because the developability of the second resin film 21a is deteriorated because the amount of filler added is increased.

  As described above, in order to improve the elastic modulus of the ceiling portion of the resin portion 20, it is difficult to form the resin portion 20 using the photosensitive second resin film 21a when a resin to which a filler is added is used. However, the formation of the resin part 20 using the photosensitive second resin film 21a is an effective method because the formation cost of the resin part 20 can be reduced. An embodiment for solving the above problem will be described below.

  FIG. 10A is a plan view of the acoustic wave device according to the first embodiment. The elastic wave element 12, the wiring 16, and the cavity 18 are illustrated through the first resin part 20 and the second resin part 40, the elastic wave element 12 and the wiring 16 are indicated by solid lines, and the cavity 18 and the second resin part 40 are indicated by broken lines. ing. FIGS. 10B and 10C are cross-sectional views taken along lines AA and BB in FIG. 10A, respectively. With reference to FIG. 10A to FIG. 10C, a second resin portion 40 is formed on the first resin portion (resin portion in Comparative Examples 1 and 2) 20. Other configurations are the same as those in FIG. 1A to FIG. 1C of Comparative Example 1, and the same members are denoted by the same reference numerals and description thereof is omitted. The second resin part 40 is provided so as to include a region where the cavity 18 is projected on the upper surface of the first resin part 20, and is provided on a part of the upper surface of the first resin part 20.

  Next, a method for manufacturing the acoustic wave device according to the first embodiment will be described with reference to FIGS. 11 (a) through 11 (c), 12 (a) through 12 (c), 13 (a) and 13 (b), and 14 (a) through 14 (c) are shown in FIG. It is the figure which showed the manufacturing process of the cross section corresponded to the AA cross section of (a). On the other hand, FIGS. 11 (d) to 11 (f), 12 (d) to 12 (f), 13 (c) and 13 (d), and 14 (d) to 14 (f) are shown. It is the figure which showed the manufacturing process of the cross section corresponded to the BB cross section of Fig.10 (a). FIGS. 11A to 14F show a manufacturing process performed using the piezoelectric substrate 10 in a wafer state, and there are a plurality of regions to be acoustic wave devices on the wafer. A region to be a plurality of acoustic wave devices is illustrated and described. A cutting region 64 in the drawing is a region for separating regions to be a plurality of acoustic wave devices by, for example, dicing.

  11A and 11D, a metal film is formed using Al on the piezoelectric substrate 10 (LiTaO 3, LiNbO 3, etc.), and the acoustic wave element 12 and the wiring 16 are formed. An electrode pad 17 is formed in a region on the wiring 16 where the plug metal 30 is to be formed. Referring to FIGS. 11B and 11E, a first novolak epoxy resin having negative photosensitivity that prevents the irradiated portion from being developed on the piezoelectric substrate 10, the acoustic wave element 12, and the wiring 16. A resin film 19 is applied to about 30 μm and post-baked. With reference to FIGS. 11C and 11F, ultraviolet light (UV light) using a mask is applied to the region where the cavity 18 on the functional portion of the acoustic wave element 12 of the first resin film 19 is to be formed, the electrode pad Irradiate the area other than 17 and the cutting area 64.

  Referring to FIGS. 12A and 12D, the first resin film 19 is developed to remove the first resin film 19 in the region not irradiated with ultraviolet rays (UV light). As a result, the opening 60 to be a cavity, the opening 62 around the electrode pad 17, and the opening of the cutting region 64 are formed in the first resin film 19. Furthermore, the 1st resin film 19 is hardened by heat-processing at 200 degreeC in nitrogen atmosphere for 1 hour. Referring to FIG. 12B and FIG. 12E, the first resin is applied to the second resin film 21 that is a film-like negative photosensitive resin applied to the protective film 52 by using a pressing roll 50 such as a laminator. Press and paste onto the film 19. With reference to FIG. 12C and FIG. 12F, ultraviolet rays are irradiated on the electrode pad 17 and a region other than the cutting region 64.

  Referring to FIG. 13A and FIG. 13C, the protective film 2 is peeled off, and a photosensitive third resin film 41 in which a silica filler is added at 45 wt% to 60 wt% on the second resin film 21. With reference to FIG. 13B and FIG. 13D to be applied, the region where the second resin portion above the cavity 18 is to be formed is irradiated with ultraviolet rays (UV light). Referring to FIG. 14A and FIG. 14D, the third resin film 41 in the region not irradiated with ultraviolet rays is removed by development, and the second resin portion 40 is formed. At the same time, the second resin film 21 in the region not irradiated with ultraviolet rays is removed, and the first resin having the cavity 18 on the acoustic wave element 12 on the piezoelectric substrate 10 from the first resin film 19 and the second resin film 21. Part 20 is formed. The first resin portion 20 is not formed in the opening 68 where the cutting region 64 and the plug metal 30 are to be formed. The second resin part 40 is formed so as to include a region where the cavity is projected on the upper surface of the first resin part 20, and the second resin part 40 is formed around the opening 68 where the plug metal 30 is to be formed. Does not form. That is, the second resin portion 40 is formed on a part of the upper surface of the first resin portion 20. Since the third resin film 41 contains a large amount of filler, the developability is deteriorated. However, by forming the second resin portion 40 only on a part of the upper surface of the first resin portion 20, from FIG. As shown in FIG. 8C, the filler residue 44 can be prevented from remaining.

  Referring to FIGS. 14B and 14E, Ni, Cu, Au, or the like is electrolessly plated in opening 68 to form conductive plug metal 30. The plug metal 30 may be formed by a method of filling a conductive material such as silver paste into the opening 42 by printing. Referring to FIG. 14C and FIG. 14F, a solder ball 32 connected to the plug metal 30 is formed on the plug metal 30. Thus, the plug metal 30 (connection portion) and the solder ball 32 that are electrically connected to the acoustic wave element 12 are formed. Thereafter, the piezoelectric substrate 10 in the cutting region 64 is cut by dicing. Thus, the acoustic wave device according to Example 1 is completed.

  The acoustic wave device according to the first embodiment includes a second resin portion 40 provided on the first resin portion 20, and the second resin portion 40 is a region where the cavity 18 is projected on the upper surface of the first resin portion 20. Is provided. Since the 2nd resin part 40 has covered the upper part of the cavity 18 of the 1st resin part 20, when modularizing an elastic wave device like a comparative example, for example, the 2nd resin part 40 and the 1st resin part 20 Can be prevented from being plastically deformed and the cavity 18 being crushed, that is, the hollow structure being deformed. If the 2nd resin part 40 contains the area | region which projected the cavity 18 on the upper surface of the 1st resin part 20 at least, it can suppress that the cavity 18 is crushed. If the surface of the second resin part 40 in contact with the upper surface of the first resin part 20 includes a region where the cavity 18 is projected on the upper surface of the first resin part 20, the effect is obtained. However, the fact that the surface obtained by projecting the upper surface of the second resin portion 40 onto the upper surface of the first resin portion includes a region where the cavity 18 is projected on the upper surface of the first resin portion 20 suppresses the collapse of the cavity 18. Therefore, it is more preferable.

  Moreover, it is preferable to make the elasticity modulus which the 2nd resin part 40 has larger than the elasticity modulus which the 1st resin part 20 has. As illustrated in FIG. 5B, when the acoustic wave device is modularized, the second resin portion 40 has a smaller strain than the first resin portion 20, and thus the deformation of the hollow structure can be further suppressed.

  Furthermore, it is preferable that the 2nd resin part 40 contains a filler. Thereby, the elasticity modulus of the 2nd resin part 40 can be improved. In Example 1, although the 1st resin part 20 does not contain a filler, you may contain the filler in the range with easy development.

  Furthermore, the amount of the filler added to the second resin part 40 is preferably 45% by weight or more and 60% by weight or less with respect to the second resin part 40. As shown in FIG. 6, when the added amount of the filler is 45% by weight or more, the normalized elastic modulus can be 2 or more. Further, as shown in FIG. 7, when the amount is 60% by weight or less, the resin can be easily applied by spin coating. The amount of filler added is more preferably 47% by weight to 55% by weight.

  Furthermore, the second resin portion 40 is preferably a photosensitive resin. Thereby, the second resin portion can be easily formed by exposure and development. Moreover, when the 2nd resin part contains a filler, it can suppress that the residue of a filler remains like FIG. 8 (a) of FIG. 8 (c) of the comparative example 2. FIG.

  Furthermore, the filler is preferably a silica filler. By using silica as a filler, the elastic modulus of the second resin portion 40 can be improved.

  The elastic modulus of the second resin part 40 from 150 ° C. to 200 ° C. is preferably 1.8 GPa or more. Thereby, as shown in FIG. 5, it can suppress more that the 2nd resin part 40 deforms plastically, and can suppress that a hollow structure deform | transforms more.

  Furthermore, it is preferable that the 1st resin part 20 and the 2nd resin part 40 contain either one of an epoxy resin and a polyimide resin. By using these resins, the first resin portion 20 and the second resin portion 40 can be easily formed at low cost.

  As shown in FIGS. 10A and 10C, a plug metal 30 (connection portion) that penetrates the first resin portion 20 and is connected to the acoustic wave element 12 is provided. The plug metal 30 is connected to the solder ball 32. The solder ball 32 is a terminal for surface mounting, and is formed higher than the upper surface of the second resin portion 40, so that surface mounting is possible. Further, the second resin portion 40 is not formed in the peripheral portion of the plug metal 30 (connection portion). That is, the second resin part 40 preferably has an opening including the plug metal 30 formed in the first resin part 20. Thereby, as in Comparative Example 2 shown in FIGS. 9A to 9C, it is possible to prevent the residue 44 from being formed in the opening where the plug metal 30 is to be formed.

  Further, as shown in FIG. 12A, a first resin film 19 having an opening 60 to be the cavity 18 is formed on the piezoelectric substrate or the piezoelectric film, and as shown in FIG. 12B, the first resin film 19 is formed. A second resin film 21 is formed on 19 so as to leave opening 60 as cavity 18, and a predetermined region of second resin film 21 is removed as shown in FIG. The first resin portion 20 is formed from the second resin film 21. Thereby, the 1st resin part 20 is formed. Further, as shown in FIG. 13A, a third resin film 41, which is a photosensitive resin film, is formed on the second resin film 21, and a predetermined region of the third resin film 41 is formed as shown in FIG. As shown in FIG. 14A, the third resin film 41 is developed, and the second resin portion 40 is formed from the third resin film 41. Thereby, the 2nd resin part 40 is formed. By such a process, the first resin part 20 and the second resin part 40 having the cavity 18 can be formed in a wafer state.

  Further, a predetermined region of the second resin film 41 is exposed as shown in FIG. 12C, and the second resin film 41 is developed as shown in FIG. Thereby, the first resin portion 20 is formed from the first resin film 19 and the second resin film 21. Further, as shown in FIG. 12C, the predetermined region of the second resin film 21 is exposed before the third resin film 41 is formed (FIG. 13A). As shown in FIG. 14A, the step of developing the second resin film 21 and forming the first resin portion 20 from the first resin film 19 and the second resin film 21 develops the third resin film 41, It is performed simultaneously with the step of forming the second resin portion 40 from the third resin film 41. By such a process, the development of the second resin film 21 and the third resin film 41 can be performed at a time. Therefore, the manufacturing process can be shortened.

  FIG. 15A to FIG. 15C are diagrams showing modifications of the first embodiment. Referring to FIG. 15A, the second resin portion 40a is formed so as to cover all of the two cavities 18, and the second resin portion 40a on the cavities 18 is connected. Referring to FIG. 15B, the second resin portion 40b is formed so as to cover all of the two cavities 18, and the second resin portion 40a on the cavities 18 is not connected. Referring to FIG. 15C, the second resin portion 40 c is formed so as to cover all of the two cavities 18, and the second resin portion 40 c is not formed in the peripheral portion of the plug metal 30. Such a modification can also be used.

  In the first embodiment, the acoustic wave element is an example of a surface acoustic wave (SAW) element formed on the piezoelectric substrate 10. The acoustic wave element may be a surface acoustic wave element formed on a piezoelectric film formed on a substrate such as a silicon substrate. A piezoelectric thin film resonator (FBAR) element can also be used as the acoustic wave element. When the FBAR element is used, the substrate is not a piezoelectric substrate, but a silicon substrate, for example, is used, and the FBAR is formed using a piezoelectric film on the substrate.

  In the first embodiment, two acoustic wave elements 12 and two cavities 18 are formed, but the number is not limited thereto. Although the example of the epoxy resin or the polyimide resin was shown as the 1st resin part 20 and the 2nd resin part 40, it is not restricted to these, What is necessary is just a resin which protects the acoustic wave element 12. FIG. Moreover, the filler added to the 2nd resin part 40 is not restricted to a silica filler, What is necessary is just a filler which improves the elasticity modulus of the 2nd resin part 40. FIG.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims. It can be changed.

FIG. 1A is a plan view of an acoustic wave device according to Comparative Example 1. FIG. FIG.1 (b) is AA sectional drawing of Fig.1 (a). FIG.1 (c) is BB sectional drawing of Fig.1 (a). FIG. 2A to FIG. 2F are cross-sectional views illustrating manufacturing steps of the acoustic wave device according to Comparative Example 1. FIGS. 3A and 3B are schematic views for explaining an experiment assuming modularization of the acoustic wave device according to Comparative Example 1. FIG. FIG. 4 is a schematic diagram of a cross-sectional SEM photograph after the experiment assuming the modularization of Comparative Example 1. FIG. 5A is a view showing a recess in the ceiling portion of the resin portion of Comparative Example 1. FIG. FIG. 5B is a diagram illustrating a result of simulating the amount of depression in the ceiling with respect to the elastic modulus of the ceiling of the resin portion. FIG. 6 is a diagram showing the normalized elastic modulus with respect to the ratio of filler addition to the resin. FIG. 7 is a diagram showing the normalized viscosity with respect to the ratio of filler addition to the resin. FIG. 8A to FIG. 8F are cross-sectional views showing manufacturing steps of the acoustic wave device according to Comparative Example 2. 9A is a plan view in the middle of the manufacturing process of the acoustic wave device according to Comparative Example 2, and FIG. 9B is a cross-sectional view taken along the line AA in FIG. 9A. FIG.9 (c) is BB sectional drawing of Fig.9 (a). FIG. 10A is a plan view of the acoustic wave device according to the first embodiment. FIG.10 (b) is AA sectional drawing of Fig.10 (a). FIG.10 (c) is BB sectional drawing of Fig.10 (a). FIG. 11A to FIG. 11F are cross-sectional views (part 1) illustrating the manufacturing process of the acoustic wave device according to the first embodiment. 12A to 12F are cross-sectional views (part 2) illustrating the manufacturing process of the acoustic wave device according to the first embodiment. FIG. 13A to FIG. 13D are cross-sectional views (part 3) illustrating the manufacturing process of the acoustic wave device according to the first embodiment. FIG. 14A to FIG. 14F are cross-sectional views (part 4) illustrating the manufacturing process of the acoustic wave device according to the first embodiment. 15A to 15C are plan views of an elastic wave filter according to a modification of the first embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Piezoelectric substrate 12 Elastic wave element 16 Wiring 17 Electrode pad 18 Cavity 19 1st resin film 20 1st resin part (resin part)
21 Second resin film 30 Plug metal 32 Solder ball 40 Second resin part 41 Third resin film 60 Opening to be hollow 64 Cutting region

Claims (8)

An acoustic wave element provided on the surface of the piezoelectric substrate or the piezoelectric film;
A first resin portion provided on the piezoelectric substrate and having a cavity on the acoustic wave element;
A second resin portion provided on the first resin portion and having a modulus of elasticity greater than that of the first resin portion;
A connecting portion provided in an opening penetrating the first resin portion and electrically connected to the acoustic wave element ;
The second resin portion is provided so as to include the entire region where the cavity is projected on the upper surface of the first resin portion, and is separated from all edges of the first resin portion and all edges of the opening. An acoustic wave device characterized by being provided .   The acoustic wave device according to claim 1, wherein the second resin portion contains a filler. Claim 1 or 2 acoustic wave device, wherein said second resin part is a photosensitive resin. The acoustic wave device according to claim 2 , wherein the filler is a silica filler. It said first resin part and the second resin portion acoustic wave device of any one of claims 1 to 4, characterized in that it comprises the one either epoxy resin and polyimide resin. Forming an acoustic wave element on the piezoelectric substrate or the piezoelectric film;
Forming a first resin portion having a cavity on the acoustic wave element on the piezoelectric substrate or the piezoelectric film;
Look including the whole region defined by projecting the cavity on the upper surface of the first resin section, and all edges and the elastic wave device and electrically the first to form the connecting portion connecting the first resin portion Forming a second resin portion having an elastic modulus larger than that of the first resin portion so as to be separated from all edges of the opening portion of the resin portion;
Forming the connection portion in the opening of the first resin portion . A method of manufacturing an acoustic wave device, comprising: The step of forming the first resin portion includes forming a first resin film having an opening in the region to be the cavity on the piezoelectric substrate or the piezoelectric film;
Forming a second resin film on the first resin film so that the opening remains as a cavity;
Removing a predetermined region of the second resin film, and forming the first resin portion from the first resin film and the second resin film,
Forming the second resin portion includes forming a third resin film, which is a photosensitive resin film, on the second resin film;
Exposing a predetermined region of the third resin film;
The method of manufacturing an acoustic wave device according to claim 6 , further comprising: developing the third resin film and forming the second resin portion from the third resin film. The second resin film is a photosensitive resin film;
The step of forming the first resin portion from the first resin film and the second resin film includes the step of exposing a predetermined region of the second resin film, developing the second resin film, and Forming the first resin portion from a resin film and the second resin film,
The step of exposing a predetermined region of the second resin film is performed before the step of forming the third resin film, the second resin film is developed, and the first resin film and the second resin film are used. 8. The elastic wave according to claim 7 , wherein the step of forming the first resin portion is performed simultaneously with the step of developing the third resin film and forming the second resin portion from the third resin film. Device manufacturing method.

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