JP4520543B2 - Wiring member for electrical inspection and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-density wiring substrate such as a printed circuit board, an integrated circuit substrate, a liquid crystal display substrate, a semiconductor package substrate (a semiconductor chip mounting substrate, a flip chip substrate), a conduction resistance test, and a burn-in in semiconductors and various packages. The present invention relates to a wiring member for electrical inspection used for electrical inspection requiring contact conduction such as a test and a manufacturing method thereof.
[0002]
[Prior art]
The mounting density of electronic components on a printed circuit board has increased, and as a result, the mutual wiring interval of the mounting portion has been reduced. As micro wiring and multi-layer technology for ensuring mutual connection are advanced, miniaturization of a package using a semiconductor mounting substrate is attempted by making full use of these wiring forming technologies. For example, a bare chip in which a semiconductor element is integrated on a silicon substrate has been mounted and sealed on a lead frame so far as an insertion component or a surface mounting component. In such a package, since the mounting density does not improve, attention has been paid to MCMs that are functionalized by mounting a plurality of bare chips on one substrate after wire bonding connection, TAB connection, or CCB connection and sealing them. . However, in recent years, CSP technology that brings the package size closer to the bare chip dimensions has risen. In such a package, secondary connection electrodes such as solder balls arranged in a two-dimensional array are formed. Such a package requires a burn-in test at 125 ° C. and energization for an initial failure test. For this reason, a test terminal with good conductivity and an inexpensive test member that does not form an oxide film even at high temperatures is desired.
[0003]
[Problems to be solved by the invention]
The present invention relates to a high-density wiring substrate such as a printed circuit board, an integrated circuit substrate, a liquid crystal display substrate, a semiconductor package substrate (a semiconductor chip mounting substrate, a flip chip substrate), a conduction resistance test, and a burn-in in semiconductors and various packages. It is an object of the present invention to provide an electrical inspection wiring member excellent in contact reliability used for electrical inspection that requires contact conduction such as a test, and an inexpensive manufacturing method thereof.
[0004]
[Means for Solving the Problems]
The wiring member for electrical inspection according to the present invention includes an insulating substrate having a through-hole serving as a guide for an external terminal of a component to be inspected, and a surface opposite to the surface of the insulating substrate facing the component to be inspected. A contact terminal portion that contacts the external terminal to be inspected provided at a location, and a developed wiring of the contact terminal portion, and the contact terminal portion is formed with a polygonal corner that directly contacts the external terminal to be inspected. It is . Corners like this can and polygon angle of each vertex is formed by providing a through hole etched structures obtuse and acute angles to the contact terminal. Thereby, the wiping effect is obtained. It is preferable that the through hole of the contact terminal portion is a polygonal star-shaped hole .
[0005]
The method for manufacturing a wiring member for electrical inspection according to the present invention includes a step of preparing a circuit forming material having a metal layer on one side of an insulating substrate, and a polygonal shape so that an external terminal to be inspected directly contacts the metal layer by etching . A step of forming a first hole group in which corner portions are formed; a step of forming a contact terminal portion including each hole of the first hole group formed in the metal layer; and an insulating substrate having no metal layer From the side, a step of forming a second hole group having a predetermined shape facing each hole of the first hole group can be provided.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of a wiring member for electrical inspection according to the present invention. Reference numeral 1 denotes an insulating substrate having a through hole 4 serving as a guide for an external terminal 3 of a component 2 to be inspected, and 5 denotes a contact terminal portion. It is. 2 is a plan view of the electrical inspection wiring member shown in FIG. 1 as viewed from below, and 6 is a developed wiring. FIG. 3 shows a wiring member in which a through hole 8 is provided in the contact terminal portion so as to form a corner portion 7 that contacts an external terminal to be inspected. FIG. 4 of the reference example is a plan view showing a positional relationship with the through hole of the insulating substrate when a circular through hole is provided in the contact terminal portion so as to configure the corner portion 7 in the contact terminal portion. 5 is a contact terminal part, 4 is a through-hole of an insulated substrate, 8 is the circular through-hole provided in the contact terminal part. FIG. 5 is a plan view showing a positional relationship with the through hole of the insulating substrate when a polygonal through hole is provided in the contact terminal portion so that the corner portion 7 is formed in the contact terminal portion. contact terminal, 4 is an insulating substrate through-hole of 8 are through-holes of a polygon formed in the contact terminal portion.
[0007]
The manufacturing method of the wiring member for electrical inspection of this invention is demonstrated . Preparing a circuit forming material having a metal layer on one surface of the insulation substrate 1 are shown in FIG. The board | substrate formed in 18 micrometers electrolytic copper foil or rolled copper foil of the metal layer shown by 9 on insulating materials, such as a polyimide shown by 1, or a glass / epoxy laminated board, is used. It is desirable that the copper foil has a roughened connection interface with the insulating material. When the degree of roughening is represented by a generally known roughness parameter based on JIS surface roughness (B0601), the center line average roughness Ra is in the range of 0.05 to 5 μm, and the maximum roughness Rt is in the range of 1 to 5 μm. Is good. Moreover, although parameter description is not possible, you may use the copper foil which carried out the secondary roughening for such primary roughening.
[0008]
FIG. 7 shows a step of forming a first hole group having a predetermined shape in the metal layer 9 by etching. A resist film is laminated on the copper surface of the substrate, and the resist 10 is formed by exposure and development. An example of the resist image of the first hole formed at this time is shown in FIG. After that, the first hole portion 11 is formed by etching with an etching solution whose main component is ferric chloride or cupric chloride, or an alkaline etching solution such as A process solution manufactured by Melstrip.
[0009]
FIG. 9 shows a step of forming an electrode portion (contact terminal portion) including each hole 11 of the first hole group formed in the metal layer. A resist film is laminated on the copper surface of the base material in which the first group of holes 11 is formed, and the resist 12 is formed by exposure and development. As shown in FIG. 10, the resist 12 is formed so as to be an electrode part (contact terminal part) including each hole 11 of the first hole group. After that, etching is performed with an etching solution containing ferric chloride or cupric chloride as a main component, or an alkaline etching solution such as A process solution manufactured by Melstrip. Thereby, the electrode part (contact terminal part 5 ) containing each hole of a 1st hole group is formed.
[0010]
FIG. 11 shows a step of forming the second hole 13 group having a predetermined shape so as to face each hole of the first hole group from the side having no metal layer on the insulating substrate. When the insulating layer is made of carbon dioxide laser, YAG or excimer laser, or when the insulating material is polyimide, the insulating layer is punched with an etchable chemical solution from the side not having the copper layer. Alternatively, if the insulating material is photosensitive and can be exposed and developed, exposure and development can be performed. The second hole 13 group serves as a through hole 4 that serves as a guide for the external terminal 3 of the component 2 to be inspected. Regarding the positional relationship between the first and second holes and the electrode wiring outer shape, the second hole outer shape may be smaller than the outermost outer shape of the first hole or may contain the first hole. Each hole shape of the first hole group may be a polygon and a structure in which the angle of each vertex is etched to an obtuse angle and an acute angle.
[0011]
Next, after electrolytically or electrolessly plating at least nickel or nickel and gold on the surface of the metal layer, rhodium is preferably electrolytically or electrolessly plated. For example, as rhodium plating, electrolytic rhodium is plated using a low stress rhodium plating solution for thickening manufactured by Nippon Electroplating Engineers Co., Ltd. The conditions are, for example, a liquid temperature of 50 to 60 ° C., a current density of 2 A / dm ² , a voltage of 4 V, and a time of 150 seconds. As a result, the oxide film on the electrode part to be inspected can be destroyed to make a low resistance contact.
[0012]
【The invention's effect】
The wiring member for electrical inspection according to the present invention, for example, when an elastomer is brought into contact under the wiring layer and a solder ball terminal of a package that is an external connection terminal of a component to be inspected is brought into contact from the insulating substrate side, the solder ball and the lead wiring Can be prevented. Since corners parts for inspection external terminals into contact with the contact terminal portion is configured to break the oxide film of the solder balls in the wiping (minute sliding), allowing reliable contact tests at low resistance.
[0013]
In this way, there is an insulating layer serving as a wiring support in a direction in which the balls (inspected component external connection terminals) are brought into contact with the burn-in board (wiring member for electrical inspection). For this reason, it becomes protection of wiring and a ball can be made to contact with an electrode (contact terminal part), without short-circuiting with wiring between electrodes . Also, the case of providing the electrode first hole (through hole) to (contact terminal), in particular leave a hole in the polygonal star shape, the tip, when the oxide film of the solder balls of solid Compared with, the rubbing phenomenon of wiping further breaks the oxide film effectively and is excellent in repeated tests. Further, since the wiring is formed in one layer, it is inexpensive. When the elastomer is applied from the wiring side, the star-shaped corners of the first hole (through hole of the contact terminal portion) contact the ball at multiple points, thus helping to absorb variations in ball height.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of an electrical inspection wiring member according to the present invention.
FIG. 2 is a plan view of the electrical inspection wiring member of FIG. 1 as viewed from below.
FIG. 3 is a cross-sectional view showing another embodiment of the electrical inspection wiring member of the present invention.
FIG. 4 is a reference plan view showing a positional relationship with a through hole of an insulating substrate when a circular through hole is provided in a contact terminal portion.
FIG. 5 is a plan view showing a positional relationship with a through hole of an insulating substrate when a polygonal through hole is provided in the contact terminal portion.
FIG. 6 is a cross-sectional view of a circuit forming material.
7 is a cross-sectional view showing a process of forming a first group of holes 11 in the metal layer 9. FIG.
FIG. 8 is a plan view of the wiring member of FIG. 7 as viewed from below.
9 is a cross-sectional view showing a process of forming an electrode portion (contact terminal portion) 5 on the metal layer 9. FIG.
10 is a plan view of the wiring member of FIG. 9 as viewed from below.
FIG. 11 is a sectional view showing another embodiment of the wiring member of the present invention.

Claims (3)

An insulating substrate having a through-hole that serves as a guide for external terminals of the component under test;
A contact terminal portion that is in contact with an external terminal to be inspected that is provided at a location of the through hole on the opposite side of the surface of the insulating substrate that faces the inspected component;
A wiring member provided with the developed wiring of the contact terminal portion,
A wiring member for electrical inspection in which the contact terminal portion is formed with a polygonal corner portion that directly contacts an external terminal to be inspected.   The wiring member for electrical inspection according to claim 1, wherein the through hole of the contact terminal portion is a polygonal star-shaped hole. Preparing a circuit forming material having a metal layer on one side of an insulating substrate;
Forming a first hole group in which polygonal corners are configured so that the external terminal to be inspected directly contacts the metal layer by etching;
Forming a contact terminal portion including each hole of the first hole group formed in the metal layer;
A method of manufacturing a wiring member for electrical inspection, comprising: forming a second hole group having a predetermined shape so as to face each hole of the first hole group from the side having no metal layer on the insulating substrate.

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