JP2000058605A - Wiring member and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a wiring member used in electrical inspection requiring contact conduction and having excellent reliability on contacts by forming an insulating layer to support a wiring in the direction that a connecting terminal on the outside of a part to be inspected is brought into contact towards the wiring member. SOLUTION: The wiring member has an insulating substrate 1 with through-holes 4 as guides for the external terminals 3 of a part to be inspected 2, contact terminal sections 5, with which the external terminals 3 of the part to be inspected formed at the places of the through-holes 4 are brought into contact, on the reverse surface of a surface, to which the part to be inspected 2 is faced oppositely, and the expanded wirings of contact terminal sections 5. The contact terminal sections 5 have corner sections, with which the external terminals 3 of the part to be inspected are brought into contact. Accordingly, when an elastomer is brought into contact under a wiring layer and the solder ball terminals of packages as the external terminals 3 of the part to be inspected are brought into contact from the insulating substrate 1 side, contacts among solder balls and drawing-around wirings can be prevented. The oxide films of the solder balls are broken by wiping, and a sure contact test is carried out with low resistance.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-density wiring board such as a printed board, an integrated circuit board, a liquid crystal display board, a semiconductor package board (a semiconductor chip mounting board, a flip chip board), a semiconductor, and various kinds of substrates. The present invention relates to a wiring member used for an electrical inspection requiring contact conduction such as a conduction resistance test and a burn-in test in a package, and a method of manufacturing the wiring member.

[0002]

2. Description of the Related Art The mounting density of electronic components on a printed circuit board has been increasing, and as a result, the distance between interconnections in the mounting portion has been reduced. Along with the progress of fine wiring and multi-layer techniques for securing interconnections, these wiring forming techniques are being used to reduce the size of a package using a semiconductor mounting substrate. For example, a bare chip in which a semiconductor element is integrated into a circuit on a silicon substrate has been mounted and sealed on a lead frame to form an insert component or a surface mount component. In such a package, since the mounting density does not improve, a plurality of bare chips are connected to one substrate by wire bond connection, TAB connection or CCB connection, and after sealing,
Attention has been paid to an MCM that is mounted on a lead frame and functionalized. However, in recent years, a CSP technology for reducing the package size without limitation to the outer dimensions of the bare chip has been emerging. In such a package, secondary connection electrodes including solder balls arranged in a two-dimensional array are formed. Such a package requires a burn-in test at 125 ° C. and an electric current for an initial failure test. Therefore, there is a demand for an inspection terminal and an inexpensive inspection member that do not form an oxide film even at high temperatures and have good conductivity.

[0003]

SUMMARY OF THE INVENTION The present invention relates to a high-density wiring board such as a printed board, an integrated circuit board, a liquid crystal display board, a semiconductor package board (semiconductor chip mounting board, flip chip board), and the like. Another object of the present invention is to provide a wiring member having excellent contact reliability used for an electrical inspection requiring contact continuity such as a conduction resistance test and a burn-in test in various packages, and an inexpensive manufacturing method thereof.

[0004]

According to the present invention, there is provided a wiring member having an insulating substrate having a through hole serving as a guide for an external terminal of a component to be inspected, and a surface opposite to a surface of the insulating substrate facing the component to be inspected. And a contact terminal portion with which the external terminal of the component to be inspected provided at the location of the through hole comes into contact, and a development wiring of the contact terminal portion. It is preferable that the contact terminal portion has a corner portion with which the external terminal of the component to be inspected contacts. Such a corner portion can be formed by providing a through hole having a structure in which the contact terminal portion has a polygonal or circular shape and each vertex is etched at an obtuse angle or an acute angle. Thereby, a wiping effect is obtained. It is preferable that the surface of the contact terminal portion that contacts the external terminal of the component under test is a roughened surface. This allows
Improve the contact with the secondary connection electrode of the package.

According to the method of manufacturing a wiring member of the present invention, a step of preparing a circuit forming material having a metal layer on one surface of an insulating substrate, a step of forming a contact terminal portion and a developed wiring on the metal layer, Forming a through-hole at a position corresponding to the contact terminal portion from the side having no contact hole. The method of manufacturing a wiring member according to the present invention includes a step of preparing a circuit-forming material having a metal layer on one surface of an insulating substrate; a step of forming a first hole group having a predetermined shape by etching the metal layer; Forming a contact terminal portion including each hole of the first hole group formed on the insulating substrate from a side not having a metal layer, facing the respective hole of the first hole group from the side having no metal layer, and forming a second terminal having a predetermined shape. May be provided.

[0006]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of a wiring member according to the present invention. Reference numeral 1 denotes an insulating substrate having a through hole 4 serving as a guide for an external terminal 3 of a component 2 to be inspected, and reference numeral 5 denotes a contact terminal portion. FIG.
Is a plan view of the wiring member of FIG. 1 as viewed from below, and 6 is a developed wiring. FIG. 3 shows a wiring member in which a through hole 8 is provided in the contact terminal portion so as to form a corner portion 7 with which the external terminal of the component under test contacts. FIG. 4 is a plan view showing a positional relationship with a through hole of an insulating substrate when a circular through hole is provided in the contact terminal portion so as to form the corner portion 7 in the contact terminal portion. The terminal portion 4 is a through hole of the insulating substrate, and 8 is a circular through hole provided with the contact terminal portion. FIG. 5 is a plan view showing a positional relationship with a through hole of an insulating substrate when a polygonal through hole is provided in the contact terminal portion so as to form the corner portion 7 in the contact terminal portion. The contact terminals 4 and 4 are through holes in the insulating substrate, and 8 is a polygonal through hole provided with the contact terminals.

A method for manufacturing a wiring member according to the present invention will be described. A circuit forming material including a metal layer on one surface of the insulating substrate 1 shown in FIG. 6 is prepared. A substrate in which an 18 μm electrolytic copper foil or a rolled copper foil of a metal layer indicated by 9 is formed on an insulating material such as polyimide or a glass / epoxy laminate indicated by 1 is used. It is desirable that the copper foil has a roughened connection interface with the insulating material. When the degree of roughening is represented by a roughness parameter based on a generally well-known JIS surface roughness (B0601), the center line average roughness Ra is 0.
The maximum roughness Rt is preferably in the range of 1 to 5 μm. Although the parameter cannot be described, a copper foil subjected to secondary roughening for such primary roughening may be used.

FIG. 7 shows a step of forming a first hole group having a predetermined shape in the metal layer 9 by etching. A resist film is laminated on the copper surface of the base material, and is exposed and developed to form a resist 10. FIG. 8 shows an example of a resist image of the first hole formed at this time. Thereafter, the first hole portion 11 is formed by etching with an etching solution containing ferric chloride or cupric chloride as a main component or an alkali etching solution such as an A process solution manufactured by Merstrip.

FIG. 9 shows a process of forming an electrode portion (contact terminal portion) including each hole 11 of the first hole group formed in the metal layer. A resist film is laminated on the copper surface of the substrate on which the first group of holes 11 is formed, and is exposed and developed to form a resist 1
Form 2 The resist 12 is formed so as to become an electrode portion (contact terminal portion) including each hole 11 of the first hole group as shown in FIG. Thereafter, etching is performed using an etching solution containing ferric chloride or cupric chloride as a main component, or an alkali etching solution such as an A process solution manufactured by Merstrip. Thus, an electrode portion (contact terminal portion 5) including each hole of the first hole group is formed.

FIG. 11 shows a second hole 1 having a predetermined shape facing an insulating substrate from the side having no metal layer and facing each hole of the first hole group.
The process of forming three groups is shown. When the insulating layer is a carbon dioxide gas laser, a YAG or excimer laser, or the insulating material is polyimide, the insulating layer is perforated from the side having no copper layer with an etchable chemical. Alternatively, exposure and development can be performed if the insulating material is photosensitive and can be exposed and developed. The second group of holes 13 is a through hole 4 serving as a guide for the external terminal 3 of the component 2 to be inspected. Regarding the positional relationship between the first and second holes and the outer shape of the electrode wiring, the outer shape of the second hole may be smaller than the outermost shape of the first hole or may include the first hole. Each hole shape of the first hole group may have a polygonal shape and an angle of each vertex etched at an obtuse angle and an acute angle.

Next, after at least nickel or nickel and gold are electrolytically or electrolessly plated on the surface of the metal layer, rhodium is desirably electrolytically or electrolessly plated. For example, as rhodium plating, electrolytic rhodium is plated by using a low-stress rhodium plating solution for thickening manufactured by Japan Electroplating Engineers Co., Ltd. The conditions are, for example, a liquid temperature of 50 to 60 ° C. and a current density of 2
The A / dm2 voltage is 4 V and the time is 150 seconds. As a result, the oxide film on the electrode portion of the component to be inspected is broken, and low-resistance contact can be made.

[0012]

According to the wiring member of the present invention, for example, when the elastomer is brought into contact with the lower part of the wiring layer and the solder ball terminal of the package which is the external connection terminal of the component to be inspected is brought into contact from the insulating substrate side, the solder ball and the wiring are drawn. Contact with wiring can be prevented. If the contact terminal has a corner that contacts the external terminal of the component under test, the oxidized film of the solder ball is destroyed by wiping (fine sliding), enabling a low-resistance and reliable contact test. .

As described above, there is an insulating layer for supporting the wiring in a direction in which the ball (the external connection terminal of the component to be inspected) contacts the burn-in board (wiring member). For this reason,
As a result, the ball can be brought into contact with the electrode (contact terminal portion) without short-circuiting with the wire between the electrodes. If the surface of the electrode (contact terminal portion) in contact with the ball is roughened, it breaks the oxide film of the solder ball and is excellent in repeated tests. Also, when a first hole (through hole) is provided in the electrode (contact terminal portion), particularly when a polygonal star-shaped hole is formed, the tip of the hole is covered with an oxide film of a solder ball. In comparison, the rubbing phenomenon of wiping further breaks the oxide film more effectively, and is excellent in repeated tests. Further, since the wiring is formed in one layer, it is inexpensive. If an elastomer is used from the wiring side, the star-shaped corners of the first hole (through-hole of the contact terminal portion) contact the ball at multiple points, thereby helping to absorb variations in ball height.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a wiring member of the present invention.

FIG. 2 is a plan view of the wiring member of FIG. 1 as viewed from below.

FIG. 3 is a sectional view showing another embodiment of the wiring member of the present invention.

FIG. 4 shows a case where a circular through hole is provided in the contact terminal portion.
FIG. 3 is a plan view showing a positional relationship with a through hole of an insulating substrate.

FIG. 5 is a plan view showing a positional relationship with a through hole of an insulating substrate when a polygonal through hole is provided in a contact terminal portion.

FIG. 6 is a cross-sectional view of a circuit forming material.

FIG. 7 is a sectional view showing a step of forming a first hole group 11 in the metal layer 9;

8 is a plan view of the wiring member of FIG. 7 as viewed from below.

FIG. 9 is a sectional view showing a step of forming an electrode portion (contact terminal portion) 5 on the metal layer 9.

FIG. 10 is a plan view of the wiring member of FIG. 9 as viewed from below.

FIG. 11 is a sectional view showing another embodiment of the wiring member of the present invention.

[Explanation of symbols]

 1. 1. Insulating substrate Inspected part 3. External terminal 3 4. Through hole 5. 5. Contact terminal section Deployment wiring 7. Corner 8. Through hole 9. Metal layer 10. Resist 11. First hole 12. Resist 13. Second hole

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2G003 AA07 AC01 AG08 AG12 2G011 AA16 AA21 AB06 AB07 AC14 AE03 4M106 AA01 AA02 AD08 AD09 BA14 CA16 CA56 DG25 DJ33

Claims (5)

[Claims] An insulating substrate having a through hole serving as a guide for an external terminal of a component to be inspected; a substrate provided at a position of the through hole on a surface of the insulating substrate opposite to a surface facing the component to be inspected; A contact member to be contacted by an external terminal of the inspection component, and a wiring member provided with a developed wiring of the contact terminal. 2. The wiring member according to claim 1, wherein the contact terminal portion has a corner portion with which the external terminal of the component to be inspected contacts. 3. The wiring member according to claim 1, wherein the contact terminal portion has a roughened surface on a surface with which the external terminal of the component to be inspected contacts. 4. A step of preparing a circuit forming material including a metal layer on one surface of an insulating substrate; a step of forming a contact terminal portion and a development wiring on the metal layer; and a step of contacting the insulating substrate from a side having no metal layer. A method for manufacturing a wiring member, comprising: a step of forming a through hole at a location corresponding to the above. 5. A step of preparing a circuit forming material having a metal layer on one surface of an insulating substrate; a step of forming a first hole group having a predetermined shape by etching in the metal layer; Forming a contact terminal portion including each hole of the group of holes, forming a second group of holes of a predetermined shape facing the respective holes of the first group of holes from the side having no metal layer on the insulating substrate. A method for manufacturing a wiring member comprising a process.