JP4512554B2 - Carrier plate - Google Patents

Description

  The present invention relates to a carrier plate, and in particular, is used for aligning and supporting the chip component when forming a contact by coating, for example, silver or palladium on both ends of an electronic chip component such as a capacitor or a resistor. Concerning the carrier plate.

  Conventionally, a carrier plate that aligns and supports the chip components when forming contact points on both ends of the electronic chip components such as capacitors and resistors has a large number of holes penetrating in the thickness direction of a metal rectangular plate body. These are formed by penetrating in parallel with the plane of the plate body, and forming an elastic wall with an elastic member on the inner wall surface of each of these holes (see, for example, Patent Document 1).

FIG. 3 shows an example of a conventional carrier plate. This carrier plate is formed in the shape of a rectangular metal plate made of stainless steel or aluminum in which a thin plate body 1 is integrally formed inside a surrounding thick outer frame 3. A large number of holes 4 penetrating in the thickness direction are formed in the plate body 1 at a predetermined pitch. A flexible member 2 made of silicone rubber as an elastic member is formed on the upper and lower surfaces of the outer plate 3 and the plate body 1 and the inner wall surface of each hole 4, and a through hole 5 is formed inside each hole 4. A positioning hole 6 is formed at a predetermined position of the outer frame 3.

  Conventionally, a carrier plate is manufactured by inserting a through-hole forming pin arranged in a mold into a hole 4 of a plate body 1 integrally formed with an outer frame 3 and then placing a low-viscosity room temperature curable liquid silicone rubber into a plate. Cast into the outer frame 3 of the main body 1 and cure at room temperature, or cast a relatively low viscosity addition type silicone rubber into the outer frame 3 of the plate main body 1 and heat at 150 ° C. for about 30 minutes. After molding, the surface was polished and formed (see, for example, Patent Documents 2 and 3).

Japanese Examined Patent Publication No. 62-11488 Japanese Patent Publication No. 3-76778 JP 2004-17549 A

  In the manufacture of the conventional carrier plate, the silicone rubber is cast and molded in the outer frame 3 of the plate body 1 and then the surface is polished, so that the surface rubber layer and the outer frame 3 are formed. The surface was basically a shape with no steps.

  In recent years, with the progress of computerization and software focusing on in-vehicle systems such as engines, vehicle running control systems, car navigation, etc., in automobile parts, etc., the capacity of chip parts has increased from the viewpoint of reducing circuit mounting area. At the same time, the dimensions tend to increase. Actually, chip parts such as multilayer ceramic capacitors having dimensions exceeding 5750 (5.7 x 5.0 x 2.7 mm), which are maximum chip parts, have appeared. When inserting these maximal chip parts into the carrier plate, a conventional carrier plate measuring 180 mm wide x 280 mm long x 9 mm thick is manually handled to apply external electrodes (for example, Termination Module 2001 (Electro Scientific Industries, Inc. (US) (product name), if the number of pieces per sheet is 608 (32 vertical x 19 horizontal holes are formed), the formation of through-holes 5 with a diameter of about 6.83 mm will maintain plate strength. Therefore, in a carrier plate that requires a through hole 5 for insertion having a large dimension exceeding a diameter of about 6.83 mm, which is about 7.00 to 8.50 mm, the number of pieces per sheet is 160 ( 16 holes × 10 holes in the horizontal direction), and the productivity is greatly reduced to about 1/4. Therefore, a carrier plate having a large number of pieces has been desired.

As shown in FIG. 4 , when the chip component 12 is taken out after applying the external electrode 14 to the chip component 12 inserted into the through hole of the carrier plate 13, the push pin 11 as shown in FIG. The chip component 12 is discharged from the carrier plate 13 by being inserted into the through hole of the carrier plate 13 and pressed by a punching press (not shown). On the upper plate of the punching press at this time, the same number of push pins 11 as the number of carrier plates 13 to be taken, for example, 608, are arranged at the same pitch as the through holes of the carrier plate 13. Accordingly, when the number of chip parts taken out of the carrier plate 13 is changed, there is a problem that the number and position of the push pins 11 attached to the punching press must be changed.

  The present invention has been made in view of these points. In the conventional apparatus for applying external electrodes in which the number of chip parts taken per sheet is, for example, 608, the number of chip parts taken is changed. Even so, an object of the present invention is to provide a carrier plate that can be used in combination with 608 types of chip part punching presses.

  Another object of the present invention is to provide an extremely productive carrier plate in which through holes having a large diameter are efficiently arranged for a carrier plate that requires a through hole having a diameter exceeding 7.0 mm. And

In order to achieve the above-described object, the carrier plate according to the first aspect of the present invention has a large number of holes penetrating in the thickness direction of a metal plate main body arranged regularly in parallel in the plane of the plate main body. A carrier plate in which through holes are formed by forming an elastic wall with an elastic member made of silicone rubber on the inner wall surface of each of these holes, and the diameters of the through holes are the same or different In the case of a plurality of types of carrier plates, the through holes of the respective types of carrier plates are respectively arranged at intersections of vertical and horizontal array lines connecting the through holes, and the diameters of the through holes are different. in the carrier plate is disposed and a small-diameter through-hole and a large-diameter through-holes are alternately in each intersection of said array line, said array line all types of carrier plate smell The chips inserted in the respective through holes are discharged by one type of punching press, which is arranged in the same manner and each has a punching pin arranged at each intersection of the array lines. .

According to the first aspect of the present invention, for example, a carrier plate having through holes of the same diameter in which the number of chip components taken per sheet is 608, and a carrier plate having through holes of 608 having different diameters. The center positions of the respective through holes can be arranged at the same position. Thereby, the punching press provided with the push pin corresponding to the carrier plate provided with 608 through holes can be used in combination for each carrier plate having a different through hole configuration. Thereby, the carrier plate which formed the through-hole with a large diameter with respect to the carrier plate of the same structure as before can be obtained. Further, in the carrier plate in the case where the diameters of the through holes are different, the small diameter through holes and the large diameter through holes can be arranged alternately and orderly. Are arranged at every other intersection of the vertical and horizontal array lines connecting each other, so that a large number of through-holes are arranged in a staggered manner, eliminating the waste of the arrangement space and for the same area Thus, through holes having a large diameter can be efficiently arranged, and the productivity of chip parts can be improved.

Thus, since the carrier plate of the present invention is configured and operates, in the carrier plate in the case where the diameters of the through holes are different , a small-diameter through hole is formed at each intersection of the vertical and horizontal array lines connecting the through holes. This is a case where the number of chips is changed in a conventional apparatus for applying external electrodes in which the number of chip parts per sheet is 608, for example, by alternately arranging large-diameter through holes. In addition, there is an excellent effect that the chip part punching press can be used in combination with the 608 type.

Further, in the present invention, in the carrier plate when the diameters of the through holes are different , a small diameter through hole and a large diameter through hole are provided at every other vertical and horizontal intersection of the vertical and horizontal array lines connecting the through holes. By arranging them alternately, a carrier plate that requires a through hole with a diameter exceeding 7.0 mm can be a highly productive carrier plate that efficiently arranges a through hole with a large diameter. Excellent effect.

  Thereby, the carrier plate of this invention has the outstanding effect that a chip component of a maximum dimension can be produced efficiently.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  1 and 2 show an embodiment of the carrier plate of the present invention. In FIG. 1, the same parts as those in the prior art are denoted by the same reference numerals.

The carrier plate of the present embodiment is formed with a large through-hole having a diameter exceeding 7.0 mm, and is made of stainless steel or aluminum in which a thin plate body 1 is integrally formed inside a surrounding thick outer frame 3. It is formed in the shape of a metal rectangular plate. A small-diameter hole 4a and a large-diameter hole 4b penetrating in the thickness direction are formed in the plate body 1 at a predetermined pitch. That is, as shown in FIG. 2, small-diameter holes 4a and large-diameter holes 4b are alternately arranged at intersections of vertical and horizontal array lines Lv and Lh connecting the respective holes 4a and 4b. Each hole 4a of FIG. 2, the pitch of the vertical and horizontal arrangement line connecting 4b array lines Lv aspect connecting the holes 4 of a conventional carrier plate of Figure 3, are formed in Lh and the same pitch. Further, a flexible member 2 made of silicone rubber as an elastic member is formed on the upper and lower surfaces of the outer plate 3, the plate body 1, and the inner wall surfaces of the holes 4a and 4b, and a large diameter is formed inside each large diameter hole 4b. A through hole 5 is formed, and a small diameter through hole 7 (functioning as a dummy hole) is formed inside each small diameter hole 4b. A positioning hole 6 is formed at a predetermined position of the outer frame 3.

  The carrier plate manufacturing method of this embodiment shown in FIGS. 1 to 2 may hold the molding pin in the mold and form the through holes 5 and 7 at the time of molding the mold, which is once a rubber layer. You may drill a hole after forming the flexible member 2.

  The material of the plate body 1 is not limited, but is preferably made of aluminum from the viewpoints of heat resistance, cost, weight, strength, and the like. Examples of aluminum include wrought materials such as 2000 series alloys, 5000 series alloys, 6000 series alloys, and 7000 series alloys, but 7000 series alloys such as 7075, 7050, and 7N01 having high strength are desirable. In addition, since the mechanical properties of aluminum alloys change due to tempering operations such as heat treatment, it is desirable to apply a treatment to increase the strength. For 7000 series alloys, T6, T651, T6511, T7651 and the like are preferable. Annealing treatment is not preferable because the strength is lowered.

  For the flexible member 2, an addition-type silicone rubber made of a vinyl group-containing polyorganosiloxane and a hydrodiene polysiloxane is used.

  The rubber hardness of the silicone rubber is designed from the functional aspect, and is usually arbitrarily determined between about 25 to 70 degrees (JIS A).

  More specifically, first, a carrier plate having the shape shown in FIG. 1 was prepared based on KE1950-35A / B (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) as an addition type liquid silicone rubber. In the carrier plate of this embodiment, the diameter of the larger through hole 5 is 7.70 mm and the number of holes is 304, and the diameter of the smaller through hole 7 is 3.50 mm and the number of holes is 304. As the punching press, the punching plate for carrier plate shown in FIG. After inserting a ceramic chip measuring 5.6 mm × 5.6 mm × 11.2 mm into the carrier plate using a dedicated load plate, applying a conductive paste and drying at 200 ° C. for 10 minutes to fix the paste. The chip was discharged from the carrier plate with a punching press, and it was determined whether the chip could be molded.

  According to this embodiment, for example, the carrier plate shown in FIG. The center position of each through-hole with a plate can be arrange | positioned in the same position. Thereby, the punching press provided with the push pin corresponding to the carrier plate provided with 608 through holes can be used in combination for both carrier plates having different through hole configurations. Thereby, the carrier plate which formed the through-hole 5 with a large diameter with respect to the carrier plate of the same structure as before can be obtained.

  Further, in the carrier plate shown in FIGS. 1 and 2, the large-diameter through-holes 5 for inserting chip components except for the small-diameter through-holes 7 which are dummy in the through-holes 5 and 7 are arranged in a staggered manner. As a result, it has been found that a maximum chip part can be efficiently produced as a ceramic chip.

  In the silicone rubber used in the flexible member 2 made of silicone rubber in the present embodiment, various additives such as a filler, a bulking filler, and a heat-resistant agent are added according to the purpose of use and design purpose of the carrier plate. can do.

For example, the compounding formulation of the filler with respect to the silicone rubber used for the flexible member 2 is not particularly limited, but the reinforcing filler and the filler are usually 10 to 300 with respect to 100 parts by weight of the base gum. About part by weight is added. As the reinforcing filler, wet silica or dry silica (fumed silica) is generally used. Wet silica as used herein refers to reinforcing silica made of silicon dioxide (SiO ₂ ), and the production method includes a direct method of directly decomposing sodium silicate with sulfuric acid, or reacting sodium silicate with salts. There are various methods such as an indirect method in which silicate is produced and then decomposed with sulfuric acid or carbon dioxide. Representative wet silicas include Nipsil VN3 (trade name, manufactured by Nippon Silica Industry Co., Ltd.), Carplex CS-5 (trade name, manufactured by Shionogi Pharmaceutical Co., Ltd.), Starsil S (trade name, manufactured by Kamijima Chemical Co., Ltd.), Toxeal US (trade name, manufactured by Tokuyama Corporation), Shilton R-2 (trade name, manufactured by Mizusawa Chemical Co., Ltd.), Nipsil 223 (trade name, manufactured by PPG (USA)), Ultrasil VN3 (trade name, manufactured by Degussa (Germany)) Vulkasil S (trade name, manufactured by Bayer AG (Germany)) is exemplified, and grades having an average particle size of 30 μm or less, preferably 5 μm or less are used. Dry silica is a reinforcing silica composed of silicon dioxide produced by thermal decomposition of silicon halides, heat reduction of silica sand, air oxidation of evaporated SiO, thermal decomposition of organosilicon compounds, etc. Aerosil 200, Aerosil R972 (trade name, manufactured by Nippon Aerosil Co., Ltd.), Cab-O-Sil MS-5 (trade name, manufactured by Cabot Corporation (USA)), and Leorosil QS102 (trade name, manufactured by Tokuyama Corporation). In this embodiment, if necessary, wet silica and dry silica may be used in combination in a timely manner. Furthermore, a lubricant (wetter) may be added for the purpose of preventing secondary bonds due to the activity on the silica surface. Examples of the lubricant include silicone resins, alkoxysilanes and siloxanes, hydroxysilanes and siloxanes, and silazanes. , Organic acid esters, polyhydric alcohols and the like.

  The bulking filler is a component necessary for maintaining the mechanical properties of the rubber, that is, the physical strength, rubber hardness, compression set, grindability, and other characteristics that are indispensable for the flexible member 2, such as calcium carbonate, Quartz powder, diatomaceous earth, zirconium silicate, clay (aluminum silicate), talc (hydrous magnesium silicate), wollastonite (calcium metasilicate), zinc oxide, magnesium oxide, alumina (aluminum oxide), aluminum sulfate , Barium sulfate, lithopone, mica (mica powder) and the like.

  Further, an antistatic material such as a heat-resistant agent such as cerium oxide or conductive carbon may be added to the silicone rubber.

  The adhesion between the plate body 1 made of aluminum and the flexible member 2 made of silicone rubber in the present embodiment is a peroxide vulcanized silicone rubber, for example, Chemlock 608 (trade name, manufactured by Road Far East Co., Ltd.). An adhesive for silicone rubber can be applied. Examples of the addition type silicone rubber include DY39-051A / B, DY39-067, DY39-115 (trade name, manufactured by Toray Dow Corning Silicone Co., Ltd.) and Primer No. 4. By using an adhesive for addition-type silicone rubber such as Primer C (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), a stronger bond can be obtained. After degreasing with a hydrocarbon-based cleaning agent or propyl bromide, an adhesive is applied, and if necessary, it is baked at 100 ° C. for about 30 minutes and used.

  3 and 4 show another embodiment of the carrier plate of the present invention.

  In the above embodiment, the carrier plate in which the small-diameter through hole 7 and the large-diameter through hole 5 are alternately arranged at the intersections of the vertical and horizontal array lines Lv and Lh connecting the through holes is illustrated. Assuming that the arrangement of push pins of the punching press is changed, only large-diameter through holes are arranged in a staggered manner, thereby improving chip part productivity with a carrier plate without small-diameter through-holes. Is intended.

  In addition, this invention is not limited to the said embodiment, It can change as needed.

The partially cut perspective view which shows embodiment of the carrier plate of this invention The top view which shows the arrangement position of the through-hole of embodiment of FIG. Partially cut perspective view showing a conventional carrier plate Partial cross-sectional view showing usage of conventional carrier plate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Plate body 2 Electronic component support body 3 Outer frame 4 Hole of plate body 5 Through hole 6 Positioning hole 7 Through hole (dummy hole)
11 Push pin 12 Chip component 13 Carrier plate 14 Conductive paste layer

Claims (1)

A large number of holes penetrating in the thickness direction of the plate body made of metal are formed by penetrating the plane of the plate body in parallel in the vertical and horizontal directions, and an elastic member made of silicone rubber is formed on the inner wall surface of each hole. A carrier plate in which a through hole is formed by forming an elastic wall, and the through hole of each type of carrier plate in a plurality of types of carrier plates when the diameter of the through hole is the same and different Are arranged at the intersections of the vertical and horizontal array lines connecting the through holes, and in the carrier plate when the diameters of the through holes are different, the small diameter through holes and the large diameter through holes are arranged on the array lines. are alternately arranged in each intersection, said arrangement line are arranged in the same in all types of the carrier plate, respectively discharge pin is of arranged at intersections of said array line One vent press the carrier plate, characterized in that it is formed so as to be discharged chips inserted into the respective through holes.