JP4511564B2 - Slit nozzle and chemical coating device provided with the same - Google Patents

Slit nozzle and chemical coating device provided with the same Download PDF

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JP4511564B2
JP4511564B2 JP2007039345A JP2007039345A JP4511564B2 JP 4511564 B2 JP4511564 B2 JP 4511564B2 JP 2007039345 A JP2007039345 A JP 2007039345A JP 2007039345 A JP2007039345 A JP 2007039345A JP 4511564 B2 JP4511564 B2 JP 4511564B2
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slit nozzle
chemical solution
chemical
body part
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JP2007330960A (en
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ジュンファン リー
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Semes Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B05B1/04—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape in flat form, e.g. fan-like, sheet-like
    • B05B1/044—Slits, i.e. narrow openings defined by two straight and parallel lips; Elongated outlets for producing very wide discharges, e.g. fluid curtains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor

Description

本発明は、スリットノズル及びそれを備える薬液塗布装置に係り、さらに詳細には、円滑で均一に薬液を供給して装備の状態を容易に維持するスリットノズル及びそれを備える薬液塗布装置に関する。   The present invention relates to a slit nozzle and a chemical liquid coating apparatus including the slit nozzle, and more particularly, to a slit nozzle that supplies a chemical liquid smoothly and uniformly to easily maintain the state of equipment and a chemical liquid coating apparatus including the slit nozzle.

平板ディスプレイパネルの製造過程には、多様な薬液を用いてガラス基板の表面を処理する工程がある。例えば、現像工程は、ガラス基板に現像液を均一に供給して現像し、現像設備は、露光されたガラス基板表面に現像液を均一に塗布して一定時間パドル（ｐｕｄｄｌｅ）を形成して現像する。この際、現像工程上必要なスプレーの均一性を得るために低流量（例えば、１分当り約３０リットル以下）の現像液を供給する場合にも、スリットノズルから吐出される現像液により形成されるカーテンが裂けずに一定の形状に保持されねばならない。   The flat panel display manufacturing process includes a process of treating the surface of the glass substrate using various chemical solutions. For example, in the development process, the developer is uniformly supplied to the glass substrate for development, and the development facility uniformly applies the developer to the exposed glass substrate surface to form a puddle for a certain period of time. To do. At this time, even when a low flow rate (for example, about 30 liters per minute or less) of the developer is supplied in order to obtain the spray uniformity required in the development process, it is formed by the developer discharged from the slit nozzle. The curtain must be held in a certain shape without tearing.

また、半導体製造用の現像液は、超高純度を要求するために高価である。したがって、現像工程で可能であれば、最小の使用で基板表面を均一に塗布することが望ましい。   Further, a developer for producing a semiconductor is expensive because it requires ultra-high purity. Therefore, if possible in the development process, it is desirable to uniformly coat the substrate surface with minimal use.

したがって、ガラス基板上の現像液塗布状態及び低流量の現像液供給によるスリットノズルのスプレー均一性の確保が、現像工程では要点となる。   Therefore, securing the spray uniformity of the slit nozzles by applying the developer on the glass substrate and supplying the developer at a low flow rate is a key point in the development process.

しかし、従来にＳＵＳ材質のスリットノズルの場合、スリットノズル自体が重くて現像液塗布装置に付着して保持するのが相対的に難しい問題がある。また、従来のスリットノズルの場合、現像液が吐出される吐出口の幅が広すぎる場合、現像液が過度に多く出るようになり、一方、吐出口の幅が狭すぎる場合、現像液の吐出速度が速すぎてガラス基板上にバブル（ｂｕｂｂｌｅ）が生じる問題がある。   However, in the case of a conventional slit nozzle made of SUS, there is a problem that the slit nozzle itself is heavy and is relatively difficult to attach and hold on the developer coating apparatus. Also, in the case of the conventional slit nozzle, if the width of the discharge port from which the developer is discharged is too wide, excessive amount of the developer will come out, while if the width of the discharge port is too narrow, the developer will be discharged. There is a problem that bubbles are generated on the glass substrate because the speed is too high.

本発明が解決しようとする技術的課題は、円滑に薬液を供給し、装備状態を容易に維持しうるスリットノズルを提供するところにある。   A technical problem to be solved by the present invention is to provide a slit nozzle that can smoothly supply a chemical solution and can easily maintain an equipped state.

本発明が解決しようとする他の技術的課題は、このようなスリットノズルを備える薬液塗布装置を提供するところにある。   Another technical problem to be solved by the present invention is to provide a chemical solution coating apparatus having such a slit nozzle.

本発明の技術的課題は、以上で言及した技術的課題に制限されず、言及されていない他の課題は下の記載から当業者に明確に理解されうる。   The technical problem of the present invention is not limited to the technical problem mentioned above, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

前記技術的課題を達成するための本発明の一実施形態によるスリットノズルは、薬液が流入される供給孔が形成された第１胴体部と、前記第１胴体部と対向して配された第２胴体部と、前記第１及び第２胴体部の間に配されて、前記第１及び第２胴体部を所定間隔離隔させるスペーサと、を備え、前記スペーサは、該スペーサの厚さによって幅が決定され、かつ、前記第１及び第２胴体部の間に前記供給孔と連結された吐出口を形成し、前記第１胴体部は、前記第２胴体部と対向する一面に形成された１つ以上の溝部を備え、前記第２胴体部は、前記溝部と対応して形成された１つ以上の突出部を備え、前記溝部と前記突出部は、所定間隔離隔して配置することによって、前記第１胴体部及び前記第２胴体部内で折り曲げられた形状を有する前記吐出口を形成する。 A slit nozzle according to an exemplary embodiment of the present invention for achieving the technical problem includes a first body part having a supply hole into which a chemical solution is introduced, and a first body part disposed opposite to the first body part. a second body portion, disposed between the first and second bodies, e Bei and a spacer for a predetermined distance the first and second bodies, the spacer, the thickness of the spacer width is determined, and wherein to form a supply hole and linked discharge opening between the first and second bodies, the first body portion is formed on one surface facing the second body portion The second body portion includes one or more projecting portions formed corresponding to the groove portions, and the groove portions and the projecting portions are spaced apart from each other by a predetermined distance. According to the above, the first body part and the second body part have a bent shape. To form a serial discharge port.

前記他の技術的課題を達成するための本発明の一実施形態による薬液塗布装置は、薬液を保管する薬液供給源と、前記薬液供給源と連結されて前記薬液を伝達する配管と、前記薬液を基板上に吐出する前記スリットノズルと、を備える。   In order to achieve the other technical problem, a chemical solution coating apparatus according to an embodiment of the present invention includes a chemical solution supply source that stores a chemical solution, a pipe that is connected to the chemical solution supply source and transmits the chemical solution, and the chemical solution The slit nozzle for discharging the liquid onto the substrate.

本発明によるスリットノズル及びこれを備える薬液塗布装置によれば、相対的に軽量で堅固な樹脂系の物質を用いてスリットノズルを形成することによって、薬液塗布装置へのスリットノズルの装着や管理が容易である。   According to the slit nozzle according to the present invention and the chemical liquid coating apparatus including the slit nozzle, the slit nozzle is formed using a relatively light and solid resin-based material, so that the mounting and management of the slit nozzle on the chemical liquid coating apparatus can be performed. Easy.

また、スペーサの厚さを調節することによって、スリットノズル内で薬液の吐出速度を容易に制御しうる。   Further, by adjusting the thickness of the spacer, the discharge speed of the chemical solution can be easily controlled in the slit nozzle.

さらに、薬液の吐出口を折り曲げて形成することによって、薬液の吐出速度が過度に上昇して基板上に塗布された薬液に気泡が発生することを防止しうる。   Furthermore, by forming the discharge port of the chemical solution by bending, it is possible to prevent the discharge rate of the chemical solution from increasing excessively and generating bubbles in the chemical solution applied on the substrate.

その他の実施例の具体的な事項は詳細な説明及び図面に含まれている。   Specific details of other embodiments are included in the detailed description and drawings.

本発明の利点及び特徴、そしてこれを達成する方法は添付された図面に基づいて詳細に後述されている実施例を参照すれば明確になる。しかし、本発明は以下で開示される実施例に限定されるものではなく、この実施例から外れて多様な形に具現でき、本明細書で説明する実施例は本発明の開示を完全にし、本発明が属する技術分野で当業者に発明の範ちゅうを完全に報せるために提供されるものであり、本発明は請求項及び発明の詳細な説明によってのみ定義される。一方、明細書全体に亙って同一な参照符号は同一な構成要素を示す。   Advantages and features of the present invention and methods of achieving the same will be apparent with reference to the embodiments described below in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various forms that deviate from the embodiments, and the embodiments described herein complete the disclosure of the present invention. The present invention is provided in order to fully inform those skilled in the art in the technical field to which the present invention pertains, and the present invention is defined only by the claims and the detailed description of the invention. On the other hand, the same reference numerals denote the same components throughout the specification.

以下、添付された図面を参照して本発明の一実施形態によるスリットノズル及びそれを備える薬液塗布装置について詳細に説明する。以下、説明される実施形態では説明の便宜上、薬液塗布装置でとして半導体製造工程で現像液を塗布する現像液塗布装置を例示しているが、本発明はこれに限定されず、基板上に薬液を均一に塗布するために、任意の半導体製造装置を備えることができる。   Hereinafter, a slit nozzle and a chemical coating apparatus including the slit nozzle according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, in the embodiment described, for the sake of convenience of explanation, a developer application apparatus that applies a developer in a semiconductor manufacturing process is exemplified as a chemical application apparatus. However, the present invention is not limited to this, and a chemical solution is formed on a substrate. In order to apply | coat uniformly, arbitrary semiconductor manufacturing apparatuses can be provided.

図１は、本発明の一実施形態による薬液塗布装置を概略的に示す斜視図であり、図２は、図１の薬液塗布装置に含まれたスリットノズルの側面図である。   FIG. 1 is a perspective view schematically showing a chemical liquid coating apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a slit nozzle included in the chemical liquid coating apparatus of FIG.

図１を参照すれば、本発明の一実施形態による薬液塗布装置１００は、基板１０上に薬液を塗布するスリットノズル（ｓｌｉｔ ｎｏｚｚｌｅまたはｐｕｄｄｌｅ ｋｎｉｆｅ）１５０と、薬液を保管する薬液供給源１１０と、薬液供給源１１０に連結されて薬液を伝達する配管１２０、１２２と、スリットノズル１５０と配管１２０、１２２との間に連結されて薬液をスリットノズル１５０に供給する供給ライン１４０とを備える。また、薬液塗布装置１００は、薬液塗布のために基板１０を移動させる基板移送装置２０を備える。   Referring to FIG. 1, a chemical solution coating apparatus 100 according to an embodiment of the present invention includes a slit nozzle 150 for applying a chemical solution on a substrate 10, a chemical supply source 110 for storing the chemical solution, Pipes 120 and 122 connected to the chemical liquid supply source 110 for transmitting the chemical liquid, and a supply line 140 connected between the slit nozzle 150 and the pipes 120 and 122 for supplying the chemical liquid to the slit nozzle 150 are provided. Moreover, the chemical solution coating apparatus 100 includes a substrate transfer device 20 that moves the substrate 10 for chemical solution application.

ここで、薬液供給源１１０は、基板１０の表面に塗布される薬液、例えば、現像液（例えば、２．３８％のＴＭＡＨ溶液）を保管している。   Here, the chemical solution supply source 110 stores a chemical solution applied to the surface of the substrate 10, for example, a developer (for example, a 2.38% TMAH solution).

配管１２０、１２２は、薬液を伝達する第１配管１２０と、第１配管１２０に供給される薬液内部のエアーを除去するための第２配管１２２とを備える。第１配管１２０は、薬液供給量調節用の第１弁１３０を備え、第１弁１３０の調節を通じて薬液の供給量を調節する。そして、第１配管１２０は、薬液供給源１１０から複数の供給ライン１４０を通じてスリットノズル１５０と連結され、供給ライン１４０を通じてスリットノズル１５０全体に薬液を均一に供給する。この際、第２配管１２２は、第１配管１２０に供給される薬液内部のエアーを除去するために第２弁１３２を備える。   The pipes 120 and 122 include a first pipe 120 that transmits the chemical liquid and a second pipe 122 that removes air inside the chemical liquid supplied to the first pipe 120. The first pipe 120 includes a first valve 130 for adjusting the chemical supply amount, and adjusts the supply amount of the chemical through adjustment of the first valve 130. The first pipe 120 is connected to the slit nozzle 150 from the chemical supply source 110 through the plurality of supply lines 140, and supplies the chemical liquid uniformly to the entire slit nozzle 150 through the supply line 140. At this time, the second pipe 122 includes a second valve 132 for removing air inside the chemical solution supplied to the first pipe 120.

第１弁１３０は、現像液供給量を調節するためにスプレーされる流量を固定的に設定する。第２弁１３２は、第１配管１２０内のエアーを除去するために瞬間大容量弁として備えられ、開閉動作を周期的（例えば、約５秒間隔）に反復させる。例えば、現像工程で、エアー（ａｉｒ、ｍｉｃｒｏｂｕｂｂｌｅ）は、現像液が基板面に均一に塗布されないなど、工程トラブルの原因となるためである。   The first valve 130 fixedly sets the flow rate to be sprayed to adjust the developer supply amount. The second valve 132 is provided as an instantaneous large-capacity valve for removing air in the first pipe 120, and repeats the opening / closing operation periodically (for example, at intervals of about 5 seconds). For example, in the development process, air (air, microbubble) is a cause of process trouble such as the developer not being uniformly applied to the substrate surface.

そして、供給ライン１４０は、例えば、ＰＦＡ（Ｐｅｒｆｌｕｏｒｏａｌｋｏｘｙ）チューブなどで形成され、第１配管１２０から供給される薬液をスリットノズル１５０に迅速で均一に供給するために複数個備えられうる。供給ライン１４０は、配管１２０、１２２内部でのエアーの発生時、スリットノズル１５０に残留せず、配管１２０、１２２側に上がるようにするために、図２に示されたように、供給ライン１４０の長さを‘コ’字状に延ばして、エアーが上がるのに必要とする空間を確保するように構成する。これは稼働初期に最大限多量のエアーを除去することが重要であり、初期に大流量弁を用いてスリットノズル１５０に排出させ、薬液のカーテンが形成された以後のエアーは、スリットノズル１５０に排出され得ないために、動作中に発生するエアーは、スリットノズル１５０内に流入されないように配管１２０、１２２及び／または供給ライン１４０に留まるようにすることが望ましい。   The supply line 140 is formed of, for example, a PFA (Perfluoroalkoxy) tube or the like, and a plurality of supply lines 140 may be provided to supply the chemical solution supplied from the first pipe 120 to the slit nozzle 150 quickly and uniformly. As shown in FIG. 2, the supply line 140 does not remain in the slit nozzle 150 when air is generated inside the pipes 120 and 122, and rises toward the pipes 120 and 122, as shown in FIG. 2. The length of the is extended to a 'U' shape so as to secure a space required for air to rise. It is important to remove a maximum amount of air at the beginning of operation, and the air after the curtain of the chemical solution is formed in the slit nozzle 150 is discharged to the slit nozzle 150 using a large flow valve in the initial stage. In order not to be discharged, it is desirable that the air generated during operation stays in the pipes 120, 122 and / or the supply line 140 so as not to flow into the slit nozzle 150.

スリットノズル１５０は、基板１０の幅方向に対応して長く形成されたノズルを通じて薬液、例えば、現像液を基板１０の表面に均一に塗布するスリット方式の塗布装置である。本発明の一実施形態による薬液塗布装置１００は、基板１０の表面に薬液を均一に塗布するために薬液の流量または流速の差をおいている１つ以上のスリットノズル１５０を備えうる。   The slit nozzle 150 is a slit-type coating apparatus that uniformly applies a chemical solution, for example, a developing solution to the surface of the substrate 10 through a nozzle formed long corresponding to the width direction of the substrate 10. The chemical solution coating apparatus 100 according to an embodiment of the present invention may include one or more slit nozzles 150 that have a difference in the flow rate or flow rate of the chemical solution in order to uniformly apply the chemical solution to the surface of the substrate 10.

以下、図３ないし図５を参照して、本発明の一実施形態によるスリットノズルについて詳細に説明する。図３は、本発明の一実施形態によるスリットノズルの分解斜視図であり、図４は、図３のスリットノズルの結合斜視図であり、図５は、図４のスリットノズルをＡ−Ａ’線に沿って切断した断面図である。   Hereinafter, a slit nozzle according to an embodiment of the present invention will be described in detail with reference to FIGS. 3 to 5. 3 is an exploded perspective view of a slit nozzle according to an embodiment of the present invention, FIG. 4 is a combined perspective view of the slit nozzle of FIG. 3, and FIG. It is sectional drawing cut | disconnected along the line.

図３ないし図５を参照すれば、本発明の一実施形態によるスリットノズル１５０は、内部に折り曲げられた吐出口２６０を形成するための第１及び第２胴体部２１０、２２０と、第１及び第２胴体部２１０、２２０の間に介在されて吐出口２６０の形成のための空間を提供するスペーサ２３０と、を備える。   3 to 5, the slit nozzle 150 according to an exemplary embodiment of the present invention includes first and second body parts 210 and 220 for forming a discharge port 260 that is bent therein, and first and second body parts. And a spacer 230 interposed between the second body parts 210 and 220 to provide a space for forming the discharge port 260.

ここで、第１胴体部２１０の一面には、供給ライン（図１の図面符号１４０参照）が挿着されて薬液１５を供給される供給孔２４０が形成されている。薬液１５をスリットノズル１５０に迅速で均一に供給させるために、供給ラインの数に対応して供給孔２４０も複数個形成することが望ましい。また、複数の供給孔２４０は、スリットノズル１５０の長手方向に沿って一定の間隔に配列されうる。   Here, a supply hole 240 through which a supply line (see reference numeral 140 in FIG. 1) is inserted and the chemical solution 15 is supplied is formed on one surface of the first body portion 210. In order to supply the chemical solution 15 to the slit nozzle 150 quickly and uniformly, it is desirable to form a plurality of supply holes 240 corresponding to the number of supply lines. Further, the plurality of supply holes 240 may be arranged at regular intervals along the longitudinal direction of the slit nozzle 150.

供給孔２４０と吐出口２６０は、互いに連結されているので、第１胴体部２１０に流入された薬液１５は、まず供給孔２４０内の空間に一時的に滞留された後、吐出口２６０を通じて基板表面に吐出される。第１胴体部２１０の他面、すなわち、第２胴体部２２０と対向する面には、折り曲げられた吐出口２６０を形成するための溝部２１２が形成されている。   Since the supply hole 240 and the discharge port 260 are connected to each other, the chemical solution 15 that has flowed into the first body 210 is first temporarily retained in the space in the supply hole 240 and then the substrate through the discharge port 260. Discharged on the surface. On the other surface of the first body portion 210, that is, the surface facing the second body portion 220, a groove portion 212 for forming the bent discharge port 260 is formed.

第２胴体部２２０は、スペーサ２３０により所定の間隔をおいて第１胴体部２１０と対向して結合する。第１胴体部２１０と対向する第２胴体部２２０の一面には、第１胴体部２１０の溝部２１２に対応する突出部２２２が形成されている。溝部２１２内に突出部２２２が挿入されて所定間隔に離隔して配されることによって、薬液１５の移動する吐出口２６０が‘コ’字状に折り曲げられた形状を有する。このように、吐出口２６０を折り曲げられた形状に形成することによって、スリットノズル１５０に流入された薬液１５の吐出速度が過度に上昇することを防止しうる。   The second body part 220 is coupled to the first body part 210 by a spacer 230 at a predetermined interval. A protrusion 222 corresponding to the groove 212 of the first body 210 is formed on one surface of the second body 220 that faces the first body 210. The protrusions 222 are inserted into the grooves 212 and spaced apart from each other by a predetermined interval, whereby the discharge port 260 through which the chemical solution 15 moves has a shape that is bent in a “U” shape. Thus, by forming the discharge port 260 in a bent shape, it is possible to prevent the discharge speed of the chemical solution 15 that has flowed into the slit nozzle 150 from rising excessively.

また、スペーサ２３０の厚さｄにより吐出口２６０の幅ｄが決定される。一般的な流体力学によれば、流体の速度と流体の流れる断面積は、次の式１のような関係が成り立つ。
（式１）
流量＝断面積×流速
したがって、供給孔２４０を通じてスリットノズル１５０に供給される薬液１５の量と吐出口２６０を通じてスリットノズル１５０から吐出される薬液１５の量とが同一なので（すなわち、流量が同一である）、薬液１５の吐出速度は、吐出口２６０の幅ｄにより決定される。 Further, the width d of the discharge port 260 is determined by the thickness d of the spacer 230. According to general fluid dynamics, the relationship of the following equation 1 is established between the fluid velocity and the cross-sectional area through which the fluid flows.
(Formula 1)
Therefore, the amount of the chemical solution 15 supplied to the slit nozzle 150 through the supply hole 240 is the same as the amount of the chemical solution 15 discharged from the slit nozzle 150 through the discharge port 260 (that is, the flow rate is the same). The discharge speed of the chemical solution 15 is determined by the width d of the discharge port 260.

従来には、供給孔２４０の断面積と比較して、吐出口２６０の幅が過度に狭くて（例えば、０．０１〜０．２ｍｍ）、薬液１５の吐出速度が過度に高く、したがって、基板上に塗布された薬液に気泡が発生する問題があった。また、この場合、薬液の塗布特性を均一に維持するために吐出口の細い幅を一定に管理するのに多くの難点があった。しかし、本実施形態では、吐出口２６０の幅ｄ（すなわち、スペーサ２３０の厚さ）を約１〜３ｍｍに形成することによって、薬液１５の吐出速度が過度に増加することを防止して、気泡の発生を防止するだけでなく、相対的に吐出口２６０の幅が広いために、これを一定に維持するように管理しやすい。さらに、前述したように、吐出口２６０を折り曲げられた形状に形成することによって、薬液１５の吐出速度を制御しうる。   Conventionally, compared with the cross-sectional area of the supply hole 240, the width of the discharge port 260 is excessively narrow (for example, 0.01 to 0.2 mm), and the discharge speed of the chemical solution 15 is excessively high. There was a problem that bubbles were generated in the chemical applied on top. Further, in this case, there are many difficulties in managing the narrow width of the discharge port uniformly in order to keep the coating characteristics of the chemical solution uniform. However, in the present embodiment, by forming the width d of the discharge port 260 (that is, the thickness of the spacer 230) to be about 1 to 3 mm, it is possible to prevent the discharge speed of the chemical solution 15 from excessively increasing and In addition to preventing the occurrence of this, since the width of the discharge port 260 is relatively wide, it is easy to manage the discharge port 260 so as to keep it constant. Furthermore, as described above, the discharge speed of the chemical solution 15 can be controlled by forming the discharge port 260 in a bent shape.

第１胴体部２１０、第２胴体部２２０またはスペーサ２３０は、多様な形状の折り曲げられた吐出口２６０を形成するために、樹脂系の物質で形成しうる。例えば、ＰＶＣなどで形成しうる。樹脂系でスリットノズル１５０を形成する場合、スリットノズル１５０の自重が軽くなって、薬液塗布装置へのスリットノズル１５０の装着や管理が容易である長所がある。   The first body part 210, the second body part 220, or the spacer 230 may be formed of a resin-based material in order to form the bent discharge ports 260 having various shapes. For example, it can be formed of PVC or the like. When the slit nozzle 150 is formed of a resin system, the weight of the slit nozzle 150 is reduced, and there is an advantage that the slit nozzle 150 can be easily mounted and managed in the chemical solution coating apparatus.

本実施形態では、第１胴体部２１０に溝部２１２が、第２胴体部２２０に突出部２２２が形成されているが、本発明はこれに限定されず、折り曲げられた吐出口２６０を形成できる任意の形状の第１胴体部２１０及び第２胴体部２２０を採用しうる。例えば、第１胴体部２１０に突出部が形成され、第２胴体部２２０に、このような突出部が挿入される溝部が形成されうる。   In the present embodiment, the groove portion 212 is formed in the first body portion 210 and the protruding portion 222 is formed in the second body portion 220. However, the present invention is not limited to this, and an arbitrary one that can form the bent discharge port 260. The first body part 210 and the second body part 220 having the shape shown in FIG. For example, a protrusion may be formed in the first body part 210, and a groove part in which such a protrusion is inserted may be formed in the second body part 220.

第１胴体部２１０、スペーサ２３０及び第２胴体部２２０は、各々に形成された結合孔２５２、２５４、２５６及びスクリュー２５０を用いて締結されうる。但し、本発明はこれに限定されず、粘着剤、接着剤、フック結合など多様な結合手段により第１胴体部２１０、スペーサ２３０及び第２胴体部２２０を結合固定しうる。   The first body part 210, the spacer 230, and the second body part 220 may be fastened using coupling holes 252, 254, 256 and a screw 250 formed in each. However, the present invention is not limited thereto, and the first body part 210, the spacer 230, and the second body part 220 can be coupled and fixed by various coupling means such as an adhesive, an adhesive, and a hook coupling.

以下、図６を参照して本発明の他の実施形態を説明する。図６は、本発明の他の実施形態によるスリットノズルの断面図である。説明の便宜上、前述した実施形態の図面（図１ないし図５）に示した各部材と同一機能を有する部材は、同一符号を付し、その詳細な説明は省略する。本実施形態のスリットノズル６５０は、図６に示したように、前述した実施形態のスリットノズルと次の説明を除いては基本的に同じ構造を有する。   Hereinafter, another embodiment of the present invention will be described with reference to FIG. FIG. 6 is a cross-sectional view of a slit nozzle according to another embodiment of the present invention. For convenience of explanation, members having the same functions as those shown in the drawings (FIGS. 1 to 5) of the embodiment described above are given the same reference numerals, and detailed descriptions thereof are omitted. As shown in FIG. 6, the slit nozzle 650 of the present embodiment has basically the same structure as the slit nozzle of the above-described embodiment except for the following description.

すなわち、図６に示されたように、第１胴体部２１０には、２つの溝部２１２、２１４が形成されており、第２胴体部２２０には、前記溝部２１２、２１４に対応する２つの突出部２２２、２２４が形成されている。このように２対の溝部２１２、２１４と突出部２２２、２２４とを形成することによって、薬液１５の吐出速度をさらに円滑に制御しうる。すなわち、薬液１５の吐出速度が過度に上昇することを防止しうる。   That is, as shown in FIG. 6, two grooves 212 and 214 are formed in the first body 210, and two protrusions corresponding to the grooves 212 and 214 are formed in the second body 220. Portions 222 and 224 are formed. Thus, by forming the two pairs of groove portions 212 and 214 and the protruding portions 222 and 224, the discharge speed of the chemical solution 15 can be controlled more smoothly. That is, it is possible to prevent the discharge speed of the chemical solution 15 from rising excessively.

本実施形態では、２対の溝部と突出部を例として説明しているが、本発明はこのような突出部と溝部の数に限定されず、１つ以上の突出部及び溝部をスリットノズルに形成しうる。   In the present embodiment, two pairs of grooves and protrusions are described as an example, but the present invention is not limited to the number of such protrusions and grooves, and one or more protrusions and grooves are used as slit nozzles. Can be formed.

以上、添付図を参照して本発明の実施例を説明したが、 本発明が属する技術分野で当業者ならば本発明がその技術的思想や必須特徴を変更せずとも他の具体的な形に実施されうるということが理解できるであろう。したがって、前述した実施例は全ての面で例示的なものであって、限定的なものではないと理解せねばならない。   Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains can be applied to other specific forms without changing the technical idea and essential features thereof. It will be understood that this can be implemented. Accordingly, it should be understood that the above-described embodiments are illustrative in all aspects and not limiting.

本発明は、スリットノズル及びそれを備える薬液塗布装置に関連した技術分野に好適に適用されうる。   The present invention can be suitably applied to a technical field related to a slit nozzle and a chemical solution coating apparatus including the slit nozzle.

本発明の一実施形態による薬液塗布装置を概略的に示す斜視図である。1 is a perspective view schematically showing a chemical solution coating apparatus according to an embodiment of the present invention. 図１の薬液塗布装置に含まれたスリットノズルの側面図である。It is a side view of the slit nozzle contained in the chemical | medical solution coating device of FIG. 本発明の一実施形態によるスリットノズルの分解斜視図である。It is a disassembled perspective view of the slit nozzle by one Embodiment of this invention. 図３のスリットノズルの結合斜視図である。FIG. 4 is a combined perspective view of the slit nozzle of FIG. 3. 図４のスリットノズルをＡ−Ａ’線に沿って切断した断面図である。It is sectional drawing which cut | disconnected the slit nozzle of FIG. 4 along the A-A 'line. 本発明の他の実施形態によるスリットノズルの断面図である。It is sectional drawing of the slit nozzle by other embodiment of this invention.

符号の説明Explanation of symbols

１０ 基板
１５ 薬液
２０ 基板移送装置
１００ 薬液塗布装置
１１０ 薬液供給源
１２０、１２２ 配管
１３０、１３２ 弁
１４０ 供給ライン
１５０ スリットノズル
２１０ 第１胴体部
２１２、２１４ 溝部
２２０ 第２胴体部
２２２、２２４ 突出部
２３０ スペーサ
２４０ 供給孔
２５０ スクリュー
２５２、２５４、２５６ 結合孔
２６０ 吐出口 DESCRIPTION OF SYMBOLS 10 Substrate 15 Chemical solution 20 Substrate transfer device 100 Chemical solution application device 110 Chemical solution supply source 120, 122 Pipe 130, 132 Valve 140 Supply line 150 Slit nozzle 210 First body portion 212, 214 Groove portion 220 Second body portion 222, 224 Projection portion 230 Spacer 240 Supply hole 250 Screw 252, 254, 256 Coupling hole 260 Discharge port

Claims (4)

薬液が流入される供給孔が形成された第１胴体部と、
前記第１胴体部と対向して配された第２胴体部と、
前記第１及び第２胴体部の間に配されて前記第１及び第２胴体部を所定間隔離隔させるスペーサと、を備え、
前記スペーサは、該スペーサの厚さによって幅が決定され、かつ、前記第１及び第２胴体部の間に前記供給孔と連結された吐出口を形成し、
前記第１胴体部は、前記第２胴体部と対向する一面に形成された１つ以上の溝部を備え、前記第２胴体部は、前記溝部と対応して形成された１つ以上の突出部を備え、
前記溝部と前記突出部は、所定間隔離隔して配置することによって、前記第１胴体部及び前記第２胴体部内で折り曲げられた形状を有する前記吐出口を形成するスリットノズル。 A first body part having a supply hole into which a chemical solution is introduced;
A second body part disposed opposite to the first body part;
E Bei and a spacer for a predetermined distance the first and second bodies arranged between said first and second bodies,
The spacer has a width determined by the thickness of the spacer, and forms a discharge port connected to the supply hole between the first and second body parts ,
The first body portion includes one or more groove portions formed on one surface facing the second body portion, and the second body portion includes one or more projecting portions formed corresponding to the groove portions. With
The slit nozzle that forms the discharge port having a shape bent in the first body part and the second body part by disposing the groove part and the projecting part at a predetermined interval . 前記スペーサの幅は約１〜３ｍｍである請求項１に記載のスリットノズル。   The slit nozzle of claim 1, wherein the spacer has a width of about 1 to 3 mm. 前記第１胴体部、前記第２胴体部または前記スペーサは、ＰＶＣ材質からなる請求項１に記載のスリットノズル。   The slit nozzle according to claim 1, wherein the first body part, the second body part, or the spacer is made of a PVC material. 薬液を保管する薬液供給源と、
前記薬液供給源と連結されて前記薬液を伝達する配管と、
前記薬液を基板上に吐出する請求項１ないし３のうち、何れか１項に記載の前記スリットノズルと、を備える薬液塗布装置。 A chemical supply source for storing the chemical,
A pipe connected to the chemical liquid supply source for transmitting the chemical liquid;
A chemical solution coating apparatus comprising: the slit nozzle according to any one of claims 1 to 3 that discharges the chemical solution onto a substrate.
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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5007168B2 (en) * 2007-07-10 2012-08-22 日東電工株式会社 Die coater adjusting method and optical film manufacturing method
CN102371226A (en) * 2010-08-26 2012-03-14 昆山大阳机电设备制造有限公司 Fixed coating head for slit gluing
CN103801466B (en) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 The wet processing process nozzle of the uniform flow of a kind of low impulsive force
CN104635437A (en) * 2013-11-07 2015-05-20 沈阳芯源微电子设备有限公司 Curtain-like developing nozzle
CN104635436A (en) * 2013-11-07 2015-05-20 沈阳芯源微电子设备有限公司 Temperature variable curtain-like developing apparatus
JP6955971B2 (en) * 2017-11-10 2021-10-27 株式会社ディスコ Cleaning nozzle
CN108187970A (en) * 2018-01-23 2018-06-22 佛山市雅路斯工业设备有限公司 A kind of valvular coating head of band
KR102078183B1 (en) * 2018-07-02 2020-04-02 스프레이시스템코리아 유한회사 Two-fluid slit nozzle capable of preventing backward flow
KR102152532B1 (en) * 2019-06-10 2020-09-04 박선길 Dispensor nozzle and mathod for manufacturing the same

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226180A (en) * 1993-01-30 1994-08-16 Sumitomo Metal Ind Ltd Coating device
JPH0731168U (en) * 1993-05-31 1995-06-13 平田機工株式会社 Fluid coating device
JPH07171471A (en) * 1993-12-21 1995-07-11 Sumitomo Metal Ind Ltd Coating method and coating nozzle
JPH09234409A (en) * 1996-03-01 1997-09-09 Nippon Tokushu Toryo Co Ltd Method for coating automobile with strippable coating material and equipment therefor
JPH10323603A (en) * 1997-05-26 1998-12-08 Fukuda Eng:Kk Apparatus for curtain-like downflow of flowing material
JPH11197576A (en) * 1998-01-08 1999-07-27 Konica Corp Coater and coating method
JPH11207236A (en) * 1998-01-20 1999-08-03 Konica Corp Die coater
JP2001137762A (en) * 2000-09-29 2001-05-22 Fukuda Engineering:Kk Apparatus for curtain coating fluid material
JP2004148184A (en) * 2002-10-30 2004-05-27 Toray Eng Co Ltd Coating method and coating apparatus
JP2004275810A (en) * 2003-03-12 2004-10-07 Pi R & D Co Ltd Coating die using shim plate and coating method using the same
JP2004313873A (en) * 2003-04-14 2004-11-11 Tokyo Ohka Kogyo Co Ltd Slit nozzle and treating liquid feeding device using the slit nozzle
JP2005087796A (en) * 2003-09-12 2005-04-07 Tdk Corp Slit coating apparatus and slit coating method
JP2006305521A (en) * 2005-05-02 2006-11-09 Suntool Corp Method and apparatus for applying adhesive to elastic string-like body on coating line

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5746875A (en) 1994-09-16 1998-05-05 Applied Materials, Inc. Gas injection slit nozzle for a plasma process reactor
KR100538546B1 (en) * 2003-08-20 2005-12-22 세메스 주식회사 Facility and method for coating photoresist on substrates and apparatus for treating a slit-nozzle used in the facility
KR100558928B1 (en) 2003-11-21 2006-03-10 세메스 주식회사 Apparatus for coating photoresist on a substrate for manufacturing flat panel display devices and nozzle used in the apparatus

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06226180A (en) * 1993-01-30 1994-08-16 Sumitomo Metal Ind Ltd Coating device
JPH0731168U (en) * 1993-05-31 1995-06-13 平田機工株式会社 Fluid coating device
JPH07171471A (en) * 1993-12-21 1995-07-11 Sumitomo Metal Ind Ltd Coating method and coating nozzle
JPH09234409A (en) * 1996-03-01 1997-09-09 Nippon Tokushu Toryo Co Ltd Method for coating automobile with strippable coating material and equipment therefor
JPH10323603A (en) * 1997-05-26 1998-12-08 Fukuda Eng:Kk Apparatus for curtain-like downflow of flowing material
JPH11197576A (en) * 1998-01-08 1999-07-27 Konica Corp Coater and coating method
JPH11207236A (en) * 1998-01-20 1999-08-03 Konica Corp Die coater
JP2001137762A (en) * 2000-09-29 2001-05-22 Fukuda Engineering:Kk Apparatus for curtain coating fluid material
JP2004148184A (en) * 2002-10-30 2004-05-27 Toray Eng Co Ltd Coating method and coating apparatus
JP2004275810A (en) * 2003-03-12 2004-10-07 Pi R & D Co Ltd Coating die using shim plate and coating method using the same
JP2004313873A (en) * 2003-04-14 2004-11-11 Tokyo Ohka Kogyo Co Ltd Slit nozzle and treating liquid feeding device using the slit nozzle
JP2005087796A (en) * 2003-09-12 2005-04-07 Tdk Corp Slit coating apparatus and slit coating method
JP2006305521A (en) * 2005-05-02 2006-11-09 Suntool Corp Method and apparatus for applying adhesive to elastic string-like body on coating line

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CN101088624A (en) 2007-12-19
CN101088624B (en) 2012-08-29
KR100782539B1 (en) 2007-12-06
JP2007330960A (en) 2007-12-27
TWI360026B (en) 2012-03-11
TW200801822A (en) 2008-01-01

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