JP4498716B2 - レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 - Google Patents
レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4498716B2 JP4498716B2 JP2003345276A JP2003345276A JP4498716B2 JP 4498716 B2 JP4498716 B2 JP 4498716B2 JP 2003345276 A JP2003345276 A JP 2003345276A JP 2003345276 A JP2003345276 A JP 2003345276A JP 4498716 B2 JP4498716 B2 JP 4498716B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser beam
- lens
- substrate
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
- Lasers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003345276A JP4498716B2 (ja) | 2002-10-03 | 2003-10-03 | レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002291545 | 2002-10-03 | ||
JP2003345276A JP4498716B2 (ja) | 2002-10-03 | 2003-10-03 | レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004146823A JP2004146823A (ja) | 2004-05-20 |
JP2004146823A5 JP2004146823A5 (enrdf_load_stackoverflow) | 2006-11-16 |
JP4498716B2 true JP4498716B2 (ja) | 2010-07-07 |
Family
ID=32473426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003345276A Expired - Fee Related JP4498716B2 (ja) | 2002-10-03 | 2003-10-03 | レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4498716B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1809598B (zh) | 2003-06-26 | 2010-05-12 | 积水化学工业株式会社 | 涂膏用粘合树脂 |
CN101331592B (zh) * | 2005-12-16 | 2010-06-16 | 株式会社半导体能源研究所 | 激光照射设备、激光照射方法和半导体装置的制造方法 |
JP5500573B2 (ja) * | 2009-05-19 | 2014-05-21 | 株式会社日本製鋼所 | 半導体不純物の活性化方法 |
CN102290342B (zh) * | 2011-09-05 | 2013-07-03 | 清华大学 | 一种采用六边形束斑的激光扫描退火方法 |
SG10201503482QA (en) * | 2012-06-11 | 2015-06-29 | Ultratech Inc | Laser annealing systems and methods with ultra-short dwell times |
CN104395033B (zh) | 2012-07-04 | 2017-06-23 | 法国圣戈班玻璃厂 | 用于在使用至少两个桥情况下对大面积衬底进行激光处理的设备和方法 |
JP6665624B2 (ja) * | 2015-03-27 | 2020-03-13 | 日本製鉄株式会社 | 試験装置およびそれを備えた電子顕微鏡 |
CN111863342B (zh) * | 2019-04-28 | 2021-08-27 | 上海微电子装备(集团)股份有限公司 | 一种ito退火工艺 |
JPWO2021256434A1 (enrdf_load_stackoverflow) | 2020-06-18 | 2021-12-23 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0795538B2 (ja) * | 1986-05-02 | 1995-10-11 | 旭硝子株式会社 | レ−ザ−アニ−ル装置 |
JP2001326363A (ja) * | 2000-03-08 | 2001-11-22 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
-
2003
- 2003-10-03 JP JP2003345276A patent/JP4498716B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2004146823A (ja) | 2004-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7800080B2 (en) | Laser irradiation apparatus and method of manufacturing semiconductor device | |
US7405114B2 (en) | Laser irradiation apparatus and method of manufacturing semiconductor device | |
US7674663B2 (en) | Method of irradiating laser, laser irradiation system, and manufacturing method of semiconductor device | |
CN100479116C (zh) | 激光照射设备和制造半导体器件的方法 | |
US6979605B2 (en) | Manufacturing method for a semiconductor device using a marker on an amorphous semiconductor film to selectively crystallize a region with a laser light | |
KR100915104B1 (ko) | 반도체 장치의 제조 방법 | |
JP5063660B2 (ja) | 半導体装置の作製方法 | |
EP1468774B1 (en) | Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device | |
JP4413569B2 (ja) | 表示パネルの製造方法及び表示パネル | |
JP4429586B2 (ja) | 半導体装置の作製方法 | |
KR101024959B1 (ko) | 빔 호모지나이저, 레이저 조사장치 및 반도체 장치의제조방법 | |
JP4498716B2 (ja) | レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 | |
JP4494045B2 (ja) | ビームホモジナイザ及びレーザ照射装置、並びに半導体装置の作製方法 | |
JP4467940B2 (ja) | レーザ照射装置及び前記レーザ照射装置を用いた半導体装置の作製方法 | |
JP5244832B2 (ja) | 半導体装置の作製方法 | |
KR20040068022A (ko) | 레이저 조사 방법, 반도체 장치를 제조하는 방법, 및레이저 조사 시스템 | |
JP2010034366A (ja) | 半導体処理装置および半導体処理方法 | |
JP4519400B2 (ja) | 半導体装置の作製方法 | |
WO2013030885A1 (ja) | 薄膜形成基板の製造方法及び薄膜基板 | |
JP3878126B2 (ja) | 半導体装置の作製方法 | |
JP5132637B2 (ja) | 半導体装置の作製方法 | |
JP2004247717A (ja) | レーザ照射方法及び半導体装置の作製方法、並びにレーザ照射装置。 | |
JP2005072565A (ja) | ビームホモジナイザおよびレーザ照射装置、並びに半導体装置の作製方法 | |
JP2009224373A (ja) | 平面表示装置の製造方法 | |
JP2011082545A (ja) | 熱処理装置、熱処理方法、半導体装置の製造方法および表示装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061002 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061002 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20091119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100129 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100223 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100326 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100413 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100414 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130423 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130423 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130423 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140423 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |