JP4479226B2 - Printed wiring board manufacturing equipment - Google Patents

Description

  The present invention relates to a printed wiring board manufacturing apparatus and manufacturing method used in various electronic devices such as a personal computer, a mobile communication telephone, and a video camera.

  In recent years, as electronic devices have higher performance and higher density, electronic components are increasingly becoming smaller, more integrated, and faster.

  For this reason, the printed wiring boards are becoming thinner, lighter, and higher in density, and the wiring patterns (line width and space width) are becoming narrower year by year.

  A conventional printed wiring board pattern forming method will be described below.

  In general, a printed wiring board that requires a high-density pattern often employs a method in which a pattern is formed by a subtractive method that removes unnecessary portions.

  First, the printed wiring board 21 before the pattern formation of FIG. 13A has a copper foil 22 having a uniform thickness covering the entire surface.

  In FIG. 13B, a dry film 24 is laminated on the surface of the printed wiring board 21, and the dry film is exposed using an exposure film 25 as shown in FIG. 13C.

  On the exposure film 25, a target wiring pattern is drawn, and there are portions where light is transmitted and portions where light is transmitted. In the portion where light is transmitted, the exposure light is transmitted and reaches the dry film. As a result, the dry film reacts and the structure changes.

  After that, a processing process using a liquid processing liquid is performed.

  First, as shown in FIG. 13 (d), the unnecessary dry film is removed with a developer, and then the copper foil where the dry film does not exist is removed with an etchant {FIG. 13 (e)}.

  Finally, in FIG. 13 (f), the dry film remaining in the peeling solution is removed, and the target pattern is formed by the above steps.

  FIG. 14 is a schematic view of a liquid processing step in a conventional printed wiring board manufacturing method, and FIG. 15 is a schematic view showing a transport method by the printed wiring board manufacturing apparatus, and shows a conventional liquid processing step (development to etching). The outline of (-peeling) is shown. Reference numeral 26 denotes a conveyance roller, 28 denotes a processing liquid discharge port, 29 denotes a processing liquid, and 30 denotes a printed wiring board traveling direction.

  In the conventional method, the transport roller 26 is rotated and the printed wiring board 21 is moved between the upper and lower transport rollers 26, and the processing liquid is discharged from the upper and lower processing liquid discharge ports 28 to perform pattern formation. It is.

For example, Patent Document 1 is known as prior art document information related to the invention of this application.
Japanese Patent Laid-Open No. 10-207081

  However, the conventional printed wiring board pattern forming method has the following problems.

  As can be seen from FIG. 14, the printed wiring board 21 moves at a constant speed in the space from which the processing liquid is discharged. For this reason, the head portion of the printed wiring board traveling direction 30 is processed first. Thereafter, the treatment gradually spreads over the entire printed wiring board. However, since the initial reaction is intense, the amount of copper foil to be treated first becomes larger than other portions. This is one of the causes for increasing the variation in the finish accuracy of the wiring pattern.

  As can be seen from FIGS. 14 and 15, in order to stably convey the printed wiring board 21, many conveying rollers 26 are installed in both the upper and lower X and Y directions of the printed wiring board. In proportion to the reduction in thickness and weight of printed wiring boards, the number of transport rollers installed is increasing in order to prevent problems during transport.

  On the other hand, as can be seen from FIG. 14, the treatment liquid 29 is discharged from the outside of the transport roller 26 toward the printed wiring board. However, the installed transport roller 26 becomes an obstacle, and the processing liquid 29 does not uniformly strike the surface of the printed wiring board 21.

  As a result, the reaction in each liquid treatment process becomes non-uniform, which has the problem of adversely affecting the dimensional accuracy of the wiring pattern. This problem increases in proportion to an increase in the number of transport rollers 26 installed.

  In recent years, since the substrate thickness is reduced and more stable transport is required, the number of transport rollers is increasing, and the adverse effects of the transport rollers are increasing.

  As measures for solving this problem, the currently employed means increases the discharge power of the processing liquid and reduces the obstacle of the transport roller. However, with this measure, the amount of energy consumed is high, and the failure of the transport roller cannot be completely eliminated.

  The present invention solves the above-mentioned conventional problems, and without using a transport roller, the printed wiring board is fixed and installed in a unit provided with a treatment liquid discharge port, and the printed wiring board is processed. It is to start and end.

  It is an object of the present invention to provide a manufacturing apparatus and a manufacturing method for realizing a printed wiring board having a wiring pattern with high dimensional accuracy.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, there is provided a printed wiring board fixing portion capable of fixing a printed wiring board in a planar shape, a processing liquid discharge port fixing portion having a plurality of processing liquid discharge ports, and a processing liquid discharge port fixing. The processing liquid supply hose connected to the unit constitutes a unit, and the processing liquid discharge port fixing part is arranged at a predetermined position in the vertical direction with respect to the printed wiring board fixed in a planar shape. This is a printed wiring board manufacturing apparatus, and with this configuration, the distance between the treatment liquid discharge port and the surface of the printed wiring board is kept constant without using a conventionally required transport roller. The processing liquid can be sprayed onto the surface of the printed wiring board evenly with the processing capacity of the processing liquid and without causing a time difference. With this configuration, a manufacturing apparatus capable of obtaining a wiring pattern with high dimensional accuracy can be provided.

  The invention according to claim 2 of the present invention is characterized in that the processing liquid discharge port having a different length is attached to the processing liquid discharge port fixing portion. In accordance with the configuration content such as the size, shape and thickness of the surface copper foil of the printed wiring board, by arbitrarily adjusting the distance between the treatment liquid discharge port and the surface of the printed wiring board, The treatment liquid can be sprayed uniformly over the entire surface of the printed wiring board. With this configuration, a manufacturing apparatus capable of obtaining a wiring pattern with high dimensional accuracy can be provided.

  According to the third aspect of the present invention, the processing positioned in the vertical direction of the central portion of the printed wiring board is longer than the length of the processing liquid discharge port positioned in the vertical direction of the end portion of the printed wiring board fixed in a flat shape. 2. The printed wiring board manufacturing apparatus according to claim 1, wherein the length of the liquid discharge port is long, and the contents of the printed wiring board dimensions, shape, surface copper foil thickness, etc. By adjusting the distance between the treatment liquid discharge port and the surface of the printed wiring board arbitrarily, the treatment liquid that tends to stay in the central part of the printed wiring board can be lengthened. This prevents the stagnation, whereby the processing liquid can be sprayed uniformly over the entire surface of the printed wiring board. With this configuration, a manufacturing apparatus capable of obtaining a wiring pattern with high dimensional accuracy can be provided.

  Invention of Claim 4 of this invention is a manufacturing apparatus of the printed wiring board of Claim 1 characterized by the above-mentioned. The process liquid discharge port fixing | fixed part can rotate or rock | fluctuate, Thereby, it has the effect | action that a process speed can be improved by eliminating the stay on the printed wiring board of a process liquid.

  In the invention according to claim 5 of the present invention, the ends of the plurality of treatment liquid supply hoses are piped through a treatment liquid storage tank and a treatment liquid supply pump, and the flow to each treatment liquid supply hose. 2. The printed wiring board manufacturing apparatus according to claim 1, wherein each of the passages is provided with a pressure gauge and an opening / closing valve, whereby the processing liquid that tends to stay particularly in the center of the printed wiring board. Retention is prevented by increasing the pressure at which the treatment liquid is released, so that the treatment liquid can be sprayed uniformly over the entire surface of the printed wiring board. With this configuration, a manufacturing apparatus capable of obtaining a wiring pattern with high dimensional accuracy can be provided.

  According to a sixth aspect of the present invention, the treatment liquid discharge port fixing portion is provided with a plurality of mounting holes for attaching the treatment liquid discharge port at predetermined pitch intervals. The printed wiring board manufacturing apparatus according to the present invention can be used, and in accordance with the configuration contents such as the size and shape of the printed wiring board and the thickness of the surface copper foil, the mounting position and number of treatment liquid discharge ports can be determined. Adjustment can be easily performed, and the processing liquid can be uniformly sprayed on the entire surface of the printed wiring board. With this configuration, a manufacturing apparatus capable of obtaining a wiring pattern with high dimensional accuracy can be provided.

  In the invention according to claim 7 of the present invention, the end portion of the treatment liquid supply hose is piped through a plurality of treatment liquid storage tanks storing different treatment liquids, a treatment liquid supply pump and a valve. The printed wiring board manufacturing apparatus according to claim 1, wherein different processing liquids can be easily supplied by opening and closing a valve of a pipe connected to the processing liquid supply hose. it can.

  According to an eighth aspect of the present invention, the plurality of processing liquid storage tanks are a developer storage tank, an etching liquid storage tank, a peeling liquid storage tank, or a washing water storage tank. In this way, the developer, etching solution, washing water, stripping solution, etc. can be easily supplied by opening and closing the valve of the pipe connected to the processing solution supply hose. Therefore, it is possible to realize processing steps necessary for manufacturing a printed wiring board.

  In the invention according to claim 9 of the present invention, the valve is an electromagnetic valve, and the pump is operated after the valve is opened, and after a certain period of time, the pump is stopped and the electromagnetic valve is closed. 8. The printed wiring board manufacturing apparatus according to claim 7, wherein the apparatus can be automatically opened and closed by using an electromagnetic valve, and the operation of the pump is controlled with the electromagnetic valve. It is also possible to automate the processing steps necessary for the production of the printed wiring board.

  The invention according to claim 10 of the present invention is characterized in that the ends of the plurality of treatment liquid supply hoses are fixed by members and are detachable from a supply port piped to the treatment liquid storage tank. The printed wiring board manufacturing apparatus according to claim 1, whereby the member to which the end of the processing liquid supply hose is fixed can move in the processing booth together with the unit, and each processing liquid booth It is possible to perform processing with different processing liquids.

  Invention of Claim 11 of this invention is equipped with the moving means of the manufacturing apparatus of the printed wiring board of Claim 10 in the process booth provided with the booth only for several process liquid in the said process booth. The printed wiring board manufacturing apparatus characterized by the above, and thereby the processing steps necessary for manufacturing the printed wiring board while sequentially moving a plurality of processing liquid booths in the processing booth having the means for moving the unit. Can be performed.

  According to a twelfth aspect of the present invention, the plurality of processing solution dedicated booths each include a different processing solution storage tank and a piping supply port. This is an apparatus for manufacturing plates, which allows the unit to be moved within a processing booth that has means for moving a plurality of processing liquid booths in sequence, changing the type of processing liquid after a predetermined processing time, and printing. It becomes possible to perform the processing steps necessary for manufacturing the wiring board.

  The invention described in claim 13 of the present invention is characterized in that the plurality of processing solution booths are constituted by using a processing solution as a developer, an etching solution, a peeling solution, and a washing water. A device for manufacturing a printed wiring board, whereby a developer and an etching solution are required for manufacturing a printed wiring board while sequentially moving a plurality of processing solution booths within a processing booth having a moving unit. It becomes possible to carry out treatment steps such as peeling liquid and washing water.

  The invention according to claim 14 of the present invention is a process performed by discharging the processing liquid from the plurality of processing liquid discharge ports attached to the processing liquid discharge port fixing portion to the surface of the printed wiring board. The printed wiring board manufacturing method is characterized in that the processing is started and finished while the relative position between the outlet fixing portion and the printed wiring board is kept constant. In addition, since the distance between the treatment liquid discharge port and the surface of the printed wiring board is kept constant, the processing capacity of the treatment liquid can be evenly processed on the surface of the printed wiring board without causing a time difference. Liquid can be injected. Thereby, a printed wiring board having a wiring pattern with high dimensional accuracy can be obtained.

  The invention according to claim 15 of the present invention is characterized in that the printed wiring board is fixed in a flat shape, and a plurality of treatment liquid discharge port fixing portions are arranged at a predetermined distance in the vertical direction of the printed wiring board. The printed wiring board manufacturing method according to claim 14, wherein the printed wiring board has a size, shape and surface copper foil thickness corresponding to the configuration content such as the thickness of the surface of the printed wiring board. The treatment liquid can be sprayed uniformly. Thereby, a printed wiring board having a wiring pattern with high dimensional accuracy can be obtained.

  According to the sixteenth aspect of the present invention, the processing liquid discharged from the processing liquid discharge port attached to the processing liquid discharge port fixing portion is in contact with the surface of the printed wiring board at the center portion from the end of the printed wiring board. The printed wiring board manufacturing method according to claim 15, wherein the distance is released at a short position, wherein the printed wiring board has a size, shape, and surface copper foil thickness. Correspondingly, by adjusting the distance between the processing liquid discharge port and the surface of the printed wiring board as desired, the processing liquid that tends to stay in the center of the printed wiring board is retained by increasing the length of the processing liquid discharge port. Thus, the processing liquid can be uniformly sprayed on the entire surface of the printed wiring board, and a printed wiring board having a wiring pattern with high dimensional accuracy can be obtained.

  According to the seventeenth aspect of the present invention, the processing liquid discharged from the processing liquid discharge port attached to the processing liquid discharge port fixing portion is discharged at a higher pressure at the center than the end of the printed wiring board. The printed wiring board manufacturing method according to claim 15, characterized in that the retention is prevented particularly by increasing the pressure for releasing the treatment liquid that tends to stay in the central part of the printed wiring board. The treatment liquid can be uniformly sprayed on the entire surface of the printed wiring board, and a printed wiring board having a wiring pattern with high dimensional accuracy can be obtained.

  The invention according to claim 18 of the present invention is characterized in that the processing liquid is discharged from the processing liquid discharge port while swinging the processing liquid discharge port fixing portion. Thus, the processing speed can be improved by eliminating the retention of the processing liquid on the printed wiring board.

  The invention according to claim 19 of the present invention is characterized in that after finishing the treatment with a predetermined treatment liquid, the treatment is started using a different treatment liquid. In this way, the processing capacity of the processing liquid can be made uniform and the processing liquid can be sprayed onto the surface of the printed wiring board without causing a time difference, and the processing necessary for manufacturing the printed wiring board. A process can be realized.

  The invention according to claim 20 of the present invention is the method for producing a printed wiring board according to claim 14, characterized in that the processing liquid is an etching liquid, and particularly remarkable in the etching process. Only the etching process is performed according to the present invention, and the other processes have a sufficient effect using conventional methods.

  The invention according to claim 21 of the present invention is characterized in that the different processing solutions are used in the order of developer, washing water, etching solution, washing water, stripping solution, washing water. This is a method for manufacturing a wiring board, whereby the processing capacity of the processing liquid can be made uniform, and the processing liquid can be sprayed onto the surface of the printed wiring board without causing a time difference. It is possible to perform processing steps such as developing solution, etching solution, stripping solution, washing water, etc. necessary for the above.

  According to this invention, the conveyance roller which is an obstruction between a printed wiring board and a process liquid can be eliminated.

  In addition, since the distance between the printed wiring board and the processing liquid discharge port can be ensured without using a transport roller, the processing liquid can be made uniform and energy saving can be realized.

  In addition, a thin printed wiring board can be transported stably without using a transport roller, and the processing liquid can be made more uniform by changing the various installation conditions of the unit provided with a processing liquid discharge port. It can be applied to the surface of the printed wiring board. As a result, a printed wiring board having a wiring pattern with high dimensional accuracy can be efficiently manufactured.

(Embodiment 1)
Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  1 to 10 show a printed wiring board manufacturing apparatus according to an embodiment of the present invention.

  In the figure, 1 is a printed wiring board, 2 is a unit having a processing liquid discharge port, 3 is a processing liquid discharge port, 4 is a processing liquid discharge port fixing part, 5 is a printed wiring board fixing part, and 6, 6a to 6j are It is a processing liquid supply hose and has a structure in which the printed wiring board 1 can be fixed in a horizontal plane by the printed wiring board fixing portion 5 in the unit 2.

  In the figure, the printed wiring board fixing portion 5 is shown only as a square for convenience, but it can be increased depending on the rigidity of the substrate. In particular, it is desirable to provide a plurality of flexible substrates on four sides in addition to the square. The printed wiring board fixing part 5 can also adopt an automatic chucking structure.

  Further, the processing liquid discharge port fixing portion 4 is arranged in the vertical direction of the printed wiring board 1 fixed in a horizontal plane, and a plurality of processing liquid discharge ports 3 are attached to the processing liquid discharge port fixing portion 4. .

  The processing liquid discharge port fixing part 4 is connected to the processing liquid supply hose 6, and the processing liquid T supplied from the processing liquid storage tank 10 by the pump 9 is sent to the processing liquid discharge port fixing part 4 via the processing liquid supply hose 6. Thus, the printed wiring board 1 can be processed by being discharged from the treatment liquid discharge port 3 to the surface of the printed wiring board 1.

  In addition, the processing of the printed wiring board in the manufacturing apparatus of the present invention is performed in a state where the printed wiring board 1 is fixed in the unit 2 from the start to the end of the processing. The exit 3 is characterized by being performed while maintaining a predetermined distance. In particular, the most remarkable feature is that the relative positions of the front end portion and the rear end portion of the printed wiring board 1 in the traveling direction D with respect to the treatment liquid discharge port fixing portions 4 at both ends of the unit 2 do not change.

  Further, a plurality of mounting holes (not shown) for attaching the processing liquid discharge ports 3 are provided in the processing liquid discharge port fixing portion 4 at a predetermined pitch interval. Can be set easily. For example, in the case of ten attachment holes, the number of the treatment liquid discharge ports 3 can be five and the remaining five can be spotted.

  In addition, this distance can be adjusted by adopting treatment liquid discharge ports 3 having different lengths.

  Further, the treatment liquid discharge port fixing portion 4 can be fixed in a rotatable state so that the angle of the treatment liquid T discharged from the treatment liquid discharge port 3 can be adjusted, or a swing mechanism (drive unit). The processing speed can also be improved by rocking the processing liquid discharge port fixing portion 4 by interlocking with the above and eliminating the retention of the processing liquid T on the printed wiring board 1.

  Furthermore, the unit 2 which is the manufacturing apparatus of the present invention can easily perform the operation of attaching or removing the processing liquid discharge port 3 in an environment where the processing liquid is not filled.

  For example, the operation of attaching and removing the processing solution discharge port 3 in the conventional etching apparatus is performed in an etching booth filled with the etching solution, which is extremely difficult in terms of working environment and efficiency.

  In particular, the temperature of the etching solution is usually set to about 50 ° C., and it is necessary to lower the temperature of the etching solution to room temperature (25 ° C.) for the safety of work. For this reason, the etching apparatus is stopped for a long time. In some cases, it is necessary to wait while avoiding danger in maintenance such as difficulty in setting conditions and checking for clogging or replacement of the treatment liquid discharge port 3.

  On the other hand, the manufacturing apparatus of the present invention can easily move the unit 2 to a safe environment, and can solve the conventional problems described above.

  A printed wiring board manufacturing method in the printed wiring board manufacturing apparatus configured as described above will be described below.

  First, in the printed wiring board manufacturing method, the drawings corresponding to the description of each setting of manufacturing conditions are as follows.

Setting 1: FIGS. 1, 2 and 3
Setting 2: FIGS. 2 and 4
Setting 3: FIGS. 5 and 6
Setting 4: FIGS. 7 and 8
Setting 5: FIGS. 9 and 10
(Note that FIG. 2 is used in common for the explanation of setting 1 and setting 2.)
As a premise of each setting, as shown in FIGS. 1 to 10, the printed wiring board 1 (X direction × Y direction = 520 mm × 350 mm) has only one printed wiring board fixing part 5 in the Z direction of the transport unit 21. Fixed in the center.

  2, 5, 7, and 9, there are four printed wiring board fixing portions 5, and the printed wiring board 1 is fixed to the transport unit 2 using the end of the printed wiring board 1.

  The processing liquid T is discharged to the printed wiring board 1 from the processing liquid discharge ports 3 installed above and below the printed wiring board 1. In the case of setting 1 to setting 3 and setting 5 (FIGS. 2, 5, and 9), four processing liquid discharge port fixing portions 4 are arranged vertically in the X direction, and in the case of setting 4 (FIG. 7). 5 each in the vertical direction in the X direction, and 5 processing liquid discharge ports 3 are installed in the Y direction in each processing liquid discharge port fixing portion 4.

  The distance H1 from the processing liquid discharge port to the printed wiring board surface is uniformly set to 100 mm in setting 1 (FIG. 3), and in setting 2 to setting 5 (FIGS. 4, 6, 8, and 10), the processing liquid is set. The distance H1 from the discharge port to the printed wiring board surface is set to 120 mm, H2 is set to 90 mm, and H3 is set to 60 mm.

  That is, the relationship between the distances H1, H2, and H3 is such that the vertical direction of the central portion of the printed wiring board 1 is greater than the length of the treatment liquid discharge port 3 positioned in the vertical direction of the end portion of the printed wiring board 1 fixed in a planar shape. It shows that the length of the processing liquid discharge port 3 positioned is long. The attachment and setting of the treatment liquid discharge ports 3 having different lengths can be easily performed as described above.

  The processing solution supply hose 6 is supplied with developer, rinsing water, etching solution, rinsing water, stripping solution, and rinsing water according to the purpose of processing.

  As shown in FIG. 11, the developer, etching solution, washing water, stripping solution, and the like are supplied by opening and closing valves 8 a to 8 d of piping connected to the treatment solution supply hose 6 of the unit 2 in the booth 11. Can do.

  FIG. 11 shows an outline of an example, and by opening the valve 8a connected to the etching solution storage tank 10a and closing the other valves 8c to 8d, the etching pump 9a is operated. An etchant can be supplied.

  Similarly, when supplying flush water, the valve 8b connected to the flush water storage tank is opened, the other valves 8a, 8c and 8d are closed, and the flushing water pump 9b is operated, thereby washing the flush water. Can be supplied. A developer and a peeling solution can be supplied in the same manner.

  The supplied processing liquid is returned to the storage tank of each processing liquid from below in the booth 11 via the valve 8 by the pump 9.

  Further, the valves 8a to 8d can be automatically opened and closed by using electromagnetic valves. It is also possible to automate the whole process by adopting the operation timing of operating the pump after opening the electromagnetic valve, stopping the pump and closing the electromagnetic valve after a certain processing time elapses. .

  In addition, as shown in FIG. 12, while a plurality of processing liquid booths are sequentially moved in a processing booth 11 having a moving unit 2, the processing liquid type is changed after a predetermined processing time has elapsed, and processing is performed. It is also possible to do this.

  In this case, the member 7 (shown in FIG. 2) to which the end portion of the processing liquid supply hose 6 is fixed is moved and conveyed in the processing booth 11 together with the unit 2. In each processing liquid booth, the end of the processing liquid supply hose 6 can be connected to a supply port piped to a different processing liquid storage tank to supply the processing liquid.

  The end of the processing liquid supply hose 6 and the processing liquid supply port in each processing tank have a detachable structure, and the attachment and detachment can be automated mechanically.

  By this method, different processes can be performed and productivity can be improved by using a plurality of transport units.

  Further, the processing pressure supplied from the processing liquid supply hose 6 can arbitrarily control the supply pressure by adopting a piping configuration having the valve 8 and the pressure gauge 12 of FIG.

  The pressure conditions in each setting in the method for manufacturing a printed wiring board in the present embodiment were as follows.

  Setting 1 and setting 2 (FIG. 2) were set to a pressure of 0.05 MPa (megapascals), and set to a pressure value of about 50% as compared with a manufacturing apparatus having a conventional conveying roller.

  In setting 3 (FIG. 5), the treatment liquid supply hoses 6b, 6c, 6f, and 6g were 0.07 MPa, and the treatment liquid supply hoses 6a, 6d, 6e, and 6h were 0.03 MPa.

  In setting 4 (FIG. 7), the treatment liquid supply hoses 6c and 6h are 0.07 MPa, the treatment liquid supply hoses 6b, 6d, 6g, and 6i are 0.05 MPa, and the treatment liquid supply hoses 6a, 6e, 6f, and 6j are 0.00. The pressure was 03 MPa.

  In setting 5 (FIG. 9), the treatment liquid supply hoses 6b, 6c, 6f, and 6g were 0.07 MPa, and the treatment liquid supply hoses 6a, 6d, 6e, and 6h were 0.03 MPa.

  Incidentally, the pressure conditions of setting 3 to setting 5 are set to a pressure value of about 30 to 70% as compared with a manufacturing apparatus having a conventional conveying roller.

  Further, in the setting 5 (FIG. 9), the processing liquid discharge port fixing portion 4 is configured to swing and rotate at a maximum of 120 ° C. in the rotation direction indicated by R by a drive unit provided inside the unit 2. The speed for one reciprocation in 4 seconds was set.

  In each of the above settings of the present invention, when a printed wiring board manufacturing apparatus having a conventional conveying roller is used with a finishing accuracy of line width / space width of the formed wiring pattern = 100 μm / 100 μm and 75 μm / 75 μm (Table 1).

  From the above results, when the printed wiring board manufacturing apparatus of the present invention is used, the finishing accuracy of the wiring pattern can be remarkably improved.

  Furthermore, when the printed wiring board manufacturing apparatus of the present invention is used, the power consumption for discharging the processing liquid can be reduced by about 50% compared to the conventional manufacturing apparatus.

  By adopting the configuration of the present invention, a printed wiring board having a wiring pattern with high dimensional accuracy can be manufactured efficiently and stably. In addition, energy saving during production has become possible.

  In addition, the manufacturing method of the printed wiring board of this invention has an especially remarkable effect in an etching process, performs only an etching process using the manufacturing apparatus of this invention, and other processes use the conventional manufacturing apparatus. Needless to say, it has a sufficient effect.

  As described above, the present invention fixes and installs a printed wiring board on a unit provided with a treatment liquid discharge port, and makes use of the characteristics of the printed wiring board manufacturing apparatus having the structure in which the unit moves. A method is provided.

  With this configuration, it is possible to eliminate the conveyance roller that is an obstacle between the printed wiring board and the processing liquid. In addition, since the distance between the printed wiring board and the processing liquid discharge port can be kept constant without using a transport roller, the processing liquid can be uniformly applied to the surface of the printed wiring board, and energy saving can also be realized. it can.

  In addition, the manufacturing apparatus of the present invention can easily perform maintenance work such as condition setting and parts replacement in an environment where the processing liquid is not filled, and can also ensure work safety.

  As a conclusion, the present invention can provide a printed wiring board manufacturing apparatus and a manufacturing method capable of efficiently manufacturing a printed wiring board having a wiring pattern with high dimensional accuracy. The availability is great.

Schematic of a printed wiring board manufacturing apparatus in an embodiment of the present invention Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Schematic of the printed wiring board manufacturing equipment Process outline diagram showing conventional printed wiring board manufacturing method Schematic of the liquid treatment process in the conventional printed wiring board manufacturing method Schematic showing a conventional method for transporting a printed wiring board by a manufacturing apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Unit 3 Processing liquid discharge port 4 Processing liquid discharge port fixing | fixed part 5 Printed wiring board fixing | fixed part 6, 6a-6j Processing liquid supply hose 7 Fixing member 8, 8a-8d valve | bulb 9 of a processing liquid supply hose , 9a to 9d Pump 10a to 10d Treatment liquid storage tank 11 Treatment booth 12 Pressure gauge

Claims (3)

Constituted by the printed wiring board to be secured to a planar printed circuit board fixing portion and a plurality of processing liquid concatenated processing liquid supply hose to the treatment liquid outlet fixing part treatment liquid outlet fixing part having a discharge port Unit,
And a processing booth equipped with a plurality of processing liquid dedicated booths,
The treatment liquid outlet fixing part is disposed at a predetermined position in a direction perpendicular to the printed wiring board is fixed to the flat,
End of the process liquid supply hose Ri detachable der and fixed by contact Ri processing liquid storage tank to a pipe has been supplying port by members,
The apparatus for manufacturing a printed wiring board, wherein the processing booth includes means for moving the unit in the processing booth . The printed wiring board manufacturing apparatus according to claim 1 , wherein the plurality of processing liquid dedicated booths are provided with storage tanks for different processing liquids and piping supply ports. 2. The printed wiring board manufacturing apparatus according to claim 1 , wherein the plurality of processing solution booths are configured using a developing solution, an etching solution, a peeling solution, and washing water as a processing solution.

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