JP4466807B2 - IC tester pogo pin block - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pogo pin block of an IC tester that electrically connects a pin electronics board and a performance board, and more particularly to a pogo pin block of an IC tester that improves the ground connection structure.
[0002]
[Prior art]
An IC tester is a device that tests a test object, for example, an IC, an LSI, or the like. In such an apparatus, for example, pin electronics boards are arranged radially on the test head. A pogo pin block is provided on the pin electronics board, and the pogo pin block is electrically connected to a performance board that is electrically connected to the test object.
[0003]
The configuration of such a pogo pin block will be described with reference to FIGS. 7 is a front view, FIG. 8 is a top view, FIG. 9 is a bottom view, FIG. 10 is a side view, and FIG. 11 is a side sectional view.
[0004]
In the figure, a pin electronics board PE is provided in a test head and is mounted with various electrical components such as a driver and a comparator for testing an object to be tested (not shown). The performance board PF is provided perpendicular to the pin electronics board PE and relays electrical signals between the test target and the pin electronics board PE.
[0005]
The pogo pin block 100 is provided on the pin electronics board PE and is electrically connected to the performance board PF. The pogo pin block 100 includes four coaxial contact probes 1, four contact probes 2, an insulating block 3, and printed circuit boards 4 and 5. The coaxial contact probe 1 and the contact probe 2 are press-fitted and fixed to the insulating block 3. The printed circuit boards 4 and 5 are provided on the upper and lower surfaces of the insulating block 3, respectively, penetrate the coaxial contact probe 1 and the contact probe 2, and are soldered to the patterns 41 and 51, respectively. Are electrically connected to each other.
[0006]
The coaxial contact probe 1 includes a sleeve 11, a plunger 12, a lead 13, a coil spring 14, an outer conductor 15, and an insulator 16. The sleeve 11 is a cylindrical conductor, and a plunger 12 is slidably provided at one end, a lead 13 is fixed to the other end, and a coil spring 14 is provided between the plunger 12 and the lead 13. One end of the plunger 12 is electrically connected to the performance board PF. The lead 13 is L-shaped and has one end electrically connected to the pin electronics board PE. The outer conductor 15 is a cylindrical shield, and a sleeve 11 is provided inside through an insulator 16. The outer conductor 15 is electrically connected to the patterns 41 and 51 of the printed boards 4 and 5.
[0007]
The contact probe 2 includes a sleeve 21, a plunger 22, a lead 23, and a coil spring 24. The sleeve 21 is a cylindrical conductor, and a plunger 22 is slidably provided at one end, a lead 23 is fixed to the other end, and a coil spring 24 is provided between the plunger 22 and the lead 23. The sleeve 21 is electrically connected to the patterns 41 and 51 of the printed boards 4 and 5. One end of the plunger 22 is electrically connected to the performance board PF. The lead 23 is L-shaped and has one end electrically connected to the pin electronics board PE.
[0008]
The operation of such an apparatus will be described below. When the performance board PF is attached from the top as shown by the arrow a in FIG. 7, the plungers 12 and 22 are pushed. Plungers 12 and 22 push coil springs 14 and 24, respectively. Thereby, the plungers 12 and 22 come into contact with the performance board PF with a spring load corresponding to the amount of expansion / contraction from the coil springs 14 and 24, and are electrically connected.
[0009]
The performance board PF is electrically connected to the pin electronics board PE via the plunger 12, the sleeve 11, and the lead 13, and can transmit signals. The performance board PF is electrically connected to the pin electronics board PE via the plunger 22, the sleeve 21, and the lead 23, and is connected to the ground. Since the outer conductor 15 of the coaxial contact probe 1 is electrically connected to the contact probe 2 by the pattern of the printed circuit boards 4 and 5, the outer conductor 15 is connected to the ground. That is, the contact probe 2 serves as a ground connection for the shield of the coaxial contact probe 1.
[0010]
[Problems to be solved by the invention]
In such an apparatus, in order to shield the coaxial contact probe 1, the contact probe 2 must be electrically connected and grounded. For this reason, the contact probe 2 is required without performing ground connection to the performance board PF.
[0011]
Moreover, it is necessary to connect to the pin electronics board PE so that the leads 13 and 23 are not connected to each other. For this reason, one of the leads 13 and 23 becomes long. The coaxial contact probe 1 is used for flowing a high-frequency signal or a minute current, and usually the lead 13 is made shorter. However, if the lead 23 is too long, the quality of the signal to be sent is lowered. .
[0012]
Therefore, a first object of the present invention is to realize a pogo pin block of an IC tester that can shield a coaxial contact probe without using a contact probe.
[0013]
A second object of the present invention is to realize a pogo pin block of an IC tester that prevents deterioration of signal quality.
[0014]
[Problems to be solved by the invention]
The present invention
In the pogo pin block of the IC tester provided in the pin electronics board by electrically connecting the pin electronics board and the performance board provided perpendicular to the pin electronics board ,
An insulation block;
A coaxial contact probe provided in the insulating block, connected to the pin electronics board by an L-shaped lead , electrically connected to the performance board, and electrically connected to the pin electronics board and the performance board;
Provided on the lower surface of the insulating block , penetrates the coaxial contact probe through a hole, electrically connects to a shield of the coaxial contact probe, and electrically connects to the pin electronics board by leads fixed to the pin electronics board. A ground plate to connect and ground, and
A contact probe attached to the insulating block, electrically connected to the performance board, and electrically connected to the ground plate via a shield of the coaxial contact probe.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to the drawings. 1 to 5 are block diagrams showing an embodiment of the present invention. 1 is a front view, FIG. 2 is a top view, FIG. 3 is a bottom view, FIG. 4 is a side view, and FIG. 5 is a side sectional view. FIG. 6 shows the configuration of the ground plate 7. Here, the same components as those in FIGS.
[0018]
In the figure, a pogo pin block 200 is provided on a pin electronics board PE and is electrically connected to a performance board PF. The pogo pin block 200 includes four coaxial contact probes 1, four contact probes 6, an insulating block 3, a printed circuit board 4, and a ground plate 7. The contact probe 6 is press-fitted and fixed to the insulating block 3, penetrates the printed circuit board 4, and is electrically connected to the pattern 41 by solder. Thereby, the coaxial contact probe 1 and the contact probe 6 are electrically connected for each set.
[0019]
The contact probe 6 includes a sleeve 61, a plunger 62, and a coil spring 63. The sleeve 61 is a cylindrical conductor. A plunger 62 is slidably provided at one end, the other end is closed, and a coil spring 63 is provided inside. The sleeve 61 is fixed to the pattern 41 of the printed circuit board 4 with solder and is electrically connected. One end of the plunger 62 is electrically connected to the performance board PF.
[0020]
The ground plate 7 is a copper plate having a thickness of 0.5 mm and is provided on the lower surface of the insulating block 3 and has four holes 71 and five leads 72. The hole 71 penetrates the coaxial contact probe 1 and the coaxial contact probe 1 is fixed with solder. The lead 72 is fixed to the pin electronics board PE with solder and is electrically connected.
[0021]
The operation of such a device will be described below. When the performance board PF is attached from the top as shown by the arrow a in FIG. 1, the plungers 12, 62 are pushed. Plungers 12 and 62 push coil springs 14 and 63, respectively. As a result, the plungers 12 and 62 come into electrical contact with the performance board PF with a spring load corresponding to the amount of expansion / contraction from the coil springs 14 and 63.
[0022]
The performance board PF is electrically connected to the pin electronics board PE via the plunger 12, the sleeve 15, and the lead 13, and can transmit signals. The performance board PF is electrically connected to the pin electronics board PE through the plunger 62, the sleeve 25, the pattern 41 of the printed circuit board 4, the outer conductor 15, and the ground plate 7, and flows to the ground. .
[0023]
As described above, the ground connection of the outer conductor 15 of the coaxial contact probe 7 can be performed by the ground plate 7 without using the contact probe 6.
[0024]
Further, since the ground connection is performed by the ground plate 7, it is not necessary to provide a lead in the contact probe 6 that performs the ground connection, and it is possible to prevent the signal quality from being deteriorated.
[0025]
In addition, this invention is not limited to this, Although the structure of 4 sets of coaxial contact probes 1 and contact probes 6 was shown, it should just be 1 set or more.
[0026]
Further, when the performance board PF does not require a ground connection, the contact probe 6 may be omitted. Thereby, a structure can be simplified.
[0027]
And although the structure which performs electrical connection with solder was shown, the structure which obtains electrical connection by press-fitting without attaching solder may be used.
[0028]
Furthermore, although the ground plate 7 has shown an example in which the coaxial contact probe 1 is inserted into the hole 71, a hole for inserting the contact probe 6 is also provided so that the ground plate 7 is electrically connected to the contact probe 6 directly. Also good. In this case, the printed board 4 becomes unnecessary.
[0029]
【The invention's effect】
According to the present invention, the ground connection of the coaxial contact probe can be performed by the ground plate for shielding the coaxial contact probe. Thereby, it is not necessary to use the contact probe for ground connection, and the configuration can be simplified.
[0030]
Further , since the ground connection is performed by the ground plate, it is not necessary to provide a lead in the contact probe for performing the ground connection, and it is possible to prevent the signal quality from being deteriorated.
[Brief description of the drawings]
FIG. 1 is a front view showing an embodiment of the present invention.
FIG. 2 is a top view showing an embodiment of the present invention.
FIG. 3 is a bottom view showing an embodiment of the present invention.
FIG. 4 is a side configuration diagram showing an embodiment of the present invention.
FIG. 5 is a side sectional view showing an embodiment of the present invention.
6 is a diagram showing a configuration of a ground plate 7. FIG.
FIG. 7 is a front view showing a pogo pin block of a conventional IC tester.
FIG. 8 is a top view showing a pogo pin block of a conventional IC tester.
FIG. 9 is a bottom view showing a pogo pin block of a conventional IC tester.
FIG. 10 is a side view showing a pogo pin block of a conventional IC tester.
FIG. 11 is a side sectional view showing a pogo pin block of a conventional IC tester.
[Explanation of symbols]
1 Coaxial contact probe 3 Insulating block 6 Contact probe 7 Ground plate 15 Outer conductor 71 Hole 72 Lead 200 Pogo pin block PE Pin electronics board PF Performance board

Claims (1)

In the pogo pin block of the IC tester provided in the pin electronics board by electrically connecting the pin electronics board and the performance board provided perpendicular to the pin electronics board ,
An insulation block;
A coaxial contact probe provided in the insulating block, connected to the pin electronics board by an L-shaped lead , electrically connected to the performance board, and electrically connected to the pin electronics board and the performance board;
Provided on the lower surface of the insulating block , penetrates the coaxial contact probe through a hole, electrically connects to a shield of the coaxial contact probe, and electrically connects to the pin electronics board by leads fixed to the pin electronics board. A ground plate to connect and ground, and
A pogo pin of an IC tester comprising: a contact probe attached to the insulating block, electrically connected to the performance board, and electrically connected to the ground plate via a shield of the coaxial contact probe. block.

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