JPH10142291A - Ic tester - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure a measurement test on an analog device and a mixed device without being influenced by noises coming from the outside by providing a shield surrounding part of a performance board, a socket connecting a DUT and a wiring member, and a test handler carrying the same. SOLUTION: During the time when a DUT(device under test) 10 is connected to an IC socket 20 and a test measurement is carried pout by a test head 8, a closed space is constituted by a shield case 100 being at the ground electric potential of a performance board 30, to an assembly circuit connecting the DUT 10, IC socket 20, and adapter socket 40 positioned from a pick-and-place 92 at a tip of a contact arm 91 of a dynamic test handler, and also the part between the adapter socket 40 and the performance board 30. Accordingly, the DUT 10 can receive a test measurement under the condition where it is completely shielded from outside noises.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC test apparatus, and more particularly, to a DUT, an IC socket, and the like from a pick and place at a tip of a contact arm of a dynamic test handler to a performance board of a test head.
The closed space covered by the shield case at the ground potential of the performance board is configured for the adapter socket, and also for the assembly circuit that connects between the adapter socket and the performance board. The present invention relates to an IC test apparatus capable of receiving test measurement without being affected by extraneous noise in a completely shielded state.

[0002]

2. Description of the Related Art A device under test DU is measured by an IC test apparatus.
When testing T, the DUT 10
To the test head 8 for testing. To explain this conceptually with reference to FIG.
A pick-and-place 92 is attached to the lower end of the contact arm 91 of the test handler 9. 3
Z indicates a Z-direction base that is driven in the vertical direction, and the contact arm 91 and the pick-and-place 92 are attached to the Z-direction base 3Z and driven in the vertical direction. 3Y indicates a Y-direction base driven in the vertical direction, and Z
The direction base 3Z is attached to the Y-direction base 3Y and driven in the vertical direction. Reference numeral 3X denotes an X-direction base that is driven in the horizontal direction, and a Y-direction base 3Y is attached to the X-direction base 3X and driven in the horizontal direction. Eventually, the Y direction base 3Y is driven and positioned in the X direction by the X direction base 3X, and the Z direction base 3Z is moved to the Y direction by the Y direction base 3Y.
And the contact arm 91 and the pick-and-place 9 by the Z-direction base 3Z.
2 is driven and positioned in the Z direction. Here, the untested DUT
10 is stored in a tray 110 for storing untested devices. The pick and place 92 attached to the lower end of the tip of the contact arm 91 is driven in the XYZ directions as described above, and is positioned on the tray 110 for storing the uninspected device, picks up the uninspected DUT 10, and transfers it to the device inspecting unit 600. The test is performed and stored in the tray 210 for storing the classified devices.

Here, a DUT will be described with reference to FIGS.
How to connect will be described. When performing test measurements, the DUT 10 cannot be directly connected to the IC test equipment for various reasons. To connect the DUT 10 to the IC test apparatus, first, the DUT 10 is fitted and connected to the IC socket 20. Next, the IC socket 20 is connected to the socket board 40. In many cases, an IC socket is directly attached to a performance board via an adapter socket without using a socket board. The socket board 40 is formed with a pin contact portion 41 to which the socket pin 21 of the IC socket 20 is fitted and connected, and an extended contact portion 43 to be connected to the pin contact portion 41 via a conductor 42. Reference numeral 50 denotes a space board in which a contact portion 51 is formed at a position corresponding to the extended contact portion 43 of the socket board 40, and an opening 52 is formed at a position corresponding to the IC socket 20. Reference numeral 60 denotes a base board, on which are formed a pin contact portion 61 with which a contact pin 64 that fits and contacts the performance board 30 and an extended contact portion 63 that is connected to the pin contact portion 61 via a conducting wire 62. Rubber connectors 70 and 70 'are interposed between the socket board 40 and the space board 50 and between the space board 50 and the base board 60. The rubber connector is obtained by mixing conductive short needles 71 having a thickness substantially equal to the thickness of a rubber sheet having rubber elasticity in the thickness direction of the rubber. Here, the short hands 71 are not in contact with each other, but are mixed relatively densely. When the rubber connector is pressed in the thickness direction, both end surfaces of the short needle 71 are exposed, and the rubber connector becomes conductive between both surfaces.

When the DUT 10 is fitted and connected to the IC socket 20, the pins of the DUT 10
Socket pin 21, pin contact portion 41, conducting wire 42, extended contact portion 43, short hand 71 of rubber connector 70, contact portion 51 of space board 50, short hand 7 of rubber connector 70
1. It can be electrically connected to the contact pins 31 elastically bias-fixed to the performance board 30 via the extended contact portions 63, the conducting wires 62, the pin contact portions 61, and the contact pins 64. The elastically biased contact pins 31 are connected to a wiring pattern radially formed on the performance board 30, and the other end of the wiring pattern penetrates the performance board 30 to reach the connector 34 on the back surface. . The connector 34 on the back side is a connector 33 connected to this.
And a connection to the IC test apparatus main body via the coaxial cable 35.

In the above conventional example, the IC socket 20
Unique socket board 4 that fits socket pins 21
0, the space board 50 and the base board 60 are manufactured and the adapter board 40 ′ is formed by interposing rubber connectors 70 and 70 ′ therebetween, so that the design after the performance board 30 is changed. DU of any pitch spacing standard without any
Test measurements of T can also be performed. The adapter socket 40 'is used in such a case.

[0006]

Referring to FIG. 5, D
The UT 10 is a contact arm 91 of the test handler 9.
I attached to the performance board 30 mounted on the test head 8 by a suction pick and place 92 or a mechanical pick and place 92 at the tip.
The IC socket 20 is held and transported to the C socket 20 and the contact arm 91 is moved up and down.
Is connected electromechanically. When the DUT 10 is electromechanically connected to the IC socket 20, the DUT 10 is connected to the IC test apparatus main body via the IC socket 20, the adapter socket 40 ', the performance board 30, the connector 33 on the back of the performance board 30, and the coaxial cable 35. The test is started.

Here, in the conventional example of the above-described IC test apparatus, the wiring pattern formed on the performance board 30, the IC socket 20, the adapter socket 40 ',
No special electromagnetic shield is applied to the DUT 10, and the DUT 10 is in a bare state and has a defenseless structure against external noise including noise generated by the handler 9 itself. Then, depending on the DUT, an adapter socket 40 'is further attached from the performance board 30 with a space therebetween via a spacer.
0 ′ and the performance board 30 may be connected by a combination circuit. In this case, the combination circuit is also vulnerable to external noise. When an analog device or a mixed device is tested as a DUT in a high frequency region by the dynamic test handler 9,
If the vicinity of the DUT is affected by external noise, accurate test measurement may not be performed.

The present invention provides an IC test apparatus capable of performing a measurement test of an analog device or a mixed device without being affected by external noise.

[0009]

[Means for Solving the Problems] Performance Board 3
0, an IC test apparatus comprising a socket and a wiring member for connecting the DUT 10 to the performance board, and the shield 1 surrounding a part of the DUT 10 and a test handler 9 for transporting the DUT 10. And shield 1
The shield case 1 attached to or near the performance board 30 with the peripheral end 101 in contact with the ground potential surface 36 of the performance board 30
Thus, an IC test apparatus comprising a cover plate 104 attached to and fixed to a contact arm 91 constituting a part of the test handler 9 was constructed.

An opening 102 through which the contact arm 91 is inserted is formed in an upper portion of the shield case 100, and a spring contact 10 connected to the same ground potential as the shield case 100 is formed around the opening 102.
3 was arranged to construct an IC test apparatus. Further, the cover plate 104 is attached to the contact arm 91 at a position where the cover plate 104 presses the spring contact 103 downward when the contact arm 91 is lowered to a position where the DUT 10 is inserted and connected to the IC socket 20. The IC test apparatus to be set was configured.

Further, an IC test apparatus was constructed in which the contact arm 91 was made of a metal material and an insulating spacer 105 was interposed between the contact arm 91 and the cover plate.

[0012]

An embodiment of the present invention will be described with reference to FIG. 1, the same reference numerals as those in FIG. 5 denote members common to each other. A performance board 30, a socket and a wiring member for connecting the DUT 10 to the performance board, the DUT 10, and a test handler 9 for transporting the DUT 10
Of the shield 1 surrounding a part of. In FIG. 1, reference numeral 100 denotes a shield case forming the shield 1. By connecting the peripheral end portion 101 of the shield case 100 to the ground potential surface 36 of the performance board 30, components connected to the IC socket 20 and the performance board 30 are accommodated in the closed space of the shield case 100. That is, the shield case 100 is
With the peripheral end 101 in contact with the ground potential surface 36 of the performance board 30, it is attached to the performance board 30, its outer periphery or its vicinity. For this attachment, welding including screwing, screwing, or any other appropriate fixing method is employed in accordance with the material shape structure of the shield case 100.

On the upper part of the shield case 100, a DUT 1 is provided.
An opening 102 through which a contact arm 91 for holding and carrying 0 is inserted is formed. Around this opening 102, a spring contact 103 connected to the same ground potential as the shield case 100 is arranged. A cover plate 104 is attached and fixed to the contact arm 91. The position at which the cover plate 104 is attached to the contact arm 91 is such that the contact plate 91 is lowered to a position where the DUT 10 is properly inserted and connected to the IC socket 20.
4 is set at a position where the spring contact 103 is pressed downward from above. Cover plate 10
Numeral 4 is formed of a conductive material and forms a part of the shield, and is fixed to the contact arm 91 via the insulating spacer 105. Shield case 100
Are electrically insulated from the contact arm 91 and are not affected by the potential of the contact arm 91. In practice, the IC test apparatus is configured so that the test head 8 and the test handler 9 maintain a common ground potential. Insulate.

Here, a performance board 30 is mounted on the test head 8, and the shield case 100 is mounted on or near the performance board 30 with its peripheral end 101 in contact with the ground potential surface 36 of the performance board 30. The adapter socket 40 'and the IC socket 20 are attached and connected to the performance board 30 in this order, and if necessary, the adapter socket 40' is connected to the performance board 30.
In a state where the adapter socket 40 'and the performance board 30 are connected by a combination circuit, the mounting is performed at a lower end of the contact arm 91 to which the cover plate 104 is mounted and fixed. Pick and Place 9
2, the DUT 10 is fitted and connected to the IC socket 20. This fitting connection drives the contact arm 91 in the XY directions as described above, positions the pick and place 92 attached to the lower end of the arm 91 above the IC socket 20, and drives the contact arm 91 downward in the Z direction. This is performed by press-fitting the untested DUT 10 picked up in the IC socket 20.

As described above, while the DUT 10 is connected to the IC socket 20 and the test measurement is performed by the test head 8, the pick-and-place 92 at the tip of the contact arm 91 of the dynamic test handler 9.
To the performance board 30 of the test head 8, the DUT 10, the IC socket 20, the adapter socket 40 ', and the combination circuit connecting the adapter socket 40' and the performance board 30 to the ground. Shield case 1 at potential
00 constitutes a closed space. This allows
The DUT will undergo test measurements while being completely shielded from extraneous noise.

If the contact arm 91 is made of a synthetic resin or other insulating material instead of metal,
It is not necessary to interpose an insulating spacer between the contact arm 91 and the cover plate. The spring contact 103 need not necessarily be a leaf spring as long as it is a spring made of a conductive and elastic material. In the embodiment, one contact arm 91 is used.
Although the case of a book is shown, the same applies to the case of a plurality of contact arms 91.

[0017]

As described above, according to the present invention, the DUT 10, the DUT 10 extending from the pick and place 92 at the tip of the contact arm 91 of the dynamic test handler 9 to the performance board 30 of the test head 8
The performance board 3 for the IC socket 20, the adapter socket 40 ', and the combination circuit connecting the adapter socket 40' and the performance board 30.
By forming a closed space covered by the shield case 100 at the ground potential of 0, the DUT can be tested and measured without being affected by the external noise while being completely shielded from the external noise. it can.

[Brief description of the drawings]

FIG. 1 illustrates an embodiment.

FIG. 2 is a diagram illustrating a part of a test handler.

FIG. 3 is a diagram illustrating a method of connecting a DUT.

FIG. 4 is a diagram illustrating details of FIG. 3;

FIG. 5 is a diagram illustrating a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Shield 10 DUT 100 Shield case 101 Peripheral end 102 Opening 103 Spring contact 104 Cover plate 105 Insulating spacer 110 Tray for storing untested devices 20 IC socket 21 Socket pin 210 Tray for storing sorted devices classified 3Z Z direction base 3Y Y direction base 3X X direction base 30 Performance board 33 Connector 34 Connector 35 Coaxial cable 36 Ground potential surface 40 Socket board 40 'Adapter socket 41 Pin contact portion 42 Conductive wire 43 Extension contact portion 50 Space board 51 Contact portion 52 Opening 60 Base board 61 Pin contact part 62 Conductive wire 63 Extension contact part 64 Contact pin 600 Device inspection part 70, 70 'rubber connector 71 Short hand 8 Test head 9 Test handler 91 Contact arm 92 Pick and place

Claims (5)

[Claims] 1. An IC test apparatus comprising: a performance board; a socket and a wiring member for connecting a DUT to the performance board; and a shield surrounding a part of the DUT and a test handler for transporting the DUT. 2. The IC test apparatus according to claim 1, wherein the shield has a shield case attached to the performance board or a vicinity thereof in a state where a peripheral end thereof is in contact with a ground potential surface of the performance board. An IC test apparatus comprising a cover plate attached and fixed to a contact arm constituting a part thereof. 3. The IC test apparatus according to claim 2, wherein an opening through which the contact arm is inserted is formed in an upper portion of the shield case, and a ground potential around the opening is the same as that of the shield case. An IC test device, wherein a spring contact to be connected is arranged. 4. The IC test apparatus according to claim 3, wherein the mounting position of the cover plate with respect to the contact arm is such that when the contact arm is lowered to a position where the DUT is inserted and connected to the IC socket, the cover plate has a spring contact. An IC test apparatus is set at a position where is pressed downward. 5. The IC test apparatus according to claim 2, wherein the contact arm is made of a metal material, and an insulating spacer is interposed between the contact arm and the cover plate. An IC test apparatus characterized by the above-mentioned.