JP4458906B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4458906B2
JP4458906B2 JP2004111380A JP2004111380A JP4458906B2 JP 4458906 B2 JP4458906 B2 JP 4458906B2 JP 2004111380 A JP2004111380 A JP 2004111380A JP 2004111380 A JP2004111380 A JP 2004111380A JP 4458906 B2 JP4458906 B2 JP 4458906B2
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JP
Japan
Prior art keywords
semiconductor
heat
semiconductor device
insulating film
interlayer insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004111380A
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English (en)
Japanese (ja)
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JP2005294760A (ja
JP2005294760A5 (enrdf_load_stackoverflow
Inventor
浩和 高田
幸一 石見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
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Renesas Technology Corp
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Priority to JP2004111380A priority Critical patent/JP4458906B2/ja
Publication of JP2005294760A publication Critical patent/JP2005294760A/ja
Publication of JP2005294760A5 publication Critical patent/JP2005294760A5/ja
Application granted granted Critical
Publication of JP4458906B2 publication Critical patent/JP4458906B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004111380A 2004-04-05 2004-04-05 半導体装置 Expired - Fee Related JP4458906B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004111380A JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004111380A JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2005294760A JP2005294760A (ja) 2005-10-20
JP2005294760A5 JP2005294760A5 (enrdf_load_stackoverflow) 2007-05-10
JP4458906B2 true JP4458906B2 (ja) 2010-04-28

Family

ID=35327313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004111380A Expired - Fee Related JP4458906B2 (ja) 2004-04-05 2004-04-05 半導体装置

Country Status (1)

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JP (1) JP4458906B2 (enrdf_load_stackoverflow)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007142276A (ja) * 2005-11-21 2007-06-07 Toshiba Corp 半導体装置及びその製造方法
TW200735308A (en) * 2005-12-23 2007-09-16 Koninkl Philips Electronics Nv On-chip interconnect-stack cooling using sacrificial interconnect segments
KR100737162B1 (ko) * 2006-08-11 2007-07-06 동부일렉트로닉스 주식회사 반도체 소자 및 그 제조방법
FR2951871B1 (fr) * 2009-10-23 2011-12-16 St Microelectronics Sa Plaque d'interface entre circuits integres
FR2961017B1 (fr) * 2010-06-02 2013-10-11 Commissariat Energie Atomique Puce electronique, composants electroniques et bras de commutation incorporant cette puce electronique
US8680674B2 (en) * 2012-05-31 2014-03-25 Freescale Semiconductor, Inc. Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices
JP2018018908A (ja) * 2016-07-26 2018-02-01 パナソニックＩｐマネジメント株式会社 熱電変換器
JP6323527B2 (ja) * 2016-10-17 2018-05-16 Tdk株式会社 半導体チップおよび磁気記録装置
KR102652928B1 (ko) 2017-02-06 2024-03-29 엘지이노텍 주식회사 열전 소자
KR20200099795A (ko) * 2019-02-15 2020-08-25 에스케이하이닉스 주식회사 반도체 장치
US11908766B2 (en) * 2021-04-05 2024-02-20 Jmj Korea Co., Ltd. Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined
CN113249692B (zh) * 2021-04-29 2023-10-20 三河同飞制冷股份有限公司 一种大功率半导体元器件的冷却板
CN119289549B (zh) * 2024-12-10 2025-02-11 安徽农业大学 一种半导体制冷结构以及冷凝器

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Publication number Publication date
JP2005294760A (ja) 2005-10-20

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