JP4450900B2 - Method for manufacturing semiconductor device - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention relates to a structure of a semiconductor device including a semiconductor circuit made of a semiconductor element such as an insulated gate transistor and a manufacturing method thereof. In particular, the present invention relates to a technique for forming a crystalline semiconductor film on an insulating surface. The semiconductor device of the present invention includes not only an element such as a thin film transistor (TFT) and a MOS transistor but also an electro-optical device such as a display device and an image sensor having a semiconductor circuit composed of these insulated gate transistors. In addition, the semiconductor device of the present invention includes an electronic apparatus in which these display device and electro-optical device are mounted.
[0002]
[Prior art]
An active matrix liquid crystal display in which a pixel portion and a driver circuit are formed by thin film transistors (TFTs) formed over an insulating substrate has been attracting attention. Liquid crystal displays of up to about 0.5 to 20 inches are used as display displays.
[0003]
At present, in order to realize a liquid crystal display capable of high-definition display, a TFT using a crystalline semiconductor film typified by polysilicon as an active layer is attracting attention. However, a TFT using a crystalline semiconductor film as an active layer has higher operation speed and driving capability than a TFT using an amorphous semiconductor film as an active layer, but it is difficult to control individual TFT characteristics.
[0004]
One of the reasons why it is difficult to control the TFT characteristics is the characteristics of the interface between the active layer and the insulating film. If this interface is contaminated, it is difficult to produce TFT characteristics with good controllability. Therefore, it is important to clean the interface between the active layer and the insulating film in contact with the active layer.
[0005]
[Problems to be solved by the invention]
Currently, high mobility is required for TFTs, and it is considered promising to use a crystalline semiconductor film having a higher mobility than an amorphous semiconductor film as an active layer of the TFT. A conventional method for manufacturing a top gate type TFT using a crystalline semiconductor film will be briefly described below.
[0006]
First, a base insulating film (hereinafter referred to as a base film in this specification) is formed over a substrate having an insulating surface, subjected to heat treatment, and then an amorphous silicon film (amorphous silicon film) is formed. Next, this amorphous silicon film is subjected to crystallization treatment such as heating or laser light irradiation to form a polysilicon film (polycrystalline silicon film). Next, after patterning the polysilicon film into a desired shape, an insulating film (gate insulating layer) and a conductive film (gate wiring forming material layer) are deposited thereon, and these are patterned to form a gate wiring. Next, an impurity imparting P-type or N-type conductivity is selectively introduced into the polysilicon film to form impurity regions that serve as a source region and a drain region. Subsequently, after depositing an interlayer insulating film and forming contact holes that expose the source and drain regions, a metal film is formed, and this is patterned to form metal wiring that contacts the source and drain regions. . Thus, the TFT manufacturing process is completed.
[0007]
In the above prior art, after the base film is formed, the surface of the base film is exposed to the atmosphere when heat treatment is performed to improve the reliability of the TFT. At this time, the surface of the base film is contaminated by atmospheric impurities (boron, oxygen, moisture, sodium, etc.). When a semiconductor film serving as an active layer is formed on and in contact with the base film contaminated by exposure to the air, the interface characteristics between the active layer, particularly the channel formation region and the base film, deteriorate, and the electrical characteristics of the TFT deteriorate. It was causing.
[0008]
In particular, since the atmosphere in the clean room contains boron (boron) from a HEPA filter that is generally used for cleaning, boron is mixed indefinitely on the surface of the film exposed to the atmosphere. The HEPA filter is made of glass in a mesh shape and is used to remove minute particles in the air. The glass contains a large amount of boron in order to make it easier to create a network structure. In addition, using a filter other than the HEPA filter is disadvantageous from the viewpoint of reducing the manufacturing cost.
[0009]
In order to investigate the influence of impurities in the atmosphere, an insulating base film was formed, and after exposure to the atmosphere, a semiconductor film made of an amorphous silicon film was stacked to produce a TFT. When the SIMS analysis was performed, a boron concentration peak was observed at the interface (main surface side or back surface side) of the active layer of the TFT, and the maximum value was 3 × 10 ¹⁷ atoms / cm ³ or more. If boron is mixed into the active layer made of a semiconductor film in this way, it is diffused and activated by subsequent processes (heat treatment, laser light treatment, etc.), making it difficult to control the impurity concentration in the active layer. Further, when the electrical characteristics of the TFT were measured, in particular, a phenomenon that the threshold voltage shifted positively was observed.
[0010]
Further, when impurities (boron, oxygen, moisture, sodium, etc.) are mixed in the active layer made of the semiconductor film, the crystallization of the semiconductor film is hindered in the crystallization process of the semiconductor film.
[0011]
The present invention improves the characteristics (threshold voltage, etc.) of the TFT by improving the interface between the active layer, particularly the region constituting the channel formation region and the base film, and has high reliability. A semiconductor device including a semiconductor circuit including elements and a method for manufacturing the semiconductor device are provided.
[0012]
[Means for Solving the Problems]
In order to solve the above object, according to the present invention, after forming a first base film, heat treatment is performed, and then a second base film (an insulating film having a thickness smaller than the first base film) and a semiconductor film are formed. One feature is that they are stacked without being exposed to the atmosphere. With this configuration, contamination of the interface between the active layer, particularly the region forming the channel formation region and the second base film is prevented, and stable and good electrical characteristics are realized.
[0013]
The first configuration of the invention disclosed in this specification is:
A first insulating film on the substrate;
A second insulating film in contact with the first insulating film;
A channel formation region in contact with the second insulating film; a source region and a drain region formed on both sides of the channel formation region;
A gate insulating layer in contact with the channel formation region;
A gate wiring provided on the channel formation region via the gate insulating layer,
The second insulating film is a semiconductor device provided with a semiconductor circuit including a semiconductor element, wherein the second insulating film is thinner than the first insulating film.
[0014]
In the above structure, the impurity concentration at the interface between the first insulating film and the second insulating film is higher than the impurity concentration at the interface between the second insulating film and the channel formation region.
[0015]
In the above structure, the second insulating film and the channel formation region are formed through at least a step of sequentially forming layers without exposure to the atmosphere.
[0016]
In the above structure, the first insulating film is formed through at least a heat treatment step.
[0017]
In the above structure, the first insulating film has a thickness of 100 to 500 nm.
[0018]
In the above structure, the second insulating film has a thickness of 10 to 100 nm.
[0019]
In the above structure, the second insulating film is a single layer film selected from a silicon nitride film, a silicon nitride oxide film, and a silicon oxide film, or a laminated film thereof.
[0020]
In the above structure, a low-concentration impurity region is provided between at least one of the channel formation region and the source region or between the channel formation region and the drain region. Yes.
[0021]
In the above structure, at least the source region and the drain region contain a catalyst element that promotes crystallization of silicon.
[0022]
The catalytic element is at least one element selected from Ni, Fe, Co, Pt, Cu, Au, and Ge, or a plurality of elements.
[0023]
Note that in this specification, the “amorphous semiconductor film” typically refers to a semiconductor film having an amorphous structure, for example, an amorphous semiconductor film having a microcrystal, and the semiconductor film includes an Si film, A film made of a Ge film or a compound semiconductor film (for example, Si _X Ge _1-X (amorphous silicon germanium film represented by 0 <X <1)). This semiconductor film can be formed using a known technique, for example, a low pressure thermal CVD method, a thermal CVD method, a PCVD method, or the like.
[0024]
Note that in this specification, a “crystalline semiconductor film” refers to a single crystal semiconductor film, a semiconductor film including a crystal grain boundary (including a polycrystalline semiconductor film and a microcrystalline semiconductor film), and amorphous throughout the entire area. The distinction from the semiconductor film (amorphous semiconductor film) in the state is made clear. Needless to say, the term “semiconductor film” in this specification includes amorphous semiconductor films in addition to crystalline semiconductor films.
[0025]
In this specification, the “semiconductor element” refers to a switching element or a memory element, such as a thin film transistor (TFT) or a thin film diode (TFD).
[0026]
The structure of the first manufacturing method for manufacturing the semiconductor device of the present invention is as follows.
Forming a first insulating film on the substrate;
Heat-treating the first insulating film;
A step of sequentially stacking a second insulating film and a semiconductor film on the first insulating film without touching the atmosphere;
Crystallization of the semiconductor film to form a crystalline semiconductor film;
A method for manufacturing a semiconductor device including a semiconductor circuit including a semiconductor element.
[0027]
The structure of the second manufacturing method for manufacturing the semiconductor device of the present invention is as follows.
Forming a first insulating film on the substrate;
Heat-treating the first insulating film;
A step of sequentially stacking a second insulating film and a semiconductor film on the first insulating film without touching the atmosphere;
Adding a catalyst element for promoting crystallization to at least a part of the semiconductor film;
Crystallization of the semiconductor film to form a crystalline semiconductor film;
A method for manufacturing a semiconductor device including a semiconductor circuit including a semiconductor element.
[0028]
The structure of the third manufacturing method for manufacturing the semiconductor device of the present invention is as follows.
Forming a first insulating film on the substrate;
Heat-treating the first insulating film;
A step of sequentially stacking a second insulating film and a semiconductor film on the first insulating film without touching the atmosphere;
Adding a catalyst element for promoting crystallization to at least a part of the semiconductor film;
Crystallization of the semiconductor film to form a crystalline semiconductor film;
Gettering the catalytic element;
A method for manufacturing a semiconductor device including a semiconductor circuit including a semiconductor element.
[0029]
In any one of the structures of the first to third manufacturing methods, the thickness of the second insulating film is smaller than that of the first insulating film.
[0030]
In any one of the structures of the first to third manufacturing methods, the heating temperature in the step of heat-treating the first insulating film is 200 to 700 ° C.
[0031]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an example of an embodiment of the present invention will be described.
[0032]
The present inventor conducted manufacturing experiments of TFTs having various structures. Even though the cleanliness of the clean room used was controlled to some extent, the threshold voltage of the TFTs fluctuated. It was confirmed as a variation.
[0033]
As a prior art aiming at solving such a problem of variation in electrical characteristics of TFT, particularly threshold voltage, one of effective means is to form a base film and a semiconductor film continuously.
[0034]
However, a TFT having excellent characteristics is never obtained simply by continuously forming a base film and a semiconductor film, and the reliability is extremely low. In particular, in order to obtain a high-quality and high-definition display, the number of display pixels required for the display has been increasing year by year. When mass production is performed, the reliability of TFTs as well as variations in threshold voltage are required. Is emphasized. Therefore, the present inventor has found from various experimental results that a base film having a thickness of 200 nm or more may be heat-treated in order to improve the reliability of the TFT. However, when the base film is heat-treated, the threshold voltage varies because the interface between the base film and the semiconductor film cannot be cleaned.
[0035]
Accordingly, the present inventor has found that an extremely high-performance TFT which has not been conventionally produced can be manufactured by continuously forming the second base film and the semiconductor film after heat-treating the first base film. This configuration of the present invention is not a mere combination of the prior art, but the heat treatment of the first base film, the formation of a clean interface between the second base film and the semiconductor film, and the heat-treated first base film This is the result of a complex technology that can be obtained for the first time by reducing the stress between semiconductor films and improving the adhesion between each film. The result is a breakthrough in TFT characteristics. It was possible.
[0036]
As the second base film of the present invention, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film (SiO _x N _y ), or a laminated film thereof can be used. A silicon oxide film is preferable if stress relaxation is important. Further, a silicon nitride film is preferable if importance is given to preventing diffusion of impurities. In particular, a silicon nitride oxide film having a lower stress than the silicon nitride film and having a higher impurity diffusion preventing effect than the silicon oxide film is optimal. The second base film 101b can be formed continuously with a semiconductor film by using a known means such as a thermal CVD method, a plasma CVD method, a sputtering method, a vapor deposition method, or a low pressure thermal CVD method. Further, if the film thickness range of the second base film is 10 to 100 nm, preferably 20 to 60 nm, a clean interface with the semiconductor film is formed and the thermal expansion coefficient is different from that of the first base film. It can serve as a buffer layer to relieve stress between certain semiconductor films.
[0037]
According to the present invention, even in a large-scale clean room, an extremely high quality semiconductor film and a clean interface can be simultaneously realized regardless of the cleanliness in the clean room. Therefore, it is possible to suppress an increase in cost due to cleaning the clean room.
[0038]
In addition, according to the present invention, variation due to release to the atmosphere can be reduced, and therefore variation between lots and between substrates can also be reduced.
[0039]
The embodiment of the present invention will be described in more detail with reference to the following examples.
[0040]
【Example】
Examples of the present invention will be described below, but it is needless to say that the present invention is not particularly limited to these examples.
[0041]
[Embodiment 1] In this embodiment, an example in which a top gate type TFT is manufactured using the present invention will be described. In this embodiment, an N-channel TFT is used for description.
[0042]
The semiconductor device of the present invention and a method for manufacturing the semiconductor device will be briefly described with reference to FIGS.
[0043]
First, the substrate 100 is prepared. As the substrate 100, a glass substrate, a quartz substrate, an insulating substrate such as crystalline glass, a ceramic substrate, a stainless steel substrate, a metal (tantalum, tungsten, molybdenum, etc.) substrate, a semiconductor substrate, a plastic substrate (polyethylene terephthalate substrate), or the like is used. be able to. In this example, a glass substrate (Corning 1737; strain point 667 ° C.) was used as the substrate 100.
[0044]
Next, a first insulating film (hereinafter referred to as a first base film in this specification) 101 a is formed over the substrate 100. As the first base film 101a, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film (SiO _x N _y ), or a stacked film of these can be used. As a means for forming the first base film 101a, a known means such as a thermal CVD method, a plasma CVD method, a sputtering method, a vapor deposition method, a reduced pressure thermal CVD method or the like can be used, and it can be used in a film thickness range of 100 to 500 nm. Note that if a base film having a thickness of 200 nm or more is heat-treated, diffusion of impurities from the substrate can be sufficiently prevented, so that a highly reliable TFT can be manufactured. In this embodiment, as the first base film 101a, using TEOS and oxygen (O ₂₎ as a source gas and a silicon oxide film having a film thickness of 200nm by plasma CVD apparatus. (Fig. 1 (A))
[0045]
Next, heat treatment is performed on the first base film 101a to form a first base film 101a ′. (FIG. 1B) The heat treatment here is performed at a temperature equal to or lower than the strain point of the substrate, preferably 200 to 700.degree. In this embodiment, heat treatment was performed at 640 ° C. for 4 hours. This heat treatment is necessary to improve the reliability of the TFT. At this time, the surface of the first base film 101a is exposed to the atmosphere.
[0046]
Next, the second insulating film 101b (hereinafter referred to as a second base film in this specification) and the semiconductor film 102 are stacked over the heat-treated first base film 101a ′ without being exposed to the air. Form. (FIG. 1C) By doing so, the interface between the semiconductor film, in particular, the region forming the channel formation region and the second base film 101b was made favorable.
[0047]
In addition, the semiconductor film and the heat-treated first base film are not in direct contact with each other, but the reliability of the TFT is improved by reducing the thickness of the second base film as compared with the first base film. I was able to.
[0048]
That is, in this embodiment, the reliability of the TFT is improved by the heat-treated first base film, and a good Si / SiO ₂ interface is formed by the second base film. Note that since the concentration of impurities at the interface between the first base film and the second base film is exposed to the atmosphere, it is higher than the interface between the second base film and the active layer, and shows a sharp peak at the interface. It was. In particular, the maximum peak concentration of boron element was 3 × 10 ¹⁷ atoms / cm ³ or more.
[0049]
As the second base film 101b, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film (SiO _x N _y ), or a stacked film of these can be used. As a means for forming the second base film 101b, a known means such as a thermal CVD method, a plasma CVD method, a sputtering method, a vapor deposition method, or a low pressure thermal CVD method is used, and the film thickness is 10 to 100 nm, preferably 20 to 60 nm. Can be used in a range. In this embodiment, TEOS and oxygen (O ₂ ) are used as a source gas for the second base film 101b, and a 20 nm-thick silicon oxide film is formed by a plasma CVD apparatus.
[0050]
The semiconductor film 102 is an amorphous silicon film, an amorphous semiconductor film having microcrystals, a microcrystalline semiconductor film, an amorphous germanium film, or Si _x Ge _1-x (0 <X <1). An amorphous silicon germanium film or a stacked film thereof can be used in a film thickness range of 20 to 70 nm (typically 40 to 50 nm). As a means for forming the semiconductor film 102, known means such as a thermal CVD method, a plasma CVD method, a low pressure thermal CVD method, a sputtering method, or the like can be used. In this embodiment, an amorphous silicon film with a thickness of 50 nm is formed as the semiconductor film 102.
[0051]
In this embodiment, a multi-chamber (apparatus shown in FIG. 7) including at least a first chamber 44 for forming a second base film and a second chamber 45 for forming a semiconductor film is used. The layers were formed by moving between the chambers without touching. Alternatively, a stack may be formed by exchanging the reaction gas in the same chamber.
[0052]
When the state of FIG. 1C is thus obtained, the semiconductor film 102 made of an amorphous silicon film is crystallized to form a semiconductor film 102 ′ made of a crystalline silicon film. In this example, the semiconductor film was crystallized by irradiation with infrared light or ultraviolet light (hereinafter referred to as laser crystallization). When ultraviolet light is used as the crystallization technique, excimer laser light or strong light generated from an ultraviolet lamp may be used, and when infrared light is used, infrared laser light or strong light generated from an infrared lamp may be used. In this embodiment, excimer laser light is linearly formed and irradiated in the atmosphere. Note that, when laser crystallization is performed by exposure to the atmosphere, a thin oxide film is formed on the surface, but is not shown in this embodiment for simplification. Further, although this embodiment was performed in the air, it is not particularly limited, and laser crystallization may be performed in an inert atmosphere or in a vacuum.
[0053]
As the crystallization treatment, any known technique such as laser crystallization treatment, thermal crystallization treatment, or thermal crystallization treatment using a catalyst element can be used. Note that laser crystallization conditions (laser light wavelength, overlap rate, irradiation intensity, pulse width, repetition frequency, irradiation time, etc.) are as follows: film thickness of insulating film 105, film thickness of initial semiconductor film 104, substrate temperature, and the like. The practitioner may determine as appropriate in consideration of the above. The irradiation condition, the pulse frequency is 30 Hz, an overlap ratio is 96%, the laser energy density in this example be 100 to 500 mJ / cm ² was 359mJ / cm ^2. Also, depending on the laser crystallization conditions, the semiconductor film may be crystallized after passing through a molten state, or the semiconductor film may be crystallized in a solid state or an intermediate state between a solid phase and a liquid phase without melting. There is.
[0054]
Next, the obtained semiconductor film 102 ′ was patterned to form an active layer 103 having a desired shape. (Figure 1 (E))
[0055]
Note that after the step of FIG. 1D or FIG. 1E, an impurity may be added to control a threshold voltage and an impurity may be added to a region to be a channel formation region. Alternatively, the process sequence in FIGS. 1D and 1E may be changed, and the semiconductor film may be patterned and then crystallized.
[0056]
Next, an insulating film (which becomes a gate insulating layer in a later step) 104 and a (conductive film gate wiring forming material layer) 105 were formed so as to cover the active layer. (FIG. 2A) As the insulating film 104, a silicon oxide film, a silicon nitride film, a silicon nitride oxide film (SiO _x N _y ), an organic resin film (such as a BCB film), or a stacked film of these is used. Can do. As a means for forming the third insulating film 104, a known means such as a thermal CVD method, a plasma CVD method, a low pressure thermal CVD method, a sputtering method, a vapor deposition method, or a coating method is used. Can do. In this embodiment, a silicon oxide film with a thickness of 150 nm is formed as the third insulating film 104.
[0057]
As the conductive film 105, a conductive material or a semiconductor material such as aluminum (Al), tantalum (Ta), copper (Cu), niobium (Nb), hafnium (Hf), zirconium (Zr), titanium (Ti) ), Chromium (Cr), silicon (Si), silicide, or the like as a main component can be used. The conductive film 105 can be used in a thickness range of 10 to 500 nm. In this embodiment, an aluminum film with a thickness of 400 nm is formed as the conductive film 105.
[0058]
Next, the conductive film 105 was patterned using the mask 108 to form a material layer 107 for forming a gate wiring, and the third insulating film 104 was further patterned to form the gate insulating layer 106. (Fig. 2 (B))
[0059]
In this embodiment, the material layer 107 for forming the gate wiring is first anodized to form a porous anodic oxide film (not shown). Further, a second anodic oxide film was applied to form a dense anodic oxide film 109, and then the porous anodic oxide film and the mask 108 were removed. In addition, a step of forming a protective film made of an insulating film covering the gate wiring may be added to protect the gate wiring without performing the anodic oxidation.
[0060]
Next, an impurity imparting N-type conductivity is added to the active layer 103 using the gate wiring as a mask. In addition, a mask for selectively adding to a predetermined region in the active layer may be formed. The impurity may be added using a known means such as an ion implantation method, a plasma doping method, or a laser doping method. However, the doping conditions, dose, acceleration voltage, and the like are adjusted so that a desired amount of impurity ions is added to a predetermined region of the active layer. In this embodiment, phosphorus element is used as an impurity imparting N-type conductivity, and the phosphorus concentration in the low-concentration impurity regions 112 and 113 is 1 × 10 ¹⁵ to 1 × 10 ¹⁷ atoms / cm in SIMS analysis. Adjusted to ³ . Further, the phosphorus concentration in the high concentration impurity regions 110 and 111 was adjusted to be 1 × 10 ²⁰ to 8 × 10 ²¹ atoms / cm ³ by SIMS analysis. (Fig. 2 (C))
[0061]
The high concentration impurity regions (n ⁺ type regions) 110 and 111 become source regions and drain regions, and the low concentration impurity regions (n ⁻ type regions) 112 and 113 become LDD regions. In addition, a region where phosphorus ions and boron ions are not implanted becomes an intrinsic or substantially intrinsic channel formation region 114 which later becomes a carrier movement path.
[0062]
In this specification, intrinsic refers to a region that does not contain any impurities that can change the Fermi level of silicon, and the substantially intrinsic region is a balance between electrons and holes that offset the conductivity type. region is, i.e., a region containing an impurity imparting N-type or P-type in a concentration range capable of controlling the threshold voltage (SIMS analysis at ^{1 × 10 15 ~1 × 10 17} atoms / cm 3) or intended, Specifically, a region in which the conductivity type is offset by adding a reverse conductivity type impurity is shown.
[0063]
In FIG. 2B, the insulating film 104 may be patterned after the addition of impurities through the insulating film 104 without patterning the insulating film 104.
[0064]
Next, a known technique such as thermal annealing or laser annealing is performed to obtain an impurity activation effect in the source region and the drain region, or a recovery effect of the crystal structure of the active layer damaged in the doping process. In this example, after irradiating a laser beam having an irradiation condition of a pulse frequency of 50 Hz and a laser energy density of 179 mJ / cm ² , a thermal activation treatment (450 ° C., 2 hours in a nitrogen atmosphere) was performed.
[0065]
Next, after forming an interlayer insulating film 115 and forming contact holes exposing the source region and the drain region, a metal film is formed and patterned to form a metal wiring 116 in contact with the source region and the drain region. ~ 117 are formed. Finally, hydrogenation treatment (hydrogen atmosphere, 350 ° C., 2 hours) is performed. (FIG. 2D) Thus, the manufacture of the N-channel TFT in this example is completed.
[0066]
In this embodiment, the oxygen concentration at the interface between the second base film and the channel formation region is 2 × 10 ¹⁹ atoms / cm ³ or less, and the carbon and nitrogen concentrations are 5 × 10 ¹⁸ atoms / cm ³ or less. I was able to.
[0067]
Note that although a method for manufacturing an N-channel TFT is described in this embodiment, if a P-channel TFT is formed, boron ions imparting P-type may be added as impurity ions in the impurity addition step.
[0068]
In this embodiment, in order to compare the influence of the second base film and the influence of the heat treatment of the insulating film, the threshold voltage of the TFT in the manufacturing method of this embodiment is different from that of this embodiment. The threshold voltage of the TFT was measured. Further, in order to compare the influence of the film thickness of the second base film, TFTs having different film thicknesses of the second base film are manufactured using the above manufacturing method, and the threshold voltage (Vth) of each TFT is manufactured. Was measured. In this embodiment, a plurality of substrates prepared under the same conditions are prepared, and TFTs [L (channel length) / W (channel width) = 8/200 μm] at random measurement points in these substrates are excluded from the route ID. interpolation (drain voltage V _D = 14 V, the gate voltage V _G = -20V~20V) was used for the measurement. FIG. 8 is a distribution diagram of threshold voltages of N-channel TFTs, and FIG. 9 is a distribution diagram of threshold voltages of P-channel TFTs.
[0069]
Note that the threshold voltage (Vth) in this specification indicates a voltage value applied to a gate wiring necessary for changing a TFT from an off state to an on state.
[0070]
Similarly, FIG. 10 shows the change amount (ΔVth) of the threshold voltage of the N-channel TFT, and FIG. 11 shows the fluctuation of the threshold voltage of the P-channel TFT. ΔVth gives a stress to the TFT [L / W = 8/8 μm] by performing the measurement by the root ID extrapolation method ten times continuously, and sets the first threshold voltage Vth ₁ and the tenth Vth ₁₀ The amount of change is measured as ΔVth. A smaller value of ΔVth indicates that the TFT is less deteriorated and the reliability is higher.
[0071]
TFTs according to the production conditions shown below were measured (2 to 3 substrates, 4 to 16 points in each substrate), and data A to H were obtained.
[0072]
A) TFT with a base film and a-Si film continuously formed (conventional example 1)
B) TFT in which an a-Si film is formed after forming a base film (conventional example 2)
C) TFT in which an a-Si film is formed after a base film is formed and heat-treated (conventional example 3)
D) TFT in which a first base film is formed and subjected to heat treatment, and then a second base film (5 nm) and an a-Si film are continuously formed.
E) TFT in which the first base film is formed and subjected to heat treatment, and then the second base film (10 nm) and the a-Si film are continuously formed.
F) TFT in which a second base film (20 nm) and an a-Si film are continuously formed after the first base film is formed and heat-treated (this example)
G) A TFT in which a second base film (50 nm) and an a-Si film are continuously formed after the first base film is formed and heat treatment is performed.
H) TFT in which a first base film is formed and subjected to heat treatment, and then a second base film (100 nm) and an a-Si film are continuously formed.
[0073]
The influence of the second base film will be considered below.
[0074]
When attention is paid to data A (conventional example 1) shown in FIGS. 8 to 11, Vth of data C is suppressed to 2 to 3V and shows a good value, but since ΔVth is large, TFT having low reliability is shown. It has become.
[0075]
Further, when attention is paid to data B (conventional example 2), Vth is slightly shifted from data A, and ΔVth is larger as data A is. From these results (data A and B), the present inventor shows that if the base film and the a-Si film are continuously formed without being exposed to the atmosphere, the interface with less impurities can be maintained, and the positive shift of Vth can be suppressed. Found.
[0076]
Further, when attention is paid to data C (conventional example 3), Vth is greatly shifted to 5-8 V, but ΔVth is very small and the TFT is highly reliable. From these results, the present inventors have found that when the base film is heat-treated, the change amount ΔVth of the threshold voltage can be reduced, that is, the reliability of the TFT is improved.
[0077]
Compared to the TFTs of the conventional examples 1 to 3, the TFT of this example is formed by successively forming a thin second base film and an a-Si film (semiconductor film) after heat-treating the first base film. As can be seen from the data D to H, especially the data E (in this example), the positive shift of Vth is suppressed, and ΔVth is small and the TFT is highly reliable.
[0078]
From the above knowledge, the threshold voltage (Vth) depends on the interface characteristics between the film directly in contact with the semiconductor film, that is, the thin second base film and the a-Si film. The present inventor has found that [Delta] Vth) is not caused by the film directly in contact with the semiconductor, i.e., the thin second base film, but by the heat-treated first base film. The present inventor has also found that the second base film functions as a buffer layer that relieves stress between the first base film and the semiconductor film.
[0079]
Further, the influence of the film thickness of the second base film will be considered below.
[0080]
8 and 9, Vth monotonically decreases with respect to the film thickness of the second base film in the N-channel TFT, and after the large change once in the P-channel TFT. Monotonically increasing. Further, when the data D to H shown in FIGS. 10 and 11 are seen, ΔVth is reduced to 20 nm or more for the P-channel TFT with respect to the film thickness of the second base film, and 50 nm for the N-channel TFT. That's it.
[0081]
From these results, when the first base film is 200 nm, the second film thickness is 10 nm or more, preferably 20 to 50 nm. However, the above-mentioned film thickness is a set film thickness, and the actual film thickness is larger than the set film thickness. Therefore, it is desirable that the second film thickness is 20 to 60 nm in actual measurement.
[0082]
In this example, a reliability test for measuring the amount of change in threshold voltage (ΔVth) was performed. However, the reliability test is not particularly limited, and the same reliability test using a general Bias-Tempreture-Stress is performed. Experimental results are obtained.
[0083]
An example of a structure of a semiconductor device including a semiconductor circuit including a semiconductor element (TFT) using the manufacturing method of this embodiment will be described with reference to FIGS.
[0084]
In this embodiment, a CMOS circuit (inverter circuit) that constitutes a part of the peripheral drive circuit section is shown in FIG. The reference numerals used in FIG. 3 are the same as those in FIG. 1 or FIG. In FIG. 3, the cross section taken along the dotted line AA ′ in the top view of the inverter circuit corresponds to the cross sectional structure of the CMOS circuit. Note that the terminal portions a, b, c, and d in the inverter circuit diagram of FIG. 3A and the top view of the inverter circuit correspond to each other.
[0085]
In FIG. 3, any TFT (thin film transistor) is formed on a laminated film of a first base film 101a ′ and a second base film 101b provided on the substrate 100. In the case of an N-channel TFT of an inverter circuit, a channel formation region 114, N-type high-concentration impurity regions (n ⁺ -type regions) 110 and 111 as active layers on the second base film, and the channel formation region Low concentration impurity regions (n ⁻ type regions) 112 and 113 are formed between the high concentration impurity regions. A gate wiring 107 ′ is formed on the channel formation region via a gate insulating layer 106. The gate wiring 106 is protected by an anodic oxide film 109. A contact hole is formed in the first interlayer insulating film 115 covering it, and wirings 116 and 117 are connected to the high concentration impurity region.
[0086]
On the other hand, the P channel type TFT has high concentration impurity regions (p ⁺ type regions) 110 ′ and 111 ′ as an active layer, a channel formation region 114 ′, and a low concentration between the p ⁺ type region and the channel formation region. Impurity regions (p ⁻ -type regions) 112 ′ and 113 ′ are formed. p ⁺ -type region 110 ', 111' to the wiring 116, 117 'are formed. Portions other than the active layer have substantially the same structure as the N-channel TFT.
[0087]
FIG. 4 shows a pixel TFT (N-channel TFT) that constitutes a part of the pixel portion. Also, the reference numerals used in FIG. 4 are the same as those in FIG. In FIG. 4A, a cross section taken along a dotted line AA ′ corresponds to the cross-sectional structure of the pixel portion in FIG.
[0088]
The N-channel TFT formed in the pixel portion has the same structure as the N-channel TFT of the inverter circuit up to the portion where the first interlayer insulating film 115 is formed. Then, wirings 116 and 117 are connected to the high-concentration impurity regions (n ⁺ -type regions) 110 and 111, and a second interlayer insulating film 118 and a black mask 119 are formed thereon. Further, a third interlayer insulating film 120 is formed thereon, and a pixel electrode 121 made of a transparent conductive film such as ITO or SnO ₂ is connected thereto. The pixel electrode covers the pixel TFT, and forms a black mask and an auxiliary capacitor. In this embodiment, a transmissive LCD is manufactured as an example, but is not particularly limited. For example, a reflective LCD can be manufactured by using a reflective metal material as a material for the pixel electrode and appropriately changing the patterning of the pixel electrode or adding / deleting some processes as appropriate.
[0089]
In this embodiment, the gate wiring of the pixel TFT in the pixel portion has a double gate structure. However, a multi-gate structure such as a triple gate structure may be used in order to reduce variation in off current. Further, a single gate structure may be used in order to improve the aperture ratio.
[0090]
Note that the peripheral driver circuit portion illustrated in FIG. 3 and the pixel portion illustrated in FIG. 4 can be manufactured over the same substrate.
[0091]
In this embodiment, the top gate TFT has been described as an example. However, the configuration of the present invention can also be applied to a bottom gate TFT.
[0092]
[Embodiment 2] This embodiment is an example of obtaining a crystalline silicon film by a method different from that of Embodiment 1. In this embodiment, a crystalline semiconductor film is formed using a catalytic element that promotes crystallization of silicon. Since the basic configuration is substantially the same as that of the first embodiment, only the differences will be described.
[0093]
This example is the same as Example 1 up to the step of continuously forming the second base film and the semiconductor film 102 (FIG. 1C).
[0094]
After obtaining the same state as that in FIG. 1C, a catalytic element for promoting crystallization of silicon is introduced into the surface of the semiconductor film 102. As the catalytic element that promotes crystallization of silicon, one or more kinds of elements selected from Ni, Fe, Co, Pt, Cu, Au, and Ge are used. In this embodiment, among the catalytic elements, Ni is used which has a high diffusion rate in the amorphous silicon film and can obtain extremely good crystallinity.
[0095]
Further, the location where the catalyst element is introduced is not particularly limited, but the catalyst element is selectively introduced by appropriately forming the entire surface of the amorphous silicon film or a mask.
[0096]
Further, as a method for introducing the catalytic element into the amorphous silicon film, any method can be used as long as the catalytic element can be brought into contact with the surface of the amorphous silicon film, or can be retained in the amorphous silicon film. There is no particular limitation. For example, a sputtering method, a CVD method, a plasma treatment method, an adsorption method, an ion implantation method, or a method of applying a solution containing a catalytic element can be used. Among these, the method of applying the solution is simple and useful in that the concentration of the catalyst element can be easily adjusted. As the metal salt, various salts can be used, and as the solvent, water, alcohols, aldehydes, ethers, other organic solvents, or a mixed solvent of water and an organic solvent can be used. In this example, a solution containing nickel in a range of 10 to 10000 ppm, preferably 100 to 10000 ppm (weight conversion) was applied using a coating method. However, it is necessary to adjust the addition amount appropriately in consideration of the thickness of the amorphous silicon film. The nickel concentration in the amorphous silicon film thus obtained is 1 × 10 ¹⁹ to 1 × 10 ²¹ atoms / cm ³ .
[0097]
After the catalytic element is introduced into the amorphous silicon film as described above, crystallization is performed by heat treatment (550 ° C., 4 hours) to obtain a crystalline semiconductor film. Further, instead of heat treatment, a step of irradiating laser light may be added.
[0098]
Further, it is preferable to perform a gettering treatment step (techniques such as JP-A-9-312260 and JP-A-8-330602) for reducing the catalytic element in the crystalline semiconductor film after the above step. . In JP-A-9-312260, the catalytic element of a crystalline semiconductor film is gettered in a thermal oxide film formed by thermal oxidation (450 to 1100 ° C.) in an oxidizing atmosphere, and the heat A gettering process for removing the oxide film is described.
[0099]
In this embodiment, the nickel element in the crystalline semiconductor film is reduced by utilizing the gettering action of phosphorus.
[0100]
In the gettering process, after the above crystallization process is completed, phosphorus is selectively doped into the crystalline semiconductor film using a mask so that the phosphorus concentration is 1 × 10 ¹⁹ to 1 × 10 ²¹ atoms / A phosphorus added region of cm ³ is formed. Next, nickel is captured in the phosphorus addition region by heating at 600 ° C. for 12 hours in a nitrogen atmosphere. Accordingly, the nickel concentration in the region other than the phosphorus addition region can be reduced to 5 × 10 ¹⁷ atoms / cm ³ or less (preferably 2 × 10 ¹⁷ atoms / cm ³ or less).
[0101]
Next, after the gettering step is completed, the mask is removed and further patterned to form an active layer. Here, the active layer is formed using a region other than the phosphorus addition region.
[0102]
As the process after the patterning process of the active layer, the TFT in the state of FIG. 2D is obtained by sequentially performing the same processes as in the first embodiment.
[0103]
The threshold voltage Vth and threshold voltage change ΔVth of the TFT manufactured using the manufacturing method of this example were measured in the same manner as in Example 1. Further, in order to compare the influence of the second base film, the threshold voltage (Vth) and threshold voltage change amount (ΔVth) of the TFT having only the first base film 200 nm (Comparative Example 1) are measured. did. FIG. 12 is a distribution diagram of threshold voltages of N-channel TFTs, and FIG. 13 is a distribution diagram of threshold voltages of P-channel TFTs.
[0104]
Similarly, FIG. 14 is a distribution diagram of the change amount (ΔVth) of the threshold voltage of the N-channel TFT, and FIG. 15 is a distribution diagram of the change amount of the threshold voltage of the P-channel TFT.
[0105]
The influence of the second base film will be considered below.
[0106]
When attention is paid to the data shown in FIGS. 12 to 15, the present embodiment has a threshold voltage smaller than that of the first comparative example, and the positive shift of the threshold voltage is suppressed by providing the second base film. Further, in this example, since the first base film is heat-treated as in Comparative Example 1, the threshold voltage fluctuation (ΔVth) is small, especially in the P channel. Almost no TFT was obtained.
[0107]
Example 3 In this example, a crystalline semiconductor film is obtained by a method different from that in Example 1. The present embodiment relates to a method for forming a crystalline silicon film by forming a laser beam shape into a rectangle or a square and performing uniform laser crystallization treatment in a region of several cm ² to several hundred cm ² by one irradiation. Since the basic configuration is substantially the same as that of the first embodiment, only the differences will be described.
[0108]
In this embodiment, excimer laser light is processed into a planar shape and irradiated in the process of FIG. When processing a laser beam into a planar shape, it is necessary to process the laser beam so that an area of about several tens of cm ² (preferably 10 cm ² or more) can be collectively irradiated. In order to anneal the entire irradiated surface with a desired laser energy density, a laser device having an output with a total energy of 5 J or more, preferably 10 J or more is used.
[0109]
In that case, the energy density is set to 100 to 800 mJ / cm ² , and the output pulse width is set to 100 nsec or more, preferably 200 nsec to 1 msec. In order to realize a pulse width of 200 nsec to 1 msec, a plurality of laser devices are connected, and a state in which a plurality of pulses are mixed is created by shifting the synchronization of the laser devices.
[0110]
By irradiating a laser beam having a planar beam shape as in this embodiment, it is possible to perform uniform laser irradiation over a large area. That is, the crystallinity (including crystal grain size and defect density) of the active layer becomes uniform, and variations in electrical characteristics between TFTs can be reduced.
[0111]
Note that this embodiment can be easily combined with Embodiment 1 or 2, and the combination is free.
[0112]
Embodiment 4 In this embodiment, an example of a liquid crystal display device manufactured according to the present invention is shown in FIG. Since a known method may be used for a manufacturing method of a pixel TFT (pixel switching element) and a cell assembly process, detailed description thereof is omitted.
[0113]
In FIG. 5, 500 is a substrate having an insulating surface (plastic substrate provided with a silicon oxide film), 501 is a pixel portion, 502 is a scanning line driver circuit, 503 is a signal line driver circuit, 530 is a counter substrate, 510 is FPC (flexible). 520 is a logic circuit. As the logic circuit 520, a circuit that performs a process such as a D / A converter, a γ correction circuit, a signal division circuit, or the like that has been substituted for a conventional IC can be formed. Of course, it is also possible to provide an IC chip on the substrate and perform signal processing on the IC chip.
[0114]
Further, in this embodiment, the liquid crystal display device is described as an example. However, the present invention is applied to an EL (electroluminescence) display device and an EC (electrochromic) display device if the display device is an active matrix type. It goes without saying that it is also possible to do.
[0115]
Further, the liquid crystal display device that can be manufactured using the present invention does not matter whether it is a transmissive type or a reflective type. It is up to the practitioner to choose either. Thus, the present invention can be applied to any active matrix type electro-optical device (semiconductor device).
[0116]
Note that in manufacturing the semiconductor device shown in this embodiment, any of the configurations of Embodiments 1 to 3 may be employed, and the embodiments can be used in any combination.
[0117]
[Embodiment 5] The present invention can be applied to all conventional IC technologies. That is, it can be applied to all semiconductor circuits currently on the market. For example, the present invention may be applied to a microprocessor such as a RISC processor or an ASIC processor integrated on one chip, and is represented by a liquid crystal driver circuit (D / A converter, γ correction circuit, signal dividing circuit, etc.). The present invention may be applied to a signal processing circuit and a high-frequency circuit for a portable device (mobile phone, PHS, mobile computer).
[0118]
A semiconductor circuit such as a microprocessor is mounted on various electronic devices and functions as a central circuit. Typical electronic devices include personal computers, portable information terminal devices, and all other home appliances. Further, a computer for controlling a vehicle (such as an automobile or a train) may be used. The present invention is applicable to such a semiconductor device.
[0119]
Note that in manufacturing the semiconductor device shown in this embodiment, any of the configurations of Embodiments 1 to 3 may be employed, and the embodiments can be used in any combination.
[0120]
Example 6
A TFT formed by implementing the present invention can be used in various electro-optical devices. That is, the present invention can be implemented in all electronic devices in which these electro-optical devices are incorporated in the display unit.
[0121]
Examples of such an electronic device include a video camera, a digital camera, a head mounted display (goggles type display), a wearable display, a car navigation system, a personal computer, a personal digital assistant (mobile computer, mobile phone, electronic book, etc.), and the like. . An example of them is shown in FIG.
[0122]
FIG. 6A illustrates a personal computer, which includes a main body 2001, an image input portion 2002, a display portion 2003, and a keyboard 2004. The present invention can be applied to the image input unit 2002, the display unit 2003, and other signal driving circuits.
[0123]
FIG. 6B shows a video camera, which includes a main body 2101, a display portion 2102, an audio input portion 2103, operation switches 2104, a battery 2105, and an image receiving portion 2106. The present invention can be applied to the display portion 2102, the audio input portion 2103, and other signal driving circuits.
[0124]
FIG. 6C illustrates a mobile computer, which includes a main body 2201, a camera unit 2202, an image receiving unit 2203, operation switches 2204, and a display unit 2205. The present invention can be applied to the display portion 2205 and other signal driving circuits.
[0125]
FIG. 6D illustrates a goggle type display which includes a main body 2301, a display portion 2302, and an arm portion 2303. The present invention can be applied to the display portion 2302 and other signal driving circuits.
[0126]
FIG. 6E shows a player using a recording medium (hereinafter referred to as a recording medium) on which a program is recorded. The player includes a main body 2401, a display portion 2402, a speaker portion 2403, a recording medium 2404, and operation switches 2405. This apparatus uses a DVD (Digital Versatile Disc), CD, or the like as a recording medium, and can perform music appreciation, movie appreciation, games, and the Internet. The present invention can be applied to the display portion 2402 and other signal driving circuits.
[0127]
FIG. 6F illustrates a digital camera, which includes a main body 2501, a display portion 2502, an eyepiece portion 2503, an operation switch 2504, and an image receiving portion (not shown). The present invention can be applied to the display portion 2502 and other signal driving circuits.
[0128]
As described above, the application range of the present invention is extremely wide and can be applied to electronic devices in various fields. Moreover, the electronic apparatus of a present Example is realizable even if it uses the structure which consists of what combination of Examples 1-5.
[0129]
Example 7
A TFT formed by implementing the present invention can be used in various electro-optical devices. That is, the present invention can be implemented in all electronic devices in which these electro-optical devices are incorporated as liquid crystal display devices.
[0130]
Examples of such an electronic device include a projector (rear type or front type). An example of them is shown in FIG.
[0131]
FIG. 16A illustrates a front type projector, which includes a projection device 2601 and a screen 2602. The present invention can be applied to a liquid crystal display device which is a part of a projection device and other signal driving circuits.
[0132]
FIG. 16B shows a rear projector, which includes a main body 2701, a projection device 2702, a mirror 2703, and a screen 2704. The present invention can be applied to a liquid crystal display device which is a part of a projection device and other signal driving circuits.
[0133]
Note that FIG. 16C is a diagram illustrating an example of the structure of the projection devices 2601 and 2702 in FIGS. 16A and 16B. The projection devices 2601 and 2702 include a light source optical system 2801, mirrors 2802, 2804 to 2806, a dichroic mirror 2803, a prism 2807, a liquid crystal display device 2808, a phase difference plate 2809, and a projection optical system 2810. Projection optical system 2810 includes an optical system including a projection lens. Although the present embodiment shows a three-plate type example, it is not particularly limited, and for example, a single-plate type may be used. Further, the practitioner may appropriately provide an optical system such as an optical lens, a film having a polarization function, a film for adjusting a phase difference, an IR film, or the like in the optical path indicated by an arrow in FIG. Good.
[0134]
FIG. 16D is a diagram illustrating an example of the structure of the light source optical system 2801 in FIG. In this embodiment, the light source optical system 2801 includes a reflector 2811, light sources 2812, 2813 and 2814, a polarization conversion element 2815, and a condenser lens 2816. Note that the light source optical system illustrated in FIG. 16D is an example and is not particularly limited. For example, the practitioner may appropriately provide an optical system such as an optical lens, a film having a polarization function, a film for adjusting a phase difference, or an IR film in the light source optical system.
[0135]
As described above, the application range of the present invention is extremely wide and can be applied to electronic devices in various fields. Moreover, the electronic apparatus of a present Example is realizable even if it uses the structure which consists of what combination of Examples 1-5. However, it goes without saying that the projector in this embodiment is a transmissive liquid crystal display device and is not applicable to a reflective liquid crystal display device.
[0136]
【The invention's effect】
By implementing the present invention, a TFT with high reproducibility and improved TFT stability and high productivity can be obtained.
[0137]
In the present invention, a TFT having extremely good electrical characteristics can be formed by stacking the second insulating film and the semiconductor film on the heat-treated first insulating film without exposure to the air. In particular, the threshold voltage Vth, which is a typical parameter of a TFT, can be realized as -0.5 to 2 V for an N-channel TFT and 0.5 to -2 V for a P-channel TFT.
[0138]
Further, if the second insulating film has a film thickness of 20 nm or more, Vth can be suppressed to about ± 0.2 V within a range of film thickness fluctuation of ± 10 nm, and a uniform TFT with little variation can be obtained. be able to.
[0139]
Furthermore, the threshold voltage variation ΔVth, which is one of the parameters that serve as a guideline for TFT reliability, can be reduced and a highly reliable TFT can be obtained.
[0140]
Further, a subthreshold coefficient (S value), which is a typical parameter of the TFT, can be 0.1 to 0.3 V / decade.
[Brief description of the drawings]
FIG. 1 shows a manufacturing process of a TFT (Example 1).
FIGS. 2A and 2B are diagrams illustrating a manufacturing process of a TFT (Example 1). FIGS.
FIG. 3 is a cross-sectional view (Example 1) illustrating an example of an inverter circuit diagram, a top view, and a cross-sectional structure diagram.
4A and 4B are a cross-sectional view and a top view illustrating an example of a pixel portion (Example 1).
FIG. 5 is a diagram illustrating a configuration of a semiconductor device (liquid crystal display device) (Example 4);
FIG. 6 illustrates an example of a semiconductor device (electronic device) (Example 6);
FIG. 7 is a diagram illustrating an example of a film forming apparatus (Example 1).
FIG. 8 is a distribution diagram showing a threshold voltage of an N-channel TFT (Example 1).
FIG. 9 is a distribution diagram showing a threshold voltage of a P-channel TFT (Example 1).
FIG. 10 is a distribution diagram showing a variation in threshold voltage of an N-channel TFT (Example 1).
FIG. 11 is a distribution diagram showing a variation in threshold voltage of a P-channel TFT (Example 1).
FIG. 12 is a distribution diagram showing a threshold voltage of an N-channel TFT (Example 2).
FIG. 13 is a distribution diagram showing a threshold voltage of a P-channel TFT (Example 2).
FIG. 14 is a distribution diagram showing a variation in threshold voltage of an N-channel TFT (Example 2).
15 is a distribution diagram showing a variation in threshold voltage of a P-channel TFT (Example 2). FIG.
FIG. 16 illustrates an example of a semiconductor device (electronic device) (Example 7);
[Explanation of symbols]
100 substrate 101a first base film 101a ′ heat-treated first base film 101b second base film 102 semiconductor film 102 ′ crystalline semiconductor film 103 active layer 104 insulating film 105 conductive film 106 gate insulating layers 107 and 107 ′ Gate wiring 108 Mask 109 Anodized film 110, 111 n ⁺ region (source region, drain region)
112, 113 n ⁻ region (low concentration impurity region)
114 Channel formation region 115 Interlayer insulating film 116, 117 wiring

Claims (12)

Forming a first insulating film on the substrate;
After exposing the first insulating film to the atmosphere and performing a heat treatment,
On the first insulating film, a second insulating film and a semiconductor film are sequentially stacked without being exposed to the atmosphere,
A method for manufacturing a semiconductor device, wherein the semiconductor film is crystallized to form a crystalline semiconductor film. Forming a first insulating film on the substrate;
After exposing the first insulating film to the atmosphere and performing a heat treatment,
On the first insulating film, a second insulating film and a semiconductor film are sequentially stacked without being exposed to the atmosphere,
Adding a catalytic element for promoting crystallization to at least a part of the semiconductor film;
A method for manufacturing a semiconductor device, wherein the semiconductor film is crystallized to form a crystalline semiconductor film. Forming a first insulating film on the substrate;
After exposing the first insulating film to the atmosphere and performing a heat treatment,
On the first insulating film, a second insulating film and a semiconductor film are sequentially stacked without being exposed to the atmosphere,
Adding a catalytic element for promoting crystallization to at least a part of the semiconductor film;
A method for manufacturing a semiconductor device, wherein the catalytic element is gettered after the semiconductor film is crystallized to form a crystalline semiconductor film. According to claim 2 or 3, wherein the catalyst element, Ni, Fe, Co, Pt , Cu, Au, a method for manufacturing a semiconductor device, characterized in that there is at least one element selected from Ge. In any one of claims 1 to 4, wherein the second insulating film, a method for manufacturing a semiconductor device characterized by forming such a thin film thickness than the thickness of the first insulating film. In any one of claims 1 to 5, wherein the first insulating film is a method for manufacturing a semiconductor device characterized by forming such a film thickness of 100 to 500 nm. In any one of claims 1 to 6, wherein the first insulating film, and wherein the silicon nitride film, a silicon nitride oxide film, a single layer film selected from a silicon oxide film, or to become in a laminate film thereof A method for manufacturing a semiconductor device. In any one of claims 1 to 7, wherein the second insulating film method for manufacturing a semiconductor device characterized by forming such a film thickness of 10 to 100 nm. In any one of claims 1 to 8, wherein the second insulating film, and wherein the silicon nitride film, a silicon nitride oxide film, a single layer film selected from a silicon oxide film, or to become in a laminate film thereof A method for manufacturing a semiconductor device. In any one of claims 1-9, wherein the heat treatment of the first insulating layer, a method for manufacturing a semiconductor apparatus which is characterized in that at 200 to 700 ° C.. In any one of claims 1 to 10, wherein the substrate is a method for manufacturing a semiconductor device, wherein the glass substrate, a quartz substrate, a ceramic substrate, a metal substrate, a semiconductor substrate or a plastic substrate. In any one of claims 1 to 11, by using the crystalline semiconductor film, a method for manufacturing a semiconductor device characterized by forming an active layer of a thin film transistor.

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