JP4441158B2 - 基板ホルダー - Google Patents
基板ホルダー Download PDFInfo
- Publication number
- JP4441158B2 JP4441158B2 JP2002041862A JP2002041862A JP4441158B2 JP 4441158 B2 JP4441158 B2 JP 4441158B2 JP 2002041862 A JP2002041862 A JP 2002041862A JP 2002041862 A JP2002041862 A JP 2002041862A JP 4441158 B2 JP4441158 B2 JP 4441158B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate holder
- thin film
- holding
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 255
- 239000010409 thin film Substances 0.000 claims description 48
- 239000010408 film Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000011521 glass Substances 0.000 description 20
- 229920002050 silicone resin Polymers 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 238000007740 vapor deposition Methods 0.000 description 14
- 229920002379 silicone rubber Polymers 0.000 description 11
- 239000004945 silicone rubber Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 8
- 238000005336 cracking Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 229920006015 heat resistant resin Polymers 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- -1 fluororesin Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002041862A JP4441158B2 (ja) | 2002-02-19 | 2002-02-19 | 基板ホルダー |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002041862A JP4441158B2 (ja) | 2002-02-19 | 2002-02-19 | 基板ホルダー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2003239070A JP2003239070A (ja) | 2003-08-27 |
| JP2003239070A5 JP2003239070A5 (enExample) | 2005-08-11 |
| JP4441158B2 true JP4441158B2 (ja) | 2010-03-31 |
Family
ID=27782145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002041862A Expired - Fee Related JP4441158B2 (ja) | 2002-02-19 | 2002-02-19 | 基板ホルダー |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4441158B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4590315B2 (ja) * | 2005-06-24 | 2010-12-01 | 株式会社ホンダロック | ミラーの表面処理装置 |
| JP6233712B2 (ja) * | 2014-08-27 | 2017-11-22 | 信越半導体株式会社 | 気相成長装置及び被処理基板の支持構造 |
| DE102020109265A1 (de) | 2020-04-02 | 2021-10-07 | Apeva Se | Substrathalter mit einer elastischen Substratauflage |
-
2002
- 2002-02-19 JP JP2002041862A patent/JP4441158B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003239070A (ja) | 2003-08-27 |
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