JP4440647B2 - 欠陥を修復する方法およびシステム - Google Patents
欠陥を修復する方法およびシステム Download PDFInfo
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- JP4440647B2 JP4440647B2 JP2003562995A JP2003562995A JP4440647B2 JP 4440647 B2 JP4440647 B2 JP 4440647B2 JP 2003562995 A JP2003562995 A JP 2003562995A JP 2003562995 A JP2003562995 A JP 2003562995A JP 4440647 B2 JP4440647 B2 JP 4440647B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
Claims (20)
- 試験片上の欠陥を修復する方法であって:
前記試験片の処理をすること;
前記試験片上に存在する欠陥の検出をすること;
前記欠陥が修復可能か否かを決定すること;
前記試験片上の前記欠陥にして、修復可能と決定された1ないしは複数の欠陥の修復をすること、
前記修復の後で、当該試験片の検査で当該試験片の上に残存している残存欠陥の検出を行う、当該試験片の検査をすること;
前記残存欠陥に応答して、前記処理に使用されるプロセス・チャンバに結合された機器のパラメータの変更を行うこと
を含む、欠陥を修復する方法。 - 前記欠陥の検出には、前記試験片上の前記欠陥の特性を決定することが含まれており、前記方法が、前記修復に使用される修復ツールに結合された機器のパラメータを前記特性に応答して変更することを含む請求項1に記載の方法。
- 前記欠陥の検出には、前記試験片上の前記欠陥の位置を決定することが含まれており、前記方法が、さらに、前記修復に使用される修復ツールに結合された機器のパラメータを前記欠陥の位置に応答して変更することを含む請求項1に記載の方法。
- さらに、前記欠陥の検出に使用された測定デバイスからの出力を前記修復に使用される修復ツールへ送ることを含み、前記出力は、前記試験片上に存在する前記欠陥に応じたものであり、さらに前記出力を処理して前記修復に使用される前記修復ツールに結合された機器のパラメータを決定することを含む請求項1に記載の方法。
- 前記欠陥の検出には、前記試験片のイメージの形成が含まれる請求項1に記載の方法。
- 前記修復は、前記欠陥の検出の間に行われる請求項1に記載の方法。
- 前記修復は、前記1ないしは複数の欠陥を化学補助レーザ除去を用いて除去することを含む請求項1に記載の方法。
- 前記修復は、前記1ないしは複数の欠陥をレーザ誘導衝撃波除去を用いて除去することを含む請求項1に記載の方法。
- 前記修復は、粒子ビーム補助修復を含む請求項1に記載の方法。
- さらに、前記欠陥の検出に使用された測定デバイスを用いて前記処理の間に前記試験片の特性を決定することを含む請求項1に記載の方法。
- 前記処理は、前記試験片上における材料の層の形成、前記試験片上におけるレジストのパターン形成、前記試験片のエッチング、前記試験片の研磨、前記試験片のクリーニングからなるグループから選択される、請求項1に記載の方法。
- 試験片上の欠陥を修復するように構成されたシステムであって:
前記試験片の処理をするように構成されたプロセス・チャンバ;
前記プロセス・チャンバによる処理の後で前記試験片上に存在する欠陥を検出するように構成された測定デバイス;
前記試験片で検出された前記欠陥の1ないしは複数に対して修復をするように構成された修復ツール;
前記修復の後で前期試験片上に残存する欠陥を検出すように構成された検査ツール;
前記プロセス・チャンバ,前記測定デバイス,前記修復ツールおよび前記検査ツールに結合されたプロセッサであって、前記試験片で検出された前記欠陥に応答する、前記測定デバイスからの出力を受けて、当該欠陥が修復可能か否かを決定するよう構成され、且つ、前記修復の後に前記試験片上に残存している残存欠陥に応答する、前記検査ツールからの出力を受けて、前記処理に使用されるプロセス・チャンバに結合された機器のパラメータを変更するように構成されているプロセッサ
を備えて成るシステム。 - 前記プロセッサは、前記検出された欠陥の特性を前記測定デバイスの出力から決定するように構成されており、かつ前記検出された欠陥の前記特性に応答して前記修復ツールに結合された前記機器の前記パラメータを変更するように構成されている請求項12に記載のシステム。
- 前記プロセッサは、前記検出された試験片上の欠陥の位置を前記測定デバイスの出力から決定するように構成されており、かつ前記検出された欠陥の前記位置に応答して前記修復ツールに結合された前記機器の前記パラメータを変更するように構成されている請求項12に記載のシステム。
- 前記プロセッサは、前記1ないしは複数の欠陥に、修復可能と決定される欠陥が含まれるように前記修復ツールに結合された機器のパラメータを変更するように構成されている請求項12、13又は14に記載のシステム。
- 前記測定デバイスは、前記試験片のイメージを形成するように構成されている請求項12、13又は14に記載のシステム。
- 前記修復ツールは、前記測定デバイスによる前記欠陥の検出の間に前記試験片で検出された1ないしは複数の欠陥を修復するように構成されている請求項12、13又は14に記載のシステム。
- 前記修復ツールが化学補助レーザ除去ツールを備える請求項12、13又は14に記載のシステム。
- 前記修復ツールがレーザ誘導衝撃波除去ツールを備える請求項12、13又は14に記載のシステム。
- 前記修復ツールが粒子ビームを用いた修復ツールを備える請求項12、13又は14に記載のシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US34932302P | 2002-01-16 | 2002-01-16 | |
PCT/US2003/001419 WO2003063233A2 (en) | 2002-01-16 | 2003-01-16 | Systems and methods for closed loop defect reduction |
Publications (2)
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JP2005516196A JP2005516196A (ja) | 2005-06-02 |
JP4440647B2 true JP4440647B2 (ja) | 2010-03-24 |
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US (1) | US7236847B2 (ja) |
JP (1) | JP4440647B2 (ja) |
WO (1) | WO2003063233A2 (ja) |
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US20030139838A1 (en) | 2003-07-24 |
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JP2005516196A (ja) | 2005-06-02 |
US7236847B2 (en) | 2007-06-26 |
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