JP4422732B2 - テストハンドラ用ハイフィックスボードクランプ装置 - Google Patents
テストハンドラ用ハイフィックスボードクランプ装置 Download PDFInfo
- Publication number
- JP4422732B2 JP4422732B2 JP2007002610A JP2007002610A JP4422732B2 JP 4422732 B2 JP4422732 B2 JP 4422732B2 JP 2007002610 A JP2007002610 A JP 2007002610A JP 2007002610 A JP2007002610 A JP 2007002610A JP 4422732 B2 JP4422732 B2 JP 4422732B2
- Authority
- JP
- Japan
- Prior art keywords
- hifix
- clamp
- boards
- test
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims description 56
- 239000004065 semiconductor Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B5/00—Clamps
- B25B5/006—Supporting devices for clamps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S269/00—Work holders
- Y10S269/90—Supporting structure having work holder receiving apertures or projections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T24/00—Buckles, buttons, clasps, etc.
- Y10T24/44—Clasp, clip, support-clamp, or required component thereof
- Y10T24/44291—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member
- Y10T24/44496—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member with operator means for moving pivoted member
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
Claims (2)
- 並設される2以上のハイフィックスボードの間に設けられて前記2以上のハイフィックスボードの対向する辺を共にクランプできるように設けられる少なくとも1つ以上の回転運動式クランプユニットと、
前記2以上のハイフィックスボードの前記対向する辺を除くそれ以外の辺をクランプできるように設けられる多数のクランプユニットとを含み、
前記回転運動式クランプユニットは、
位置固定された回転点を中心に回転することで、前記2以上のハイフィックスボードの前記対向する辺を共にクランプするか、クランプを解除するように設けられるクランパと、
前記クランパに回転力を提供するための動力装置と
を含み、
前記動力装置は、シリンダを含み、前記シリンダは前記対向する辺の延長線と並行して設けられ、前記対向する辺の間に設けられない
ことを特徴とするテストハンドラ用ハイフィックスボードクランプ装置。 - 前記多数のクランプユニットは直線運動式クランプユニットと回転運動式クランプユニットとを含むことを特徴とする請求項1に記載のテストハンドラ用ハイフィックスボードクランプ装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020060022522U KR200435062Y1 (ko) | 2006-08-22 | 2006-08-22 | 테스트핸들러용 하이픽스보드 클램핑장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008051791A JP2008051791A (ja) | 2008-03-06 |
JP4422732B2 true JP4422732B2 (ja) | 2010-02-24 |
Family
ID=39168757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007002610A Active JP4422732B2 (ja) | 2006-08-22 | 2007-01-10 | テストハンドラ用ハイフィックスボードクランプ装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8919755B2 (ja) |
JP (1) | JP4422732B2 (ja) |
KR (1) | KR200435062Y1 (ja) |
TW (1) | TWI364083B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200435062Y1 (ko) * | 2006-08-22 | 2007-01-09 | (주)테크윙 | 테스트핸들러용 하이픽스보드 클램핑장치 |
CN111515741A (zh) * | 2020-06-04 | 2020-08-11 | 江苏鑫贺伟业机械制造有限公司 | 一种高精度传动轴加工用双工位反转装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1016594A (en) * | 1908-03-25 | 1912-02-06 | Carl Backus | Clamp and gage. |
US2430613A (en) * | 1945-03-15 | 1947-11-11 | Robert W Hodge | Work holding means |
US3473420A (en) * | 1967-04-04 | 1969-10-21 | Allied Chem | Jig for spinnerette |
US4170345A (en) * | 1977-12-13 | 1979-10-09 | Townsend Ralph G | Holding clamp assembly |
GB2136727B (en) * | 1983-02-15 | 1987-10-14 | Keith Shafto | Clamping and holding tool for woodwork |
US4901990A (en) * | 1987-05-26 | 1990-02-20 | Frechette Simon P | Machine tool fixture with air supply system |
FR2633452B1 (fr) * | 1988-06-28 | 1990-11-02 | Doue Julien | Dispositif de support pour un substrat mince, notamment en un materiau semiconducteur |
US4867427A (en) * | 1988-08-01 | 1989-09-19 | Cunningham Paul D | Clamp for welding platens |
US5044615A (en) * | 1991-02-08 | 1991-09-03 | International Business Machines Corporation | Dual purpose work board holder |
US5180150A (en) * | 1992-01-24 | 1993-01-19 | Hughes Danbury Optical Systems, Inc. | Apparatus for providing consistent registration of semiconductor wafers |
US5362036A (en) * | 1993-07-23 | 1994-11-08 | Halliburton Company | Modular welding fixture apparatus |
US5501436A (en) * | 1994-03-30 | 1996-03-26 | Miller; Dennis K. | Substrate retention fixture |
US5538231A (en) * | 1994-11-30 | 1996-07-23 | Caterpillar Inc. | Apparatus for locating a workpiece on a burn table |
US5961107A (en) * | 1996-03-06 | 1999-10-05 | Morghen; Manfred A. | Workpiece indexing and clamping system |
US5848490A (en) * | 1997-03-04 | 1998-12-15 | Lee; Doo Young | Portrait displaying receptacle |
WO1999018599A2 (en) * | 1997-10-03 | 1999-04-15 | Koninklijke Philips Electronics N.V. | Holder for a semiconductor substrate, and method of manufacturing a semiconductor device using such a holder |
US6702269B1 (en) * | 1999-04-01 | 2004-03-09 | Mitek Holdings | Truss jigging system |
FR2791916B1 (fr) * | 1999-04-06 | 2001-05-04 | Abb Preciflex Systems | Procede de maintien en position d'une piece dans un poste d'assemblage |
JP3567803B2 (ja) | 1999-07-08 | 2004-09-22 | 日立ハイテク電子エンジニアリング株式会社 | Icデバイスの試験装置 |
US6792675B2 (en) * | 2002-01-15 | 2004-09-21 | Sun Microsystems, Inc. | Apparatus for aligning and soldering connectors to a printed board |
KR200435062Y1 (ko) * | 2006-08-22 | 2007-01-09 | (주)테크윙 | 테스트핸들러용 하이픽스보드 클램핑장치 |
-
2006
- 2006-08-22 KR KR2020060022522U patent/KR200435062Y1/ko not_active IP Right Cessation
-
2007
- 2007-01-10 TW TW096100917A patent/TWI364083B/zh active
- 2007-01-10 JP JP2007002610A patent/JP4422732B2/ja active Active
- 2007-01-11 US US11/652,181 patent/US8919755B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW200811975A (en) | 2008-03-01 |
US20080061485A1 (en) | 2008-03-13 |
TWI364083B (en) | 2012-05-11 |
KR200435062Y1 (ko) | 2007-01-09 |
US8919755B2 (en) | 2014-12-30 |
JP2008051791A (ja) | 2008-03-06 |
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