JP4414330B2 - 有機エレクトロルミネッセンス素子の製造方法 - Google Patents
有機エレクトロルミネッセンス素子の製造方法 Download PDFInfo
- Publication number
- JP4414330B2 JP4414330B2 JP2004377998A JP2004377998A JP4414330B2 JP 4414330 B2 JP4414330 B2 JP 4414330B2 JP 2004377998 A JP2004377998 A JP 2004377998A JP 2004377998 A JP2004377998 A JP 2004377998A JP 4414330 B2 JP4414330 B2 JP 4414330B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- manufacturing
- spatial light
- organic electroluminescence
- light modulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005401 electroluminescence Methods 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000000034 method Methods 0.000 title description 13
- 239000010410 layer Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 31
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 4
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 4
- 230000005525 hole transport Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 238000004020 luminiscence type Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 239000012044 organic layer Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000007641 inkjet printing Methods 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001931 thermography Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000027756 respiratory electron transport chain Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/048—Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Toxicology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Electroluminescent Light Sources (AREA)
- Laser Beam Processing (AREA)
Description
110 基板
120 ドナー基板
130 有機膜層
140 レーザー発生器
150 レーザービーム
160、260、360 空間光変調器
170 プロジェクションレンズ
210 回折格子
220 反射面
460、560 デジタルマイクロミラーデバイス(DMD)型空間光変調器
Claims (12)
- 画素電極が形成された基板を提供する段階と、
前記基板の全面にドナー基板をラミネーションする段階と、
レーザー発生器から発生するレーザービームをレーザーの照射装置の空間光変調器(SLM)に入射し、ガウシアン形態、不均一な形態のいずれかの入射光の位相、強さ、偏光又は方向を、電気又は光入力に対応した均質な光を形成する空間パターンに変調させることにより、レーザービームを均質にする段階と、
前記レーザーの照射装置を用いて前記ドナー基板の所定領域に均質のレーザービームを照射して、前記基板上に有機膜層パターンを形成する段階と、
を含むことを特徴とする有機エレクトロルミネッセンス素子の製造方法。 - 前記空間光変調器は、少なくとも2つ以上の空間光変調器がアレイされていることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記空間光変調器は、デジタルマイクロミラーデバイス(DMD)型空間光変調器であることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記デジタルマイクロミラーデバイス(DMD)型空間光変調器は、少なくとも2つ以上のデジタルマイクロミラーデバイス(DMD)型空間光変調器がアレイされていることを特徴とする請求項3に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記レーザーの照射装置は
レーザー発生器と、
前記レーザー発生器の下部に位置し、前記レーザー発生器で発生されて入射されるレーザービームを変調する空間光変調器と、
前記空間光変調器の下部に位置するプロジェクションレンズを含むことを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。 - 前記レーザー発生器は、少なくとも2つ以上のレーザー発生器がアレイされていることを特徴とする請求項5に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記レーザー発生器で発生されて入射されるレーザービームは、ガウシアンビーム形態を有することを特徴とする請求項5に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記レーザー発生器は、レーザーダイオードであることを特徴とする請求項5に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記レーザーダイオードは、少なくとも2つ以上のレーザーダイオードがアレイされていることを特徴とする請求項8に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記画素電極上に有機膜層パターンを形成する段階は、N2雰囲気でなされることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記画素電極上に有機膜層パターンを形成する段階は、真空雰囲気でなされることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。
- 前記有機膜層パターンは、発光層、正孔注入層、正孔伝達層、電子伝達層及び電子注入層からなる群より選ばれる1種の単一層又は2種以上の多重層であることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040076668A KR100731729B1 (ko) | 2004-09-23 | 2004-09-23 | 유기 전계 발광 소자의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006093081A JP2006093081A (ja) | 2006-04-06 |
JP4414330B2 true JP4414330B2 (ja) | 2010-02-10 |
Family
ID=36072676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004377998A Active JP4414330B2 (ja) | 2004-09-23 | 2004-12-27 | 有機エレクトロルミネッセンス素子の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8617329B2 (ja) |
EP (1) | EP1640107B1 (ja) |
JP (1) | JP4414330B2 (ja) |
KR (1) | KR100731729B1 (ja) |
CN (1) | CN1753585B (ja) |
DE (1) | DE602004013007T2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2014137B1 (en) | 2006-05-04 | 2017-08-09 | LG Display Co., Ltd. | Organic light-emitting device having light-emitting pattern and method for preparing the same |
KR101008843B1 (ko) * | 2006-10-17 | 2011-01-19 | 주식회사 엘지화학 | 발광 패턴을 갖는 유기발광소자의 제조방법 및 이 방법에의하여 제조된 유기발광소자 |
US8595204B2 (en) * | 2007-03-05 | 2013-11-26 | Microsoft Corporation | Spam score propagation for web spam detection |
EP2520233B1 (en) | 2009-04-02 | 2017-11-01 | Endoshape, Inc. | Vascular occlusion devices |
KR101310452B1 (ko) * | 2011-08-25 | 2013-09-24 | 삼성전기주식회사 | 어레이 타입 공간변조기를 이용한 레이저가공방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5872026A (ja) * | 1981-10-26 | 1983-04-28 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ損失波長特性測定器 |
US5061049A (en) * | 1984-08-31 | 1991-10-29 | Texas Instruments Incorporated | Spatial light modulator and method |
FR2664712B1 (fr) * | 1991-10-30 | 1994-04-15 | Thomson Csf | Dispositif de modulation optique a cellules deformables. |
US5998085A (en) * | 1996-07-23 | 1999-12-07 | 3M Innovative Properties | Process for preparing high resolution emissive arrays and corresponding articles |
KR200172946Y1 (ko) | 1998-03-02 | 2000-05-01 | 배길성 | 진공청소기의 흡입장치용 에지테이터조립체의 에지테이터설치구조 |
JP2000075406A (ja) | 1998-08-27 | 2000-03-14 | Futaba Corp | プロジェクタ用光源及びプロジェクタ |
US6002826A (en) * | 1998-08-28 | 1999-12-14 | Brookhaven Science Associates | Thin display optical projector |
US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
US6169565B1 (en) | 1999-03-31 | 2001-01-02 | Eastman Kodak Company | Laser printer utilizing a spatial light modulator |
US6211997B1 (en) * | 1999-03-31 | 2001-04-03 | Eastman Kodak Company | Modulator for optical printing |
US6458504B2 (en) * | 2000-04-28 | 2002-10-01 | Fuji Photo Film Co., Ltd. | Method for forming an image |
US6605796B2 (en) * | 2000-05-25 | 2003-08-12 | Westar Photonics | Laser beam shaping device and apparatus for material machining |
GB0112611D0 (en) * | 2001-05-23 | 2001-07-18 | Plastic Logic Ltd | Patterning of devices |
TW582062B (en) * | 2001-09-14 | 2004-04-01 | Sony Corp | Laser irradiation apparatus and method of treating semiconductor thin film |
US6695029B2 (en) | 2001-12-12 | 2004-02-24 | Eastman Kodak Company | Apparatus for permitting transfer of organic material from a donor to form a layer in an OLED device |
EP1455985A1 (en) * | 2001-12-21 | 2004-09-15 | iFire Technology Inc. | Method of laser ablation for patterning thin film layers for electroluminescent displays |
US6582875B1 (en) | 2002-01-23 | 2003-06-24 | Eastman Kodak Company | Using a multichannel linear laser light beam in making OLED devices by thermal transfer |
KR20030095313A (ko) * | 2002-06-07 | 2003-12-18 | 후지 샤신 필름 가부시기가이샤 | 레이저 어닐링장치 및 레이저 박막형성장치 |
-
2004
- 2004-09-23 KR KR20040076668A patent/KR100731729B1/ko active IP Right Grant
- 2004-12-27 JP JP2004377998A patent/JP4414330B2/ja active Active
- 2004-12-27 US US11/020,660 patent/US8617329B2/en active Active
- 2004-12-30 EP EP20040090521 patent/EP1640107B1/en active Active
- 2004-12-30 DE DE200460013007 patent/DE602004013007T2/de active Active
- 2004-12-31 CN CN2004100997558A patent/CN1753585B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US8617329B2 (en) | 2013-12-31 |
KR20060027744A (ko) | 2006-03-28 |
EP1640107B1 (en) | 2008-04-09 |
CN1753585A (zh) | 2006-03-29 |
DE602004013007T2 (de) | 2009-05-28 |
US20060060297A1 (en) | 2006-03-23 |
DE602004013007D1 (de) | 2008-05-21 |
KR100731729B1 (ko) | 2007-06-22 |
CN1753585B (zh) | 2010-11-10 |
JP2006093081A (ja) | 2006-04-06 |
EP1640107A1 (en) | 2006-03-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7744770B2 (en) | Device transfer method | |
TWI575332B (zh) | 微影裝置、圖案化器件及微影方法 | |
JP4400888B2 (ja) | レーザ照射装置及びレーザ熱転写法 | |
US8390917B1 (en) | Multiple line single-pass imaging using spatial light modulator and anamorphic projection optics | |
KR100342653B1 (ko) | 유기 전계발광소자의 제조 방법 | |
US20120104284A1 (en) | Patterning device for generating a pattern in and/or on a layer | |
JP2006093127A (ja) | 有機電界発光素子の製造方法 | |
JP4414330B2 (ja) | 有機エレクトロルミネッセンス素子の製造方法 | |
KR100989130B1 (ko) | 레이저 조사 장치 및 그를 이용한 유기전계발광표시장치의 제조 방법 | |
US6507355B2 (en) | Image recording apparatus | |
JP2006319140A (ja) | 露光方法、および露光装置 | |
JP4404005B2 (ja) | 液滴吐出装置、パターン形成方法、電気光学装置の製造方法 | |
KR100666567B1 (ko) | 레이저 열전사 장치, 레이저 열전사 방법, 및 그를 이용한유기전계발광표시장치의 제조방법 | |
CN104272192A (zh) | 用于改变多个辐射束的性质的组件、光刻仪器、改变多个辐射束的性质的方法以及器件制造方法 | |
KR100590263B1 (ko) | 레이저 열전사 장치와 그를 이용한유기전계발광표시장치의 제조방법 | |
KR100848340B1 (ko) | 레이저 조사 장치 및 그를 이용한 유기전계발광표시장치의제조 방법 | |
US9823576B2 (en) | Radiation modulator for a lithography apparatus, a lithography apparatus, a method of modulating radiation for use in lithography, and a device manufacturing method | |
Yi et al. | Study of optimal laser beam profile for laser induced thermal printing of organic film | |
JP4632103B2 (ja) | フォトマスク |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080407 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20081208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090225 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090421 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090717 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090908 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090928 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20091020 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091119 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121127 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4414330 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121127 Year of fee payment: 3 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121127 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131127 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |