JP4393063B2 - 複合パターンのための位相シフトマスキング - Google Patents
複合パターンのための位相シフトマスキング Download PDFInfo
- Publication number
- JP4393063B2 JP4393063B2 JP2002508143A JP2002508143A JP4393063B2 JP 4393063 B2 JP4393063 B2 JP 4393063B2 JP 2002508143 A JP2002508143 A JP 2002508143A JP 2002508143 A JP2002508143 A JP 2002508143A JP 4393063 B2 JP4393063 B2 JP 4393063B2
- Authority
- JP
- Japan
- Prior art keywords
- phase shift
- phase
- region
- feature
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000010363 phase shift Effects 0.000 title claims abstract description 252
- 230000000873 masking effect Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 74
- 230000000295 complement effect Effects 0.000 claims abstract description 17
- 230000007704 transition Effects 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 5
- 238000012986 modification Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 16
- 238000012937 correction Methods 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 11
- 238000013507 mapping Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000002131 composite material Substances 0.000 description 11
- 238000004088 simulation Methods 0.000 description 11
- 238000013459 approach Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000002159 abnormal effect Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 241000251131 Sphyrna Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000010420 art technique Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000012925 reference material Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/29—Rim PSM or outrigger PSM; Preparation thereof
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Steroid Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21593800P | 2000-07-05 | 2000-07-05 | |
| US09/669,359 US6503666B1 (en) | 2000-07-05 | 2000-09-26 | Phase shift masking for complex patterns |
| PCT/US2000/042284 WO2002003140A1 (en) | 2000-07-05 | 2000-11-28 | Phase shift masking for complex patterns |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004502971A JP2004502971A (ja) | 2004-01-29 |
| JP2004502971A5 JP2004502971A5 (cg-RX-API-DMAC7.html) | 2005-12-22 |
| JP4393063B2 true JP4393063B2 (ja) | 2010-01-06 |
Family
ID=26910506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002508143A Expired - Lifetime JP4393063B2 (ja) | 2000-07-05 | 2000-11-28 | 複合パターンのための位相シフトマスキング |
Country Status (6)
| Country | Link |
|---|---|
| EP (2) | EP1299771B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4393063B2 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1218217C (cg-RX-API-DMAC7.html) |
| AT (1) | ATE502321T1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU2001239698A1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE60045744D1 (cg-RX-API-DMAC7.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7858450B2 (en) * | 2004-01-06 | 2010-12-28 | Samsung Electronics Co., Ltd. | Optic mask and manufacturing method of thin film transistor array panel using the same |
| KR100586549B1 (ko) * | 2004-12-02 | 2006-06-08 | 주식회사 하이닉스반도체 | 포토 마스크 및 이를 이용한 패턴 제조 방법 |
| KR100675882B1 (ko) * | 2004-12-22 | 2007-02-02 | 주식회사 하이닉스반도체 | 다중투과 위상 마스크 및 이를 이용한 노광 방법 |
| US8065638B2 (en) * | 2009-01-30 | 2011-11-22 | Synopsys, Inc. | Incremental concurrent processing for efficient computation of high-volume layout data |
| WO2011051791A2 (en) | 2009-10-30 | 2011-05-05 | Synopsys, Inc. | Method and system for lithography hotspot correction of a post-route layout |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5589305A (en) * | 1990-11-29 | 1996-12-31 | Kabushiki Kaisha Toshiba | Method of fabricating a reticle |
| US5246800A (en) | 1991-09-12 | 1993-09-21 | Etec Systems, Inc. | Discrete phase shift mask writing |
| DE69328220T2 (de) | 1992-09-01 | 2000-08-24 | Dai Nippon Printing Co., Ltd. | Verfahren zur Herstellung einer Phasenschiebermaske oder eines Phasenschiebermasken-Rohlings |
| US5362584A (en) * | 1993-04-02 | 1994-11-08 | International Business Machines Corporation | Phase-shifting transparent lithographic mask for writing contiguous structures from noncontiguous mask areas |
| US5496666A (en) * | 1994-10-27 | 1996-03-05 | Chartered Semiconductor Manufacturing Pte Ltd. | Contact hole mask for semiconductor fabrication |
| US5472814A (en) | 1994-11-17 | 1995-12-05 | International Business Machines Corporation | Orthogonally separated phase shifted and unphase shifted mask patterns for image improvement |
| US5523186A (en) * | 1994-12-16 | 1996-06-04 | International Business Machines Corporation | Split and cover technique for phase shifting photolithography |
| JP2790127B2 (ja) * | 1996-06-27 | 1998-08-27 | 日本電気株式会社 | フォトマスク及びその製造方法 |
| US5858580A (en) | 1997-09-17 | 1999-01-12 | Numerical Technologies, Inc. | Phase shifting circuit manufacture method and apparatus |
| US5923566A (en) * | 1997-03-25 | 1999-07-13 | International Business Machines Corporation | Phase shifted design verification routine |
| US6057063A (en) | 1997-04-14 | 2000-05-02 | International Business Machines Corporation | Phase shifted mask design system, phase shifted mask and VLSI circuit devices manufactured therewith |
| JPH11109603A (ja) * | 1997-10-06 | 1999-04-23 | Mitsubishi Electric Corp | フォトマスクおよび半導体装置の製造方法 |
| US6096458A (en) | 1998-08-05 | 2000-08-01 | International Business Machines Corporation | Methods for manufacturing photolithography masks utilizing interfering beams of radiation |
-
2000
- 2000-11-28 EP EP00992248A patent/EP1299771B1/en not_active Expired - Lifetime
- 2000-11-28 CN CN008197296A patent/CN1218217C/zh not_active Expired - Fee Related
- 2000-11-28 JP JP2002508143A patent/JP4393063B2/ja not_active Expired - Lifetime
- 2000-11-28 EP EP11153593.6A patent/EP2322992B1/en not_active Expired - Lifetime
- 2000-11-28 AT AT00992248T patent/ATE502321T1/de not_active IP Right Cessation
- 2000-11-28 DE DE60045744T patent/DE60045744D1/de not_active Expired - Lifetime
- 2000-11-28 AU AU2001239698A patent/AU2001239698A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1218217C (zh) | 2005-09-07 |
| EP2322992B1 (en) | 2013-07-24 |
| EP2322992A1 (en) | 2011-05-18 |
| AU2001239698A1 (en) | 2002-01-14 |
| DE60045744D1 (de) | 2011-04-28 |
| ATE502321T1 (de) | 2011-04-15 |
| EP1299771A1 (en) | 2003-04-09 |
| EP1299771B1 (en) | 2011-03-16 |
| JP2004502971A (ja) | 2004-01-29 |
| CN1454332A (zh) | 2003-11-05 |
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