JP4392818B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP4392818B2
JP4392818B2 JP2000150601A JP2000150601A JP4392818B2 JP 4392818 B2 JP4392818 B2 JP 4392818B2 JP 2000150601 A JP2000150601 A JP 2000150601A JP 2000150601 A JP2000150601 A JP 2000150601A JP 4392818 B2 JP4392818 B2 JP 4392818B2
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JP
Japan
Prior art keywords
plate
polishing
top plate
fluid
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000150601A
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English (en)
Japanese (ja)
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JP2001293652A5 (enExample
JP2001293652A (ja
Inventor
昭二 斎藤
稔 津久井
浩二 源田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamai Co Ltd
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Hamai Co Ltd
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Publication date
Application filed by Hamai Co Ltd filed Critical Hamai Co Ltd
Priority to JP2000150601A priority Critical patent/JP4392818B2/ja
Publication of JP2001293652A publication Critical patent/JP2001293652A/ja
Publication of JP2001293652A5 publication Critical patent/JP2001293652A5/ja
Application granted granted Critical
Publication of JP4392818B2 publication Critical patent/JP4392818B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2000150601A 2000-04-14 2000-04-14 研磨装置 Expired - Fee Related JP4392818B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000150601A JP4392818B2 (ja) 2000-04-14 2000-04-14 研磨装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000150601A JP4392818B2 (ja) 2000-04-14 2000-04-14 研磨装置

Publications (3)

Publication Number Publication Date
JP2001293652A JP2001293652A (ja) 2001-10-23
JP2001293652A5 JP2001293652A5 (enExample) 2006-10-26
JP4392818B2 true JP4392818B2 (ja) 2010-01-06

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ID=18656281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000150601A Expired - Fee Related JP4392818B2 (ja) 2000-04-14 2000-04-14 研磨装置

Country Status (1)

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JP (1) JP4392818B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1310739C (zh) * 2002-09-06 2007-04-18 大连淡宁实业发展有限公司 钒酸钇单晶片的批量加工工艺
JP2006175534A (ja) * 2004-12-21 2006-07-06 Nippon Quality Links Kk 研磨方法及び研磨装置
US7618306B2 (en) 2005-09-22 2009-11-17 3M Innovative Properties Company Conformable abrasive articles and methods of making and using the same
CN113910004B (zh) * 2021-06-16 2024-11-19 徐德富 一种新型光学加压无研具抛光装置
CN114193253B (zh) * 2021-12-16 2022-08-16 长春财经学院 一种基于人工智能的电路板研磨装置

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Publication number Publication date
JP2001293652A (ja) 2001-10-23

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