JP4391126B2 - 発光装置の作製方法 - Google Patents
発光装置の作製方法 Download PDFInfo
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- JP4391126B2 JP4391126B2 JP2003137169A JP2003137169A JP4391126B2 JP 4391126 B2 JP4391126 B2 JP 4391126B2 JP 2003137169 A JP2003137169 A JP 2003137169A JP 2003137169 A JP2003137169 A JP 2003137169A JP 4391126 B2 JP4391126 B2 JP 4391126B2
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- electrode
- insulating film
- film
- light
- interlayer insulating
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- 238000000034 method Methods 0.000 title claims description 109
- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000010408 film Substances 0.000 claims description 518
- 239000010410 layer Substances 0.000 claims description 229
- 239000011229 interlayer Substances 0.000 claims description 166
- 150000002894 organic compounds Chemical class 0.000 claims description 90
- 238000005530 etching Methods 0.000 claims description 86
- 239000012212 insulator Substances 0.000 claims description 81
- 239000010409 thin film Substances 0.000 claims description 50
- 229910052751 metal Inorganic materials 0.000 claims description 47
- 239000002184 metal Substances 0.000 claims description 46
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000012535 impurity Substances 0.000 description 103
- 239000000758 substrate Substances 0.000 description 69
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 55
- 229910052710 silicon Inorganic materials 0.000 description 55
- 239000010703 silicon Substances 0.000 description 55
- 239000000463 material Substances 0.000 description 54
- 239000004065 semiconductor Substances 0.000 description 48
- 239000011347 resin Substances 0.000 description 34
- 229920005989 resin Polymers 0.000 description 34
- 230000008569 process Effects 0.000 description 32
- 239000007789 gas Substances 0.000 description 30
- 229910052581 Si3N4 Inorganic materials 0.000 description 29
- 230000015572 biosynthetic process Effects 0.000 description 29
- 238000010438 heat treatment Methods 0.000 description 29
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 29
- 229910010272 inorganic material Inorganic materials 0.000 description 27
- 239000011147 inorganic material Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 24
- 239000000956 alloy Substances 0.000 description 22
- 229910052760 oxygen Inorganic materials 0.000 description 22
- 238000004544 sputter deposition Methods 0.000 description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 238000005984 hydrogenation reaction Methods 0.000 description 20
- 239000004642 Polyimide Substances 0.000 description 19
- 229910045601 alloy Inorganic materials 0.000 description 19
- 229910052782 aluminium Inorganic materials 0.000 description 19
- 229920001721 polyimide Polymers 0.000 description 19
- 239000011368 organic material Substances 0.000 description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- 239000011159 matrix material Substances 0.000 description 17
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 239000004925 Acrylic resin Substances 0.000 description 15
- 229920000178 Acrylic resin Polymers 0.000 description 15
- 238000002425 crystallisation Methods 0.000 description 15
- 229910052739 hydrogen Inorganic materials 0.000 description 15
- 238000007789 sealing Methods 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 14
- 239000000460 chlorine Substances 0.000 description 14
- 229910052814 silicon oxide Inorganic materials 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 230000008025 crystallization Effects 0.000 description 13
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 12
- 229910052721 tungsten Inorganic materials 0.000 description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
- 239000002585 base Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 11
- 239000002356 single layer Substances 0.000 description 11
- 238000007740 vapor deposition Methods 0.000 description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 10
- 239000004952 Polyamide Substances 0.000 description 10
- 230000004888 barrier function Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 10
- 229920002647 polyamide Polymers 0.000 description 10
- 229910052718 tin Inorganic materials 0.000 description 10
- 239000011135 tin Substances 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 150000001408 amides Chemical class 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 9
- 238000000059 patterning Methods 0.000 description 9
- 239000011574 phosphorus Substances 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229940126062 Compound A Drugs 0.000 description 8
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 8
- 238000005247 gettering Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 239000012298 atmosphere Substances 0.000 description 7
- 239000000975 dye Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 6
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000000565 sealant Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 239000011787 zinc oxide Substances 0.000 description 6
- YLYPIBBGWLKELC-UHFFFAOYSA-N 4-(dicyanomethylene)-2-methyl-6-(4-(dimethylamino)styryl)-4H-pyran Chemical compound C1=CC(N(C)C)=CC=C1C=CC1=CC(=C(C#N)C#N)C=C(C)O1 YLYPIBBGWLKELC-UHFFFAOYSA-N 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- VOFUROIFQGPCGE-UHFFFAOYSA-N nile red Chemical compound C1=CC=C2C3=NC4=CC=C(N(CC)CC)C=C4OC3=CC(=O)C2=C1 VOFUROIFQGPCGE-UHFFFAOYSA-N 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010937 tungsten Substances 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 150000005072 1,3,4-oxadiazoles Chemical class 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 238000010549 co-Evaporation Methods 0.000 description 4
- VBVAVBCYMYWNOU-UHFFFAOYSA-N coumarin 6 Chemical compound C1=CC=C2SC(C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=NC2=C1 VBVAVBCYMYWNOU-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 230000005281 excited state Effects 0.000 description 4
- 238000009616 inductively coupled plasma Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 4
- 229910017073 AlLi Inorganic materials 0.000 description 3
- 229910017911 MgIn Inorganic materials 0.000 description 3
- 229910000676 Si alloy Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 238000001994 activation Methods 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 125000005605 benzo group Chemical group 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000005283 ground state Effects 0.000 description 3
- 238000005499 laser crystallization Methods 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- -1 tungsten nitride Chemical class 0.000 description 3
- KLCLIOISYBHYDZ-UHFFFAOYSA-N 1,4,4-triphenylbuta-1,3-dienylbenzene Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)=CC=C(C=1C=CC=CC=1)C1=CC=CC=C1 KLCLIOISYBHYDZ-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910004261 CaF 2 Inorganic materials 0.000 description 2
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 2
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011152 fibreglass Substances 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002620 polyvinyl fluoride Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910052727 yttrium Inorganic materials 0.000 description 2
- OYQCBJZGELKKPM-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O-2].[Zn+2].[O-2].[In+3] OYQCBJZGELKKPM-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 229910018575 Al—Ti Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 229910019794 NbN Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- 229910008812 WSi Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000005224 laser annealing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- AIYYMMQIMJOTBM-UHFFFAOYSA-L nickel(ii) acetate Chemical compound [Ni+2].CC([O-])=O.CC([O-])=O AIYYMMQIMJOTBM-UHFFFAOYSA-L 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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JP2003137169A JP4391126B2 (ja) | 2002-05-15 | 2003-05-15 | 発光装置の作製方法 |
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JP2002139934 | 2002-05-15 | ||
JP2003137169A JP4391126B2 (ja) | 2002-05-15 | 2003-05-15 | 発光装置の作製方法 |
Publications (3)
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JP2004047446A JP2004047446A (ja) | 2004-02-12 |
JP2004047446A5 JP2004047446A5 (enrdf_load_stackoverflow) | 2006-06-01 |
JP4391126B2 true JP4391126B2 (ja) | 2009-12-24 |
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JP2003137169A Expired - Fee Related JP4391126B2 (ja) | 2002-05-15 | 2003-05-15 | 発光装置の作製方法 |
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Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7619258B2 (en) * | 2004-03-16 | 2009-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US8217396B2 (en) | 2004-07-30 | 2012-07-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device comprising electrode layer contacting wiring in the connection region and extending to pixel region |
JP5072202B2 (ja) * | 2004-07-30 | 2012-11-14 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
JP2006114493A (ja) * | 2004-09-17 | 2006-04-27 | Semiconductor Energy Lab Co Ltd | 発光装置 |
US7791270B2 (en) | 2004-09-17 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd | Light-emitting device with reduced deterioration of periphery |
US8772783B2 (en) | 2004-10-14 | 2014-07-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP4954527B2 (ja) * | 2004-10-14 | 2012-06-20 | 株式会社半導体エネルギー研究所 | 表示装置の作製方法 |
KR101054344B1 (ko) | 2004-11-17 | 2011-08-04 | 삼성전자주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
US8030643B2 (en) | 2005-03-28 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method the same |
EP1760776B1 (en) * | 2005-08-31 | 2019-12-25 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method for semiconductor device with flexible substrate |
JP4954088B2 (ja) * | 2005-12-05 | 2012-06-13 | シャープ株式会社 | 有機エレクトロルミネセンスパネル及び有機エレクトロルミネセンス表示装置 |
JP5046521B2 (ja) | 2006-01-18 | 2012-10-10 | 株式会社半導体エネルギー研究所 | 発光装置 |
US7968382B2 (en) | 2007-02-02 | 2011-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
KR101041146B1 (ko) * | 2009-09-02 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 표시 장치 |
DE102010050507A1 (de) * | 2010-11-08 | 2012-05-24 | H.C. Starck Clevios Gmbh | Verfahren zur Herstellung von Schichtkörpern durch Behandlung mit organischen Ätzmitteln und daraus erhältliche Schichtkörper |
JP6476449B2 (ja) * | 2014-12-16 | 2019-03-06 | 株式会社Joled | 表示パネル、および表示パネルの製造方法 |
JP6906363B2 (ja) * | 2017-05-16 | 2021-07-21 | 株式会社ジャパンディスプレイ | 表示装置 |
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JPH0527996U (ja) * | 1991-09-18 | 1993-04-09 | 沖電気工業株式会社 | Elデイスプレイ素子 |
JP3463971B2 (ja) * | 1996-12-26 | 2003-11-05 | 出光興産株式会社 | 有機アクティブel発光装置 |
JP4730994B2 (ja) * | 1999-06-04 | 2011-07-20 | 株式会社半導体エネルギー研究所 | 電気光学装置及びその作製方法並びに電子装置 |
JP4337171B2 (ja) * | 1999-06-14 | 2009-09-30 | ソニー株式会社 | 表示装置 |
JP2001351787A (ja) * | 2000-06-07 | 2001-12-21 | Sharp Corp | 有機led素子とその製造方法および有機ledディスプレイ |
JP2002083689A (ja) * | 2000-06-29 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | 発光装置 |
JP4884609B2 (ja) * | 2000-08-10 | 2012-02-29 | 株式会社半導体エネルギー研究所 | 表示装置及びその駆動方法、並びに電子機器 |
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