JP4383278B2 - パワーic用配線基板 - Google Patents
パワーic用配線基板 Download PDFInfo
- Publication number
- JP4383278B2 JP4383278B2 JP2004217303A JP2004217303A JP4383278B2 JP 4383278 B2 JP4383278 B2 JP 4383278B2 JP 2004217303 A JP2004217303 A JP 2004217303A JP 2004217303 A JP2004217303 A JP 2004217303A JP 4383278 B2 JP4383278 B2 JP 4383278B2
- Authority
- JP
- Japan
- Prior art keywords
- voltage side
- wiring board
- wiring
- pattern
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
110 制御部
111 入出力回路
112 論理・保護回路
113,114 レベルシフト用MOS回路
115 出力段バッファ回路
2 ドライバIC
210 高圧側ICチップ
213n 高圧側出力段バッファnMOSチップ
213p 高圧側出力段バッファpMOSチップ
220 低圧側ICチップ
223n 低圧側出力段バッファnMOSチップ
223p 低圧側出力段バッファpMOSチップ
230 レベルシフト用MOSチップ
24 配線基板
241H,241L 配線導体
242 貫通ビア配線
243 配線層
245 高誘電率層
25,25’ 接続材料
26 ワイヤ
27 ボンディングパッド
271 ゲートまたはソースワイヤパッドパターン(低圧パターン)
272 チップ搭載パターン(高圧パターン)
273 イオントラップ用埋設配線
274 容量
275 金属イオン
276 電界
277 溝
28 出力端子
29 封止材料
Claims (4)
- 高圧側回路を構成する高圧側パターンと低圧側回路を構成する低圧側パターンとを表面に形成した配線基板と、
配線基板の高圧側パターンと低圧側パターンの中間の前記配線基板中に埋設したイオントラップ用配線を備え、該イオントラップ用配線上の配線基板表面には溝を設けたことを特徴とするパワーIC用配線基板。 - 請求項1記載の配線基板において、
高圧側パターンには高圧側回路を構成するベアチップの裏面電極を固着し、低圧側パターンには前記ベアチップの表面電極をワイヤを介して接続したことを特徴とするパワーIC用配線基板。 - 請求項1記載の配線基板において、
イオントラップ用配線には、低圧側パターンに印加する電位以下の電位を付与することを特徴とするパワーIC用配線基板。 - 請求項1記載の配線基板において、
イオントラップ用配線上の配線基板内には高誘電率層を設けたことを特徴とするパワーIC用配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004217303A JP4383278B2 (ja) | 2004-07-26 | 2004-07-26 | パワーic用配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004217303A JP4383278B2 (ja) | 2004-07-26 | 2004-07-26 | パワーic用配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006041100A JP2006041100A (ja) | 2006-02-09 |
JP4383278B2 true JP4383278B2 (ja) | 2009-12-16 |
Family
ID=35905791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004217303A Expired - Fee Related JP4383278B2 (ja) | 2004-07-26 | 2004-07-26 | パワーic用配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4383278B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5364338B2 (ja) * | 2008-11-07 | 2013-12-11 | ローム株式会社 | 半導体装置 |
-
2004
- 2004-07-26 JP JP2004217303A patent/JP4383278B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006041100A (ja) | 2006-02-09 |
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