JP4372709B2 - Inspection device - Google Patents

Description

  The present invention relates to an inspection apparatus for inspecting the printing state of solder paste or the state of solder bumps printed on an electrode pattern of a printed circuit board.

  In general, when an electronic component is mounted on a printed board, first, cream solder is printed on a predetermined electrode pattern provided on the printed board. Next, the electronic component is temporarily fixed on the printed circuit board based on the viscosity of the cream solder. Thereafter, the printed circuit board is guided to a reflow furnace, and soldering is performed through a predetermined reflow process.

  In the middle of such a process, a solder inspection apparatus is incorporated, and the printing state of the cream solder, such as printing misalignment, print bleeding, and print fading, is inspected prior to temporary fixing of electronic components. In such inspection, an image processing technique is used, and information such as volume value, area value, and height of cream solder on the electrode pattern is acquired.

  And, for example, in order to specify the printing defect location of the cream solder on the printed circuit board, or to determine whether the determination of the printing defect is appropriate, for example, an operation of confirming the inspection result by the solder inspection apparatus is performed. Has been made.

  However, when the inspection result is represented by a numerical value or a graph, it is difficult to instantly imagine the shape of the cream solder, and the confirmation work takes time.

  Therefore, as a technique for solving this, it is conceivable to display the inspection result as an image indicating the printing state.

For example, a technique for enlarging and displaying a three-dimensional image for a selected part is known (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 11-287627

  Creating a 3D model from the inspection results of the solder inspection device described above and displaying the print state as a 3D image is an effective means, but there are irregularities on the solder printing surface, so the viewpoint is fixed For example, when the convex part comes to the front, a hidden part is generated, and a part that cannot be confirmed is generated. Of course, if the 3D model can be rotated and viewed so that it can be seen from any direction, there will be no part that cannot be confirmed, but the confirmation operation will take a very long time.

  This problem also applies to the inspection of solder bumps.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to facilitate the confirmation of the inspection result by the inspection apparatus and to reduce the time required for the confirmation operation.

  In the following, each means suitable for solving the above-mentioned purpose will be described in terms of items. In addition, the effect etc. peculiar to the means to respond | correspond as needed are added.

Means 1. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
A three-dimensional image showing a three-dimensional shape of the measurement object based on a measurement value by the three-dimensional calculation means is displayed on a display screen of a display means, and two-dimensional of the measurement object based on an image pickup by the second imaging means Display control means for displaying a real image on the display screen of the display means;
An inspection apparatus comprising:

  In the inspection apparatus described in the means 1, the three-dimensional measurement irradiation unit irradiates the measurement target with light for three-dimensional measurement, and the first imaging unit performs imaging based on the irradiation light. Based on this imaging, the three-dimensional calculation means performs three-dimensional measurement of the measurement object, and the measurement object is inspected by the inspection means.

  Note that the measurement object may be cream solder printed on a printed circuit board. Alternatively, it may be a solder bump. In addition, it is conceivable to employ an arbitrary measurement method such as a phase shift method, a light section method, a spatial code method, or a focusing method for three-dimensional measurement. The same applies to the following means.

  In addition to such a basic configuration, the inspection apparatus further includes a two-dimensional imaging irradiation unit, a second imaging unit, and a display control unit.

  Here, the irradiation means for two-dimensional imaging irradiates the measurement object with light for two-dimensional imaging, and the second imaging means performs imaging from above the measurement object based on the irradiation light.

  The display control means displays a three-dimensional image showing the three-dimensional shape of the measurement object based on the measurement value obtained by the three-dimensional calculation means on the display screen of the display means, and also measures the measurement object based on the imaging by the second imaging means. Are displayed on the display screen of the display means.

  According to such a configuration, since the three-dimensional image indicating the three-dimensional shape of the measurement object is displayed, the shape of the measurement object can be grasped instantaneously. In addition, since a 2D actual image obtained by imaging the measurement object from above is displayed together with the 3D image, even if a portion that cannot be confirmed in the 3D image due to the unevenness of the measurement object occurs, The shape can be estimated and confirmed. As a result, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced.

  The display means may be provided in the inspection apparatus itself, or may be provided outside the inspection apparatus.

Mean 2. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from directly above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
Two-dimensional data storage means for storing a two-dimensional real image of the measurement object as two-dimensional data based on imaging by the second imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. And a display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data.

  The basic configuration of the inspection apparatus described in the means 2 is the same as that of the inspection apparatus described in the means 1. That is, the irradiation means for three-dimensional measurement irradiates the measurement object with light for three-dimensional measurement, and the first imaging means performs imaging based on the irradiation light. Based on this imaging, the three-dimensional calculation means performs three-dimensional measurement of the measurement object, and the measurement object is inspected by the inspection means.

  In addition to such a basic configuration, the inspection apparatus further includes three-dimensional data storage means, two-dimensional imaging irradiation means, second imaging means, two-dimensional data storage means, display means, and display control means. .

  The three-dimensional data storage means stores three-dimensional data that can specify the three-dimensional shape of the measurement object. This three-dimensional data is stored based on the measurement value by the three-dimensional calculation means.

  In addition to the configuration for storing such three-dimensional data, the means 2 has a configuration for storing two-dimensional data. That is, the two-dimensional imaging irradiation unit irradiates the measurement target with light for two-dimensional imaging, and the second imaging unit performs imaging from directly above the measurement target based on the irradiation light. Based on the imaging by the second imaging means, a two-dimensional actual image of the measurement object is stored in the two-dimensional data storage means as two-dimensional data.

  The display control means displays a three-dimensional image showing the three-dimensional shape of the measurement object on the display screen of the display means on the basis of the three-dimensional data stored in the three-dimensional data storage means, and the two-dimensional data storage means The two-dimensional real image of the measurement object is displayed on the display screen of the display means based on the two-dimensional data stored in. Here, the display means is embodied as a display device, for example.

  According to such a configuration, since the three-dimensional image indicating the three-dimensional shape of the measurement object is displayed, the shape of the measurement object can be grasped instantaneously. In addition, since a 2D actual image obtained by imaging the measurement object from above is displayed together with the 3D image, even if a portion that cannot be confirmed in the 3D image due to the unevenness of the measurement object occurs, It is possible to estimate and confirm the shape of the. As a result, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced. Further, since the data is stored (accumulated) in the three-dimensional data storage means and the two-dimensional data storage means, there is also an advantage that the inspection results made in the past can be confirmed at any time.

Means 3. In the inspection apparatus according to means 1 or 2,
The inspection apparatus, wherein the first imaging unit and the second imaging unit are configured by a single imaging unit.

  According to the means 3, since the first image pickup means and the second image pickup means described above are configured by a single image pickup means, the image pickup mechanism can be simplified compared to a configuration in which an image pickup mechanism is newly added to the inspection apparatus. This can reduce the cost of the inspection apparatus. If a single imaging means is used, image data obtained by imaging can be handled in the same coordinate system, and processing such as coordinate conversion is not required for display. As a result, the control content can be significantly simplified.

  In addition, when using a single imaging unit, the following configuration may be employed.

Means 4. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Imaging that performs imaging for three-dimensional measurement based on irradiation light from the irradiation means for three-dimensional measurement, and performs imaging from directly above the measurement object based on irradiation light from the irradiation means for two-dimensional imaging Means,
Switching between irradiation by the irradiation means for three-dimensional measurement and irradiation by the irradiation means for two-dimensional imaging, and switching means for switching processing based on imaging by the imaging means in accordance with switching of the irradiation means,
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging for three-dimensional measurement by the imaging means;
Inspection means for inspecting the measurement object based on the measurement value by the three-dimensional calculation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional data storage means for storing, as two-dimensional data, a two-dimensional real image of the measurement object based on imaging by the imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. And a display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data.

  In the means 4, imaging for three-dimensional measurement is performed by a single imaging means based on the irradiation light from the irradiation means for three-dimensional measurement, and the measurement object is based on the irradiation light from the irradiation means for two-dimensional imaging. Imaging is performed from directly above. And here, the switching means switches between irradiation by the irradiation means for three-dimensional measurement and irradiation by the irradiation means for two-dimensional imaging, and processing based on imaging by the imaging means is switched in accordance with switching of the irradiation means. It is done. By providing such a switching means, for example, in comparison with a configuration in which it is determined whether the imaging by the imaging means is for three-dimensional measurement or a two-dimensional real image and post-processing is performed, the determination processing is not necessary. Data processing after imaging is simplified.

Means 5. In the inspection apparatus according to any one of means 1 to 4,
An inspection result storage means for storing an inspection result by the inspection means;
The display control means is further configured to display the inspection result stored in the inspection result storage means on the display screen of the display means.

  In the means 5, the display control means can further display the inspection result stored in the inspection result storage means on the display screen of the display means. Here, the inspection result includes a determination result of good / bad and a three-dimensional measurement result for determination. In this way, since the shape of the measurement object can be grasped, for example, as a measurement value or the like, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced.

Means 6. In the inspection apparatus according to any one of means 1 to 5,
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device.

  The means 6 can display a three-dimensional image of the measurement object as viewed from an arbitrarily set direction based on the measurement value obtained by the three-dimensional calculation means as the above-described three-dimensional image. If such a stereoscopic image is displayed, there is a high possibility that the shape of the measurement object can be grasped instantaneously in combination with the display of the two-dimensional real image. As a result, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced.

Mean 7 In the inspection apparatus according to any one of means 1 to 6,
The display control means is configured to be able to display a planar image of the measurement object showing height information as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Inspection device to do.

  The means 7 can display a planar image of the measurement object on which the height information is shown based on the measurement value obtained by the three-dimensional calculation means as the above-described three-dimensional image. If such a planar image is displayed, there is a high possibility that the shape of the measurement object can be grasped instantaneously in combination with the display of the two-dimensional real image. As a result, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced. The height information may be indicated by contour lines, color classification of height sections, or the like.

Means 8. In the inspection apparatus according to any one of means 1 to 7,
The inspection apparatus, wherein the display control means is configured to be able to display a cut surface in the height direction of the measurement object based on a measurement value obtained by the three-dimensional calculation means.

  According to the means 8, since the cut surface in the height direction of the measurement object can be displayed, it is more likely that the shape of the measurement object can be grasped instantaneously in combination with the display of the two-dimensional real image. . As a result, the inspection result can be easily confirmed by the inspection apparatus, and the time required for the confirmation work can be reduced.

  In addition, in order to make it easy to understand which part of the measurement object the cut surface to be displayed is, the configuration capable of displaying the two-dimensional real image or the flat image corresponds to the flat image. The cut surface may be displayed in such a manner that the cut surface is a predetermined line that is displayed superimposed on the three-dimensional real image or the planar image. At this time, although there is no height information in the data of the two-dimensional real image, it is possible to display a cut surface in the height direction corresponding to the two-dimensional real image by using the measurement value by the three-dimensional calculation means. It becomes possible.

Means 9. In the inspection apparatus according to any one of means 1 to 8,
Only for the measurement object that has been determined to be defective by the inspection means, the two-dimensional data is stored in the two-dimensional data storage means, and the three-dimensional data is stored in the three-dimensional data storage means. And
The inspection apparatus, wherein the display control means is configured to be able to display the two-dimensional real image together with the three-dimensional image only for a measurement object that has been determined to be defective by the inspection means.

  The means 9 can display a two-dimensional image together with the three-dimensional image for the measurement object that has been determined to be defective by the inspection means. This is based on the technical idea that it is often necessary to check the inspection result when a defect is determined. According to the means 9, only for the measurement object that has been determined to be defective by the inspection means, the two-dimensional data is stored in the two-dimensional data storage means, and the three-dimensional data is stored in the three-dimensional data storage means. As a result, it is possible to avoid a situation in which the storage capacity of the two-dimensional data storage means and the three-dimensional data storage means becomes enormous.

Means 10. In the inspection apparatus according to any one of means 1 to 9,
An inspection unit comprising at least the irradiation means for three-dimensional measurement, the first imaging means, the three-dimensional calculation means, and the inspection means;
An inspection apparatus configured as a separate body from the inspection unit and comprising a result confirmation unit including at least the display control means.

  In the means 10, the inspection apparatus is configured separately from the inspection unit including at least the three-dimensional measurement irradiation means, the first imaging means, the three-dimensional calculation means, and the inspection means, and at least the display control means. And a result confirmation unit. In this case, as for other means, the inspection unit may be provided, the result confirmation unit may be provided, or a unit different from these units may be provided. The inspection unit and the result confirmation unit are connected via, for example, a network. As described above, by realizing the inspection function and the result confirmation function in separate units, the result can be confirmed at a place away from the inspection place. In addition, by using a control device different from the inspection for confirming the result, a configuration that does not interfere with the inspection, that is, a configuration in which the inspection result can be confirmed in parallel with the inspection can be obtained. Of course, both the inspection unit and the result confirmation unit may have a display control means. In this case, the result can be confirmed also in the inspection unit.

Means 11. In the inspection apparatus according to any one of means 1 to 10,
An input means for inputting information,
The display control means can display specific information for specifying the measurement object to be selected on the display means, and the measurement object is selected by the specific information via the input means. And an inspection apparatus configured to display the two-dimensional actual image in association with the three-dimensional image together with the three-dimensional image.

  According to the means 11, the specific information for specifying the measurement object to be selected can be displayed on the display means, and when the measurement object is selected by the specific information via the input means, the three-dimensional image At the same time, a two-dimensional actual image is displayed in correspondence with the three-dimensional image. For example, when the measurement object is cream solder printed on an electrode pattern on a printed circuit board, the specific information may be information on a pad on which cream solder is printed. If the measurement object can be selected based on the display on the display unit in this way, the measurement object to be displayed can be easily selected.

  It is also conceivable to display information on the measurement object itself as the specific information for specifying the measurement object.

Means 12. In the inspection apparatus according to means 11,
The display control means can display a setting frame set in accordance with the electrode pattern on the substrate. When the setting frame is selected via the input means, the display frame exists in the setting frame. An inspection apparatus configured to display specific information of a measurement object on the display means.

  As described above, when the measurement object is cream solder on a printed circuit board, there are a large number of pads on which cream solder is printed. In this respect, according to the means 12, it is possible to display a setting frame set in accordance with the electrode pattern on the substrate, and when the setting frame is selected via the input means, it exists in the setting frame. Specific information of the measurement object is displayed on the display means. Therefore, even when the number of measurement objects is enormous, selection of the measurement objects becomes easy.

  Hereinafter, an embodiment will be described with reference to the drawings.

  As shown in FIG. 1, the inspection apparatus 1 includes a base 2, and an X-axis moving mechanism 3 and a Y-axis moving mechanism 4 are provided on the base 2. A rail 10 is disposed on the Y-axis moving mechanism 4, and a printed board K as a board is placed on the rail 10. The printed circuit board K is moved in the X-axis direction and the Y-axis direction by operating the X-axis moving mechanism 3 and the Y-axis moving mechanism 4.

  The inspection apparatus 1 is also electrically connected to the irradiation means 5 for three-dimensional measurement, a CCD camera (for example, a color camera) 6 as “imaging means (first imaging means, second imaging means)”, and the CCD camera 6. Connected control means 7. The three-dimensional measurement irradiating means 5 is configured to irradiate a predetermined light pattern obliquely from above to the surface of the printed circuit board K in the three-dimensional measurement of cream solder. The CCD camera 6 is arranged right above the printed circuit board K, and can image the portion of the printed circuit board K irradiated with the light pattern.

  Then, the control means 7 performs image processing based on the image data of the printed circuit board K imaged by the CCD camera 6 (imaging based on the light pattern from the irradiation means 5 for 3D measurement), and first performs 2D measurement. (Mainly area measurement) is performed. Thereafter, an inspection relating to cream solder is performed based on the various values measured two-dimensionally. Next, three-dimensional measurement of cream solder (mainly height measurement and volume measurement) is performed by a three-dimensional measurement method. Thereafter, an inspection relating to cream solder is performed based on the various values measured three-dimensionally. Therefore, the control means 7 corresponds to “inspection means”. Although a detailed description is not given here, any measurement method such as a phase shift method, a light cutting method, a spatial code method, a focusing method, or the like is appropriately employed for the three-dimensional measurement in the present embodiment.

  Further, in the present embodiment, the printed circuit board K is imaged from directly above by the CCD camera 6 irrespective of the inspection. The image captured here corresponds to a “two-dimensional actual image”. As a configuration for obtaining a two-dimensional real image, a two-dimensional imaging irradiation means 11 is provided as shown in FIG. The two-dimensional imaging irradiation means 11 is composed of a ring light. That is, in obtaining a two-dimensional real image, the printed circuit board K (cream solder) is imaged by the CCD camera 6 based on the light irradiated from the irradiation means 11 for two-dimensional imaging. The wavelength of the light emitted from the irradiation means 11 for two-dimensional imaging is not particularly limited. However, irregular reflection is unlikely to occur in the region where the resist exists on the printed circuit board K, and the cream solder can be clearly imaged on the printed circuit board K. Select.

  Next, the electrical configuration of the inspection apparatus 1 centering on the control means 7 will be described.

  As shown in FIG. 2, the inspection apparatus 1 controls the imaging control unit 21, the three-dimensional measurement irradiation unit 5, and the two-dimensional imaging irradiation unit 11 that control the imaging timing of the CCD camera 6 and execute imaging. Irradiation control means 22, switching means 23 for switching between imaging for inspection and imaging for obtaining a two-dimensional actual image, X-axis movement control means 24 for controlling X-axis movement mechanism 3, and Y-axis movement mechanism 4 Y-axis movement control means 25 for controlling is provided.

  Here, the control means 7 is connected to the irradiation control means 22 via the switching means 23. Further, the switching unit 23 switches the irradiation units 5 and 11 to be employed based on a control signal from the control unit 7. The irradiation control unit 22 performs execution control of irradiation based on a control signal sent from the control unit 7 via the switching unit 23.

  Further, the control means 7 is connected to the imaging control means 21 via the switching means 23. The imaging control means 21 performs execution control of imaging by the CCD camera 6 based on a control signal sent from the control means 7 via the switching means 23. Here, the switching unit 23 switches the transmission destination of the image data output from the imaging control unit 21 in accordance with the irradiation units 5 and 11 to be employed based on the control signal from the control unit 7.

  Furthermore, the control means 7 is connected to the X-axis movement control means 22 and the Y-axis movement control means 23, and these X-axis movement control means 22 and Y-axis movement control means 23 are controlled by the control signal from the control means 7. Based on this, the X axis moving mechanism 3 and the Y axis moving mechanism 4 are appropriately driven and controlled. As a result, the printed circuit board K is appropriately moved in the X-axis direction and the Y-axis direction.

  In addition, the inspection apparatus 1 includes cream input soldering based on input means 26 constituted by a keyboard, a mouse, or a touch panel, display means 27 having a display screen such as a CRT or liquid crystal, and imaging for inspection such as three-dimensional measurement. 3D calculation means 28 for measuring the height and volume of the apparatus, inspection result storage means 29 for storing the inspection results, and 3D data storage means for storing the 3D data of the printed circuit board K obtained from the 3D measurement 30, a two-dimensional data storage means 31 for storing two-dimensional data (two-dimensional actual image data) of the printed circuit board K, and a transfer means 32 capable of transferring the three-dimensional data and the two-dimensional data to an external device. Yes. These means 26 to 32 are electrically connected to the control means 7.

  Next, the operation of the inspection apparatus 1 configured as described above will be described with a focus on the contents of control performed by the control means 7.

  The control means 7 controls the irradiation control means 22 via the switching means 23, and irradiates the printed circuit board K with a predetermined light pattern when the imaging for inspection is performed. . Further, when performing imaging for obtaining a two-dimensional real image, the two-dimensional imaging irradiation unit 11 irradiates the printed board K with imaging light. At the same time, the control means 7 controls the imaging control means 21 via the switching means 23, and takes in the image data from the CCD camera 6 into the three-dimensional calculation means 28 for imaging for inspection. Further, when capturing an image for obtaining a two-dimensional real image, the image data from the CCD camera 6 is taken into the two-dimensional data storage means 31. The control means 7 appropriately controls the drive of the X-axis movement mechanism 3 and the Y-axis movement mechanism 4 via the X-axis movement control means 22 and the Y-axis movement control means 23. Thereby, the predetermined area of the printed circuit board K is sequentially imaged.

  As described above, the control means 7 first performs two-dimensional measurement (mainly area measurement) based on imaging for inspection, and performs inspection regarding cream solder based on the various values measured two-dimensionally. Moreover, three-dimensional measurement (mainly height measurement and volume measurement) of the cream solder is performed by a three-dimensional measurement method, and an inspection relating to the cream solder is performed based on various values measured in three dimensions. Here, the three-dimensional calculation means 28 performs calculation processing for three-dimensional measurement. Then, when the various values of the two-dimensional measurement and the three-dimensional measurement do not satisfy the reference value, it is determined as a defective product. The printed circuit board K determined to be defective is discharged by a discharge mechanism (not shown), for example.

  In the present embodiment, the control means 7 stores the inspection result in the inspection result storage means 29 regardless of the determination of good / bad. In the present embodiment, three-dimensional model data indicating the three-dimensional shape of the cream solder is stored in the three-dimensional data storage unit 30 based on the measurement value obtained by the three-dimensional calculation unit 28. The three-dimensional model data is CAD data or the like that directly indicates the shape. Of course, any three-dimensional data that can specify the shape may be used. On the other hand, as described above, the data of the two-dimensional actual image is stored in the two-dimensional data storage unit 31.

  Based on the data stored in the three-dimensional data storage means 30 and the two-dimensional data storage means 31, the control means 7 can execute display processing. Next, the display process will be described based on the flowchart of FIG. 3 and the explanatory diagrams of FIGS. This display process is repeatedly executed by selecting and operating the “Measurement” button displayed on the display screen of the display means 27. The “measurement” button is selected via the input unit 26. For example, a configuration in which the “measurement” button is selected by a pointing device such as a mouse or a touch panel integrally formed with the display unit 27 is conceivable. .

  In the first step (hereinafter, steps are simply indicated by symbol S) 100, an image of the printed circuit board K is displayed. Specifically, as shown in FIG. 4, a window WL1 is displayed. This window WL1 is composed of small windows WS1, WS2 and WS3 divided into a plurality of windows. Then, an image (printed circuit board image) KG of the printed circuit board K prepared in advance is displayed in the upper left small window WS1. The image KG may be captured by the CCD camera 6 or may be captured by another imaging mechanism. Then, the control means 7 displays the setting frame 41 according to the electrode pattern of the printed board K. The above-described imaging by the CCD camera 6 is performed in units of the setting frame 41. In FIG. 4, the electrode pattern is omitted, and the setting frame 41 is also schematically shown.

  In continuing S110, it is judged whether the setting frame 41 was selected. The selection of the setting frame 41 is made via the input unit 26. However, as with the above-described “measurement” button selection, the setting frame 41 is selected by a pointing device such as a mouse, or is configured integrally with the display unit 27, for example. A configuration that can be selected with a touch panel is conceivable. Hereinafter, the same applies to the selection on the display screen. If it is determined that the setting frame 41 has been selected (S110: YES), an image corresponding to the setting frame 41 is displayed in S120. For example, as shown in FIG. 4, when the setting frame 41 indicated by the symbol a is selected, a two-dimensional image corresponding to the setting frame 41 is displayed in the small window WS2 below the small window WS1. This two-dimensional image is displayed based on the two-dimensional data stored in the two-dimensional data storage means 31. The description will be continued assuming that a plurality of pad portions 42 are included in this image. Thereafter, the process proceeds to S130. On the other hand, when it is determined that the setting frame 41 is not selected (S110: NO), the process of S120 is not executed and the process proceeds to S130.

  In S130, it is determined whether or not the pad portion 42 displayed in the small window WS2 has been selected. If it is determined that the pad part 42 has been selected (S130: YES), the image of the selected pad part 42 is enlarged and displayed in S140, and then the process proceeds to S150. In the example shown in FIG. 4, the pad portion 42 indicated by the symbol b is selected, and the enlarged image G2 of the pad portion 42 is displayed in the small window WS3 on the right side. In the enlarged image G2, printed cream solder 43 is shown inside the pad portion. The enlarged image G2 is an enlarged image of an image based on the two-dimensional data stored in the two-dimensional data storage means 31, and is a color plane image. On the other hand, if it is determined that the pad portion 42 has not been selected (S130: NO), the processing of S140 is not executed, and the routine proceeds to S150.

  In S150, it is determined whether or not the enlarged image G2 displayed in the small window WS3 is selected. If it is determined that the enlarged image G2 is selected (S150: YES), the process proceeds to S160. On the other hand, when it is determined that the enlarged image G2 is not selected (S150: NO), the subsequent processing is not executed and the present display processing is terminated.

  In S160, the enlarged image G2 is displayed in another window. Specifically, as shown in FIG. 5, a new window WL2 is displayed. The window WL2 includes small windows WS4, WS5, WS6, WS7, and WS8 divided into a plurality of windows. Then, an enlarged image G2 of the pad is displayed in the upper left small window WS4. This enlarged image G2 corresponds to a “two-dimensional actual image”. As described above, the enlarged image G2 is a color plane image.

  In subsequent S170, the three-dimensional image G3 is displayed. Specifically, as shown in FIG. 5, a three-dimensional image G3 showing a three-dimensional shape is displayed in a small window WS5 below the small window W4, for example, with a wire frame. This three-dimensional image G3 corresponds to a “stereoscopic image (three-dimensional image)”. The three-dimensional image G3 is displayed based on the three-dimensional data stored in the three-dimensional data storage means 30, and can be rotated and displayed so that it can be viewed from an arbitrary direction. In FIG. 5, this stereoscopic image is schematically illustrated in order to avoid complication.

  In the next S180, the three-dimensional planar image GH3 is displayed. Specifically, as shown in FIG. 5, a three-dimensional planar image GH3 in which height information is indicated by contour lines is displayed in a small window WS6 on the upper right. Although this image GH3 is a planar image, it includes height information and is displayed based on the three-dimensional data stored in the three-dimensional data storage means 30. This three-dimensional planar image GH3 corresponds to a “planar image (three-dimensional image)”. Here, the height information is shown by contour lines, but it is not particularly limited as long as it is a display showing the height information. For example, the height information may be indicated by color classification for each height section.

  In subsequent S190, a cross section is displayed. Specifically, as shown in FIG. 5, the cut surface indicated by the symbol A in the short direction of the three-dimensional planar image GH3 is displayed in the small window WS7 on the left side of the small window WS6. Further, the cut surface indicated by the symbol B in the longitudinal direction is displayed in the small window WS8 below the small window WS6.

  The control means 7 for executing such display processing corresponds to “display control means”.

  As described above in detail, according to the present embodiment, the three-dimensional model data indicating the three-dimensional shape of the cream solder is based on the measurement value by the three-dimensional calculation means 28 regardless of the good / bad determination. It is stored in the data storage means 30. On the other hand, as described above, the data of the two-dimensional actual image is stored in the two-dimensional data storage unit 31. Then, as shown in FIG. 5, an enlarged image G2 of the pad (cream solder) as a two-dimensional real image is displayed in the upper left small window WS4 (S160 in FIG. 3). At the same time, the three-dimensional image G3 showing the three-dimensional shape of the cream solder is displayed in the small window WS5 below the small window W4 (S170). Further, a three-dimensional plane image GH3 in which height information is indicated by contour lines is displayed in the small window WS6 on the upper right (S180), and the cut surface indicated by the symbol A in the short direction of the three-dimensional plane image GH3 is the small window. The small window WS7 on the left side of WS6 and the cut surface indicated by the symbol B in the longitudinal direction are displayed in the small window WS8 below the small window WS6 (S190).

  Thus, since the three-dimensional image G3 which shows the three-dimensional shape of cream solder is displayed, the shape of cream solder can be grasped instantaneously. Further, since the two-dimensional real image G2 obtained by imaging the cream solder from directly above is displayed at the same time as the three-dimensional image G3, even if a portion that cannot be confirmed in the three-dimensional image G3 occurs due to the unevenness of the cream solder, the two-dimensional real image G2 Therefore, the shape of the part can be estimated and confirmed. Moreover, since the three-dimensional plane image GH3 in which the height information is indicated by contour lines is displayed and the cut surface in the height direction of the three-dimensional plane image GH3 can be displayed, the three-dimensional image G3, three-dimensional The display of the planar image GH3, and further the cut surface, combined with the display of the two-dimensional actual image G2, increases the possibility of instantly grasping the shape of the cream solder. As a result, confirmation of the inspection result by the inspection apparatus 1 is facilitated, and the time required for the confirmation operation can be reduced.

  In addition, since the data is stored (accumulated) in the three-dimensional data storage means 30 and the two-dimensional data storage means 31, there is also an advantage that inspection results made in the past can be confirmed at any time.

  In the present embodiment, a single CCD camera 6 is employed as a single imaging means. Thereby, compared with the structure which adds an imaging mechanism newly to the inspection apparatus 1, the simplification of an imaging mechanism can be achieved and the cost increase of the inspection apparatus 1 can be suppressed. Further, if one CCD camera 6 is used, imaging can be handled in the same coordinate system, and processing such as coordinate conversion is not required at the time of display. The switching means 23 is electrically connected to the control device 7, and the switching means 23 switches the irradiation means 5, 11 to be employed based on a control signal from the control means 7, and the irradiation means 5. , 11, the transmission destination of the image data output from the imaging control means 21 is switched. As a result, data processing after imaging is simple in that the determination processing is not necessary as compared with a configuration in which post-processing is performed by determining whether imaging by the CCD camera 6 is an imaging for inspection or a two-dimensional actual image. become.

  Furthermore, in the present embodiment, the setting frame 41 displayed in the small window WS1 on the display unit 27 is selected via the input unit 26 (S110: YES in FIG. 3), and thus exists in the setting frame 41. The pad portion 42 to be displayed is displayed in the small window WS2 (S120). Then, the enlarged image G2 is displayed by selecting this bad portion 42 via the input means 26 (S130: YES, S140), and by selecting this enlarged image G2 (S150: YES), it is shown in FIG. The cream solder is displayed (S160 to S190). This facilitates selection of cream solder even when the number of pads (cream solder) on the printed circuit board K is enormous.

  In addition, you may implement as follows, for example, without being limited to the content of description of embodiment mentioned above.

  (A) In the above embodiment, the display of the inspection result (good / bad determination result, three-dimensional measurement result, etc.) via the display means 27 is not particularly described, but for example, it is indicated by a two-dot chain line in FIG. The inspection result may be displayed in the region R1, the region R2 indicated by a two-dot chain line in FIG. In this way, since the shape of the cream solder can be grasped as, for example, a measured value or the like, it is easy to confirm the inspection result by the inspection apparatus 1, and the time required for the confirmation work can be reduced. From the viewpoint of grasping the shape of the cream solder, it is desirable to display it together with the three-dimensional image G3 and the two-dimensional real image G2 (see FIG. 5).

  (B) In the above embodiment, the three-dimensional data and the two-dimensional data are stored regardless of the determination of good / bad, but the two-dimensional data (two-dimensional actual image data) and three-dimensional data about the cream solder determined to be defective Data (three-dimensional model data) may be stored. By doing so, it is possible to avoid a situation in which the storage capacity of the two-dimensional data storage unit 31 and the three-dimensional data storage unit 30 is enormous.

  (C) In the above embodiment, the configuration including the transfer means 32 has been described. Using this transfer means 32, the data stored in the two-dimensional data storage means 31 and the three-dimensional data storage means 30 are transferred to an external device, and the above display processing (see FIG. 3) is executed by the external device. It is good. It is conceivable that the inspection apparatus 1 and the external apparatus are connected by, for example, a LAN. In this way, the inspection result can be confirmed at a place away from the inspection place. Further, if the display process is executed by the control device of the external device, the inspection result can be confirmed in parallel with the inspection by the inspection device 1. In this case, the inspection apparatus 1 corresponds to an “inspection unit”, the external apparatus corresponds to a “result confirmation unit”, and the inspection apparatus 1 and the external apparatus constitute an “inspection apparatus”. The control device of the external device corresponds to “display control means”. Of course, it is also possible to adopt a configuration in which display processing can be executed by both the control means 7 of the inspection device 1 and the control device of the external device.

  (D) In the above embodiment, the three-dimensional image G3, the two-dimensional real image G2, the three-dimensional plane image GH3, and the cut surface of the three-dimensional plane image GH3 are displayed. Any configuration that displays a two-dimensional real image together with the original image may be used. That is, in the above-described embodiment, it is sufficient that at least one of the three-dimensional image G3 and the three-dimensional plane image GH3 and the two-dimensional real image are displayed. For example, a configuration in which a display of a cut surface or the like is not performed. It is good.

  (E) In the above embodiment, the cut surface in the three-dimensional plane image GH3 is displayed. However, the cut surface in the two-dimensional real image G2 may be displayed. In this case, since the 2D actual image G2 itself does not have height information, it is conceivable to obtain the height information from 3D model data stored in the 3D data storage means 30, for example.

  (F) In the above embodiment, cream solder printed on the printed circuit board K is used as a measurement object, but it is also possible to implement solder bumps, which are protrusions by solder, as a measurement object.

It is a schematic perspective view which shows typically the inspection apparatus in embodiment. It is a block diagram which shows the electric constitution of a test | inspection apparatus. It is a flowchart which shows a display process. It is explanatory drawing which illustrates the display screen by a display process. It is explanatory drawing which illustrates the display screen by a display process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Inspection apparatus, 5 ... Three-dimensional measurement irradiation means, 6 ... CCD camera as imaging means, 7 ... Control means, 11 ... Two-dimensional imaging irradiation means, 23 ... Switching means, 26 ... Input means, 27 ... Display Means 28 ... Three-dimensional operation means 29 ... Inspection result storage means 30 ... Three-dimensional data storage means 31 ... Two-dimensional data storage means 32 ... Transfer means 41 ... Setting frame 42 ... Pad part 43 ... Cream Solder (image), G2 ... 2D real image (enlarged image), G3 ... 3D image, GH3 ... 3D plane image.

Claims (20)

3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
A three-dimensional image showing a three-dimensional shape of the measurement object based on a measurement value by the three-dimensional calculation means is displayed on a display screen of a display means, and two-dimensional of the measurement object based on an image pickup by the second imaging means Display control means for displaying a real image on the display screen of the display means;
Equipped with a,
Only for the measurement object that has been determined to be defective by the inspection means, the two-dimensional data is stored in the two-dimensional data storage means, and the three-dimensional data is stored in the three-dimensional data storage means. And
The inspection apparatus, wherein the display control means is configured to be able to display the two-dimensional real image together with the three-dimensional image only for a measurement object that has been determined to be defective by the inspection means. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from directly above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
Two-dimensional data storage means for storing a two-dimensional real image of the measurement object as two-dimensional data based on imaging by the second imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data .
Only for the measurement object that has been determined to be defective by the inspection means, the two-dimensional data is stored in the two-dimensional data storage means, and the three-dimensional data is stored in the three-dimensional data storage means. And
The inspection apparatus, wherein the display control means is configured to be able to display the two-dimensional real image together with the three-dimensional image only for a measurement object that has been determined to be defective by the inspection means. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Imaging that performs imaging for three-dimensional measurement based on irradiation light from the irradiation means for three-dimensional measurement, and performs imaging from directly above the measurement object based on irradiation light from the irradiation means for two-dimensional imaging Means,
Switching between irradiation by the irradiation means for three-dimensional measurement and irradiation by the irradiation means for two-dimensional imaging, and switching means for switching processing based on imaging by the imaging means in accordance with switching of the irradiation means,
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging for three-dimensional measurement by the imaging means;
Inspection means for inspecting the measurement object based on the measurement value by the three-dimensional calculation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional data storage means for storing, as two-dimensional data, a two-dimensional real image of the measurement object based on imaging by the imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data .
Only for the measurement object that has been determined to be defective by the inspection means, the two-dimensional data is stored in the two-dimensional data storage means, and the three-dimensional data is stored in the three-dimensional data storage means. And
The inspection apparatus, wherein the display control means is configured to be able to display the two-dimensional real image together with the three-dimensional image only for a measurement object that has been determined to be defective by the inspection means. The inspection apparatus according to any one of claims 1 to 3 ,
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
A second imaging means for imaging from the true on the measurement object based on the light emitted from the two-dimensional imaging irradiation means,
A three-dimensional image showing a three-dimensional shape of the measurement object based on a measurement value by the three-dimensional calculation means is displayed on a display screen of a display means, and two-dimensional of the measurement object based on an image pickup by the second imaging means Display control means for displaying a real image on the display screen of the display means;
Equipped with a,
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from directly above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
Two-dimensional data storage means for storing a two-dimensional real image of the measurement object as two-dimensional data based on imaging by the second imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data .
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Imaging that performs imaging for three-dimensional measurement based on irradiation light from the irradiation means for three-dimensional measurement, and performs imaging from directly above the measurement object based on irradiation light from the irradiation means for two-dimensional imaging Means,
Switching between irradiation by the irradiation means for three-dimensional measurement and irradiation by the irradiation means for two-dimensional imaging, and switching means for switching processing based on imaging by the imaging means in accordance with switching of the irradiation means,
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging for three-dimensional measurement by the imaging means;
Inspection means for inspecting the measurement object based on the measurement value by the three-dimensional calculation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional data storage means for storing, as two-dimensional data, a two-dimensional real image of the measurement object based on imaging by the imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means based on the two-dimensional data .
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device. The inspection apparatus according to claim 1, 2 , 5 or 6 ,
The inspection apparatus, wherein the first imaging unit and the second imaging unit are configured by a single imaging unit. The inspection apparatus according to any one of claims 1 to 8 ,
An input means for inputting information,
The display control means can display specific information for specifying the measurement object to be selected on the display means, and the measurement object is selected by the specific information via the input means. And an inspection apparatus configured to display the two-dimensional actual image in association with the three-dimensional image together with the three-dimensional image. The inspection apparatus according to claim 9 , wherein
The display control means can display a setting frame set in accordance with the electrode pattern on the substrate. When the setting frame is selected via the input means, the display frame exists in the setting frame. An inspection apparatus configured to display specific information of a measurement object on the display means. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
A three-dimensional image showing a three-dimensional shape of the measurement object based on a measurement value by the three-dimensional calculation means is displayed on a display screen of a display means, and two-dimensional of the measurement object based on an image pickup by the second imaging means Display control means for displaying a real image on the display screen of the display means ;
Input means for entering information and
With
The display control means can display specific information for specifying the measurement object to be selected on the display means, and the measurement object is selected by the specific information via the input means. And an inspection apparatus configured to display the two-dimensional actual image in association with the three-dimensional image together with the three-dimensional image . 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
First imaging means for imaging based on the irradiation light from the three-dimensional measurement irradiation means;
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging by the first imaging means;
In an inspection apparatus provided with inspection means for inspecting the measurement object based on the measurement value by the three-dimensional operation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Second imaging means for imaging from directly above the measurement object based on the irradiation light from the irradiation means for two-dimensional imaging;
Two-dimensional data storage means for storing a two-dimensional real image of the measurement object as two-dimensional data based on imaging by the second imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means, based on the two-dimensional data .
Input means for entering information and
With
The display control means can display specific information for specifying the measurement object to be selected on the display means, and the measurement object is selected by the specific information via the input means. And an inspection apparatus configured to display the two-dimensional actual image in association with the three-dimensional image together with the three-dimensional image . The inspection apparatus according to claim 11 or 12 ,
The inspection apparatus, wherein the first imaging unit and the second imaging unit are configured by a single imaging unit. 3D measurement irradiation means for irradiating the measurement object with light for 3D measurement;
Two-dimensional imaging irradiation means for irradiating the measurement object with light for two-dimensional imaging;
Imaging that performs imaging for three-dimensional measurement based on irradiation light from the irradiation means for three-dimensional measurement, and performs imaging from directly above the measurement object based on irradiation light from the irradiation means for two-dimensional imaging Means,
Switching between irradiation by the irradiation means for three-dimensional measurement and irradiation by the irradiation means for two-dimensional imaging, and switching means for switching processing based on imaging by the imaging means in accordance with switching of the irradiation means,
Three-dimensional calculation means for performing three-dimensional measurement of the measurement object based on imaging for three-dimensional measurement by the imaging means;
Inspection means for inspecting the measurement object based on the measurement value by the three-dimensional calculation means,
Three-dimensional data storage means for storing three-dimensional data capable of specifying the three-dimensional shape of the measurement object based on the measurement value by the three-dimensional calculation means;
Two-dimensional data storage means for storing, as two-dimensional data, a two-dimensional real image of the measurement object based on imaging by the imaging means;
Display means having a display screen;
Based on the three-dimensional data stored in the three-dimensional data storage means, a three-dimensional image showing the three-dimensional shape of the measurement object is displayed on the display screen of the display means, and stored in the two-dimensional data storage means. Display control means for displaying the two-dimensional real image of the measurement object on the display screen of the display means, based on the two-dimensional data .
Input means for entering information and
With
The display control means can display specific information for specifying the measurement object to be selected on the display means, and the measurement object is selected by the specific information via the input means. And an inspection apparatus configured to display the two-dimensional actual image in association with the three-dimensional image together with the three-dimensional image . The inspection apparatus according to any one of claims 11 to 14 ,
The display control means can display a setting frame set in accordance with the electrode pattern on the substrate. When the setting frame is selected via the input means, the display frame exists in the setting frame. An inspection apparatus configured to display specific information of a measurement object on the display means. The inspection apparatus according to any one of claims 11 to 15 ,
The display control means is configured to be able to display a three-dimensional image of the measurement object when viewed from an arbitrarily set direction as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Characteristic inspection device. The inspection apparatus according to any one of claims 1 to 16 ,
An inspection result storage means for storing an inspection result by the inspection means;
The display control means is further configured to display the inspection result stored in the inspection result storage means on the display screen of the display means. The inspection apparatus according to any one of claims 1 to 17 ,
The display control means is configured to be able to display a planar image of the measurement object showing height information as the three-dimensional image based on a measurement value obtained by the three-dimensional calculation means. Inspection device to do. The inspection apparatus according to any one of claims 1 to 18 ,
The inspection apparatus, wherein the display control means is configured to be able to display a cut surface in the height direction of the measurement object based on a measurement value obtained by the three-dimensional calculation means. The inspection apparatus according to any one of claims 1 to 19 ,
An inspection unit comprising at least the irradiation means for three-dimensional measurement, the first imaging means, the three-dimensional calculation means, and the inspection means;
An inspection apparatus configured as a separate body from the inspection unit and comprising a result confirmation unit including at least the display control means.

Images